Niki, JP
Ayao Niki, Ogaki-Shi JP
Patent application number | Description | Published |
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20090078451 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer. | 03-26-2009 |
20100095523 | MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD - A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes. | 04-22-2010 |
20100116529 | PRINTED WIRING BOARD HAVING A STIFFENER - To provide a novel multilayer printed wiring board in which a conductor on the outermost resin layer is positioned properly. Furthermore, to provide a novel multilayer printed wiring board in which productivity is enhanced when forming solder bumps on the pads for mounting a semiconductor element. In multilayer printed wiring board, multiple pads for connection with a semiconductor chip are formed on one surface, and on its opposite surface, external connection terminals for connection with another substrate are formed. The pads for connection with a semiconductor chip are formed in the central region of one surface, stiffener is formed in the peripheral region surrounding the pads for connection with a semiconductor chip, pads for connection with a semiconductor chip and stiffener are formed with the same material and are set to be the same height, and the actual area of the stiffener is determined according to the total area of the multiple pads for connection with a semiconductor chip. | 05-13-2010 |
20100243305 | SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. | 09-30-2010 |
20100243311 | SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer. | 09-30-2010 |
20110085306 | MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD - A coreless multilayer printed wiring board including a coreless layer having an opening, a conductive film formed on an upper surface of the coreless layer and closing one end of the opening of the coreless layer, a via-hole formed in the opening of the coreless layer, a first resin layer formed on the coreless layer and the conductive film and having an opening reaching to the conductive film, a via-hole formed in the opening of the first resin layer, a second resin layer formed on the upper surface of the first resin layer and having an opening, a via-hole formed in the opening of the second resin layer. The via-holes formed in the first and second resin layers are open in the direction opposite to the direction in which the via-hole formed in the coreless layer is open. | 04-14-2011 |
20110220399 | MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING THE BOARD - A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes. | 09-15-2011 |
20110296681 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component. | 12-08-2011 |
20110302779 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a printed wiring board including providing a support member having a metal surface, securing a metal foil to the metal surface such that the metal foil is joined or bonded to a peripheral portion of the metal surface, forming a resin insulation layer on the metal foil secured on the metal surface, forming an opening for a via conductor in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the opening a via conductor electrically connecting the conductive circuit and the metal foil such that a laminated sheet body is formed, and cutting a portion of the laminated sheet body inside the peripheral portion of the metal surface of the support member such that the metal foil releases the portion of the laminated sheet body from the support member. | 12-15-2011 |
20120181072 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer. | 07-19-2012 |
Isamu Niki, Anan-Shi JP
Patent application number | Description | Published |
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20080303043 | SEMICONDUCTOR LIGHT EMITTING DEVICE - At least one recess and/or protruding portion is created on the surface portion of a substrate for scattering or diffracting light generated in a light emitting region. The recess and/or protruding portion has a shape that prevents crystal defects from occurring in semiconductor layers. | 12-11-2008 |
20090042328 | SEMICONDUCTOR LIGHT EMITTING DEVICE - At least one recess and/or protruding portion is created on the surface portion of a substrate for scattering or diffracting light generated in a light emitting region. The recess and/or protruding portion has a shape that prevents crystal defects from occurring in semiconductor layers. | 02-12-2009 |
20100264445 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate. | 10-21-2010 |
20100264446 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate. | 10-21-2010 |
20100264447 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate. | 10-21-2010 |
20100266815 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate. | 10-21-2010 |
20100267181 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate. | 10-21-2010 |
20130183496 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate. | 07-18-2013 |
20140299974 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate. | 10-09-2014 |
Kazutaka Niki, Osaka JP
Patent application number | Description | Published |
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20130192405 | BICYCLE ELECTRIC ACTUATOR UNIT - A bicycle electric actuator unit basically has a housing, an electric drive part and a cable holding member. The electric drive part is disposed in the housing and electrically connected to an electrical cable. The cable holding member is provided at an outer surface of the housing to hold a portion of the electrical cable. The bicycle electric actuator unit can be for example part of an electric bicycle component such as an electric front derailleur or an electric rear derailleur. | 08-01-2013 |
Kazuya Niki, Osaka JP
Patent application number | Description | Published |
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20080266757 | ELECTRIC CIRCUIT DEVICE - An electric circuit device comprises an electric element and a conductive plate. The electric element comprises first and second anode electrodes and a cathode electrode. The first anode electrode is disposed on one end of the electric element in the longitudinal direction DR | 10-30-2008 |
20100277851 | ELECTRIC CIRCUIT DEVICE - An electric circuit device ( | 11-04-2010 |
20110273816 | SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A solid electrolytic capacitor includes a capacitor element, a conductive member, an electrical insulating member, and a tubular member. The element has an element body with a cathode layer, and an anode lead. The conductive member is placed to face a first end surface of the body through which the lead is pulled out. The electrical insulating member is placed between the conductive member and the body. The lead passes through a through hole defined in the electrical insulating member. A tip end portion of the lead is inserted into a through hole or a closed end hole defined in the conductive member to be electrically connected to the conductive member. Insertion of the body into the tubular member causes the tubular member to cover at least part of a side surface of the body, while making electrical connection between the tubular member and the cathode layer. | 11-10-2011 |
Kazuya Niki, Hirakata-Shi JP
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20100033904 | COMPOSITE ELECTRIC ELEMENT - [Problems] To provide an electric element which generates less heat even when its components are miniaturized and it carries a large amount of current, decreases the impedance by decreasing the inductance and is effective over high frequencies. | 02-11-2010 |
20100046135 | ELECTRIC ELEMENT - An electric element comprises a dielectric layers, conductive plates, anode electrodes, and cathode electrodes. The conductive plates and the conductive plates are alternately laminated in the width direction of the electric element. The anode electrodes are connected to each of the conductive plates with a predetermined distance. The cathode electrodes are connected to each of the conductive plates with a predetermined distance. The electric element is mounted on a substrate in a manner where the bottom surface makes contact with the substrate. The anode electrode is connected to a first signal line that has a width substantially equal to that of the electric element disposed on the substrate. The anode electrode is connected to a second signal line that has a width substantially equal to that of the electric element disposed on the substrate. | 02-25-2010 |
20100232084 | ELECTRIC ELEMENT AND ELECTRIC CIRCUIT - Each of the plurality of conductive plates is formed on a principal surface of each of stacked dielectric layers. Side anode electrodes are connected to positive electrodes of conductive plates, while side cathode electrodes are connected to cathodes of conductive plates. Anode electrodes are connected to the side anode electrodes. Cathode electrodes are connected to the side cathode electrodes. By passing DC currents through the positive conductive plates and cathode conductive plates so as to flow in the opposite directions, effective inductance of the positive conductive plates becomes smaller than its self-inductance. Consequently, the inductance is reduced, thereby lowering impedance. | 09-16-2010 |
Keitaro Niki, Susono-Shi JP
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20090271050 | TRAVEL CONTROL DEVICE - Information for generating a target speed pattern is computed from information acquired from various sensors and a running mode input switch, so as to generate the target speed pattern (S | 10-29-2009 |
20130096778 | VEHICLE TRAVEL CONTROL DEVICE - A travel control device for a vehicle has a steered angle varying device | 04-18-2013 |
20140012469 | VEHICLE INFORMATION PROCESSING DEVICE - A vehicle information processing device mounted on a vehicle includes a future position calculating unit configured to calculate a future position of the vehicle based on steering input information corresponding to a steering input, a vehicle state amount that prescribes a turning state, and a vehicle speed, and an estimating unit configured to estimate a turning curvature of the vehicle at a provisional travel position ahead of a present position based on at least three vehicle positions according to the vehicle including at least the one calculated future position as well as including a vehicle position corresponding to the present position of the vehicle. As a result, a turning curvature of the vehicle at a vehicle position ahead of a present position can be estimated by a simple configuration and further the estimated turning curvature can be preferably used to stabilize vehicle behavior. | 01-09-2014 |
Keitaro Niki, Aichi-Ken JP
Patent application number | Description | Published |
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20110257845 | STEERING CONTROL APPARATUS FOR VEHICLE - A coordinate-control-gain calculation section | 10-20-2011 |
20110272205 | ELECTRIC POWER STEERING DEVICE - An electric power steering device for a vehicle includes an estimation mechanism estimating if there is a possibility that a backward electric current flows in a booster circuit toward a vehicle battery device, and a boosting controller stopping the boosting operation of the booster circuit to prevent a backward electric current from flowing in the booster circuit when it is estimated that there is a possibility that a backward electric current flows by the estimation mechanism. The estimation mechanism estimates that there is a possibility that a backward electric current flows in the booster circuit when the steering condition of a steering wheel is a returning condition or a steering-held condition. Otherwise, the estimation mechanism estimates if a backward electric current flows on the basis of input and output voltages of the booster circuit and information on the switching of a first boosting switching element. Thereby, overheat of the booster circuit can be prevented. | 11-10-2011 |
Masahiko Niki, Wako-Shi JP
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20140353073 | ELECTRIC POWER STEERING APPARATUS - An electric power steering apparatus includes an electric motor configured to apply an assist torque to an steering system of a motor vehicle, a rotational quantity detection unit for detecting a rotational quantity of the electric motor while the rotational quantity detection unit is in a wake-up state, and a counter electromotive voltage detection unit for detecting a counter electromotive voltage of the electric motor. When a main power supply of the electric power steering apparatus is turned off, the rotational quantity detection unit enters into a sleep state, and when a prescribed condition is established based on the counter electromotive voltage detected by the counter electromotive voltage detection unit, the rotational quantity detection unit transitions from the sleep state to the wakeup state. | 12-04-2014 |
Masamitsu Niki, Kobe-Shi JP
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20110232386 | ULTRASONIC FLAW DETECTING APPARATUS AND ULTRASONIC FLAW DETECTING METHOD - According to one embodiment, An ultrasonic flaw detecting apparatus comprising: a transducer in which a piezoelectric element array for transmitting ultrasonic waves to and receiving echo signals from a test object; an element driving unit for scanning the piezoelectric element array at a predetermined cycle and causing the ultrasonic waves; a synthesizing unit for synthesizing an internal image of the test object based on the echo signals received by the piezoelectric element array; and a signal replacing unit for replacing the received echo signal with an echo signal in which a bottom echo of the test object is removed. | 09-29-2011 |
Masatoshi Niki, Toyonaka-Shi JP
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20090237866 | CHIP CAPACITOR - A capacitor element having an upper surface, a lower surface, a first end surface and a second end surface is coated with a cathode layer, except for the first end surface. Anode lead extends out from the first end surface. An anode terminal has a first portion located close to and beneath the lower surface of the capacitor element and has a second portion connected to the anode lead via an arcuate connector. A cathode terminal is disposed under the lower surface of the capacitor element, being spaced from the first portion of the anode terminal. A packaging resin covers the capacitor element, the anode terminal and the cathode terminal. A depression is formed in the anode terminal, which extends from a portion of the anode terminal facing the lower surface of the capacitor element to the inner edge of the anode terminal facing the cathode terminal. | 09-24-2009 |
Motoharu Niki, Shizuoka-Ken JP
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20110056080 | METHOD FOR MANUFACTURING A DRIVE WHEEL BEARING DEVICE - A method for manufacturing a drive wheel bearing device is provided. During the manufacturing, a swaged portion is formed in a manner as a non-hardened region, and in a manner that variations based on a reference surface in the axial direction of the flat surface are restricted within +/−0.2 mm The reference surface is provided with an end face on an outboard side of a flange for an attachment of a wheel or an end face on an inboard side of the flange for attachment to a vehicle body. Part of the swaged portion making contact with an outer joint member of to drive wheel bearing device is formed into a flat surface. Serrations and a pilot part are formed on an inner periphery of a first inner member of the drive wheel bearing device. An inner peripheral surface of the pilot part is formed as a turned surface, and the turned surface has been turned after forming the swaged portion. A serrated shaft is formed on the outer joint member for transmitting torque to and from the first inner member through the serrations and an outer periphery surface opposing to the pilot part. A surface hardened layer is formed on the outer joint member by heat treatment in a region that includes at least the serrated shaft. | 03-10-2011 |
20120295719 | DRIVE WHEEL BEARING DEVICE - A drive wheel bearing device is provided with an outer member, an inner member, double-row rolling elements and a constant velocity joint. The inner member includes double-row inner races opposite outer races of the outer member, a first inner member, and a second inner member formed with at least one of the double-row inner races, the first inner member and the second inner member being inseparably coupled together at a flange-like swaged portion. The constant velocity joint includes an outer joint member press-fitted to an inner periphery of the first inner member with torque transmission means formed therebetween that transmits torque by engagement of a plurality of axially extending teeth, wherein the torque transmitting teeth of the first inner member have a tooth profile that is controlled within a specified range over the entire axial length of the teeth. | 11-22-2012 |
Motohiro Niki, Tokyo-To JP
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20140115945 | FISH SPEAR - A fish spear ( | 05-01-2014 |
Shigeru Niki, Tsukuba-Shi, Ibaraki JP
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20150303330 | PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE - The inventive photoelectric conversion device includes a substrate, a lower electrode layer provided on the substrate, a CIGS compound semiconductor layer provided on the lower electrode layer as covering the lower electrode layer, and a transparent electrode layer provided on the compound semiconductor layer, wherein the compound semiconductor layer has a maximum Ga content variation of not less than 5% as measured in a layer thickness direction, and a maximum In content variation of not less than 6% as measured in the layer thickness direction. | 10-22-2015 |
Shigeru Niki, Ibaraki JP
Patent application number | Description | Published |
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20090217969 | Method for Manufacturing Photoelectric Converter and Photoelectric Converter - Disclosed is a method for manufacturing a photoelectric converter wherein a lower electrode layer, a compound semiconductor thin film having a chalcopyrite structure which serves as a light absorptive layer and a light-transmitting electrode layer that are laminated to form layers are each patterned by photolithography, thereby minimizing damages to the crystals of the compound semiconductor thin film. | 09-03-2009 |
20090301558 | Photoelectric Converter and Method for Producing the Same - A photoelectric converter includes a lower electrode layer, a compound semiconductor thin film of a chalcopyrite structure functioning as a photoabsorption layer and a light transmitting electrode layer that are sequentially laminated on a substrate. An end portion of the of compound semiconductor thin film is positioned outward beyond an end of the light transmitting electrode layer. | 12-10-2009 |
20100102368 | SOLID STATE IMAGING DEVICE AND FABRICATION METHOD FOR THE SAME - A solid state imaging device with an easy structure in which have the high sensitivity which reaches the wide wavelength region from visible light to near infrared light wavelength region, and dark current is reduced, and a fabrication method for the same, are provided. | 04-29-2010 |
20100163864 | SEMICONDUCTOR DEVICE - An object of the present invention is to increase the light emission efficiency of a ZnO-based optical semiconductor device. An optical semiconductor device B has a structure which includes n-type Zn | 07-01-2010 |
20110023963 | SOLAR CELL AND MANUFACTURING METHOD THEREOF - There is provided a solar cell in which a lower electrode layer, a photoelectric conversion layer having a chalcopyrite structure that includes a Group Ib element, a Group IIIb element, and a Group VIb element, and an upper electrode layer are sequentially formed on top of a substrate, wherein the solar cell is provided with a silicate layer between the substrate and the lower electrode layer. | 02-03-2011 |
20110024859 | PHOTOELECTRIC CONVERSION DEVICE, FABRICATION METHOD FOR THE SAME, AND SOLID STATE IMAGING DEVICE - A photoelectric conversion device has a high S/N ratio and can increase the detection efficiency even under a low luminance. The photoelectric conversion device generates an increased electric charge by impact ionization in a photoelectric conversion unit formed from a chalcopyrite type semiconductor, so as to improve dark current characteristic. The photoelectric conversion device includes: a lower electrode layer; a compound semiconductor thin film of chalcopyrite structure disposed on the lower electrode layer and having a high resistivity layer on a surface; and a transparent electrode layer disposed on the compound semiconductor thin film, wherein the lower electrode layer, the compound semiconductor thin film, and the transparent electrode layer are laminated one after another, and a reverse bias voltage is applied between the transparent electrode layer and the lower electrode layer, and the multiplication by the impact ionization of the electric charge generated by photoelectric conversion is generated within the compound semiconductor thin film. It is also possible to provide a fabrication method for such photoelectric conversion device, and a solid state imaging device using the photoelectric conversion device. | 02-03-2011 |
20120199203 | GLASS SHEET FOR CU-IN-GA-SE SOLAR CELLS, AND SOLAR CELLS USING SAME - Provided are a glass sheet for a CIGS solar cell which satisfies both of high power generation efficiency and high glass transition temperature, and a CIGS solar cell having high power generation efficiency. A glass sheet for a Cu—In—Ga—Se solar cell containing, in terms of mol % on the basis of the following oxides, 60 to 75% of SiO | 08-09-2012 |
20130095594 | SOLID STATE IMAGING DEVICE AND FABRICATION METHOD FOR THE SAME - A solid state imaging device includes a circuit unit formed on a substrate and a photoelectric conversion unit. The photoelectric conversion circuit includes a lower electrode layer placed on the circuit unit, a compound semiconductor thin film of chalcopyrite structure which is placed on the lower electrode layer and functions as an optical absorption layer, and an optical transparent electrode layer placed on the compound semiconductor thin film. The lower electrode layer, the compound semiconductor thin film, and the optical transparent electrode layer are laminated one after another on the circuit unit. | 04-18-2013 |
Shigeru Niki, Chiyoda-Ku JP
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20130160845 | GLASS SUBSTRATE FOR CU-IN-GA-SE SOLAR CELL AND SOLAR CELL USING SAME - A glass substrate for a CIGS solar cell, having high cell efficiency and high glass transition temperature is provided. The glass substrate for a vapor-deposited CIGS film solar cell has a glass transition temperature of at least 580° C. and an average thermal expansion coefficient of from 70×10 | 06-27-2013 |
Tadashi Niki, Osaka JP
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20130021684 | LENS UNIT - A lens unit has a lens frame configured to be mounted to an imaging device having an imaging element, a first optical system having a first optical axis supported by the lens frame, a second optical system having a second optical axis supported by the lens frame; and an adjustment mechanism configured to adjust a position of the first optical system and/or the second optical system in an optical axis direction with respect to the lens frame. | 01-24-2013 |
20130027792 | LENS UNIT - A lens unit has an optical system having at least one lens, a lens holder supporting the optical system and a lens frame having a guide component. The guide component guides a movement of the lens holder in a first direction. The lens holder has a first portion and a second portion. The first portion is disposed slidably over the guide component. The second portion is disposed slidably over the guide component and disposed spaced apart from the first portion in the first direction. The guide component is sandwiched between the first portion and the second portion by an elastic force of the first portion and/or the second portion. | 01-31-2013 |
Toru Niki, Kanagawa JP
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20130179310 | INFORMATION PROCESSING APPARATUS, CONSUMABLES STOCK MANAGEMENT SYSTEM, CONSUMABLES STOCK MANAGING METHOD, CONSUMABLES STOCK MANAGING PROGRAM, AND MEMORY MEDIUM - A frequency of a residual amount signal which includes the absence of consumables and is issued by a printing apparatus is analyzed, whether new consumables have been attached or not is properly discriminated, and proper stock management is made. | 07-11-2013 |
Toshihiko Niki, Itami-Shi JP
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20100050546 | STRAND - There is provided a strand that can reduce the trouble in constructing an object to which compression force is applied by the strand and that can keep the construction cost down. | 03-04-2010 |
20100108197 | HIGH-STRENGTH PC STEEL STRANDED WIRE, PROCESS FOR MANUFACTURING THE SAME, AND CONCRETE STRUCTURE UTILIZING THE WIRE - The present invention provides a prestressing strand that has higher strength and is more suitable for practical use than known prestressing strands, and a concrete construction using the prestressing strand. | 05-06-2010 |
Toshihiko Niki, Hyogo JP
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20100233478 | POWDER COATING COMPOSITION FOR PC STRAND COATING, COATING METHOD, AND COATING FILM - A powder coating composition for PC strand coating which, when used for the coating of a PC strand, can advantageously form a coating film having an even thickness at low cost without causing uneven thickness or stringness is disclosed. The powder coating composition of this invention for PC strand coating is characterized by having a melt viscosity of 3,000-15,000 poise. | 09-16-2010 |
Toshikazu Niki, Matsumoto-Shi JP
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20090071004 | METHOD FOR MANUFACTURING FLUID EJECTING HEAD AND METHOD FOR MANUFACTURING FLUID EJECTING APPARATUS - A method for manufacturing a fluid ejecting head includes providing a channel unit including a vibrating plate and having nozzle opening through which fluid is ejected and pressure chamber that communicate with the nozzle opening. A piezoelectric unit includes a piezoelectric element that vibrates the vibrating plate of the channel unit. A securing plate secures the piezoelectric element. A head case having a housing chamber is used to house the piezoelectric unit, such that the piezoelectric element is pressed against the vibrating plate. The piezoelectric unit is pushed in a housing direction such that a portion of the piezoelectric unit is pressed against a sidewall of the housing chamber. The piezoelectric element and the vibrating plate, and the securing plate and the head case, respectively, are secured to each other by bonding them together while the piezoelectric unit is being pressed against the vibrating plate and the sidewall. | 03-19-2009 |
20090085987 | Method for Manufacturing Liquid Ejecting Head, and Liquid Ejecting Head - There is provided a manufacturing method of a liquid ejecting head including an unit having a plurality of piezoelectric elements and a fixing plate supporting the piezoelectric elements, a case having an accommodation space for accommodating the unit, and a flow path unit having a vibration plate, a reference portion which becomes a reference of an arrangement position of the unit in the accommodation space being provided on at least a surface among inner wall surfaces partitioning the accommodation space. The manufacturing method of the liquid ejecting head including regulating the arrangement position of the unit in the accommodation space by accommodating the unit in the accommodation space and by making contact of the fixing plate with the reference portion by a bias force applied by a bias member, and bonding and fixing the piezoelectric elements and the vibration plate and bonding and fixing the fixing plate and the case in the state where the arrangement position of the unit is regulated. | 04-02-2009 |
Toshiro Niki, Takamatsu-Shi JP
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20130323176 | GALECTIN-9-SECRETING CELL, AND PRODUCTION METHOD AND USE OF THE SAME - The object of the present invention is to provide a cell that can exhibit physiological activity based on galectin-9, a method for producing the cell, and use of the cell. In order to achieve the above object, the cell of the present invention contains galectin-9, and the galectin-9 is expressed on a cell surface. | 12-05-2013 |
Toshiro Niki, Kagawa JP
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20150093366 | GALECTIN-9-SECRETING CELL, AND PRODUCTION METHOD AND USE OF THE SAME - The object of the present invention is to provide a cell that can exhibit physiological activity based on galectin-9, a method for producing the cell, and use of the cell. In order to achieve the above object, the cell of the present invention contains galectin-9, and the galectin-9 is expressed on a cell surface. | 04-02-2015 |
Yohei Niki, Atsugi-Shi JP
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20110119622 | WINDOW DISPLAY CONTROL APPARATUS AND METHOD OF CONTROLLING WINDOW DISPLAYS - A plurality of display windows corresponding to a plurality of applications is formed from a plurality of fixed window frames that is displayed with regularity on one display screen of a display unit. A display control unit performs display control by sequentially displaying displays relating to the plurality of applications in a switching manner in the order in which the plurality of applications is selected in a time series in the fixed window display frames that are displayed with regularity on one display screen of the display unit when the plurality of applications is selected in the time series. | 05-19-2011 |
20110196515 | MEASUREMENT PARAMETER INPUT CONTROL DEVICE AND MEASUREMENT PARAMETER INPUT CONTROL METHOD - A measurement parameter input control method and a measurement parameter input control device are provided which can intuitively change measurement parameters, which are set for a target device and are necessary for various measuring processes, with high operability. The measurement parameter input control device includes: a parameter processing section that acquires measurement parameter information including measurement parameters from a target device and that rewrites changed parameters which are measurement parameters after the changing to the target device; a parameter identifying section that identifies the types of the parameters in the acquired measurement parameter information and outputs soft key constructing information for constructing a parameter setting soft key based on the identified measurement parameter information, a display control section that includes a soft key controller displaying and controlling the parameter setting soft key based on the measurement parameter information on a display screen of a display unit on the basis of the soft key constructing information from the parameter identifying section; and an input unit that operates the parameter setting soft key displayed on the display unit. | 08-11-2011 |
Yoko Niki, Kakogawa JP
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20140154190 | Skin Lightening Compositions - Compositions and methods for lightening and/or depigmenting skin are provided, the compositions comprising compounds having the structure: | 06-05-2014 |
20140178319 | Modulation Of Melanogenesis By Modification Of Tyrosinase By Palmitoylation - Compositions and methods for modulating melanogenesis by modifying tyrosinase palmitoylation are provided. | 06-26-2014 |
20150283054 | MODULATION OF MELANOGENESIS BY MODIFICATION OF TYROSINASE BY PALMITOYLATION - Compositions and methods for modulating melanogenesis by modifying tyrosinase palmitoylation are provided. | 10-08-2015 |
20150283104 | MODULATION OF MELANOGENESIS BY MODIFICATION OF TYROSINASE BY PALMITOYLATION - Compositions and methods for modulating melanogenesis by modifying tyrosinase palmitoylation are provided. | 10-08-2015 |
20150283105 | MODULATION OF MELANOGENESIS BY MODIFICATION OF TYROSINASE BY PALMITOYLATION - Compositions and methods for modulating melanogenesis by modifying tyrosinase palmitoylation are provided. | 10-08-2015 |
Yoko Niki, Kakogawa(hyogo) JP
Patent application number | Description | Published |
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20150086497 | Skin Lightening Compositions - Compositions and methods for lightening and/or depigmenting skin are provided, the compositions comprising compounds having the structure: | 03-26-2015 |
Yoko Niki, Kakogawa (hyogo) JP
Patent application number | Description | Published |
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20110171149 | Skin Lightening Compositions - Compositions and methods for lightening and/or depigmenting skin are provided, the compositions comprising compounds having the structure: | 07-14-2011 |
20140112877 | SKIN LIGHTENING COMPOSITIONS - Compositions and methods for lightening and/or depigmenting skin are provided, the compositions comprising compounds having the structure: | 04-24-2014 |
20140212365 | SKIN LIGHTENING COMPOSITIONS - Compositions and methods for lightening and/or depigmenting skin are provided, the compositions comprising compounds having the structure: | 07-31-2014 |
Yoshiki Niki, Oota-Shi JP
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20080297203 | CURRENT MIRROR CIRCUIT - A current mirror circuit including: a first resistance element having one terminal connected to a first potential, and the other terminal connected to a second potential lower than the first potential; an operational amplifier having a high-potential input terminal connected to the first potential and the one terminal of the first resistance element; a second resistance element having one terminal connected to a low-potential input terminal of the operational amplifier, and the other terminal connected to the second potential; and a transistor having a first electrode connected to an output terminal of the operational amplifier, a second electrode connected to the low-potential input terminal of the operational amplifier and the one terminal of the second resistance element, and a third electrode used as an output terminal, wherein the first and second resistance elements both start to operate from a linear area having lower voltage than a saturation area. | 12-04-2008 |
Yosuke Niki, Kanagawa JP
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20130117223 | INFORMATION PROCESSING SYSTEM AND METHOD OF CONTROLLING THE SAME - In an information processing system | 05-09-2013 |