Patent application number | Description | Published |
20110096291 | Systems for Extended Depth Fourier Domain Optical Coherence Tomography (FDOCT) and Related Methods - Systems for extended depth frequency domain optical coherence tomography are provided including a detection system configured to sample spectral elements at substantially equal frequency intervals, wherein a spectral width associated with the sampled spectral elements is not greater than one-half of the frequency interval. Related methods are also provided herein. | 04-28-2011 |
20110102802 | Systems for Comprehensive Fourier Domain Optical Coherence Tomography (FDOCT) and Related Methods - Optical coherence tomography systems for imaging a whole eye are provided including a sample arm including focal optics that are configured to rapidly switch between at least two scanning modes in less than about 1.0 second. | 05-05-2011 |
20110150293 | Methods, Systems and Computer Program Products for Biometric Identification by Tissue Imaging Using Optical Coherence Tomography (OCT) - Optical coherence tomography (OCT) imaging systems for imaging uniquely identifiable structure are provided including a source having an associated source arm path and having an associated reference arm path coupled to the source path, the reference arm path having an associated reference arm path length. A sample having an associated sample arm path coupled to the source arm and reference arm paths is provided. Processing methods to convert the depth-dependent image data to a uniquely identifiable code are provided. Related methods and computer program products are also provided. | 06-23-2011 |
20110160576 | Methods, Systems and Computer Program Products for Diagnosing Conditions Using Unique Codes Generated from a Multidimensional Image of a Sample - Methods of providing a diagnosis using a digital code associated with an image are provided including collecting a multidimensional image, the multidimensional image having at least two dimensions; extracting a two dimensional subset of the multidimensional image; reducing the multidimensional image to a first code that is unique to the multidimensional image based on the extracted two dimensional image; comparing the first unique code associated with the subject to a library of reference codes, each of the reference codes in the library of reference codes being indicative of a class of objects; determining if the subject associated with the first unique code falls into at least one of the classes of objects associated with the reference codes based on a result of the comparison; and formulating a diagnostic decision based on the whether the first unique code associated with the subject falls into at least one of the classes associated with the reference code. Related systems and computer program products are also provided herein. | 06-30-2011 |
20110216956 | Methods, Systems and Computer Program Products for Collapsing Volume Data to Lower Dimensional Representations Thereof - Methods of collapsing volume data to a lower dimensional representation of the volume data are provided. The methods include collapsing volume data to a lower dimensional representation of the volume data using histogram projection. Related systems and computer program products are also provided. | 09-08-2011 |
20120033227 | Compact Multimodality Optical Coherence Tomography Imaging Systems and Related Methods and Computer Program Products - Systems for imaging a sample are provided. The system includes an optical coherence tomography (OCT) imaging portion having an associated OCT path defined by one set of optical elements between an OCT signal delivery optical fiber and the sample; an image capture portion having an associated image capture path defined by a second set of optical elements between an image capture device and the sample, different from the OCT path; and an illuminator portion having an associated illumination path defined by a third set of optical elements between an illumination source and the sample. The OCT path, the image capture path, and the illuminator path have at least one optical element in common, and the respective paths differ from each other by at least one optical element. The OCT path and the image capture path share a common intermediate conjugate image plane. Focal control is achieved for the OCT path and the image capture path concurrently through adjustment of one or more common optical elements distal to the common intermediate conjugate plane, such that focal control requires no differential adjustment between optical elements not in common to both paths. | 02-09-2012 |
20120242988 | Linearized Variable-Dispersion Spectrometers and Related Assemblies - Wavenumber linear spectrometers are provided including an input configured to receive electromagnetic radiation from an external source; collimating optics configured to collimate the received electromagnetic radiation; a dispersive assembly including first and second diffractive gratings, wherein the first diffraction grating is configured in a first dispersive stage to receive the collimated electromagnetic radiation and wherein the dispersive assembly includes at least two dispersive stages configured to disperse the collimated input; and an imaging lens assembly configured to image the electromagnetic radiation dispersed by the at least two dispersive stages onto a linear detection array such that the variation in frequency spacing along the linear detection array is no greater than about 10%. | 09-27-2012 |
20120275677 | Image Analysis System and Related Methods and Computer Program Products - Methods are provided including receiving a plurality of images from at least one image acquisition system; selecting at least a portion of a set of images for analysis using at least one attribute of image metadata; selecting at least one method for deriving quantitative information from the at least a portion of the set of images; processing the selected at least a portion of the set of images with the selected at least one method for deriving quantitative information; associating the derived quantitative information with the at least a portion of the set of images via a data structure; selecting at least one method for aggregating at least a portion of a set of derived quantitative information into a reduced set of results; and generating at least one report to represent the reduced set of results for one of an individual image and the set of images as a pool. | 11-01-2012 |
20130100406 | Systems for Extended Depth Frequency Domain Optical Coherence Tomography (FDOCT) and Related Methods - Systems for extended depth frequency domain optical coherence tomography are provided including a detection system configured to sample spectral elements at substantially equal frequency intervals, wherein a spectral width associated with the sampled spectral elements is not greater than one-half of the frequency interval. Related methods are also provided herein. | 04-25-2013 |
20130182895 | Spectral Domain Optical Coherence Tomography Analysis and Data Mining Systems and Related Methods and Computer Program Products - Methods for analyzing images acquired using an image acquisition system include receiving a plurality of images from at least one image acquisition system; selecting at least a portion of a set of images for analysis using at least one attribute of image metadata; selecting at least one method for deriving quantitative information from the at least a portion of the set of images; processing the selected at least a portion of the set of images with the selected at least one method for deriving quantitative information to generate an intermediate set of quantitative data associated with the at least a portion of the set of images; and storing the intermediate set of quantitative data and the metadata in a reference database, the reference database including intermediate sets of quantitative data and associated metadata for images associated with a plurality of subjects. | 07-18-2013 |
20130202176 | Systems for Processing Images Generated Using Fourier Domain Optical Coherence Tomography (FDOCT) - Methods, systems and computer program products for managing frequency domain optical coherence tomography (FDOCT) image resolution. A spectrum used to acquire an image of a subject is calibrated and default dispersion correction parameters are set. Default dispersion management parameters associated with a region of the image of the subject are also set. The image of the subject is acquires after setting the default dispersion correction parameters and the default dispersion management parameters. A quality of the acquired image is compared to a quality metric for the acquired image. The dispersion correction parameters are adjusted if the quality of the acquired image does not meet or exceed the quality metric for the acquired image. The acquired image is reprocesses based on the adjusted dispersion correction parameters. The steps of comparing, adjusting and reprocessing are repeated until the acquired image meets or exceeds the quality metric for the acquired image. | 08-08-2013 |
20130329188 | Systems for Extended Depth Frequency Domain Optical Coherence Tomography (FDOCT) and Related Methods - Systems for extended depth frequency domain optical coherence tomography are provided including a detection system configured to sample spectral elements at substantially equal frequency intervals, wherein a spectral width associated with the sampled spectral elements is not greater than one-half of the frequency interval. Related methods are also provided herein. | 12-12-2013 |
20140160431 | Systems for Comprehensive Fourier Domain Optical Coherence Tomography (FDOCT) and Related Methods - Optical coherence tomography systems for imaging a whole eye are provided including a sample arm including focal optics that are configured to rapidly switch between at least two scanning modes in less than about 1.0 second. | 06-12-2014 |
20140300902 | Systems for Extended Depth Frequency Domain Optical Coherence Tomography (FDOCT) and Related Methods - Systems for extended depth frequency domain optical coherence tomography are provided including including a detection system configured to sample spectral elements at substantially equal frequency intervals, wherein a spectral width associated with the sampled spectral elements is not greater than one-half of the frequency interval. Related methods are also provided herein. | 10-09-2014 |
20140313509 | Linearized Variable-Dispersion Spectrometers and Related Assemblies - Wavenumber linear spectrometers are provided including an input configured to receive electromagnetic radiation from an external source; collimating optics configured to collimate the received electromagnetic radiation; a dispersive assembly including first and second diffractive gratings, wherein the first diffraction grating is configured in a first dispersive stage to receive the collimated electromagnetic radiation and wherein the dispersive assembly includes at least two dispersive stages configured to disperse the collimated input; and an imaging lens assembly configured to image the electromagnetic radiation dispersed by the at least two dispersive stages onto a linear detection array such that the variation in frequency spacing along the linear detection array is no greater than about 10%. | 10-23-2014 |
20140341459 | Methods, Systems and Computer Program Products for Diagnosing Conditions Using Unique Codes Generated from a Multidimensional Image of a Sample - Methods of providing a diagnosis using a digital code associated with an image are provided including collecting a multidimensional image, the multidimensional image having at least two dimensions; extracting a two dimensional subset of the multidimensional image; reducing the multidimensional image to a first code that is unique to the multidimensional image based on the extracted two dimensional image; comparing the first unique code associated with the subject to a library of reference codes, each of the reference codes in the library of reference codes being indicative of a class of objects; determining if the subject associated with the first unique code falls into at least one of the classes of objects associated with the reference codes based on a result of the comparison; and formulating a diagnostic decision based on the whether the first unique code associated with the subject falls into at least one of the classes associated with the reference code. Related systems and computer program products are also provided herein. | 11-20-2014 |
20150103355 | Compact Multimodality Optical Coherence Tomography Imaging Systems - Systems for imaging a sample are provided. The system includes an optical coherence tomography (OCT) imaging portion having an associated OCT path defined by one set of optical elements between an OCT signal delivery optical fiber and the sample; an image capture portion having an associated image capture path defined by a second set of optical elements between an image capture device and the sample, different from the OCT path; and an illuminator portion having an associated illumination path defined by a third set of optical elements between an illumination source and the sample. The OCT path, the image capture path, and the illuminator path have at least one optical element in common, and the respective paths differ from each other by at least one optical element. The OCT path and the image capture path share a common intermediate conjugate image plane. Focal control is achieved for the OCT path and the image capture path concurrently through adjustment of one or more common optical elements distal to the common intermediate conjugate plane, such that focal control requires no differential adjustment between optical elements not in common to both paths. | 04-16-2015 |
20150157205 | Systems and Methods for Quantitative Doppler Optical Coherence Tomography - Methods of obtaining a measure of blood flow using a Fourier domain optical coherence tomography (FDOCT) system is provided. The method includes obtaining a first optical coherence tomography (OCT) survey scan of a retina of a subject using an OCT scan beam and obtaining a second OCT scan of the retina. The second OCT scan is within an area defined by the obtained first OCT scan and includes a region of retinal blood vessels emerging from and returning to an Optic Nerve Head (ONH) of the retina. An optical phase change is determined from the obtained second OCT scan, the optical phase change being associated with blood flow in a retinal blood vessel in the region of the second OCT scan. An angle of the retinal blood vessel associated with the optical phase change is determined, the angle being measured relative to a direction of transmission of the OCT scan beam. A quantitative measure of vessel blood flow is computed using the optical phase change and the vessel angle relative to the direction of the OCT scan beam. | 06-11-2015 |
Patent application number | Description | Published |
20100236603 | Concentrator-Type Photovoltaic (CPV) Modules, Receiver and Sub-Receivers and Methods of Forming Same - CPV modules include a back plate having an array of 1 mm | 09-23-2010 |
20100248484 | Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby - Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer. | 09-30-2010 |
20110279014 | OLED DEVICE WITH EMBEDDED CHIP DRIVING - An electroluminescent device having a plurality of current driven pixels arranged in rows and columns, such that when current is provided to a pixel it produces light, including each pixel having first and second electrodes and current responsive electroluminescent media disposed between the first and second electrodes; at least one chiplet having a thickness less than 20 micrometers; including transistor drive circuitry for controlling the operation of at least four pixels, the chiplet being mounted on a substrate and having connection pads; a planarization layer disposed over at least a portion of the chiplet; a first conductive layer over the planarization layer and connected to at least one of the connection pads; and a structure for providing electrical signals through the first conductive layer and at least one of the connection pads of the chiplet so that the transistor drive circuitry of the chiplet controls current to the four pixels. | 11-17-2011 |
20120126229 | INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRATED CIRCUIT ELEMENTS WITH IMPROVED INTERCONNECTION ALIGNMENT TOLERANCE - An electronic component array includes a backplane substrate, and a plurality of integrated circuit elements on the backplane substrate. Each of the integrated circuit elements includes a chiplet substrate having a connection pad and a conductor element on a surface thereof. The connection pad and the conductor element are electrically separated by an insulating layer that exposes at least a portion of the connection pad. At least one of the integrated circuit elements is misaligned on the backplane substrate relative to a desired position thereon. A plurality of conductive wires are provided on the backplane substrate including the integrated circuit elements thereon, and the connection pad of each of the integrated circuit elements is electrically connected to a respective one of the conductive wires notwithstanding the misalignment of the at least one of the integrated circuit elements. Related fabrication methods are also discussed. | 05-24-2012 |
20120228669 | HIGH-YIELD FABRICATION OF LARGE-FORMAT SUBSTRATES WITH DISTRIBUTED, INDEPENDENT CONTROL ELEMENTS - A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s). | 09-13-2012 |
20120313241 | METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS - A method for selectively transferring active components from a source substrate to a destination substrate includes pressing a first stamp having first pillars protruding therefrom against active components on the source substrate to adhere respective primary surfaces of the active components including electrical connections thereon to respective transfer surfaces of the first pillars. A second stamp having second pillars protruding therefrom is pressed against the active components on the first stamp to adhere respective secondary surfaces of the active components to respective transfer surfaces of the second pillars. The transfer surfaces of the second pillars have greater adhesive strength than the first pillars. The second stamp is pressed against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate. | 12-13-2012 |
20120314388 | SUBSTRATES WITH TRANSFERABLE CHIPLETS - A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength. The breakable tethers physically secure the active components to the intermediate substrate. | 12-13-2012 |
20130153277 | ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS - An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed. | 06-20-2013 |
20130196474 | MATERIALS AND PROCESSES FOR RELEASING PRINTABLE COMPOUND SEMICONDUCTOR DEVICES - A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed. | 08-01-2013 |
20130221355 | STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS - A substrate includes an anchor area ( | 08-29-2013 |
20140034127 | SURFACE-MOUNTABLE LENS CRADLES AND INTERCONNECTION STRUCTURES FOR CONCENTRATOR-TYPE PHOTOVOLTAIC DEVICES - A concentrator-type photovoltaic (CPV) receiver includes a solar cell on a substrate. The solar cell includes a light receiving surface having a conductive terminal thereon. A conductive lens support frame is mounted on the substrate and includes an opening therein that exposes the light receiving surface of the solar cell. A lens element is provided on the support frame opposite the light receiving surface of the solar cell. The support frame is electrically connected to the conductive terminal on the light receiving surface and an electrical node on the substrate. The support frame also supports and self-aligns the lens element with the light receiving surface to concentrate incident light thereon. Related fabrication processes are also discussed. | 02-06-2014 |
20140048128 | SURFACE MOUNTABLE SOLAR RECEIVER WITH INTEGRATED THROUGH SUBSTRATE INTERCONNECT AND OPTICAL ELEMENT CRADLE - A concentrator-type photovoltaic (CPV) device includes a solar cell comprising a substrate including a light receiving surface and a mounting surface opposite the light receiving surface. A conductive through-substrate interconnect having insulated sidewalls extends through the substrate from the mounting surface to the light receiving surface to provide an electrical connection to a conductive terminal on the light receiving surface. A lens support structure is formed on the light receiving surface, and a lens element is provided on the support structure opposite the light receiving surface. The support structure supports and aligns the lens element with the light receiving surface to concentrate incident light thereon. Related fabrication processes are also discussed. | 02-20-2014 |
20140261628 | HIGH EFFICIENCY SOLAR RECEIVERS INCLUDING STACKED SOLAR CELLS FOR CONCENTRATOR PHOTOVOLTAICS - A solar receiver includes at least two electrically independent photovoltaic cells which are stacked. An inter-cell interface between the photovoltaic cells includes a multi-layer dielectric stack. The multi-layer dielectric stack includes at least two dielectric layers having different refractive indices. Related devices and fabrication methods are also discussed. | 09-18-2014 |
20140264937 | Through-Silicon Vias and Interposers Formed by Metal-Catalyzed Wet Etching - Provided are methods for making a through-silicon via feature in a silicon substrate and related systems, such as by forming a noble metal structure on a silicon substrate support surface to generate silicon substrate contact regions that are in contact with or proximate to the noble metal structure; exposing at least a portion of the silicon substrate support surface and noble metal structure to an etchant to preferentially etch the silicon substrate contact regions compared to silicon substrate non-contact regions until the etch front reaches the silicon substrate bottom surface. | 09-18-2014 |
20150079783 | Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby - Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer. | 03-19-2015 |
20150135525 | METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS - A method for selectively transferring active components from a source substrate to a destination substrate includes providing a source substrate having a process side including active components and a back side opposite the process side, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces and facing the back side; pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; pressing a second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars, wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars; and pressing the second stamp including the active components on the second pillars thereof against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate. | 05-21-2015 |
20150163906 | Substrates with Transferable Chiplets - A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The transparent intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the transparent intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the transparent intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength. The breakable tethers physically secure the active components to the transparent intermediate substrate. Related devices are also discussed. | 06-11-2015 |
Patent application number | Description | Published |
20090057879 | STRUCTURE AND PROCESS FOR ELECTRICAL INTERCONNECT AND THERMAL MANAGEMENT - A structure and method for thermal management of integrated circuits. The structure for thermal management of integrated circuits includes first and second substrates bonded together, at least one of the first and second substrates including at least one circuit element, an entrance through-hole having a length extending through a thickness of at least one of the first substrate and the second substrate, an exit through-hole having a length extending through a thickness of at least one of the first substrate and the second substrate, a bonding element forming a seal between the first and second substrates and forming a space between the first and second substrate, and a coolant channel formed in the space between the first and second substrates such that a fluid entering the entrance through-hole transits the coolant channel and the exit through-hole to provide cooling to the circuit element. The method supplies a fluid through the entrance through-hole, flows the fluid through the coolant channel between the first substrate and second substrates, and removes the fluid from the coolant channel through the exit through-hole. | 03-05-2009 |
20110006204 | HIGH DENSITY FARADAY CUP ARRAY OR OTHER OPEN TRENCH STRUCTURES AND METHOD OF MANUFACTURE THEREOF - A detector array and method for making the detector array. The detector array includes a substrate including a plurality of trenches formed therein, and a plurality of collectors electrically isolated from each other, formed on the walls of the trenches, and configured to collect charged particles incident on respective ones of the collectors and to output from the collectors signals indicative of charged particle collection. In the detector array, adjacent ones of the plurality of trenches are disposed in a staggered configuration relative to one another. The method forms in a substrate a plurality of trenches across a surface of the substrate such that adjacent ones of the trenches are in a staggered sequence relative to one another, forms in the plurality of trenches a plurality of collectors, and connects a plurality of electrodes respectively to the collectors. | 01-13-2011 |
20110017703 | SELECTIVE PLANARIZATION METHOD AND DEVICES FABRICATED ON PLANARIZED STRUCTURES - A method and system for treating a surface structure of a workpiece. The method provides a carrier-gel to the surface structure of the workpiece. The carrier-gel includes an etchant for selectively etching a first material of the surface structure and has a gel particle size larger than the surface structure. The method etches the first material from the surface structure by a reaction of the etchant included in the carrier-gel with the first material of the surface structure in order to remove a part of the first material from the surface structure for subsequent device fabrication. The system includes a chemical reactor supporting the workpiece. The chemical reactor is configured to flow the carrier-gel noted to the surface structure of the workpiece in order to remove the first material from the surface structure. | 01-27-2011 |
20110031388 | FARADAY CUP ARRAY INTEGRATED WITH A READOUT IC AND METHOD FOR MANUFACTURE THEREOF - A detector array and method for making the detector array. The array includes a substrate including a plurality of trenches formed therein, and includes a plurality of collectors electrically isolated from each other, formed on the walls of the trenches, and configured to collect charge particles incident on respective ones of the collectors and to output from said collectors signals indicative of charged particle collection. The array includes a plurality of readout circuits disposed on a side of the substrate opposite openings to the collectors. The readout circuits are configured to read charge collection signals from respective ones of the plurality of collectors. | 02-10-2011 |
20110298134 | THREE DIMENSIONAL INTERCONNECT STRUCTURE AND METHOD THEREOF - A three-dimensional interconnect includes a first substrate bonded to a second substrate, the first substrate including a device layer and a bulk semiconductor layer, a metal pad disposed on the second substrate, an electrically insulating layer disposed between the first and second substrates. The structure has a via-hole extending through the device layer, the bulk semi-conductor layer and the electrically insulating layer to the metal pad on the second substrate. The structure has a dielectric coating on a sidewall of the via-hole, and a plasma-treated region of the metal pad disposed on the second substrate. The structure includes a via metal monolithically extending from the plasma-treated region of the metal pad through the via-hole and electrically interconnecting the device layer of the first substrate to the metal pad of the second substrate. | 12-08-2011 |