Patent application number | Description | Published |
20090088839 | POLYMER COMPOSITIONS SUITABLE FOR INTRAOCULAR LENSES AND RELATED METHODS - A polymeric material with a molecular response time that makes it suitable for use near fragile body tissues. The polymeric material is useful for both low modulus and high modulus applications thereby simplifying the multi-part polymeric article manufacturing process and creating better integrated multi-part polymeric articles. Cross-linked polymers with different moduli may be obtained utilizing the same or similar starting materials but modifying the amount of catalyst, the amount of cross-linking agent, and/or the amount of methyl vinyl cyclics. | 04-02-2009 |
20090163602 | SILICONE CONTAINING POLYMERIC MATERIALS - A polymeric material with a variable modulus of elasticity is described herein. The polymeric material described herein is useful for forming implantable medical devices (e.g. ophthalmic lenses, breast implants, and body augmentation devices). In addition, medical devices formed from the polymer material can be used to controllably release a therapeutic agent. Also, the polymeric material may be used to prepare topical compositions or other applications or devices where control of a mechanical property such as material modulus is important. | 06-25-2009 |
20110295264 | Intraocular Lens Insertion Devices - A cartridge for an intraocular lens insertion device is disclosed. An example cartridge may include an intraocular lens insertion cartridge body having a distal end and a proximal end and configured to receive an intraocular lens for insertion into a patient's eye through an incision; the intraocular lens insertion cartridge body having an inner surface comprising at least one polymeric material having a hardness greater than about 50 D and an elongation at break greater than about 150%; the inner surface of the intraocular lens insertion cartridge body defining an at least partially tapering insertion pathway disposed within the intraocular lens insertion cartridge body and extending from the proximal end to the distal end of the intraocular lens insertion cartridge body. | 12-01-2011 |
20120041554 | MEDICAL DEVICES HAVING SOFT, FLEXIBLE LUBRICIOUS COATINGS - Soft, flexible highly lubricious coatings for polymeric IOL insertion cartridges that allow IOLs to be easily inserted through small bore cartridges suitable for use with small (less than 3 mm) incisions are provided. These lubricious coatings allow IOLs to be inserted into the eye of a patient without the risk of lens damage or transfer of lubricants to the lens surface during implantation. Specifically, polymeric coatings comprising a matrix polymer having an equivalent weight greater than 5000 g/eq are used to form interpenetrating networks (IPN) on the surface of hydrophobic structural polymers. The IPNs thus formed entrap highly lubricious hydrophilic compounds within the IPN using multi-functional cross linkers. | 02-16-2012 |
20120095125 | SILICONE CONTAINING POLYMERIC MATERIALS - A polymeric material with a variable modulus of elasticity is described herein. The polymeric material described herein is useful for forming implantable medical devices (e.g. ophthalmic lenses, breast implants, and body augmentation devices). In addition, medical devices formed from the polymer material can be used to controllably release a therapeutic agent. Also, the polymeric material may be used to prepare topical compositions or other applications or devices where control of a mechanical property such as material modulus is important. | 04-19-2012 |
20120184703 | SILICONE CONTAINING POLYMERIC MATERIALS - A polymeric material with a variable modulus of elasticity is described herein. The polymeric material described herein is useful for forming implantable medical devices (e.g. ophthalmic lenses, breast implants, and body augmentation devices). In addition, medical devices formed from the polymer material can be used to controllably release a therapeutic agent. Also, the polymeric material may be used to prepare topical compositions or other applications or devices where control of a mechanical property such as material modulus is important. | 07-19-2012 |
20120186718 | POLYMER COMPOSITIONS SUITABLE FOR INTRAOCULAR LENSES AND RELATED METHODS - A polymeric material with a molecular response time that makes it suitable for use near fragile body tissues. The polymeric material is useful for both low modulus and high modulus applications thereby simplifying the multi-part polymeric article manufacturing process and creating better integrated multi-part polymeric articles. Cross-linked polymers with different moduli may be obtained utilizing the same or similar starting materials but modifying the amount of catalyst, the amount of cross-linking agent, and/or the amount of methyl vinyl cyclics. | 07-26-2012 |
20130184417 | SILICONE CONTAINING POLYMERIC MATERIALS - A polymeric material with a variable modulus of elasticity is described herein. The polymeric material described herein is useful for forming implantable medical devices (e.g. ophthalmic lenses, breast implants, and body augmentation devices). In addition, medical devices formed from the polymer material can be used to controllably release a therapeutic agent. Also, the polymeric material may be used to prepare topical compositions or other applications or devices where control of a mechanical property such as material modulus is important. | 07-18-2013 |
20140188122 | INTRAOCULAR LENS INSERTION DEVICE - A cartridge for an intraocular lens insertion device is disclosed. An example cartridge may include an intraocular lens insertion cartridge body having a distal end and a proximal end and configured to receive an intraocular lens for insertion into a patient's eye through an incision; the intraocular lens insertion cartridge body having an inner surface comprising at least one polymeric material having a hardness greater than about 50D and an elongation at break greater than about 150%; the inner surface of the intraocular lens insertion cartridge body defining an at least partially tapering insertion pathway disposed within the intraocular lens insertion cartridge body and extending from the proximal end to the distal end of the intraocular lens insertion cartridge body. | 07-03-2014 |
20140277439 | SURFACE TREATMENT OF SILICONE MATERIALS - Disclosed herein are surface treatments for soft silicone gel materials such as silicone intraocular lenses. | 09-18-2014 |
20150157454 | IOL Insertion Apparatus - An intraocular lens insertion apparatus includes a hollow tube having an interior wall defining a hollow space through which an intraocular lens may be passed from the open space into an eye. A lubricity enhancing component is covalently bonded to the hollow tube at the interior wall in an amount effective to facilitate the passage of the intraocular lens through the hollow space. The lubricity enhancing component includes a substituent component effective to reduce hydrolysis of said lubricity enhancing component relative to an identical lubricity enhancing component without the substituent component. | 06-11-2015 |
20160081795 | INTRAOCULAR LENS INSERTION DEVICE - A cartridge for an intraocular lens insertion device is disclosed. An example cartridge may include an intraocular lens insertion cartridge body having a distal end and a proximal end and configured to receive an intraocular lens for insertion into a patient's eye through an incision; the intraocular lens insertion cartridge body having an inner surface comprising at least one polymeric material having a hardness greater than about 50D and an elongation at break greater than about 150%; the inner surface of the intraocular lens insertion cartridge body defining an at least partially tapering insertion pathway disposed within the intraocular lens insertion cartridge body and extending from the proximal end to the distal end of the intraocular lens insertion cartridge body. | 03-24-2016 |
Patent application number | Description | Published |
20120175773 | Thermal Enhanced Package Using Embedded Substrate - An integrated circuit (IC) device is provided. The IC device includes an IC die having opposing first and second surfaces, a carrier coupled to the first surface of the IC die, a laminate coupled to the carrier and the second surface of the IC die, and a trace located on a surface of the laminate and electrically coupled to a bond pad located on the second surface of the IC die. The trace is configured to couple the bond pad to a circuit board. | 07-12-2012 |
20130075917 | Multi-Chip and Multi-Substrate Reconstitution Based Packaging - Embodiments for multi-chip and multi-substrate reconstitution based packaging are provided. Example packages are formed using substrates from a reconstitution. substrate panel or strip. The reconstitution substrate panel or strip may include known good substrates of same or different material types and/or same of different layer counts and sizes. As such, different combinations of reconstitution substrates and chips can be used within the same package, thereby allowing substrate customization according to semiconductor chip block(s) and types contained in the package. | 03-28-2013 |
20130134596 | Wafer Level Semiconductor Package - There are disclosed herein various implementations of improved wafer level semiconductor packages. One exemplary implementation comprises forming a post-fabrication redistribution layer (post-Fab RDL) between first and second dielectric layers affixed over a surface of a wafer, and forming a window for receiving an electrical contact body in the second dielectric layer, the window exposing the post-Fab RDL. At least one of the first and second dielectric layers is a pre-formed dielectric layer, which may be affixed over the surface of the wafer using a lamination process. In one implementation, the window is formed using a direct laser ablation process. | 05-30-2013 |
20130154106 | Stacked Packaging Using Reconstituted Wafers - An exemplary implementation of the present disclosure includes a stacked package having a top die from a top reconstituted wafer situated over a bottom die from a bottom reconstituted wafer. The top die and the bottom die are insulated from one another by an insulation arrangement. The top die and the bottom die are also interconnected through the insulation arrangement. The insulation arrangement can include a top molding compound that flanks the top die and a bottom molding compound that flanks the bottom die. The top die and the bottom die can be interconnected through at least the top molding compound. Furthermore, the top die and the bottom die can be interconnected through a conductive via that extends within the insulation arrangement. | 06-20-2013 |
20130168841 | Programmable Interposer with Conductive Particles - An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable interposer. The conductive particles are capable of forming an aligned configuration between the top and bottom interface electrodes in response to application of an energy field to the programmable interposer so as to electrically connect the top and bottom interface electrodes. The conductive particles can have a conductive outer surface. Also, the conductive particles can be spherical. The conductive particles can be within a bulk material in an interface layer in the programmable interposer, and the bulk material can be cured to secure programmed paths between the top and bottom interface electrodes. | 07-04-2013 |
20130168854 | Semiconductor Package with a Bridge Interposer - There are disclosed herein various implementations of semiconductor packages including a bridge interposer. One exemplary implementation includes a first active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The semiconductor package also includes a second active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The second portion of the first active die and the second portion of the second active die include solder balls mounted on a package substrate, and are configured to communicate electrical signals to the package substrate utilizing the solder balls and without utilizing through-semiconductor vias (TSVs). | 07-04-2013 |
20130168860 | Semiconductor Package with Ultra-Thin Interposer Without Through-Semiconductor Vias - There are disclosed herein various implementations of semiconductor packages including an interposer without through-semiconductor vias (TSVs). One exemplary implementation includes a first active die situated over an interposer. The interposer includes an interposer dielectric having intra-interposer routing traces. The first active die communicates electrical signals to a package substrate situated below the interposer utilizing the intra-interposer routing traces and without utilizing TSVs. In one implementation, the semiconductor package includes a second active die situated over the interposer, the second active die communicating electrical signals to the package substrate utilizing the intra-interposer routing traces and without utilizing TSVs. Moreover, in one implementation, the first active die and the second active die communicate chip-to-chip signals through the interposer. | 07-04-2013 |
20130181354 | Semiconductor Interposer Having a Cavity for Intra-Interposer Die - A semiconductor package may include a substrate, and a semiconductor interposer having a cavity and a plurality of through semiconductor vias. The semiconductor interposer is situated over the substrate. An intra-interposer die is disposed within the cavity of the semiconductor interposer. A thermally conductive adhesive is disposed within the cavity and contacts the intra-interposer die. Additionally, a top die is situated over the semiconductor interposer. In one implementation, the semiconductor interposer is a silicon interposer. In another implementation, the semiconductor interposer is flip-chip mounted to the substrate such that the intra-interposer die disposed within the cavity faces the substrate. In yet another implementation, the cavity in the semiconductor interposer may extend from a top surface of the semiconductor interposer to a bottom surface of the semiconductor interposer and a thermal interface material may be disposed between the intra-interposer die and the substrate. | 07-18-2013 |
20130193587 | Semiconductor Package Having an Interposer Configured for Magnetic Signaling - There are disclosed herein various implementations of semiconductor packages having an interposer configured for magnetic signaling. One exemplary implementation includes a die transmit pad in an active die for transmitting a magnetic signal corresponding to a die electrical signal produced by the active die, and an interposer magnetic tunnel junction (MTJ) pad in the interposer for receiving the magnetic signal. A sensing circuit is coupled to the interposer MTJ pad for producing a receive electrical signal corresponding to the magnetic signal. In one implementation, the sensing circuit is configured to sense a resistance of the interposer MTJ pad and to produce the receive electrical signal according to the sensed resistance. | 08-01-2013 |
20130193996 | Semiconductor Package with Improved Testability - An exemplary implementation of the present disclosure includes a testable semiconductor package that includes an active die having interface contacts and dedicated testing contacts. An interposer is situated adjacent a bottom surface of the active die, the interposer providing electrical connections between the interface contacts and a bottom surface of the testable semiconductor package. At least one conductive medium provides electrical connection between at least one of the dedicated testing contacts and a top surface of the testable semiconductor package. The at least one conductive medium can be coupled to a package-top testing connection, which may include a solder ball. | 08-01-2013 |
20130221499 | Semiconductor Package with Integrated Electromagnetic Shielding - There are disclosed herein various implementations of a shield interposer situated between a top active die and a bottom active die for shielding the active dies from electromagnetic noise. One implementation includes an interposer dielectric layer, a through-silicon via (TSV) within the interposer dielectric layer, and an electromagnetic shield. The TSV connects the electromagnetic shield to a first fixed potential. The electromagnetic shield may include a grid of conductive layers laterally extending across the shield interposer. The shield interposer may also include another electromagnetic shield connected to another fixed potential. | 08-29-2013 |
20130221500 | System-In-Package with Integrated Socket - There are disclosed herein various implementations of a system-in-package with integrated socket. In one such implementation, the system-in-package includes a first active die having a first plurality of electrical connectors on a top surface of the first active die, an interposer situated over the first active die, and a second active die having a second plurality of electrical connectors on a bottom surface of the second active die. The interposer is configured to selectively couple at least one of the first plurality of electrical connectors to at least one of the second plurality of electrical connectors. In addition, a socket encloses the first and second active dies and the interposer, the socket being electrically coupled to at least one of the first active die, the second active die, and the interposer. | 08-29-2013 |
20130221506 | Semiconductor Packages with Integrated Heat Spreaders - One implementation of present disclosure includes a semiconductor package stack. The semiconductor package stack includes an upper package coupled to a lower package by a plurality of solder balls. The semiconductor package stack also includes a lower active die situated in a lower package substrate in the lower package. The lower active die is thermally coupled to a heat spreader in the upper package by a thermal interface material. An upper active die is situated in an upper package substrate in the upper package, the upper package substrate being situated over the heat spreader. The thermal interface material can include an array of aligned carbon nanotubes within a filler material. The heat spreader can include at least one layer of metal or metal alloy. Furthermore, the heat spreader can be connected to ground or a DC voltage source. The plurality of solder balls can be situated under the heat spreader. | 08-29-2013 |
20130221525 | Semiconductor Package with Integrated Selectively Conductive Film Interposer - There are disclosed herein various implementations of semiconductor packages having a selectively conductive film interposer. In one such implementation, a semiconductor package includes a first active die having a first plurality of electrical connectors on a top surface of the first active die, a selectively conductive film interposer situated over the first active die, and a second active die having a second plurality of electrical connectors on a bottom surface of the second active die. The selectively conductive film interposer may be configured to serve as an interposer and to selectively couple at least one of the first plurality of electrical connectors to at least one of the second plurality of electrical connectors. | 08-29-2013 |
20140084462 | Wafer Level Semiconductor Package - There are disclosed herein various implementations of improved wafer level semiconductor packages. One exemplary implementation comprises forming a post-fabrication redistribution layer (post-Fab RDL) between first and second dielectric layers affixed over a surface of a wafer, and forming a window for receiving an electrical contact body in the second dielectric layer, the window exposing the post-Fab RDL. At least one of the first and second dielectric layers is a pre-formed dielectric layer, which may be affixed over the surface of the wafer using a lamination process. In one implementation, the window is formed using a direct laser ablation process. | 03-27-2014 |
20140087553 | Fabricating a Wafer Level Semiconductor Package Having a Pre-formed Dielectric Layer - There are disclosed herein various implementations of improved wafer level semiconductor packages. One exemplary implementation comprises forming a post-fabrication redistribution layer (post-Fab RDL) between first and second dielectric layers affixed over a surface of a wafer, and forming a window for receiving an electrical contact body in the second dielectric layer, the window exposing the post-Fab RDL. At least one of the first and second dielectric layers is a pre-formed dielectric layer, which may be affixed over the surface of the wafer using a lamination process. In one implementation, the window is formed using a direct laser ablation process. | 03-27-2014 |
20140151900 | STACKED PACKAGING USING RECONSTITUTED WAFERS - An exemplary implementation of the present disclosure includes a stacked package having a top die from a top reconstituted wafer situated over a bottom die from a bottom reconstituted wafer. The top die and the bottom die are insulated from one another by an insulation arrangement. The top die and the bottom die are also interconnected through the insulation arrangement. The insulation arrangement can include a top molding compound that flanks the top die and a bottom molding compound that flanks the bottom die. The top die and the bottom die can be interconnected through at least the top molding compound. Furthermore, the top die and the bottom die can be interconnected through a conductive via that extends within the insulation arrangement. | 06-05-2014 |