Patent application number | Description | Published |
20090166678 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device | 07-02-2009 |
20100163930 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD - An object of the present invention is to reduce on-state resistance and increases reliability in a semiconductor device having an electrode formed in a recessed structure. | 07-01-2010 |
20100193842 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device | 08-05-2010 |
20100244018 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A object is to provide a semiconductor device having normally-off characteristics and capable of easily suppressing field concentration below a side surface of a concave portion. A device includes a nitride-based semiconductor layer having a concave portion formed in a part of one principal surface, a side surface of the concave portion being slanted; a first electrode provided on the principal surface; a second electrode on an opposite side to the first electrode across the concave portion, and provided on the principal surface; an insulating layer formed on both sides of the concave portion in the principal surface; and | 09-30-2010 |
20110140174 | COMPOUND SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF - A compound semiconductor device is comprised of: a compound semiconductor layer including a first active layer and a second active layer forming a hetero junction with the first active layer so as to naturally generate a two-dimensional carrier gas channel in the first active layer along the hetero junction; a first electrode formed on the second active layer; a second electrode in ohmic contact with the first active layer and isolated from the first electrode; and a channel modifier for locally changing a part of the first active layer under the channel modifier into a normally-off state, the channel modifier being formed on the second active layer so as to enclose but be isolated from the first electrode and the second electrode. | 06-16-2011 |
20110233538 | COMPOUND SEMICONDUCTOR DEVICE - A compound semiconductor device includes a compound semiconductor layer in which a two-dimensional carrier gas layer is formed, the compound semiconductor layer including a carrier travel layer and a carrier supply layer; first and second main electrodes, which are arranged apart from each other on the compound semiconductor layer, and are ohmically connected to the two-dimensional carrier gas layer; a metal oxide semiconductor film arranged on the compound semiconductor layer between the first main electrode and the second main electrode; and a control electrode arranged on the metal oxide semiconductor film, the control electrode including a titanium film that contacts the metal oxide semiconductor film or a titanium-containing compound film that contacts the metal oxide semiconductor film. | 09-29-2011 |
Patent application number | Description | Published |
20090079085 | SEMICONDUCTOR DEVICE - A semiconductor device including a semiconductor section including a semiconductor element and a recess formed in one of main surfaces and a metallic member at least a part of which is embedded in the recess. A void is formed in a region of the metallic member corresponding to the recess. | 03-26-2009 |
20090315071 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a semiconductor device 10 includes forming a plurality of second conductive second semiconductor regions at specific intervals on one main surface of a first conductive first semiconductor region, the plurality of second conductive second semiconductor regions being opposite to the first conductive first semiconductor region, forming a plurality of the first conductive third semiconductor regions on a main surface of the second semiconductor region, the plurality of the first conductive third regions being separated from each other, forming a plurality of holes at specific intervals on an another main surface which faces the one main surface of the first semiconductor region, the plurality of holes being separated from each other, forming a pair of adjacent second conductive fourth semiconductor regions which are alternately connected at a bottom part of the hole within the first semiconductor region, and burying an electrode within the hole. | 12-24-2009 |
20100230746 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes an epitaxial layer having a first conduction type, a base layer formed adjacent and on the epitaxial layer and having an opposite second conduction type to the first conduction type, a source layer formed selectively on the base layer and having the first conduction type, a trench which passes through the base layer and the source layer and which reaches the epitaxial layer, an insulation film formed along an interior wall of the trench, a control electrode formed within the trench via the insulation film, and a semiconductor region formed along the bottom part of the trench at the epitaxial layer and having the first conduction type. | 09-16-2010 |
20120001226 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a semiconductor device 10 includes forming a plurality of second conductive second semiconductor regions at specific intervals on one main surface of a first conductive first semiconductor region, the plurality of second conductive second semiconductor regions being opposite to the first conductive first semiconductor region, forming a plurality of the first conductive third semiconductor regions on a main surface of the second semiconductor region, the plurality of the first conductive third regions being separated from each other, forming a plurality of holes at specific intervals on an another main surface which faces the one main surface of the first semiconductor region, the plurality of holes being separated from each other, forming a pair of adjacent second conductive fourth semiconductor regions which are alternately connected at a bottom part of the hole within the first semiconductor region, and burying an electrode within the hole. | 01-05-2012 |
20120258578 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes an epitaxial layer having a first conduction type, a base layer formed adjacent and on the epitaxial layer and having an opposite second conduction type to the first conduction type, a source layer formed selectively on the base layer and having the first conduction type, a trench which passes through the base layer and the source layer and which reaches the epitaxial layer, an insulation film formed along an interior wall of the trench, a control electrode formed within the trench via the insulation film, and a semiconductor region formed along the bottom part of the trench at the epitaxial layer and having the first conduction type. | 10-11-2012 |