Patent application number | Description | Published |
20090051051 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a first insulator film having a first opening, a first wiring layer extending from the first opening onto the first insulator film, a first semiconductor chip mounted on the first insulator film so as to be electrically coupled with the first wiring layer, and a resin portion applied on the first insulation film to cover the first semiconductor chip. | 02-26-2009 |
20090093085 | Carrier Structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device - A carrier structure for fabricating a stacked-type semiconductor device includes: a lower carrier that has laminated thin plates and has first openings for mounting first semiconductor packages thereon; and an upper carrier having second openings for mounting second semiconductor packages on the first semiconductor packages. The lower carrier composed of the laminated thin plates realizes an even plate thickness and reduces warps because stress is distributed to the thin plates. This results in an improved production yield. A pattern of the openings in the thin plates of the lower carrier may be formed by etching or electric discharging. The openings thus formed have reduced warps and burrs. | 04-09-2009 |
20090311831 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is disclosed. As a part of the method, one surface of a substrate is molded with resin where the substrate and the resin are heated in a first heating process and maintained in a flat condition. The substrate and the resin are returned to room temperature while being maintained in the flat condition after the first heating process. The resin is cut after the substrate and the resin are returned to room temperature from a surface of the resin that is opposite the surface of the resin where the substrate contacts the resin. The substrate is left intact when the resin is cut. Thereafter, the substrate is separated. | 12-17-2009 |
20090321958 | SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUFACTURING THEREOF - Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal. Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device. | 12-31-2009 |
20100102424 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR - The present invention provides a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized. | 04-29-2010 |
20110024922 | SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD - The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion. | 02-03-2011 |
20110309494 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR - Various embodiments of the present invention include a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized. | 12-22-2011 |
20110312108 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR - Various embodiments of the present invention include a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized. | 12-22-2011 |
20130100318 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE - Various embodiments of the present invention include a semiconductor device and a fabrication method therefore, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefore, in which downsizing and cost reduction can be realized. | 04-25-2013 |
20150202854 | LAMINATED GLASS PRODUCTION METHOD - A laminated glass production method includes bending multiple glass plates into a desired shape by heating the glass plates to near a softening point, stacking the bent glass plates in layers with an interlayer interposed therebetween, and forming laminated glass by bonding the glass plates and the interlayer stacked in layers by applying pressure. At least two of the glass plates composing the laminated glass have different thicknesses. Of the two glass plates having different thicknesses, the thicker glass plate has a lower viscosity than the thinner glass plates at a temperature between the annealing point and the softening point of the thicker glass plate. Forming the laminated glass includes forming an uneven temperature distribution on a principal surface of each of the glass plates. | 07-23-2015 |
20150255446 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE - Various embodiments of the present invention include a semiconductor device and a fabrication method therefore, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefore, in which downsizing and cost reduction can be realized. | 09-10-2015 |
Patent application number | Description | Published |
20130306426 | STARTING APPARATUS - In a hydraulic transmission apparatus, a lockup piston of a lockup clutch mechanism is placed on the opposite side of first and second friction plates from a sidewall portion of a front cover. A damper device is placed on the opposite side of the lockup piston from the first and second friction plates. An outer peripheral portion of the lockup piston is located closer to the outer periphery than an outer peripheral portion of a flange member. A part of the lockup piston is placed in a region located between first and second springs and a third spring of the damper device in a radial direction and in the range of an axial width of the third spring located closer to the lockup piston. | 11-21-2013 |
20140027231 | STARTING DEVICE - A lockup clutch mechanism of a hydraulic transmission device includes a lockup piston that is capable of moving toward a front cover to press first and second friction plates, and a flange member that together with the lockup piston defines an engagement-side oil chamber. The front cover and the lockup piston define a first lubricant passage that supplies hydraulic oil to the first and second friction plates. A second lubricant passage communicating with the first lubricant passage is formed in a centerpiece of the front cover. A first shaft oil passage communicating with the engagement-side oil chamber and a second shaft oil passage communicating with the second lubricant passage are formed in an input shaft. | 01-30-2014 |
20140251746 | STARTING DEVICE - A starting device configured with a multi-plate clutch and a damper device. The damper device may include an input element to which power from a motor is transmitted via the multi-plate clutch, an outer peripheral-side elastic body to which the power is transmitted from the input element, an inner peripheral-side elastic body that is placed on an inner peripheral side of the outer peripheral-side elastic body, an intermediate element that transmits the power from the outer peripheral-side elastic body to the inner peripheral-side elastic body, and an output element to which the power is transmitted from the inner peripheral-side elastic body. The input element may be coupled to a clutch drum of the multi-plate clutch so that the input element and the clutch drum interpose the intermediate element therebetween. | 09-11-2014 |