Patent application number | Description | Published |
20100065322 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 03-18-2010 |
20100139962 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer (resin layer) interposed therebetween, and the wiring layers are connected to each other through a via formed in each of the resin layers. A recessed portion is formed in an annular shape surrounding a chip mounting area on the outermost resin layer on a chip mounting surface side of the wiring board. Alternatively, a projected portion is formed instead of the recessed portion. | 06-10-2010 |
20100147560 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board (package) includes: a cavity formed at a position corresponding to a chip mounting area of the outermost insulating layer on one side of both surfaces of the wiring board; a pad exposed from the surface of the insulating layer in the cavity; and a pad exposed from the surface of the insulating layer in a peripheral region of the cavity. A chip is flip-chip bonded to the pads in the cavity of the package, and another package is bonded to the pads in the peripheral region of the cavity, to thereby form a semiconductor device having a package on package (POP) structure. | 06-17-2010 |
20100147574 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board (package) has a structure in which multiple wiring layers are stacked one on top of another with insulating layers each interposed between corresponding two of the wiring layers, and the wiring layers are connected to each other through vias formed in the insulating layers. In the peripheral region around the chip mounting area of the outermost insulating layer on one of both surfaces of the board, a pad is formed in a bump shape to cover a surface of a portion of the outermost insulating layer, the portion being formed to protrude, and a pad whose surface is exposed from the insulating layer is arranged in the chip mounting area. A chip is flip-chip bonded to the pad of the package, and another package is bonded to the bump shaped pad in a peripheral region around the chip (package-on-package bonding). | 06-17-2010 |
20110147924 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes an insulating layer, a wiring layer buried in the insulating layer, and a connection pad connected to the wiring layer via a via conductor provided in the insulating layer and in which at least a part is buried in an outer surface side of the insulating layer, wherein the connection pad includes a first metal layer (a first copper layer) arranged on the outer surface side, an intermediate metal layer (a nickel layer) arranged on a surface of an inner layer side of the first metal layer, and a second metal layer (a second copper layer) arranged on a surface of an inner layer side of the intermediate metal layer, and a hardness of the intermediate metal layer is higher than a hardness of the first metal layer and the second metal layer. | 06-23-2011 |
20110290536 | WIRING SUBSTRATE - A wiring substrate includes a wiring layer, and an insulating layer configured to cover the wiring layer, wherein the insulating layer is recognized to have any color in a range from purple to blue. | 12-01-2011 |
20110304016 | WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE - A wiring board includes a structure in which a plurality of wiring layers are stacked with insulating layers interposed therebetween, a plurality of pads for mounting an electronic component, the pads being formed on an outermost insulating layer on one surface side of the structure and exposed to the surface of the outermost insulating layer, and a recessed portion formed at a place corresponding to a mounting area for the electronic component. The recessed portion is formed in the outermost insulating layer at an area between the pads to which electrode terminals of the electronic component to be mounted are to be connected, respectively. | 12-15-2011 |
20120175153 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings. | 07-12-2012 |
20130075145 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height. | 03-28-2013 |
20130134127 | WIRING BOARD AND METHOD OF FABRICATING THE SAME - A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad. | 05-30-2013 |
20130140692 | WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE INCLUDING WIRING SUBSTRATE - A wiring substrate includes an insulating layer having a first surface on which a projecting part is formed, and an electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface. The first electrode pad surface is exposed from the projecting part of the insulating layer. The second electrode pad surface is covered by the insulating layer. A cross-section of the projecting part is a tapered shape. One side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer. | 06-06-2013 |
20130143062 | METHOD AND SUPPORT MEMBER FOR MANUFACTURING WIRING SUBSTRATE, AND STRUCTURE MEMBER FOR WIRING SUBSTRATE - A wiring substrate manufacturing method includes forming a layered configuration including a first metal layer, a peeling layer, and a second metal layer, removing an edge part of the layered configuration, so that the first metal layer is smaller than the second metal layer from a plan view, forming a support body by adhering the first metal layer to a base member and adhering the base member to a process part, the process part being formed by the removing of the edge part, forming a wiring substrate on the second metal layer, removing a part of the support body and a part of the wiring substrate that are superposed with respect to the process part from a plan view, and separating the second metal layer and the wiring substrate from the support body after the removing of the parts of the support body and the wiring substrate. | 06-06-2013 |
Patent application number | Description | Published |
20140367208 | VEHICLE DISC BRAKE - Each pad return spring includes a lug piece attachment portion that is attached to a corresponding lug piece, and a pad return portion. The lug piece attachment portion of each pad return spring includes a first piece that is disposed on a first surface, on a disc rotor side, of the corresponding lug piece, a second piece that is disposed on a second surface, on the opposite side to the disc rotor side, of the corresponding lug piece, and a connection piece that connects the first piece and the second piece. The lug piece attachment portion of each pad return spring has a substantially U shape in section. The lug piece attachment portions are formed with engagement claw portions, and the lug pieces are formed with engagement grooves. | 12-18-2014 |
20150136537 | VEHICLE DISC BRAKE - An embodiment discloses a vehicle disc brake including a caliper body, a banjo and a banjo bolt. An acting portion of the caliper body has a cylinder bore accommodating a piston. The caliper body is formed through a gravity casting method. A gate mark is formed on the bottom wall of the cylinder bore as a result of cutting the gate after the caliper body has been cast, and the gate mark includes a worked surface and a projecting surface. A union hole communicating with a hydraulic pressure chamber and a locking hole receiving the locking projection of a banjo are opened in the worked surface. And, an uneven portion is provided between the worked surface and the projecting surface. | 05-21-2015 |