Patent application number | Description | Published |
20080248596 | Method of making a circuitized substrate having at least one capacitor therein - A method of making a circuitized substrate which includes at least one and possibly several capacitors as part thereof. In one embodiment, the substrate is produced by forming a layer of capacitive dielectric material on a dielectric layer and thereafter forming channels with the capacitive material, e.g., using a laser. The channels are then filled with conductive material, e.g., copper, using selected deposition techniques, e.g., sputtering, electro-less plating and electroplating. A second dielectric layer is then formed atop the capacitor and a capacitor “core” results. This “core” may then be combined with other dielectric and conductive layers to form a larger, multilayered PCB or chip carrier. In an alternative approach, the capacitive dielectric material may be photo-imageable, with the channels being formed using conventional exposure and development processing known in the art. In still another embodiment, at least two spaced-apart conductors may be formed within a metal layer deposited on a dielectric layer, these conductors defining a channel there-between. The capacitive dielectric material may then be deposited (e.g., using lamination) within the channels. | 10-09-2008 |
20100060381 | Mulit-layer embedded capacitance and resistance substrate core - A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser. | 03-11-2010 |
20100167210 | MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE - A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser. | 07-01-2010 |
20110039212 | Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate - A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided. | 02-17-2011 |
20110043987 | METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH RESISTOR INCLUDING MATERIAL WITH METAL COMPONENT AND ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE - A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided. | 02-24-2011 |
20120015532 | HIGH DENSITY DECAL AND METHOD FOR ATTACHING SAME - A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal. | 01-19-2012 |
20120017437 | CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY INCLUDING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE - A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto. | 01-26-2012 |
20120031649 | CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging. | 02-09-2012 |
20120068326 | ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS - A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling. | 03-22-2012 |
20120069531 | CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS - A conducting paste and method of forming the paste for device level interconnection. The conducting paste contains metal loading in the range 80-95% that is useful for making five micron device level interconnects. The conducting paste is made by mixing two different conducting pastes, each paste maintaining its micro level individual rich region in the mixed paste even after final curing. One paste contains at least one low melting point alloy and the other paste contains noble metal fillers such as gold or silver flakes. In general, average flake size below five micron is suitable for five micron interconnects. However, 1 micron or smaller silver flakes and an LMP mixture is preferred for five micron interconnects. The amount of LMP based paste in the final mixture is preferably 20-50% by weight. The nano micro paste embodiment shows good electrical yield (81%) and low contact resistance. | 03-22-2012 |
20120152605 | CIRCUITIZED SUBSTRATE WITH DIELECTRIC INTERPOSER ASSEMBLY AND METHOD - A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed. | 06-21-2012 |
20120160544 | CORELESS LAYER BUILDUP STRUCTURE WITH LGA - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging. | 06-28-2012 |
20120160547 | CORELESS LAYER BUILDUP STRUCTURE - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. | 06-28-2012 |
20120162928 | ELECTRONIC PACKAGE AND METHOD OF MAKING SAME - An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates and also including an opening therein in which is positioned at least one electrical component, such as a semiconductor chip, coupled to the lower or base substrate. A second component may also be mounted on and electrically coupled to the upper surface of the top or cover circuitized substrate. A method of making such a package is also provided. | 06-28-2012 |
20120201006 | ELECTRONIC PACKAGE WITH THERMAL INTERPOSER AND METHOD OF MAKING SAME - An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package. | 08-09-2012 |
20120223047 | METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE - Methods of forming embedded, multilayer capacitors in printed circuit boards wherein copper or other electrically conductive channels are formed on a dielectric substrate. The channels may be preformed using etching or deposition techniques. A photoimageable dielectric is an upper surface of the laminate. Exposing and etching the photoimageable dielectric exposes the space between the copper traces. These spaces are then filled with a capacitor material. Finally, copper is either laminated or deposited atop the structure. This upper copper layer is then etched to provide electrical interconnections to the capacitor elements. Traces may be formed to a height to meet a plane defining the upper surface of the dielectric substrate or thin traces may be formed on the remaining dielectric surface and a secondary copper plating process is utilized to raise the height of the traces. | 09-06-2012 |
20120228014 | CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD OF MAKING SAME - A circuitized substrate for use in such electrical structures as information handling systems wherein the substrate includes a capacitive substrate as part thereof. The capacitive substrate includes a thin film layer of capacitive material strategically positioned on a conductive layer relative to added electrically conductive elements to in turn provide a plurality of internal capacitors within the final circuitized substrate during operation thereof. A method of making such a circuitized substrate is also provided. | 09-13-2012 |
20120243155 | CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND INFORMATION HANDLING SYSTEM UTILIZING SAME - A method of forming a circuitized substrate utilizing a conductive nub structure for enhanced interconnection integrity by using a joining core layer with copper outer layer on it, and forming thru-holes in the joining layer. Placing conductive adhesive in the thru-hole prior to removing the copper outer layers from the joining core layer creates an adhesive bump on joining core layer that engages a conductive secondary metal nub placed on the circuitized substrate-to-joining layer contact points, thus creating an enhanced connection between the layers. | 09-27-2012 |
20120257343 | CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION - A method of forming a circuitized substrate for use in electronic packages. A substrate layer is provided that has a copper pad on a surface. A conductive seed layer and a photoresist layer are placed on the surface. The photoresist is developed and conductive material is placed within the developed features and a second conductive material placed on the first conductive material. The photoresist and conductive seed layer are removed to leave a micro-pillar array. The joining and lamination of two circuitized substrate layers utilizes the micro-pillar array for the electrical connection of the circuitized substrate layers. | 10-11-2012 |
20130033827 | ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERCONNECTS - A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling. | 02-07-2013 |
Patent application number | Description | Published |
20080221858 | Dynamic Online Multi-Parameter Optimization System and Method for Autonomic Computing Systems - An improved method and system for performing dynamic online multi-parameter optimization for autonomic computing systems are provided. With the method and system of the present invention, a simplex, i.e. a set of points in the parameter space that has been directly sampled, is maintained. The system's performance with regard to a particular utility value is measured for the particular setting of configuration parameters associated with each point in the simplex. A new sample point is determined using the geometric transformations of the simplex. The method and system provide mechanisms for limiting the size of the simplex that is generated through these geometric transformations so that the present invention may be implemented in noisy environments in which the same configuration settings may lead to different results with regard to the utility value. In addition, mechanisms are provided for resampling a current best point in the simplex to determine if the environment has changed. If a sufficiently different utility value is obtained from a previously sampled utility value for the point in the simplex, then rather than contracting, the simplex is expanded. If the difference between utility values is not sufficient enough, then contraction of the simplex is performed. In addition, in order to allow for both real and integer valued parameters in the simplex, a mechanism is provided by which invalid valued parameters that are generated by geometric transformations being performed on the simplex are mapped to a nearest valid value. Similarly, parameter values that violate constraints are mapped to values that satisfy constraints taking care that the dimensionality of the simplex is not reduced. | 09-11-2008 |
20080263559 | METHOD AND APPARATUS FOR UTILITY-BASED DYNAMIC RESOURCE ALLOCATION IN A DISTRIBUTED COMPUTING SYSTEM - In one embodiment, the present invention is a method for allocation of finite computational resources amongst multiple entities, wherein the method is structured to optimize the business value of an enterprise providing computational services. One embodiment of the inventive method involves establishing, for each entity, a service level utility indicative of how much business value is obtained for a given level of computational system performance. The service-level utility for each entity is transformed into a corresponding resource-level utility indicative of how much business value may be obtained for a given set or amount of resources allocated to the entity. The resource-level utilities for each entity are aggregated, and new resource allocations are determined and executed based upon the resource-level utility information. The invention is thereby capable of making rapid allocation decisions, according to time-varying need or value of the resources by each of the entities. | 10-23-2008 |
20090012922 | METHOD AND APPARATUS FOR REWARD-BASED LEARNING OF IMPROVED SYSTEMS MANAGEMENT POLICIES - In one embodiment, the present invention is a method for reward-based learning of improved systems management policies. One embodiment of the inventive method involves supplying a first policy and a reward mechanism. The first policy maps states of at least one component of a data processing system to selected management actions, while the reward mechanism generates numerical measures of value responsive to particular actions (e.g., management actions) performed in particular states of the component(s). The first policy and the reward mechanism are applied to the component(s), and results achieved through this application (e.g., observations of corresponding states, actions and rewards) are processed in accordance with reward-based learning to derive a second policy having improved performance relative to the first policy in at least one state of the component(s). | 01-08-2009 |
20110230229 | Social Recommender System for Generating Dialogues Based on Similar Prior Dialogues from a Group of Users - Techniques for organizing information in a user-interactive system based on user interest are provided. In one aspect, a method for operating a system having a plurality of resources through which a user can navigate is provided. The method includes the following steps. When the user accesses the system, the resources are presented to the user in a particular order. Interests of the user in the resources presented are determined. The interests of the user are compared to interests of other users to find one or more subsets of users to which the user belongs by virtue of having similar interests. Upon one or more subsequent accesses to the system by the user, the order in which the resources are presented to the user is based on interests common to the one or more subsets of users to which the user belongs. | 09-22-2011 |
20120078417 | Detecting Energy and Environmental Leaks In Indoor Environments Using a Mobile Robot - Techniques for energy and environmental leak detection in an indoor environment using one or more mobile robots are provided. An energy leak detection system is provided. The energy leak detection system includes one or more mobile robots configured to move throughout at least a portion of a building and to take temperature and air flow measurements at a plurality of locations within the building. An environmental leak detection system is also provided. The environmental leak detection system includes one or more mobile robots configured to move throughout at least a portion of a building and to take airborne matter measurements at a plurality of locations within the building. | 03-29-2012 |
20120117399 | SAVING POWER BY MANAGING THE STATE OF INACTIVE COMPUTING DEVICES - A system method and computer program product for managing readiness states of a plurality of computing devices. A programmed processor unit operates, upon receipt of a request, to either: provide one or more computing devices from an inactive pool to an active pool, or accept one or more active computing devices into the inactive pool. An Inactive Pool Manager proactively manages the inactive states of each computing device by: determining the desired number (and identities) of computing devices to be placed in each inactive state of readiness by solving a constraint optimization problem that describes a user-specified trade-off between expected readiness (estimated time to be able to activate computing devices when they are needed next) and conserving energy; generating a plan for changing the current set of inactive states to the desired set; and, executing the plan. Multiple alternative ways of quantifying the desired responsiveness to surges in demand are provided, and, in each case, the tradeoff between responsiveness and power savings is formulated as an objective function with constraints, and the desired number of devices in each inactive state emerges as the solution to a constraint optimization problem. | 05-10-2012 |
20120331318 | SAVING POWER BY MANAGING THE STATE OF INACTIVE COMPUTING DEVICES - Managing readiness states of a plurality of computing devices. A programmed processor unit operates, upon receipt of a request, to: provide one or more computing devices from an inactive pool to an active pool, or accept one or more active computing devices into the inactive pool. The system proactively manages the inactive states of each computing device by: determining the desired number (and identities) of computing devices to be placed in each inactive state of readiness by solving a constraint optimization problem that describes a user-specified trade-off between expected readiness (estimated time to be able to activate computing devices when they are needed next) and conserving energy; generating a plan for changing the current set of inactive states to the desired set; and, executing the plan. Multiple alternative ways of quantifying the desired responsiveness to surges in demand are provided. | 12-27-2012 |
20140059367 | SAVING POWER BY MANAGING THE STATE OF INACTIVE COMPUTING DEVICES - A system method and computer program product for managing readiness states of a plurality of computing devices. In response to a request, a computer system operates to either: provide one or more computing devices from an inactive pool to an active pool, or accept one or more active computing devices into the inactive pool. An Inactive Pool Manager proactively manages the inactive states of each computing device by: determining the desired number (and identities) of computing devices to be placed in each inactive state of readiness by solving a constraint optimization problem that describes a user-specified trade-off between expected readiness (estimated time to be able to activate computing devices when they are needed next) and conserving energy; generating a plan for changing the current set of inactive states to the desired set; and, executing the plan. Multiple alternative ways of quantifying the desired responsiveness to surges in demand are provided. | 02-27-2014 |
Patent application number | Description | Published |
20090098515 | METHOD AND APPARATUS FOR IMPROVED REWARD-BASED LEARNING USING NONLINEAR DIMENSIONALITY REDUCTION - The present invention is a method and an apparatus for reward-based learning of policies for managing or controlling a system or plant. In one embodiment, a method for reward-based learning includes receiving a set of one or more exemplars, where at least two of the exemplars comprise a (state, action) pair for a system, and at least one of the exemplars includes an immediate reward responsive to a (state, action) pair. A distance measure between pairs of exemplars is used to compute a Non-Linear Dimensionality Reduction (NLDR) mapping of (state, action) pairs into a lower-dimensional representation. The mapping is then applied to the set of exemplars, and reward-based learning is applied to the transformed exemplars to obtain a management policy. | 04-16-2009 |
20120084580 | Power Budget Allocation in Multi-Processor Systems - Systems, apparatuses, methods, and software that implement power budget allocation optimization algorithms in multi-processor systems, such as server farms. The algorithms are derived from a queuing theoretic model that minimizes the mean response time of the system to the jobs in the workload while accounting for a variety of factors. These factors include, but are not necessarily limited to, the type of power (frequency) scaling mechanism(s) available within the processors in the system, the power-to-frequency relationship(s) of the processors for the scaling mechanism(s) available, whether or not the system is an open or closed loop system, the arrival rate of jobs incoming into the system, the number of jobs within the system, and the type of workload being processed. | 04-05-2012 |
20120218102 | MANAGING EMERGENCY RESPONSE SERVICES USING MOBILE COMMUNICATION DEVICES - One or more embodiments manage emergency response services. An emergency event is determined to have occurred. A set of civilian responders currently available to respond to the emergency event is selected from a plurality of civilian responders in response to determining that the emergency event has occurred. Each civilian responder in the set of civilian responders is associated with at least one wireless communication device. The set of civilian responders is notified that the emergency event has occurred. A set of emergency event information associated with the emergency event is transmitted to at least one wireless communication device associated with each civilian responder in the set of civilian responders. | 08-30-2012 |
20120290135 | UNIFIED AND FLEXIBLE CONTROL OF MULTIPLE DATA CENTER COOLING MECHANISMS - Techniques are described for controlling the climate in a data center. Using the input of an administrator, multiple desired attributes of a data center (e.g., temperature, energy consumption, costs, or system performance) may be balanced using a utility function that maximizes the utility of the computing systems in the data center according to the administrator's preferences. Additionally, a cooling model is generated that represents the affect of a control parameter (e.g., the fan speed of a CRAC) on the desire attributes of the data center. The cooling model may then be substituted into the utility function to replace the desired attributes. Using this new utility function, the control parameters may be varied such that the maximum utility is achieved. | 11-15-2012 |
20120317265 | Automatically Detecting and Locating Equipment Within an Equipment Rack - A mechanism is provided for automatically detecting and locating equipment within an intelligent equipment rack. The intelligent equipment rack comprises a rack controller that determines whether a signal has been received indicating that a rack space in a plurality of rack spaces in the intelligent equipment rack has been occupied by a piece of electronic equipment. Responsive to receiving the signal indicating that the rack space has been occupied by the piece of electronic equipment, the rack controller updates a rack information table in the memory with occupation information related to the rack space occupied by the piece of electronic equipment. | 12-13-2012 |
20130085611 | UNIFIED AND FLEXIBLE CONTROL OF MULTIPLE DATA CENTER COOLING MECHANISMS - Techniques are described for controlling the climate in a data center. Using the input of an administrator, multiple desired attributes of a data center (e.g., temperature, energy consumption, costs, or system performance) may be balanced using a utility function that maximizes the utility of the computing systems in the data center according to the administrator's preferences. Additionally, a cooling model is generated that represents the affect of a control parameter (e.g., the fan speed of a CRAC) on the desire attributes of the data center. The cooling model may then be substituted into the utility function to replace the desired attributes. Using this new utility function, the control parameters may be varied such that the maximum utility is achieved. | 04-04-2013 |
20130096831 | AUTOMATIC, ADAPTIVE AND OPTIMIZED SENSOR SELECTION AND VIRTUALIZATION - A system, method and computer program product for managing sensors. One example of embodiment includes a data reader to receive sensor measurements from sensors. A user value collector receives user values from users representing a user's measurement of an abstract concept. A data store saves the sensor measurements and the user values in computer readable memory. The system further includes a virtual sensor generator. The virtual sensor generator determines a mapping function based on the stored sensor measurements and user values. Furthermore, given a new set of sensor measurements from the sensors, the virtual sensor generator employs the mapping function to generate a new virtual sensor value. | 04-18-2013 |
20130103214 | Provisioning Aggregate Computational Workloads And Air Conditioning Unit Configurations To Optimize Utility Of Air Conditioning Units And Processing Resources Within A Data Center - Methods, apparatuses, and computer program products for provisioning aggregate computational workloads and air conditioning unit configurations to optimize utility of air conditioning units and processing resources within a data center are provided. Embodiments include for each air conditioning unit within the data center, determining a thermal zone generated by the air conditioning unit; for a given aggregate computational workload, identifying a plurality of computational workload configurations, each computational workload configuration indicating spatial assignments of the aggregate computational workload among a plurality of processing resources within the data center; for each computational workload configuration, calculating a total minimum energy consumption of the air conditioning units and the processing resources; and selecting the computational workload configuration with the lowest total minimum energy consumption and the determined lowest power air conditioning unit configuration corresponding with the selected computational workload configuration. | 04-25-2013 |
20130103218 | PROVISIONING AGGREGATE COMPUTATIONAL WORKLOADS AND AIR CONDITIONING UNIT CONFIGURATIONS TO OPTIMIZE UTILITY OF AIR CONDITIONING UNITS AND PROCESSING RESOURCES WITHIN A DATA CENTER - Methods, apparatuses, and computer program products for provisioning aggregate computational workloads and air conditioning unit configurations to optimize utility of air conditioning units and processing resources within a data center are provided. Embodiments include for each air conditioning unit within the data center, determining a thermal zone generated by the air conditioning unit; for a given aggregate computational workload, identifying a plurality of computational workload configurations, each computational workload configuration indicating spatial assignments of the aggregate computational workload among a plurality of processing resources within the data center; for each computational workload configuration, calculating a total minimum energy consumption of the air conditioning units and the processing resources; and selecting the computational workload configuration with the lowest total minimum energy consumption and the determined lowest power air conditioning unit configuration corresponding with the selected computational workload configuration. | 04-25-2013 |
20130179226 | AUTOMATED TASK PRICING IN CROWDSOURCING MARKETPLACES - Illustrative embodiments disclose pricing tasks by receiving a request comprising a task and a description of the task and then identifying the type of task based on the description. A pricing module retrieves a condition in a marketplace associated with the type and selects a strategy for pricing based on a rule for the type. The module then generates a price for the task using the strategy, and it adjusts the price based on the condition. | 07-11-2013 |
20130253969 | Broadcast Messaging of Incentives Based on Value - A method for a provider to generate incentives for users to perform tasks includes the following steps. The tasks are assigned to the users to obtain a matrix of task assignments in which each of the users is assigned to at least one of the tasks and each of the tasks is assigned to at least one of the users, wherein each of the task assignments has a value and a cost to the provider, wherein for a given one of the task assignments the value less the cost to the provider is an economic utility to the provider, and wherein the step of assigning the tasks to the users is done so as to maximize a net benefit to the provider which is a sum of the economic utility for all of the task assignments. Incentives are offered to the users to perform the task assignments. | 09-26-2013 |
20130311406 | Automated Object Classification Using Temperature Profiles - Methods and apparatus are provided for automated object classification using temperature profiles. An object in an environment (such as an exemplary data center) is classified by obtaining a surface temperature profile of the object; and classifying the object as a particular type of equipment based on the obtained surface temperature profile. The surface temperature profile of the object can be compared to a plurality of predefined characteristic surface temperature profiles each associated with a given type of equipment. | 11-21-2013 |
20130311407 | Automated Object Classification Using Temperature Profiles - Methods and apparatus are provided for automated object classification using temperature profiles. An object in an environment (such as an exemplary data center) is classified by obtaining a surface temperature profile of the object; and classifying the object as a particular type of equipment based on the obtained surface temperature profile. The surface temperature profile of the object can be compared to a plurality of predefined characteristic surface temperature profiles each associated with a given type of equipment. | 11-21-2013 |
20140006671 | Location of Computing Assets within an Organization | 01-02-2014 |
20140006672 | Location of Computing Assets within an Organization | 01-02-2014 |
20140136253 | DETERMINING WHETHER TO USE CROWDSOURCING FOR A SPECIFIED TASK - An embodiment of the invention, directed to a method, is associated with a workflow process comprising one or more discrete tasks. The method includes the step identifying a specified one of the tasks that may be performed by crowdsourcing. The method further includes defining a specified metric, which comprises a measure of benefit provided by using crowdsourcing to perform the specified task, or comprises a cost of using crowdsourcing to perform the specified task, selectively. The method further includes determining whether at least a given criterion has been met, wherein the given criterion is related to the specified metric. The specified task is then performed using crowdsourcing, only after determining that the given criterion has been met. | 05-15-2014 |
20140136254 | DETERMINING WHETHER TO USE CROWDSOURCING FOR A SPECIFIED TASK - An embodiment of the invention, directed to a method, is associated with a workflow process comprising one or more discrete tasks. The method includes the step identifying a specified one of the tasks that may be performed by crowdsourcing. The method further includes defining a specified metric, which comprises a measure of benefit provided by using crowdsourcing to perform the specified task, or comprises a cost of using crowdsourcing to perform the specified task, selectively. The method further includes determining whether at least a given criterion has been met, wherein the given criterion is related to the specified metric. The specified task is then performed using crowdsourcing, only after determining that the given criterion has been met. | 05-15-2014 |