Tsai, Hsinchu
Bin-Hong Tsai, Hsinchu TW
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20100193950 | WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO - The invention relates generally to wafer level, chip scale semiconductor device packaging compositions capable of providing high density, small scale circuitry lines without the use of photolithography. The wafer level package comprises a stress buffer layer containing a polymer binder and a spinel crystal filler in both a non-activated and a laser activated form. The stress buffer layer is patterned with a laser to thereby activate the filler, and the laser ablation path can then be selectively metalized. | 08-05-2010 |
20120225510 | METHOD FOR ENCAPSULATING A SUBSTRATE AND METHOD FOR FABRICATING A LIGHT EMITTING DIODE DEVICE - The present invention relates to a method for encapsulating a substrate, which comprises: | 09-06-2012 |
Chang-Da Tsai, Hsinchu TW
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20100072497 | LIGHT EMITTING DIODE CHIP - A light emitting diode chip includes a permanent substrate having a holding space formed on the permanent substrate; an insulating layer and a metal layer sequentially formed on the permanent substrate and the holding spacer; a die having a eutectic layer and a light-emitting region and bonded to the metal layer within the holding space via the eutectic layer coupling to the metal layer; a filler structure filled between the holding space and the die; and an electrode formed on the die and in contact with the light-emitting region. | 03-25-2010 |
20120322180 | LIGHT EMITTING DIODE AND MANUFACTURING METHOD OF THE SAME - A light emitting diode comprises a permanent substrate having a chip holding space formed on a first surface of the permanent substrate; an insulating layer and a metal layer sequentially formed on the first surface of the permanent substrate and the chip holding space, wherein the metal layer comprises a first area and a second area not being contacted to each other; a chip having a first surface attached on a bottom of the chip holding space, contacted to the first area of the metal layer; a filler structure filled between the chip holding space and the chip; and a first electrode formed on a second surface of the chip. The chip comprises a light-emitting region and an electrical connection between the first area of the metal layer and the light emitting region is realized by using a chip-bonding technology. | 12-20-2012 |
Cheng Hua Tsai, Hsinchu TW
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20090002916 | Interdigital capacitor - An interdigital capacitor includes a first finger electrode structure and a second finger electrode structure. The first finger electrode structure has a first electrode and a plurality of first extending electrodes. The first extending electrodes are linearly disposed and arranged. The second finger electrode structure has a second electrode and a plurality of second extending electrodes. The second extending electrodes are linearly disposed and arranged. The second finger electrode structure interlaces with the first finger electrode structure. At least one pair of first coupling electrodes extend respectively from the neighboring first and second extending electrodes and are disposed between them. | 01-01-2009 |
Chen-Shun Tsai, Hsinchu TW
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20120161775 | INSPECTION METHOD FOR AN ACTIVE MATRIX SUBSTRATE - An active matrix substrate including a substrate, a plurality of scan lines, a plurality of data lines, a plurality of independent common line patterns, and a plurality of pixels is provided. The scan lines, data lines, and common line patterns are disposed on the substrate. The pixels are arranged in array on the substrate, wherein each pixel is electrically connected to corresponding scan line and data line, and the common line patterns are distributed under each pixel. Each pixel includes a plurality of active components and a plurality of pixel electrodes. Each of the pixel electrodes is electrically connected to corresponding scan line and data line through different active components. The capacitance coupling effect between each of the pixel electrodes and common line patterns are different. Additionally, an inspection method for the active matrix substrate and a liquid crystal display having the active matrix substrate are further provided. | 06-28-2012 |
Chin Chyuan Tsai, Hsinchu TW
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20110050355 | EMI SUPPRESSOR HAVING BANDPASS FILTERING FUNCTION - An electromagnetic interference (EMI) suppressor having a bandpass filtering function is provided. The EMI suppressor is disposed on a substrate, and includes a signal line, a ground line, an open-circuit line, a first line group, and a second line group. The signal line has an input terminal and an output terminal for feeding in and feeding out electromagnetic wave signals respectively. One terminal of the ground line is connected to the signal line and the other terminal is a ground terminal. One terminal of the open-circuit line is connected to the signal line and the other terminal is an open-circuit terminal. The first line group is formed by a first open-circuit line and a second open-circuit line, and is connected to the signal line. The second line group is formed by a third open-circuit line and a fourth open-circuit line, and is connected to the signal line. | 03-03-2011 |
Chin-Ying Tsai, Hsinchu TW
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20090170971 | METHOD FOR MANUFACTURING STARCH FOAM - A method for manufacturing a starch foam is provided. A mixture is mixed to form a foamable mixture. The mixture includes a starch, a nucleating agent, and a foaming agent. The foamable mixture is foamed to form a foam. The starch includes a cereal or a root crop. The cereal includes rice, wheat or corn. The root crop includes cassava, sweet potato or potato. | 07-02-2009 |
Chi-Wen Tsai, Hsinchu TW
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20120017427 | METHOD FOR FORMING ANTENNA STRUCTURE - A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer. | 01-26-2012 |
20120027951 | METHOD FOR FORMING ANTENNA STRUCTURE - A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and forming a photosensitive medium layer on the non-conductive frame, wherein the medium layer comprises a catalyzer for electroless deposition; applying a light beam through a transparent portion of a mask to the medium layer, such that a part of the medium layer is solidified within a predetermined region on the non-conductive frame; removing a part of the medium layer outside of the predetermined region; and forming a metal layer on the medium layer within the predetermined region. | 02-02-2012 |
20120042505 | METHOD FOR MANUFACTURING ANTENNA - A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate. | 02-23-2012 |
Chuen-Horng Tsai, Hsinchu TW
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20080247938 | Process of growing carbon nanotubes directly on carbon fiber - A process for growing a carbon nanotube directly on a carbon fiber includes at least the steps of depositing a metallic film of at least 1 nm in thickness on at least one surface of a flake-shaped carbon-fiber substrate; placing the substrate into a reactor; introducing a gas including carbon-containing substances into the reactor as a carbon source needed for growing a plurality of carbon nanotubes (CNTs); and thermally cracking the carbon-containing substances in the gas to grow the carbon nanotubes directly on the substrate. | 10-09-2008 |
20080251390 | Process of electrodeposition platinum and platinum-based alloy nano-particles with addition of ethylene glycol - An electrodeposition process of platinum and platinum-based alloy nano-particles with addition of ethylene glycol is disclosed. An acidic solution which contains metal chloride includes at least one platinum-based chloride and the alloy thereof, and ethylene glycol are introduced into a reactor as an electrodeposition solution. By applying an external negative potential, platinum particles or platinum-based alloy particles are deposited on the substrate. The above acidic solution is able to provide ionic conductivity during electrodeposition. The added ethylene glycol effectively enhances the removal of chlorine from metal chlorides. Meanwhile, ethylene glycol is used as stabilizer to prevent the particles from aggregation onto the substrate, thereby increasing the dispersion of deposited particles. | 10-16-2008 |
20100176001 | ELECTROPLATING SOLUTION FOR MANUFACTURING NANOMETER PLATINUM AND PLATINUM BASED ALLOY PARTICLES AND METHOD THEREOF - The present invention generally relates to an electroplating solution for manufacturing nanometer platinum and platinum based alloy particles and a method thereof. That is, an acid solution having platinum complex compound and citric acid is provided into a reaction tank to be as an electroplating solution, then a plurality of platinum and platinum based alloy particles are deposited on the surfaces of electrodes under the condition of applying negative potentials. The acid solution is capable of effectively providing the rate of conducting ions. The citric acid can effectively promote the dispersity of the platinum and platinum based alloy particles and reduce the dimensions the platinum and platinum based alloy particles. | 07-15-2010 |
Chuen-Jinn Tsai, Hsinchu TW
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20090095161 | POROUS METAL DENUDER - A porous metal denuder has a cascade impactor to collect aerosol particles of different diameters, two porous metal discs downstream to collect basic and acidic gases, respectively, and a final filter to collect particles smaller than the cut diameter of the last stage of the cascade impactor which will penetrate the two porous metal discs. | 04-16-2009 |
20140060213 | PORTABLE NANOPARTICLE SAMPLER - A portable nanoparticle sampler for collecting respirable particulate matters and nanoparticles is composed of a tangential flow cyclone, a multi-microorifice impactor and a filter cassette. The tangential flow cyclone can remove the microparticles with cutoff aerodynamic diameter (dpa) larger than 4 μm and guide the airflow to the multi-microorifice impactor located below the cyclone. The multi-microorifice impactor includes a multi-orifice nozzle and a rotary impaction plate for enabling the microparticles with dpa from 100 nm to 4 μm to be uniformly collected on a silicon-oil-coated impaction substrate. The remanent microparticles with dpa smaller than 100 nm are collected by the filter cassette. Therefore, compared with the prior art, the portable nanoparticle sampler is characterized by low pressure loss and accurate microparticle sizing to meet the requirement of nanoparticle sampling at workplaces. | 03-06-2014 |
Chung-Hang Tsai, Hsinchu TW
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20100054500 | AUDIO DEVICE AND AUDIO INPUT/OUTPUT METHOD - An audio device and an audio input/output method are described, which is coupled to an audio port, and includes a capacitor, a load, an output amplifying module, and an input amplifying module. The capacitor and the load are coupled to the audio port. The output amplifying module is operated at a first working voltage, for outputting a first audio signal to the audio port. A direct current (DC) level of the first audio signal is substantially zero volts. The input amplifying module is operated at a second working voltage, in order to receive a second audio signal from the audio port. When the audio port is in an output state, the output amplifying module is enabled and the input amplifying module is disabled, and when the audio port is in an input state, the input amplifying module is enabled and the output amplifying module is disabled. | 03-04-2010 |
Chun Lin Tsai, Hsinchu TW
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20100096697 | HIGH VOLTAGE DEVICE HAVING REDUCED ON-STATE RESISTANCE - A semiconductor device includes a semiconductor substrate, a source region and a drain region formed in the substrate, a gate structure formed on the substrate disposed between the source and drain regions, and a first isolation structure formed in the substrate between the gate structure and the drain region, the first isolation structure including projections that are located proximate to an edge of the drain region. Each projection includes a width measured in a first direction along the edge of the drain region and a length measured in a second direction perpendicular to the first direction, and adjacent projections are spaced a distance from each other. | 04-22-2010 |
20110241114 | HIGH VOLTAGE MOS TRANSISTOR - A high voltage metal-oxide-semiconductor laterally diffused device (HV LDMOS) and a method of making it are provided in this disclosure. The device includes a semiconductor substrate, a gate structure formed on the substrate, a source and a drain formed in the substrate on either side of the gate structure, a first doped well formed in the substrate, and a second doped well formed in the first well. One portion of the second well surrounds the source and the other portion of the second well extends laterally from the first portion in the first well. | 10-06-2011 |
20120061681 | MECHANISM OF FORMING SIC CRYSTALLINE ON SI SUBSTRATES TO ALLOW INTEGRATION OF GAN AND SI ELECTRONICS - The mechanisms of forming SiC crystalline regions on Si substrate described above enable formation and integration of GaN-based devices and Si-based devices on a same substrate. The SiC crystalline regions are formed by implanting carbon into regions of Si substrate and then annealing the substrate. An implant-stop layer is used to cover the Si device regions during formation of the SiC crystalline regions. | 03-15-2012 |
20130015460 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAMEAANM CHEN; Po-ChihAACI Hsinchu CityAACO TWAAGP CHEN; Po-Chih Hsinchu City TWAANM YU; Jiun-Lei JerryAACI Zhudong TownshipAACO TWAAGP YU; Jiun-Lei Jerry Zhudong Township TWAANM YAO; Fu-WeiAACI Hsinchu CityAACO TWAAGP YAO; Fu-Wei Hsinchu City TWAANM HSU; Chun-WeiAACI Taichung CityAACO TWAAGP HSU; Chun-Wei Taichung City TWAANM YANG; Fu-ChihAACI Fengshan CityAACO TWAAGP YANG; Fu-Chih Fengshan City TWAANM TSAI; Chun LinAACI HsinchuAACO TWAAGP TSAI; Chun Lin Hsinchu TW - An embodiment of the disclosure includes a semiconductor structure. The semiconductor structure includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and different from the first III-V compound layer in composition. An interface is defined between the first III-V compound layer and the second III-V compound layer. A gate is disposed on the second III-V compound layer. A source feature and a drain feature are disposed on opposite side of the gate. Each of the source feature and the drain feature includes a corresponding metal feature at least partially embedded in the second III-V compound layer. A corresponding intermetallic compound underlies each metal feature. Each intermetallic compound contacts a carrier channel located at the interface. | 01-17-2013 |
20130043533 | TRANSISTOR HAVING WING STRUCTURE - A semiconductor device includes an active region having a channel region and at least a wing region adjoining the channel region under the gate dielectric layer. The at least one wing region may be two symmetrical wing regions across the channel region. | 02-21-2013 |
20130069116 | METHOD OF FORMING A SEMICONDUCTOR STRUCTURE - A semiconductor structure is disclosed. The semiconductor structure includes a first layer. A second layer is disposed on the first layer and different from the first layer in composition. An interface is between the first layer and the second layer. A third layer is disposed on the second layer. A gate is disposed on the third layer. A source feature and a drain feature are disposed on opposite sides of the gate. Each of the source feature and the drain feature includes a corresponding metal feature at least partially embedded in the second and the third layer. A corresponding intermetallic compound underlies each metal feature. Each intermetallic compound contacts a carrier channel located at the interface. | 03-21-2013 |
20130146893 | SIC CRYSTALLINE ON SI SUBSTRATES TO ALLOW INTEGRATION OF GAN AND SI ELECTRONICS - A silicon substrate with a GaN-based device and a Si-based device on the silicon substrate is provided. The silicon substrate includes the GaN-based device on a SiC crystalline region. The SiC crystalline region is formed in the silicon substrate. The silicon substrate also includes the Si-based device on a silicon region, and the silicon region is next to the SiC crystalline region on the silicon substrate. | 06-13-2013 |
20130161689 | INSULATED GATE BIPOLAR TRANSISTOR STRUCTURE HAVING LOW SUBSTRATE LEAKAGE - A high voltage laterally diffused metal-oxide-semiconductor (HV LDMOS) device, particularly an insulated gate bipolar junction transistor (IGBT), and a method of making it are provided in this disclosure. The device includes a semiconductor substrate having at least one highly doped buried portion, a first doped well grown over the substrate, a gate structure formed on the first well, a source and a drain formed on either side of the gate structure, and a second doped well having a U-shaped cross section formed in the first well. A portion of the drain is formed over the first well outside of the second well. | 06-27-2013 |
20130168685 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF FORMING THE SAME - A high electron mobility transistor (HEMT) includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A carrier channel is located between the first III-V compound layer and the second III-V compound layer. A source feature and a drain feature are disposed on the second III-V compound layer. A p-type layer is disposed on a portion of the second III-V compound layer between the source feature and the drain feature. A gate electrode is disposed on the p-type layer. The gate electrode includes a refractory metal. A depletion region is disposed in the carrier channel and under the gate electrode. | 07-04-2013 |
20130207187 | INSULATED GATE BIPOLAR TRANSISTOR STRUCTURE HAVING LOW SUBSTRATE LEAKAGE - A high voltage metal-oxide-semiconductor laterally diffused device (HV LDMOS), particularly an insulated gate bipolar junction transistor (IGBT), and a method of making it are provided in this disclosure. The device includes a semiconductor substrate, a gate structure formed on the substrate, a source and a drain formed in the substrate on either side of the gate structure, a first doped well formed in the substrate, and a second doped well formed in the first well. The gate, source, second doped well, a portion of the first well, and a portion of the drain structure are surrounded by a deep trench isolation feature and an implanted oxygen layer in the silicon substrate. | 08-15-2013 |
20130256679 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF FORMING THE SAME - A high electron mobility transistor (HEMT) includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A carrier channel is located between the first III-V compound layer and the second III-V compound layer. A salicide source feature and a salicide drain feature are in contact with the first III-V compound layer through the second III-V compound layer. A gate electrode is disposed over a portion of the second III-V compound layer between the salicide source feature and the salicide drain feature. | 10-03-2013 |
20140035035 | INSULATED GATE BIPOLAR TRANSISTOR STRUCTURE HAVING LOW SUBSTRATE LEAKAGE - A high voltage metal-oxide-semiconductor laterally diffused device (HV LDMOS), particularly an insulated gate bipolar junction transistor (IGBT), and a method of making it are provided in this disclosure. The device includes a semiconductor substrate, a gate structure formed on the substrate, a source and a drain formed in the substrate on either side of the gate structure, a first doped well formed in the substrate, and a second doped well formed in the first well. The gate, source, second doped well, a portion of the first well, and a portion of the drain structure are surrounded by a deep trench isolation feature and an implanted oxygen layer in the silicon substrate. | 02-06-2014 |
20140187002 | METHOD OF FORMING A SEMICONDUCTOR STRUCTURE - A method of forming a semiconductor structure having a substrate is disclosed. The semiconductor structure includes a first layer formed in contact with the substrate. The first layer made of a first III-V semiconductor material selected from GaN, GaAs and InP. A second layer is formed on the first layer. The second layer made of a second III-V semiconductor material selected from AlGaN, AlGaAs and AlInP. An interface is between the first layer and the second layer forms a carrier channel. An insulating layer is formed on the second layer. Portions of the insulating layer and the second layer are removed to expose a top surface of the first layer. A metal feature is formed in contact with the carrier channel and the metal feature is annealed to form a corresponding intermetallic compound. | 07-03-2014 |
20150072496 | METHOD OF MAKING AN INSULATED GATE BIPOLAR TRANSISTOR STRUCTURE - A method for fabricating a high voltage semiconductor transistor includes growing a first well region over a substrate having a first conductivity type, the first well region having a second type of conductivity. First, second and third portions of a second well region having the first type of conductivity are doped into the first well region. A first insulating layer is grown in and over the first well portion within the second well region. A second insulating layer is grown on the substrate over the third portion of the second well region. An anti-punch through region is doped into the first well region. A gate structure is formed on the substrate. A source region is formed in the first portion of the second well region on an opposite side of the gate structure from the first insulating layer. A drain region is formed in the first well region. | 03-12-2015 |
Chuo-Han Tsai, Hsinchu TW
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20090279187 | Optical zoom system with voice coil motors - An optical zoom system uses voice coil motors to drive zoom lens sets moving along an optical axis for the control of forming image and focusing. Voice coil motors of the system move respectively two zoom lens sets to the first position and the second position on the optical axis to control the image formation and to adjust the imaging distance. The first position and the second position are predetermined and recorded in a zoom database. | 11-12-2009 |
Dianne Tan-Feng Tsai, Hsinchu TW
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20080240755 | Developing method in imaging-forming device - A developing method in an image-forming device is provided. The developing method includes the steps of charging a photoreceptor; exposing the photoreceptor to form a first latent image on the photoreceptor; developing the first latent image by a first developing unit having a first potential to form a first toner image; and discharging the photoreceptor having the first toner image, such that when the photoreceptor is charged again, the first toner image on the photoreceptor has a second potential, and the second potential is approximately the same as the first potential of the first developing unit. | 10-02-2008 |
Dong-Jie Tsai, Hsinchu TW
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20100005487 | SYETEM AND METHOD FOR PROCESSING PROGRAM INCLUDING ADVERTISEMENTS - A system and a method for processing a program with inserted advertisements are provided. The system includes a plurality of program subscriber apparatuses, an advertising time server and a program-processing device, all of which are in communication with a network. At first, the program subscriber apparatuses generate a plurality of advertising time information in response to the operations of the program subscriber apparatuses by users. Then, the advertising time database integrated the advertising time information to provide an advertising time database having therein a plurality of representative advertising time information. The program-processing apparatus can process a specific program according to the representative advertising time information. | 01-07-2010 |
George Tsai, Hsinchu TW
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20090015167 | DECORATIVE LIGHT DISPLAY - A decorative light display includes a plurality of light source assemblies, each respective light source assembly of the plurality of light source assemblies having a known power requirement and at least one power supply operably coupled to each respective light source assembly of the plurality of light source assemblies for supplying power from an external power source to each respective light source assembly of the plurality of light source assemblies, the at least one power supply providing power to each respective light source assembly, which power satisfies the known power requirement thereof. A method of displaying decorative lighting is further included. | 01-15-2009 |
Hai-Hsiang Tsai, Hsinchu TW
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20100002568 | High-density information storage apparatus - A system is provided. The system includes an information storage medium including a substrate and a plurality of pit trains formed on the substrate at a track pitch between 0.64 and 0.67 micrometers. The system further includes a pickup head having a numerical aperture of around 0.6 and a wavelength of around 650 nanometers. The system has a tangential tilt margin between 0.54 and 0.68 degrees, and a radial tilt margin between 0.68 and 0.83 degrees when a jitter of the system is about 10%. | 01-07-2010 |
Hann-Huei Tsai, Hsinchu TW
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20100099582 | Biochip Package Structure - A biochip package structure is provided. The biochip package structure includes a substrate, a biochip, at least one wire, and a molding compound. The substrate has a circuit unit electrically connected, by wiring, to the biochip defined with a sensing region. The molding compound covers the wire but leaves the sensing region of the biochip exposed, allowing a cavity to be formed in the sensing region. The cavity delivers a biomedical sample. The biomedical sample reacts in the sensing region. Thus, the biochip package structure is applicable to various medical and biochemical assays. | 04-22-2010 |
20110117747 | METHOD OF FABRICATING SINGLE CHIP FOR INTEGRATING FIELD-EFFECT TRANSISTOR INTO MEMS STRUCTURE - A method of fabricating a single chip for integrating a field-effect transistor into a microelectromechanical systems (MEMS) structure is provided. The method includes the steps of: providing a substrate having thereon at least one transistor structure, a MEMS structure and a blocking structure, wherein the blocking structure encircles the MEMS structure to separate the MEMS structure from the transistor structure; forming a masking layer for covering the transistor structure, the MEMS structure and the blocking structure; forming a patterned photoresist layer on the masking layer; performing a first etching process by using the patterned photoresist layer to remove the masking layer on the MEMS structure; and performing a second etching process by removing a portion of the MEMS structure to form a plurality of microstructures such that a relative motion among the microstructures takes place in a direction perpendicular to the substrate. | 05-19-2011 |
20110133256 | CMOS-MEMS Cantilever Structure - The present invention discloses a CMOS-MEMS cantilever structure. The CMOS-MEMS cantilever structure includes a substrate, a circuit structure, and a cantilever beam. The substrate has a circuit area and a sensor unit area defined thereon. The circuit structure is formed in the circuit area. The cantilever beam is disposed in the sensor unit area with one end floating above the substrate and the other end connecting to the circuit structure. With the above arrangement, the manufacturing process of CMOS-MEMS cantilever structure of this invention can be simplified. Furthermore, the structure of the cantilever beam is thinned down and therefore has a higher sensitivity. | 06-09-2011 |
20120279838 | CMOS-MEMS SWITCH STRUCTURE - A CMOS-MEMS switch structure is disclosed. The CMOS-MEMS switch structure includes a first substrate, a second substrate, a first cantilever beam, and a second cantilever beam. The first and second substrates are positioned opposite each other. The first cantilever beam is provided on the first substrate, extends from the first substrate toward the second substrate, and bends downward. Likewise, the second cantilever beam is provided on the second substrate, extends from the second substrate toward the first substrate, and bends downward. The first and second substrates are movable toward each other to connect a first top surface of the first cantilever beam and a second top surface of the second cantilever beam, and away from each other so that the first top surface of the first cantilever beam and the second top surface of the second cantilever beam are disconnected, thereby closing or opening the CMOS-MEMS switch structure. | 11-08-2012 |
20140035479 | LED DRIVER CIRCUIT STRUCTURE WITH OVER-CURRENT SUPPRESSION - An LED driver circuit structure with over-current suppression is provided. The LED driver circuit includes a DC-DC converter, a voltage detector, a reference voltage supplier module, an error amplifier, a comparator, and an SR-latch. The LED driver circuit structure controls the output voltage and thus the output current of the DC-DC converter by multi-step switching of reference voltages and current levels to achieve over-current suppression, thereby extending an LED endurance period and increasing a PWM dimming frequency range for LED brightness control applications. | 02-06-2014 |
Hao-Yi Tsai, Hsinchu TW
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20080303539 | Parametric testline with increased test pattern areas - An integrated circuit parametric testline providing increased test pattern areas is disclosed. The testline comprises a dielectric layer over a substrate, a plurality of probe pads over the dielectric layer, and a first device under test (DUT) formed in the testline in a space underlying the probe pads. The testline may also include a second DUT, which is formed in a space underlying the probe pads overlying the first DUT in an overlaying configuration. The testline may further include a polygon shaped probe pad structure providing an increased test pattern area between adjacent probe pads. | 12-11-2008 |
20090032945 | SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE - A solder bump on a semiconductor substrate is provided. The solder bump has a semiconductor substrate with a top copper pad thereon, a protective layer on the semiconductor substrate and at least one inorganic passivation layer overlying the protective layer with a first opening exposing the top copper pad, wherein the inorganic passivation layer has a thinner portion adjacent a top portion of the first opening. The solder bump further has a soft passivation layer on the inorganic passivation layer with a second opening larger than the first opening, an under bump metal layer conformally formed along the first opening and the second opening and a solder bump formed on the under bump metal layer. | 02-05-2009 |
20110062597 | PACKAGE STRUCTURES - A package structure includes a substrate, a first die and at least one second die. The substrate includes a first pair of parallel edges and a second pair of parallel edges. The first die is mounted over the substrate. The first die includes a third pair of parallel edges and a fourth pair of parallel edges, wherein the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively. The at least one second die is mounted over the first die. | 03-17-2011 |
20150035139 | Copper Post Structure for Wafer Level Chip Scale Package - In a method for forming a packaging structure, a metal pad is formed on a semiconductor substrate, and a first polymer insulating layer is formed over the semiconductor substrate. An opening passing through the first polymer insulating layer is formed to expose a portion of the metal pad. A copper-containing material is deposited in the opening and over the first polymer insulating layer, thereby forming a copper-containing layer having a first thickness and a first width over the first polymer insulating layer. A conductive bump having a second width is formed over the copper-containing layer, in which the second width is smaller than the first width. An exposed portion of the copper-containing layer is etched using the conductive bump as a mask until the exposed portion is reduced to a second thickness, thereby forming a monolithic copper-containing structure. | 02-05-2015 |
Hao-Yin Tsai, Hsinchu TW
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20100007001 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - Semiconductor package structures and methods for manufacturing the same are provided. The semiconductor package structure comprises a substrate unit and a first chip stack structure. The substrate unit comprises a circuit structure having test pads. The first chip stack structure comprises chips, and each of the chips has a plurality of through silicon plugs. The through silicon plugs of two adjacent chips are electrically connected and further electrically connected to the test pads of the substrate unit for electrical testing. Another semiconductor package structure provided by the present invention comprises a first semiconductor chip and a second semiconductor chip. Each of the semiconductor chips has test pads for electrical testing and a plurality of through silicon plugs connecting to the test pads. The second semiconductor chip is mounted on the first semiconductor chip, and a portion of the through silicon plugs of two semiconductor chips are electrically connected with each other. | 01-14-2010 |
Hsiang Po Tsai, Hsinchu TW
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20090214692 | HOT PRESS MOLD FOR MEA OF FUEL CELL - A hot press mold for a MEA of fuel cell is provided. The hot press mold includes: a first mold including a first alignment part; a second mold including a second alignment part, being piled up a first electrode, a film, and a second electrode on it, whereby the first and second alignment parts join together to pile the first electrode, the film, and the second electrode between the first and second mold; and a lock loop secures the edge of the first and second mold to fix the first and second mold. | 08-27-2009 |
20090280391 | PACKAGE STRUCTURE FOR FUEL CELL - Provided is a package structure for a fuel cell, including a first polar plate and a second polar plate. The first polar plate includes a first recess used to accommodate an anode of a membrane electrode assembly (MEA), and at least a first sealed flange surrounding the first recess. The second polar plate includes a second recess corresponding in position to the first recess and used to accommodate a cathode of the MEA, and at least a first sealed groove surrounding the second recess and corresponding in position to the first sealed flange. The first sealed flange and the first sealed groove are employed to hold by clamping the periphery of the proton exchange membrane of the MEA, so as to accomplish sealing. | 11-12-2009 |
Hsieh-Chih Tsai, Hsinchu TW
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20100247654 | STABLE MICELLES FORMED WITH DIBLOCK COPOLYMERS OF CRITICAL MICELLE CONCENTRATION COPOLYMER AND TEMPERATURE-SENSITIVE COPOLYMER - A novel class of mixed micelles formed with critical micelle concentration (Cmc) character's diblock copolymer, and temperature-sensitive character's diblock copolymer were disclosed. The mixed micelles possess complementary effects in adjusting external temperature shift (storage vs. body temperature) and concentration change (dilution after intravenous injection). The mixed micelles of the present invention can serve as a potential injectable drug delivery system for anticancer drugs, such as doxorubicin and many others. | 09-30-2010 |
Hsi-Jung Tsai, Hsinchu TW
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20120068985 | CHIP AND COMPUTER SYSTEM - A computer system is provided. The computer system comprises system and peripheral hardware devices, a display device and a chip. The display device comprises a display panel and an on-screen display (OSD) control module. The chip comprises a computer system environment information monitoring module, a control connection interface and a control module. The computer system environment information monitoring module monitors computer system environment information according to the system and peripheral hardware devices. The control connection interface is electrically connected to the OSD control module. The control module is electrically connected to the computer system environment information monitoring module and the control connection interface to control the OSD control module through the control connection interface according to the computer system environment information to further control the display function of the display panel. | 03-22-2012 |
20140207961 | CHIP AND COMPUTER SYSTEM - A computer system is provided. The computer system comprises a network module and an input device. The network module receives remote information from a remote host through a network. The input device receives first input information, a display device and a chip. The display device comprises a display panel and an on-screen display (OSD) control module. The chip comprises a control connection interface and a control module. The control connection interface is electrically connected to the OSD control module. The control module is electrically connected to the network module, the input device and the control connection interface to control the OSD control module through the control connection interface according to the remote information or the first input information to further control the display function of the display panel | 07-24-2014 |
Hsin-Ting Tsai, Hsinchu TW
Patent application number | Description | Published |
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20110212567 | METHOD OF FABRICATING IMAGE SENSOR AND REWORKING METHOD THEREOF - A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region are sequentially formed on the substrate. A color filter array is formed on the first planarization layer in the pixel array region. A second planarization layer is formed to cover the color filter array and filled into the opening. A plurality of microlens is formed above the color filter array on the second planarization layer. A capping layer is conformally formed on the microlens and the second planarization layer. An etching step is performed to remove the capping layer and the second planarization layer in the opening so as to expose the patterned metal layer in the pad region. | 09-01-2011 |
Huai-Fang Tsai, Hsinchu TW
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20100165634 | Ultra-thin light guidance device - Disclosed is an ultra-thin light guidance device, which is realized through integrating a micro prism set into a light guidance module, and achieving filtering the incident lights by means of a micro grating in said micro prism set, thus only part of the effective incident lights pass through said micro prism set, while the rest of incident lights are reflected back to a bottom light guidance layer and a bottom light reflection plate, so that lights are reflected back and enters into said micro prism set again. As such, in less than 10 mm thickness of the ultra-thin light guidance device, a dot or a line light source is converted to form an evenly distributed and highly efficient surface light source by making use of said micro prism set. | 07-01-2010 |
20110187964 | LIQUID CRYSTAL PANEL MODULE, BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY - A liquid crystal panel module, a backlight module and a liquid crystal display (LCD) are provided. The liquid crystal panel module includes a liquid crystal panel and a diffraction grating layer. The liquid crystal panel has a plurality of pixels. The diffraction grating layer is disposed on the liquid crystal panel, and a maximum period of a grating of the diffraction grating layer is smaller than 1/10 of a size of the pixels. The backlight module includes a light guide plate, a light emitting element and a diffraction grating film. A light provided by the light emitting element emits from a light emitting surface of the light guide plate and is bended towards the light emitting element after passing through the diffraction grating film. The liquid crystal panel module and the backlight module can be applied to the LCD together or individually. | 08-04-2011 |
Hui-Jung Tsai, Hsinchu TW
Patent application number | Description | Published |
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20110298123 | CU PILLAR BUMP WITH NON-METAL SIDEWALL SPACER AND METAL TOP CAP - A bump has a non-metal sidewall spacer on a lower sidewall portion of Cu pillar, and a metal top cap on a top surface and an upper sidewall portion of the Cu pillar. The metal top cap is formed by an electroless or immersion plating technique after the non-metal sidewall spacer formation. | 12-08-2011 |
Hui-Ying Tsai, Hsinchu TW
Patent application number | Description | Published |
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20080299740 | METHOD FOR FORMING STI STRUCTURE - A method for forming a shallow trench isolation (STI) structure is described. A patterned mask layer is formed on a substrate, having a trench-like opening therein exposing a portion of the substrate. A thermal oxidation process is performed to the substrate. An anisotropic etching process is performed using the patterned mask layer as a mask to form a trench in the substrate, and then the trench is filled with an insulating material. | 12-04-2008 |
I-Shen Tsai, Hsinchu TW
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20110220986 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME - A memory device including a substrate, a conductive layer, a charge storage layer, first and second dopant regions and first and second cell dopant regions is provided. A plurality of trenches is deployed in the substrate. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layer is disposed between the substrate and the conductive layer. The first and second dopant regions having a first conductive type are configured in the substrate under bottoms of the trenches and in an upper portion of the substrate between two adjacent trenches, respectively. The first and second cell dopant regions having a second conductive type are configured in the substrate between lower portions of side surfaces of the trenches and in the substrate adjacent to the bottoms of the second dopant regions, respectively. The first and the second conductive types are different dopant types. | 09-15-2011 |
Jao-Hsing Tsai, Hsinchu TW
Patent application number | Description | Published |
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20080207406 | FOLDING STEP EXERCISER - A folding step exerciser includes a base including a front square socket projecting upwardly and including front and rear apertures, a horizontal support extending rearward from the support, and a transverse tube on the support adjacent rear of the socket; left and right handlebars; an upright having a top end adjustably secured to the handlebars; a pivot fixedly secured around a bottom end of the upright, the pivot having a U-shaped cross-section and including a front surface, a cavity on a bottom edge of the front surface, two triangular side surfaces, and a hole at a rear pointed end of either side surface; a bolt adapted to drive through one hole, the tube, and the other hole to pivotably secure the pivot and the socket together by cooperating with a nut, and a fastener adapted to threadably fasten the pivot and the socket together. | 08-28-2008 |
20080207415 | TWISTING EXERCISER - A twisting exerciser includes a base and a first pivot assembly and a second pivot assembly are respectively connected to the base. A first extension is rotatably connected to the first pivot assembly and a handlebar unit is connected to the first extension. A knee support unit is rotatably connected to the second extension which is rotatably connected to the second pivot assembly. Two support members are connected to the knee support unit. | 08-28-2008 |
20090042701 | PORTABLE EXERCISE DEVICE - A portable exercise device includes a body has two shafts respectively longitudinally extending therefrom and co-axially aligning with each other. Two rotors and two torsion springs are respectively pivotally sleeved on the two shafts of the body to make the two rotors reciprocally rotate relative to the two shafts. A wrench device and a stretch device respectively securely receive the two rotors for providing two exercise ways to the user. | 02-12-2009 |
20090054218 | Exerciser with Two Rotatable Disks - An exerciser includes a hollow base having two openings. Each opening includes at least one first circular groove. Two bearing members are received in the two openinigs, and each has a frame with which a plurality of balls are rotatably engaged. Two disks are rotatably mounted on the two bearing members respectively, and each disk includes at least one second circular groove and teeth defined in an underside thereof. The balls are rotatably engaged between the at least one first circular groove and the at least one second circular groove. A driving gear is located in the hollow base and engaged with the teeth of both of the two disks. | 02-26-2009 |
20100210424 | SWINGING GYMNASTIC MACHINE - A swinging gymnastic machine includes a front swinging assembly, a rear swinging assembly, a handle assembly pivotally secured to the front swinging assembly, and a pedal assembly pivotally secured to the rear swinging assembly. Each of the front and rear swinging assemblies has a spring unit. The front and rear swinging assemblies are durable and are unsusceptible of deflection. The swinging gymnastic machine also has the benefit of reducing the occupied space when it is not in use as both a front leg and the handle assembly are adapted to be folded rearwardly. A person has to exert a great force to overcome the resistance of both the front and rear swinging assemblies through the arms and calves in order to effectively exercise. | 08-19-2010 |
20100261588 | LEG STRETCHING EXERCISE APPARATUS - A leg stretching exercise apparatus includes a base seat, a telescopic handle erectly projecting from the front of the base seat, pulley sets and hinge members set on both sides of the base seat, first and second side frames hinged at each hinge member, pedal plates respectively slideably mounted on the first and second side frames by wheels under the pedal plates. An end of resistance members is hooked on to crooks under the pedal plates, and the other end is mounted around the pulley sets at the side of the base seat then hooked on to the crooks at fixed end of the first and second side frames. Thereby, a user can step both feet on the pedal plates and move the pedal plates outwardly in horizontal direction to obtain good exercising effect by the resistant force generated from the resistance members while exercising. | 10-14-2010 |
20110077137 | Swivel Exerciser - A swivel exerciser includes a base frame, left and right handlebars, a plate on the base frame, a curved rail around the plate and fixedly secured onto the base frame, left and right stop members at both ends of the rail, pivotal left and right arms, left and right pedals on ends of the left and right arms respectively and being slidable on the rail, left and right projecting plates each at one side of the left or right arm and having a through hole, and an inverted U-shaped member. In a first exercise mode, the inverted U-shaped member has both ends inserted into the through holes of the pedals for interconnection so that both the left and right pedals may swing clockwise or counterclockwise. In a second exercise mode, after removing the inverted U-shaped member either pedal may swing clockwise or counterclockwise independently. | 03-31-2011 |
20120108397 | Leg Stretching Device - A leg stretching device includes a frame having multiple lugs so as to be pivotably connected with first and second pedals. Two first protrusions extend from the first and second pedals respectively. Two side extensions respectively extend from two ends of the frame. A rod is connected to the mediate portion of the frame by an angle adjusting member. Two second protrusions extend from two sides of the rod respectively. Two resilient bands are respectively connected to the two first protrusions and the two second protrusions. The angle adjusting member adjusts the tensions of the two resilient bands. Two extension portions are respectively connected to the two side extensions and each extension portion has a support rod. The first and second pedals each have multiple positioning holes facing the support rod so as to adjust the angle of stretching. | 05-03-2012 |
20120225759 | Pull-up and Abdominal Exerciser - An exerciser includes a base having a first frame and a second frame which is pivotably connected to the first frame, and a slide device. The first and second frames are arranged to have an angle therebetween. The slide device has a damper and a roller is connected to the slide rod so as to move on the second frame. The users put the base on the floor to use the exerciser as a pull-up exerciser. The users can also overlap the first and second frames and put the first and second frames on the floor to use as an abdominal exerciser. The damper generates different resistance to obtain different exercising levels. | 09-06-2012 |
Jung-Che Tsai, Hsinchu TW
Patent application number | Description | Published |
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20080309779 | FOCUSING METHOD, SUITABLE FOR AN IMAGE CAPTURING APPARATUS USING IN AN ENVIRONMENT OF LOW BRIGHTNESS AND IMAGE CAPTURING APPARATUS USING THE SAME - A focusing method, suitable for an image capturing apparatus using in an environment of low brightness, is provided herein. The focusing method includes that an image sensing unit in the image capturing apparatus is wholly or partially divided into a plurality of regions, and digital image data sensed by the image sensing unit is divided into a plurality of sets corresponding to the regions of the image sensing unit. The regional image data corresponding to each of the regions are summed up during the focusing step, so as to obtain a sum of data for each region. Each sum of data is used to calculate a corresponding contrast value, and the contrast value is used to perform calculations for the focusing step, so as to obtain a focus. | 12-18-2008 |
Kun-Hua Tsai, Hsinchu TW
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20090058831 | Pixel Unit, Method for Sensing Touch of an Object, and Display Apparatus Incorporating the Same - A pixel unit, method for sensing touch of an object, and a display apparatus incorporating the same are provided. The display apparatus includes a data line. The pixel unit includes a first switch circuit electrically connected to the data line and a sensing circuit electrically connected to the first switch circuit. The sensing circuit generates a signal in response to the touch of the object, while the signal is transmitted through the data line with the first switch circuit turned on. In addition, the display apparatus further includes a readout line. The pixel unit further includes a second switch circuit electrically connected to the readout line. The sensing circuit is electrically connected to the second switch circuit. In a first time period, the sensing circuit receives a reference voltage via the first switch circuit. Then the signal generated by the touch of the object is transmitted through the readout line via the second switch circuit in a second time period. | 03-05-2009 |
Lian-Cheng Tsai, Hsinchu TW
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20080258834 | PULSE WIDTH MODULATION CIRCUIT - A pulse width modulation (PWM) circuit includes a turn on/off switch and a PWM controller. The first terminal of the turn on/off switch is coupled to a turn off voltage. The control terminal of the turn on/off switch receives a turn on/off signal to decide whether the circuit between the first terminal and the second terminal of the turn on/off switch is turned on or not. The PWM controller includes a PWM pin and a turn on/off device. The PWM pin is coupled to the second terminal of the turn on/off switch to output a PWM signal. The turn on/off device is coupled to the PWM pin to decide the turn on/off of the PWM controller according to a signal swing state of the PWM pin. | 10-23-2008 |
Li Duan Tsai, Hsinchu TW
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20090166198 | REFERENCE ELECTRODE - The invention provides a reference electrode including a liquid electrolyte containing water, a water soluble organic compound with molecular size and boiling point are both greater than water, and an ionic salt; a solid crystal of the ionic salt in the liquid electrolyte; a metal/metal salt complex layer in contact with the liquid electrolyte; an leading wire connected to the metal/metal salt complex layer; an insulation case for containing the liquid electrolyte; and a nano-porous junction material embedded in the insulation case for contacting the liquid electrolyte, wherein a pore size of the nano-porous junction material is greater than a cation diameter of the ionic salt but smaller than a molecular length of the water soluble organic compound. The solid crystal of the ionic salt is the sediment of part of the ionic salt because the amount of the ionic salt is more than its solubility in the liquid electrolyte. | 07-02-2009 |
20120168217 | EMBEDDED CAPACITOR SUBSTRATE MODULE - An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board. | 07-05-2012 |
20130248235 | EMBEDDED CAPACITOR MODULE - An embedded capacitor module includes an electrode lead-out portion and at least one solid electrolytic capacitor portion adjacently disposed with the electrode lead-out portion. The electrode lead-out portion comprises a first substrate, a second substrate, a first insulating material disposed between the first substrate and the second substrate, a first porous layer formed on at least one surface of the first substrate, and a first oxide layer disposed on the first porous layer. The solid electrolytic capacitor portion comprises the first substrate, the second substrate, the first porous layer, the first oxide layer, all of which are extended from the electrode lead-out portion, a first conductive polymer layer disposed on the first oxide layer, a first carbon layer disposed on the first conductive polymer layer, and a first conductive adhesive layer disposed on the first carbon layer. | 09-26-2013 |
Lin Wei Tsai, Hsinchu TW
Patent application number | Description | Published |
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20110294397 | Remote control ball assembly - A remote control ball assembly includes a housing, an actuating device having a circuit board disposed in the housing and having a processing device and a signal receiving device attached to the circuit board, two motors each include a wheel attached to a spindle and contacted with the housing, and a radio transmitter includes another processing device and an angle detector and a signal emitting device attached to another circuit board for detecting a status of the radio transmitter and for emitting the status signal to the signal receiving device, which then actuates the motors and the wheels to operate or to move the housing on land and on water without being operated by the fingers of the user. | 12-01-2011 |
20120242493 | Movement responding device for mobile object - A movement responding device includes a housing, a circuit board disposed in the housing, a control device mounted on the circuit board, a light device attached to the circuit board and electrically connected to the control device for generating a light, and a movement detector attached to the circuit board and electrically connected to the control device for detecting a movement of an object or a user and for supplying a detected information to the control device and for actuating the light device to generate the light when sensed or detected a movement of the object or the user or in automatic response to the detection of ambient movement or sound. | 09-27-2012 |
Loen-Shien Tsai, Hsinchu TW
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20100254194 | MEMORY APPARATUS AND METHOD FOR OPERATING THE SAME - The invention provides a method for reading a first data storage of a memory cell. The method comprises sensing a first current of the memory cell by applying a first bit line voltage on the memory cell. When the first current is larger than a first reference current with respect to the first bit line voltage, the first data storage is determined to be at an un-programmed state. Otherwise, a second current of the memory cell is sensed by applying a second bit line voltage on the memory cell. When the difference between the first current and the second current is larger than the difference between the first reference current and the second reference current, the first data storage is determined to be at the un-programmed state. Otherwise, the first data storage is determined to be at a programmed state | 10-07-2010 |
Lun Tsai, Hsinchu TW
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20090086353 | Bank Structure for a Display Panel and Method of Manufacturing the Same - A bank structure for a display panel is provided. The display panel comprises a substrate, and the bank structure is formed on the surface of the substrate. The bank structure comprises a periphery and a partition, wherein the periphery forms a receiving space with the substrate and the partition is disposed in the receiving space for separating the receiving space into two sub-spaces with fluid-communication. Therefore, the ink can be injected and uniformly distributed in the sub-spaces to overcome the disadvantages of poor injection precision and increasing the spray control of the ink. | 04-02-2009 |
Meng Hsueh Tsai, Hsinchu TW
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20100007575 | COUPLED-LOOP CHIP ANTENNA - A loop antenna for communication is provided, which includes a microwave substrate, being a hexahedron; a first conductive layer, disposed on an upper surface of the substrate for forming a first loop; a second conductive layer, disposed on a first side surface of the substrate, and electrically connected to a feed-in point and a ground point; and a third conductive layer, disposed on a lower surface of the substrate for forming a second loop. The first conductive layer and the second conductive layer are electrically connected at the junction between the upper surface and the first side surface, and the second conductive layer and the third conductive layer are electrically connected at the junction between the first side surface and the lower surface. The antenna also has an appropriate bandwidth for wireless communication application. | 01-14-2010 |
Meng-Lun Tsai, Hsinchu TW
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20090309123 | LIGHT-EMITTING DEVICE - This application discloses alight-emitting diode device, comprising an epitaxial structure having a light-emitting layer, a first-type conductivity layer, and a second-type conductivity layer wherein the thicknesses of the first-type conductivity confining layer is not equal to the second-type conductivity confining layer and the light-emitting layer is not overlapped with the portion of the epitaxial structure corresponding to the peak zone of the wave intensity distribution curve along the direction of the epitaxy growth. | 12-17-2009 |
Mi-Ching Tsai, Hsinchu TW
Patent application number | Description | Published |
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20090303840 | METHOD FOR REMOVING MICRO-DEBRIS AND DEVICE OF THE SAME - The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes. | 12-10-2009 |
20120167915 | METHOD FOR REMOVING MICRO-DEBRIS AND DEVICE OF THE SAME - The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes. | 07-05-2012 |
Ming-Dai Tsai, Hsinchu TW
Patent application number | Description | Published |
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20110063169 | PHASED-ARRAY TRANSCEIVER FOR MILLIMETER-WAVE FREQUENCIES - A phased-array transmitter and receiver that may be effectively implemented on a silicon substrate. The transmitter distributes to front-ends, and the receiver combines signals from front-ends, using a power distribution/combination tree that employs both passive and active elements. By monitoring the power inputs and outputs, a digital control is able to rapidly provide phase and gain correction information to the front-ends. Such a transmitter/receiver includes a plurality of radio frequency (RF) front-ends and a power splitting/combining network that includes active and passive components configured to distribute signals to/from the front-ends. | 03-17-2011 |
Ming Hsieh Tsai, Hsinchu TW
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20090206870 | METHOD FOR ANALYZING IC DEVICES AND WAFERS - A method for analyzing Integrated circuit (IC) devices is provided. The method comprises the following steps: dividing an IC device into n working units, wherein each working unit causes a corresponding current dissipation; selecting n operation parameters, wherein each of the operation parameters variably corresponds to the current dissipation of each working unit; selecting m sets of the operation parameters and separately operating the IC device under the m sets of the operation parameters, wherein m is not smaller than n, and obtaining the total current dissipations of the IC device; computering m sets of current dissipation data of the working units corresponding to the m sets of operation parameters by using the total current dissipations; computering a basic current dissipation of the IC device by using the total current dissipations of the IC device and the obtained corresponding current dissipation data set of the working units; and determining the defective working units by comparing the obtained data with the standard data, respectively. | 08-20-2009 |
Ming-Jinn Tsai, Hsinchu TW
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20100006814 | PHASE-CHANGE MEMORY ELEMENT - A phase-change memory cell is proposed. The phase-change memory includes a bottom electrode; a phase-change spacer formed to contact the bottom electrode; an electrical conductive layer having a vertical portion and a horizontal portion, wherein the electrical conductive layer electrically connects to the phase-change spacer via the horizontal portion; and a top electrode electrically connected to the electrical conductive layer via the vertical portion of the electrically conductive layer. | 01-14-2010 |
20140048762 | PHASE CHANGE MEMORY ELEMENT - A phase-change memory element with an electrically isolated conductor is provided. The phase-change memory element includes: a first electrode and a second electrode; a phase-change material layer electrically connected to the first electrode and the second electrode; and at least two electrically isolated conductors, disposed between the first electrode and the second electrode, directly contacting the phase-change material layers. | 02-20-2014 |
20150041752 | PHASE CHANGE MEMORY ELEMENT - A phase-change memory element with an electrically isolated conductor is provided. The phase-change memory element includes: a first electrode and a second electrode; a phase-change material layer electrically connected to the first electrode and the second electrode; and at least two electrically isolated conductors, disposed between the first electrode and the second electrode, directly contacting the phase-change material layers. | 02-12-2015 |
Ming-Sung Tsai, Hsinchu TW
Patent application number | Description | Published |
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20080273299 | Memory card and method for fabricating the same - A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface with the chip mounted thereon; covering the circuit board unit and the thin film by a mold so as to form a mold cavity having same shape as the circuit board unit but bigger size; filling a packaging material in the mold cavity so as to form an encapsulant encapsulating the chip and outer sides of the circuit board unit, thus integrally forming a memory card having the predefined shape. The present invention eliminates the need to perform a shape cutting process by using water jet or laser as in the prior art, thus reducing the fabricating cost and improving the fabricating yield. | 11-06-2008 |
20100321913 | MEMORY CARD - A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface with the chip mounted thereon; covering the circuit board unit and the thin film by a mold so as to form a mold cavity having same shape as the circuit board unit but bigger size; filling a packaging material in the mold cavity so as to form an encapsulant encapsulating the chip and outer sides of the circuit board unit, thus integrally forming a memory card having the predefined shape. The present invention eliminates the need to perform a shape cutting process by using water jet or laser as in the prior art, thus reducing the fabricating cost and improving the fabricating yield. | 12-23-2010 |
Ruey-Shi Tsai, Hsinchu TW
Patent application number | Description | Published |
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20090206755 | LAMP TUBE STRUCTURE WITH REFLECTIVE SURFACE - Disclosed is a lamp tube structure with reflective surface. In this invention, the lamp tube structure with reflective surface can be achieved by forming a reflective layer on the inner surface or outer surface through coating, plating, chemical vapor deposition, sputtering, evaporation deposition or pasting. The lamp tube structure with reflective surface can also be achieved by the assembling the parts with reflective surface in combination with the transparent lamp tube or lamp tube parts, in this invention. The incorporation of the reflective surface lets the lamp light be utilized more effectively, and it is helpful to energy saving. | 08-20-2009 |
Ru-Mei Tsai, Hsinchu TW
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20090180076 | PROJECTOR WITH SERVICE INFORMATION DISPLAYING FUNCTION AND SERVICE INFORMATION DISPLAYING METHOD FOR USE WITH SUCH PROJECTOR - A projector with a service information displaying function and a service information displaying method for use with the projector are provided. The projector includes a data storage unit, a monitor and a controller. The service information displaying method includes steps of pre-storing a data file in the projector, showing a main menu contained in the data file in response to a call request, and selecting a first item from the main menu and showing at least one service information corresponding to the first item. | 07-16-2009 |
Sen-Wei Tsai, Hsinchu TW
Patent application number | Description | Published |
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20090235132 | METHOD AND APPARATUS FOR BROADCASTING SCAN PATTERNS IN A SCAN-BASED INTEGRATED CIRCUIT - A broadcaster, system, and method for reducing test data volume and test application time in an ATE (automatic test equipment) in a scan-based integrated circuit. The scan-based integrated circuit contains multiple scan chains, each scan chain comprising multiple scan cells coupled in series. The broadcaster is a combinational logic network coupled to an optional virtual scan controller and an optional scan connector. The virtual scan controller controls the operation of the broadcaster. The system transmits virtual scan patterns stored in the ATE and generates broadcast scan patterns through the broadcaster for testing manufacturing faults in the scan-based integrated circuit. The number of scan chains that can be supported by the ATE is significantly increased. Methods are further proposed to reorder scan cells in selected scan chains, to generate the broadcast scan patterns and virtual scan patterns, and to synthesize the broadcaster and a compactor in the scan-based integrated circuit. | 09-17-2009 |
Shang-Yu Tsai, Hsinchu TW
Patent application number | Description | Published |
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20120097986 | WAFER LEVEL REFLECTOR FOR LED PACKAGING - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 04-26-2012 |
20120104435 | REFRACTIVE INDEX TUNING OF WAFER LEVEL PACKAGE LEDS - Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens. | 05-03-2012 |
20120261690 | LIGHT EMITTING DIODE WITH MICRO-STRUCTURE LENS - A light emitting diode (LED) with a micro-structure lens includes a LED die and a micro-structure lens. The micro-structure lens includes a convex lens portion, at least one concentric ridge structure surrounding the convex lens portion, and a lower portion below the convex lens portion and the at least one concentric ridge structure. The lower portion is arranged to be disposed over the LED die. A first optical path length from an edge of the LED die to a top center of the microstructure lens is substantially the same as a second optical path length from the edge of the LED die to a side of the micro-structure lens. | 10-18-2012 |
20130299855 | Wafer Level Reflector for LED Packaging - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 11-14-2013 |
Shiann-Tsong Tsai, Hsinchu TW
Patent application number | Description | Published |
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20090045527 | Multi-substrate region-based package and method for fabricating the same - A multi-substrate region-based package and a method for fabricating the same are provided. An active surface of a chip is divided into a plurality of functional regions, and each of the functional regions is electrically connected to a corresponding substrate via bonding wires. Each of the functional regions has a separate system, and the circuit layout thereof is not limited by the substrate or other systems but can be flexibly and independently designed, thereby allowing the package to be made smaller and thinner. Each set of the functional region and its corresponding substrate functions as an independent unit, such that the substrates are not affected by each other, thereby providing good compatibility, improved reliability and reduced packaging area. | 02-19-2009 |
20090111221 | Fabrication method of semiconductor device - A fabrication method of semiconductor device includes providing a substrate which has a plurality of electrical connection pads and is covered with an insulative layer, wherein the insulative layer has an opening formed for exposing the electrical connection pads; forming a filling material on the insulative layer of the substrate and compressing a semiconductor chip to the substrate through a plurality of bumps, the bumps electrically connecting the electrical connection pads and the filling material filling spacing between the semiconductor chip and the substrate so as to form a filling layer. By replacing the conventional underfilling process with the preprinting process of the filling material, the fabrication cost of the semiconductor device is reduced and the fabrication process is simplified. | 04-30-2009 |
20090243096 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF - A semiconductor device and a method of manufacturing the same are disclosed. The method is carried out by forming solder pads on a substrate by wet etching, flipping a semiconductor chip having a plurality of connection bumps formed on an active surface of the semiconductor chip for the connection bumps to be mounted by compression on the solder pads of the substrate correspondingly, at a temperature of the compression between the connection bumps and the solder pads lower than the melting points of the solder pads and the connection bumps, so as to allow the semiconductor chip to be engaged with and electrically connected to the substrate through the connection bumps and the solder pads, thereby enhancing the bonding strength of the solder pads and the connection bumps and increasing the fabrication reliability. | 10-01-2009 |
20100052161 | Semiconductor wafer with adhesive protection layer - A semiconductor wafer with an adhesive protection layer includes: a wafer body having a first surface and an opposing second surface; a plurality of electrical connection pads formed on the second surface of the wafer body; and the adhesive protection layer formed on the second surface of the wafer body and the plurality of electrical connection pads, wherein the protection layer is made of a material including a photosensitive adhesive, a thermal-setting adhesive and a dielectric material. The protection layer not only isolates circuits on the wafer surface from external moisture and contaminant, but also can be patterned and is adhesive, such that the wafer can be mounted to a circuit substrate in a subsequent process by the protection layer, without having to apply an additional adhesive on the wafer, thereby greatly simplifying the wafer-substrate attachment procedure during package fabrication processes. | 03-04-2010 |
20100148361 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device and a method for fabricating the same, including: a substrate having a mounting surface formed with a plurality of bonding fingers and covered with an insulating layer, the insulating layer having an opening formed therein for exposing the bonding fingers; and a chip coupled to the substrate and including a body, a self-adhesive protective layer, and a plurality of bumps protruding from the self-adhesive protective layer. The self-adhesive protective layer is formed on the chip but leaves the bumps exposed. The self-adhesive protective layer is made of a photosensitive adhesive, thermosetting adhesive, or dielectric material. The chip is coupled to the substrate via the self-adhesive protective layer, thus allowing the bumps to be electrically connected to the bonding fingers and at least an end of the opening to be exposed. The method enables a more streamlined manufacturing process and lower fabrication costs by dispensing with adhesive dispensing. | 06-17-2010 |
20100163605 | BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD - A ball-implantation method and a system applying the method are provided. To begin with, solder balls are implanted onto a flux applied to each of the ball pads on a substrate plate. Then, a vibration force of preset magnitude is exerted on the substrate plate, inducing vibration and causing any solder balls that have deviated from positions corresponding to the ball pads exposed from the openings of a solder mask provided on the substrate plate to return to the correct orientation and be kept therein by the vibration force and gravity. Subsequently, the ball implantation process is completed using a reflow process to solder the implanted solder balls. Using this method and the system thereof, the problem of missing or misaligned solder balls that occurs after the reflow process is solved, thereby dispensing with rework and improving the production yield and product reliability. | 07-01-2010 |
20120220081 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE STRUCTURE - A method of fabricating a semiconductor package structure is provided that includes: providing a chip having an active surface and a plurality of conductive bumps formed on the active surface, and a base substrate having an underfill layer formed on a surface thereof; attaching the active surface of the chip to the underfill layer, such that the conductive bumps are embedded in the underfill layer; removing the base substrate to expose the underfill layer; and attaching the chip to a package substrate via the underfill layer, such that the chip is electrically connected to the package substrate by the conductive bumps. Since the underfill layer is attached to the active surface of the chip first, and the underfill layer is provided on the package substrate, performing a soldering process is not needed, material cost is decreased, and the fabrication process is simplified. | 08-30-2012 |
Song-Feng Tsai, Hsinchu TW
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20110185224 | FLASH STORAGE DEVICE AND DATA PROTECTION METHOD THEREOF - A flash storage device comprises: a memory module, for storing data; a control unit, electrically connected to the memory module, for accessing the data in the memory module; and a detecting unit, electrically connected to the control unit, for passing a temperature detecting result to the control unit, and the control unit determining whether a data protection operation is activated according to the temperature detecting result. | 07-28-2011 |
20110238892 | WEAR LEVELING METHOD OF NON-VOLATILE MEMORY - A method of wear leveling applied to a non-volatile memory is provided. The method comprises steps of: categorizing all blocks within the non-volatile memory to a first group with erased blocks having higher history numbers, a second group with erased blocks having lower history numbers, or a third group with blocks not either assigned to the first group or the second group; selecting a first block which contains a clod data from the third group; selecting a second block from the first group; copying the cold data from the first block into the second block and updating the history number of the second block; and erasing the first block. | 09-29-2011 |
20130021088 | SOLID STATE DRIVE AND CONTROLLING METHOD THEREOF - A controlling method is provided for preventing a solid state drive from being operated at a high temperature. The solid state drive includes a controlling circuit, a temperature detecting circuit and a plurality of dies. The dies are divided into n groups and accessed by the controlling circuit through n IO buses. The controlling circuit is in communication with the temperature detecting circuit for detecting a temperature of the solid state drive. The controlling method includes the following steps. Firstly, a judging step is performed to judge whether the temperature of the solid state drive is higher than a predetermined temperature. If the temperature of the solid state drive is higher than the predetermined temperature, the frequencies of n clock signals in the n IO buses are decreased. | 01-24-2013 |
Tsung-Yen Tsai, Hsinchu TW
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20110189799 | Method for Transferring a Nano Material from a Substrate to Another Substrate - A method for transferring a nano material formed on a first substrate through deposition techniques to a second substrate, includes: (A) contacting the second substrate with a free end of the nano material on the first substrate; (B) heating the first substrate so that heat is conducted substantially from the first substrate through the nano material to the second substrate to soften a contact portion of a surface of the second substrate that is in contact with the free end of the nano material; (C) after step (B), cooling the second substrate so as to permit hardening of the contact portion of the surface of the second substrate and solid bonding of the nano material to the second substrate; and (D) after step (C), removing the first substrate from the nano material. | 08-04-2011 |
Tung-Chang Tsai, Hsinchu TW
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20090115954 | LIQUID CRYSTAL DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - An LCD panel including a first substrate, a second substrate, a black matrix, a liquid crystal (LC) layer, first photo spacers and second photo spacers is provided. The first and the second substrates are substantially parallel. The LC layer is disposed between the first and the second substrates. The black matrix disposed on the first substrate surrounds display regions and defines a non-display region. The first photo spacers contact the second substrate and are disposed on the black matrix. The second photo spacers are disposed on the black matrix. Channels are formed between the second photo spacers, such that LC molecules of the LC layer flow between the display regions through the channels. The width of the channels between any two of the adjacent second photo spacers substantially ranges from 2˜10 μm. The dimension of the first photo spacers is substantially greater than that of the second photo spacers. | 05-07-2009 |
Wang-Hsiang Tsai, Hsinchu TW
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20080230886 | Stacked package module - A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads, the first circuit board comprises a first surface, an opposite second surface, a plurality of first conductive pads on the first surface, a plurality of second conductive pads on the second surface, a plurality of conductive vias, and at least one circuit layer, and the electrodes of the first chip directly electrically connect to the conductive pads on the surfaces of the circuit board through the conductive vias and the circuit layer within the circuit board; and a second package structure electrically connecting to the first package structure through a plurality of solder balls to make package on package. The stacked package module provided by this invention has characteristics of compact size, high performance, and high flexibility. | 09-25-2008 |
Wei-Tai Tsai, Hsinchu TW
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20090016450 | IN-LOOP DEBLOCKING-FILTERING METHOD AND APPARATUS APPLIED TO VIDEO CODEC - An in-loop deblocking-filtering method applied to a video CODEC is provided. The method includes steps of: receiving a macroblock of pixel values outputted from a motion-compensating unit; dividing the macroblock of pixel values into a plurality of block of pixel values, and executing a data-transpose procedure to the plurality of blocks of pixel values; storing the plurality of block of pixel values, which are processed by the data-transpose procedure, in a memory buffer; executing a horizontal deblocking-filtering procedure to the macroblock of pixel values, which are stored in the memory buffer, for updating a portion of the pixel values in the macroblock; executing the data-transpose procedure to the plurality of block of pixel values stored in the memory buffer; and executing a vertical deblocking-filtering procedure to the macroblock of pixel values, which are stored in the memory buffer, for updating a portion of the pixel values in the macroblock. | 01-15-2009 |
Wen-Tsai Tsai, Hsinchu TW
Patent application number | Description | Published |
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20110310570 | LOW NOISE BLOCK DOWN-CONVERTER WITH INTEGRATED FEED - An LNBF is disclosed. The LNBF includes a housing, a spacer, down-converter circuit, and an F-connector. The spacer is disposed on the housing, wherein a hole is formed on the spacer. The down-converter circuit board is disposed between the housing and the spacer. The F-connector is disposed on the spacer and electrically connected to the down-converter circuit board via the hole. | 12-22-2011 |
20110316641 | RADIO FREQUENCY DEVICE - A radio frequency device is disclosed, which includes an isolation substrate, a ground layer, a first signal end, a second signal end, a radio frequency circuit, and an impedance unit. The isolation substrate includes a first plane and a second plane. The ground layer is disposed on the second plane of the isolation substrate for providing grounding. The first signal end is formed on the first plane of the isolation substrate. The second signal end is formed on the first plane of the isolation substrate and coupled to the ground layer. The radio frequency circuit is disposed on the first plane of the isolation substrate and coupled to the first signal end. The impedance unit is disposed on the first plane of the isolation substrate and coupled to the first signal end and the second signal end. | 12-29-2011 |
20110316644 | CIRCUIT BOARD WITH JUMPER STRUCTURE - A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal transmission line is formed on a first plane of the substrate, and coupled to a first signal end and a second signal end. A first signal transmitted on the first signal transmission line in a combination method of a microstrip line to co-planar waveguide transition and a co-planar waveguide to microstrip line transition. The second signal transmission line is formed on the second plane of the substrate, and coupled to a third signal end and a fourth signal end. A second signal is transmitted on the second signal transmission line in the co-planar waveguide transmission. | 12-29-2011 |
Whey-Fone Tsai, Hsinchu TW
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20110063434 | Monitor system for monitoring riverbed elevation change at bridge pier - A monitor system for monitoring riverbed elevation changes at bridge piers is revealed. The monitor system includes a container, a rail, a holder, a photographic unit, a processor and a transmission unit. The container is disposed at a pier under the water and the rail is mounted in the container. The holder is arranged at the rail and is moved on the rail. The photographic unit is disposed on the holder to capture a monitor image of a riverbed under the water. As to the processor, it processes the monitor image so as to learn elevation change of the riverbed under the water. By the transmission unit, the riverbed elevation change is sent to a remote monitor unit so as to get the riverbed elevation according to the riverbed elevation change. Thus the riverbed elevation change at the bridge pier is monitored in real time. | 03-17-2011 |
20110242309 | MULTI-LENS MONITORING SYSTEM FOR BED ELEVATION AROUND A PIER - The present invention relates to a multi-lens monitoring system for bed elevation around a pier according to the present invention comprises a container, a holder, a plurality of photographing units, and a processing module. The container is disposed on the pier; the holder is disposed inside the container; and the plurality of photographing units are disposed on the holder for photographing the bed under water and producing a monitoring image. The processing module is used for activating one of the plurality of photographing units for photographing the bed under water. The processing module also analyzes the monitoring image, gives the elevation variation of the bed, and transmits the elevation variation of the bed to a remote monitoring unit for real-timely monitoring and recording. During the monitoring process, the processing module will change activating one of the plurality of photographing units according to the monitoring image, and hence the electrical power can be saved. | 10-06-2011 |
20110255735 | PROBE MONITORING SYSTEM FOR RIVERBED ELEVATION MONITORING AT BRIDGE PIERS - A probe monitoring system for riverbed elevation monitoring at bridge piers is revealed. The system includes a housing, a measuring rod, a moving member, a control module, a photographic unit and a sensing unit. The housing is fixed on the pier. Both the moving member for driving the measuring rod and the control module for control of the moving member are mounted in the housing. When the control module drives the measuring rod to move downward and the sensing unit on the bottom of the measuring rod approaches the riverbed, a sensing signal is sent to the control module. Thus the moving member stops moving the measuring rod and the photographic unit takes pictures of the measuring rod to generate an image. Then the riverbed elevation is obtained according to the image or the movement of the moving member and is sent to a remote monitor unit for real-time monitoring. | 10-20-2011 |
20120127300 | TELESCOPIC PROBE MONITORING SYSTEM FOR RIVERBEDELEVATION MONITORING AT BRIDGE PIERS - A telescopic probe monitoring system for riverbed elevation monitoring at a bridge pier is revealed. The system includes a measurement module for measuring riverbed elevation under water and a control module. The measurement module includes a housing, a multi-layer tube, a driving member with scales, a photographic unit for capturing images, and a sensing unit. The control module controls the driving member to extend the multi-layer tube. Thus the sensing unit on the bottom of the multi-layer tube contacts the riverbed and then sends a sensing signal to the control module for stopping pushing the multi-layer tube and controlling the photographic unit to capture images of the driving member. According to the images and movement of the measurement module, the control module learns the riverbed elevation and sends the riverbed elevation to a remote monitor unit for real-time monitoring of the riverbed elevation. | 05-24-2012 |
Winston Tsai, Hsinchu TW
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20110191139 | METHODS AND SYSTEMS FOR DYNAMIC INVENTORY CONTROL - The embodiments of the present invention fill the need of properly controlling product inventory of semiconductor chips by providing methods and systems of dynamic inventory control. The methods and systems timely modify parameters affecting inventory. The parameters may include target inventory, cycle time, wafer start, future inventory and future shipment. In addition, the methods and systems gather real-time customer demand forecast to assist in production planning and adjustment. Further, the methods and systems identify inventory control turning points dynamically to adjust production activities to prevent overstock and to prevent stockout. | 08-04-2011 |
Wu-Jung Tsai, Hsinchu TW
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20090303840 | METHOD FOR REMOVING MICRO-DEBRIS AND DEVICE OF THE SAME - The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes. | 12-10-2009 |
20120167915 | METHOD FOR REMOVING MICRO-DEBRIS AND DEVICE OF THE SAME - The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes. | 07-05-2012 |
Ya-Lu Tsai, Hsinchu TW
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20110142730 | Crystalline Silicon Formation Apparatus - In a crystalline silicon formation apparatus, a quick cooling method is applied to the bottom of a crucible to control a growth orientation of a polycrystalline silicon grain, such that the crystal grain forms twin boundary, and the twin boundary is a symmetric grain boundary, and the crystal grain is solidified and grown upward in unidirection to form a complete polycrystalline silicon, such that defects or impurities will not form in the polycrystalline silicon easily. | 06-16-2011 |
Yao-Chou Tsai, Hsinchu TW
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20100269951 | WIRE STRETCHING DEVICE - A wire stretching device for applying a drag force onto a wire wound around an object is provided. The wire stretching device comprises a primary platform, a first sub-platform, a second sub-platform and a driving device. The primary platform comprises a plate, a fixed stick and a track, wherein the fixed stick and the track are disposed on a surface of the plate, and the fixed stick has a first fixing device for fixing a first end of the wire. The object is fixed on a first stage of the first sub-platform, and a second fixing device is disposed on a second stage of the second sub-platform for fixing the second end of the wire. The second sub-platform is moved by the driving device for adjusting the tension of the wire. The first sub-platform is passively moved along the track corresponding to the tension of the wire. | 10-28-2010 |
20110189818 | Method for forming oxide thin film transistor - A method for manufacturing oxide thin film transistors includes steps of: forming a gate, a drain electrode, a source electrode, and an oxide semiconductor layer respectively. The oxide semiconductor layer is formed on the gate electrode; the drain electrode and the source electrode are formed at two opposite sides of the oxide semiconductor layer. The method further includes a step of depositing a dielectric layer of silicon oxide, and a reacting gas for depositing the silicon oxide includes silane and nitrous oxide. A flow rate of nitrous oxide is in a range from 10 to 200 standard cubic centimeters per minute (SCCM). Oxide thin film transistors manufactured by above method has advantages of low leakage, high mobility, and other integrated circuit member can be directly formed on the thin film transistor array substrate of a display device. | 08-04-2011 |
20110242014 | DISPLAY PANEL - A display panel is provided. The display panel comprises a first substrate, a second substrate, a display control circuit and a force sensing circuit. The display control circuit is disposed on the first substrate between the first substrate and the second substrate for controlling the display panel to display an image through the second substrate. The force sensing circuit is disposed side by side with the display control circuit on the first substrate between the first substrate and second substrate, wherein the force sensing circuit comprises a plurality of force sensing elements for sensing at least one external force and correspondingly generate a plurality of force signals respectively to transform at least one touch signal corresponding to the at least one external force. | 10-06-2011 |
20110290414 | METHOD FOR MANUFACTURING COLOR ELECTROPHORETIC DISPLAY DEVICE - A method for manufacturing a color electrophoretic display device includes the following steps. First, a substrate having a displaying region and a circuit region around the displaying region is provided. Next, a driving array is formed in the displaying region. Subsequently, an electrophoretic display layer is formed on the driving array. Afterwards, a thermal transfer process is performed so that a color filter layer is formed on the electrophoretic display layer. The method can increase the production eligibility rate of the color electrophoretic display device, thereby improving the display quality of the color electrophoretic display device. | 12-01-2011 |
20120168428 | ELECTROTHERMAL TRANSFER DEVICE AND ELECTROTHERMAL TRANSFER METHOD - An electrothermal transfer device includes a substrate, a plurality of electrothermal components and a heating circuit. The electrothermal components are disposed on a surface of the substrate and arranged in a pattern. The heating circuit is electrically connected to the electrothermal components. In an electrothermal transfer method, at first, a transfer substrate is disposed on a workpiece substrate. Then, the electrothermal transfer device is disposed on the transfer substrate so that the electrothermal components contact with the transfer substrate. Thereafter, the heating circuit is used to heat the electrothermal transfer components so that the transfer substrate is heated to be transferred to the workpiece substrate. The electrothermal transfer device and the electrothermal transfer method can reduce cost. | 07-05-2012 |
20120250135 | Color Display and Method for Manufacturing Color Display - A method for manufacturing a color display provides a bottom substrate, injects a liquid display media onto the bottom substrate, and disposes a sealing substrate on the liquid display media, such that the liquid display media is contained between the sealing substrate and the bottom substrate. The method also aligns an image device corresponding to the bottom substrate and transfers a color coating onto the sealing substrate by a laser device through a laser thermal transfer process to form a color filter layer on the sealing substrate. | 10-04-2012 |
20120261656 | PHOTODIODE, LIGHT SENSOR DEVICE AND FABRICATING METHOD THEREOF - A photodiode, a light sensor and a fabricating method thereof are disclosed. An n-type semiconductor layer and an intrinsic semiconductor layer of the photodiode respectively comprise n-type amorphous indium gallium zinc oxide (IGZO) and intrinsic IGZO. The oxygen content of the intrinsic amorphous IGZO is greater than the oxygen content of the n-type amorphous IGZO. A light sensor comprise the photodiode is also disclosed. | 10-18-2012 |
20120262776 | COLOR ELECTRONIC PAPER DEVICE AND MANUFACTURING METHOD THEREOF - A color electronic paper device and manufacturing method thereof are provided. The device includes: a front panel; a color filter layer, placed over the front panel; a color protection layer, being a thermoplastic transparent layer placed over the color filter layer; an adhesive layer, placed over the color protection layer; and a cover, placed over the adhesive layer. | 10-18-2012 |
20120268820 | COLOR FILTER FILM, GRATING STRUCTURE AND DISPLAY MODULE - A grating structure used on a color filter film of a display module is disclosed in the invention. The grating structure is disposed on a substrate of the color filter film. The grating structure includes a plurality of optical transparent layers and an optical reflection layer. The optical transparent layers are stacked on the substrate in sequence. Each of the optical transparent layers has a different refractive index from the other optical transparent layers. The optical reflection layer is disposed over the optical transparent layers. | 10-25-2012 |
20120300419 | INTERMEDIATE STRUCTURE, METHOD AND SUBSTRATE FOR FABRICATING FLEXIBLE DISPLAY DEVICE - An intermediate structure of a flexible display device includes a substrate, an etching layer, a flexible substrate, and a display module. A trench structure is formed in a surface of the substrate. The etching layer is formed on the surface and covers the substrate. The flexible substrate is disposed on the etching layer. The flexible substrate and the substrate are spaced apart from each other by the etching layer. The display module is disposed on the flexible substrate. The flexible substrate can be peeled from the substrate without applying a mechanical force and thus the yield is improved, and the process time and the fabricating cost are also reduced. In addition, the present invention also provides a substrate for fabricating a flexible display device and a method for fabricating a flexible display device. | 11-29-2012 |
20120320446 | COLOR ELECTRONIC PAPER APPARATUS, DISPLAY AND MANUFACTURING METHOD THEREOF - A color electronic paper apparatus includes a display layer, a color resist layer, an anti-ultraviolet layer and a protective sheet. The color resist layer is disposed on the display layer. The anti-ultraviolet layer is disposed on the color resist layer. The protective sheet is disposed on the anti-ultraviolet layer. A manufacturing method of the color electronic paper apparatus and a color electronic paper display are provided herein. | 12-20-2012 |
20130043474 | ACTIVE ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a method for manufacturing an active array substrate. The method includes the steps of: forming a first patterned metal layer on a substrate; sequentially forming a semiconductor layer, an insulating layer and a second metal layer to cover the first patterned metal layer; forming a patterned photoresist layer on the second metal layer; patterning the second metal layer, the insulating layer and the semiconductor layer to form a second patterned metal layer, a patterned insulating layer and a patterned semiconductor layer, and removing a portion of the patterned photoresist layer; heating the remained portion of the patterned photoresist layer such that the remained portion is fluidized and transformed into a protective layer; and forming a pixel electrode. | 02-21-2013 |
20130072079 | MANUFACTURING METHOD FOR FLEXIBLE DISPLAY APPARATUS - A manufacturing method for a flexible display apparatus is provided. A rigid substrate is provided. A flexible substrate having a supporting portion and a cutting portion surrounding the supporting portion is provided. A first adhesive material is formed between the rigid substrate and the cutting portion of the flexible substrate, so that the flexible substrate is adhered onto the rigid substrate by the first adhesive material. The first adhesive material does not locate on the supporting portion of the flexible substrate. At least a display unit is formed on the supporting portion of the flexible substrate. The supporting portion and the cutting portion of the flexible substrate are separated so as to separate the rigid substrate and the flexible substrate, wherein the flexible substrate and the display unit thereon form a flexible display apparatus. In the method, the flexible substrate and the rigid substrate can be easily separated. | 03-21-2013 |
20130099220 | Transistor Structure - A transistor structure comprises a patterned N-type transparent oxide semiconductor formed over a substrate as a base, and a patterned p-type organic polymer semiconductor formed on the patterned N-type transparent oxide semiconductor comprising a first portion and a second portion so that the patterned N-type transparent oxide semiconductor and the first portion and the second portion of the patterned p-type organic polymer semiconductor form heterojunctions therebetween respectively, wherein the first portion of the patterned p-type organic polymer semiconductor is used as an emitter, and the second portion of the patterned p-type organic polymer semiconductor is used as a collector. | 04-25-2013 |
20130105790 | THIN FILM TRANSISTOR SUBSTRATE AND METHOD FABRICATING THE SAME | 05-02-2013 |
20130187900 | COURT BORDER MODULE USING DISPLAY APPARATUS - A court border module using a display apparatus is disclosed, which uses piezoelectric elements to drive the display apparatus. When a ball hits a court border, which is defined by the display apparatus, a force is applied to the piezoelectric elements which then generate power to drive the corresponding part of the display apparatus. The color of the part of the display apparatus hit by the ball is switched. Therefore the change in the color of the court border can be observed by officials and others to instantly and objectively determine whether the ball has hit the court border. | 07-25-2013 |
20130210201 | METHOD FOR MANUFACTURING ACTIVE ARRAY SUBSTRATE - A method for manufacturing an active array substrate is provided herein. The active array substrate can be manufactured by using only two photolithography process steps. The photolithography process step using a first photomask may be provided for forming a drain electrode, a source electrode, a data line and/or a data line connecting pad and a patterned transparent conductive layer, etc. The photolithography process step using a second photomask may be utilized for forming a gate electrode, a gate line, a gate insulating layer, a channel layer and/or a gate line connecting pad, and so forth. | 08-15-2013 |
20130215493 | ELECTROPHORETIC DISPLAY FILM AND ELECTROPHORETIC DISPLAY APPARATUS - An electrophoretic display film is provided, which includes a first protective film, a second protective film and a plurality of display media. The second protective film is opposite to the first protective film. The display media are disposed between the first protective film and the second protective film, in which each of the display media includes an electrophoretic liquid and a plurality of black charged particles and a plurality of charged particles with metallic gloss both distributed in the electrophoretic liquid. | 08-22-2013 |
20130241816 | ELECTROPHORETIC DISPLAY APPARATUS - An electrophoretic display apparatus including a substrate and an electrophoretic display film is provided. The substrate has multiple pixel units, each the pixel unit has a transparent region and a reflective region and each the pixel unit includes a pixel electrode and a reflective layer. The pixel electrode is located in the transparent region and the reflective region. The reflective layer is disposed on the pixel electrode and located in the reflective region. The electrophoretic display film is disposed on the substrate and includes a common electrode and multiple microcapsules disposed between the common electrode and the pixel units, in which each the microcapsule includes multiple black electrophoretic particles, and the arrangement of the black electrophoretic particles is controlled by a driving voltage applied between the pixel electrode of each the pixel unit and the common electrode of the electrophoretic display film. | 09-19-2013 |
20140021473 | SEMICONDUCTOR STRUCTURE - A semiconductor structure includes a gate, an oxide channel layer, a gate insulating layer, a source, a drain and a dielectric stacked layer. The oxide channel layer is stacked over the gate, with the gate insulting layer disposed therebetween. The source and the drain are disposed on a side of the oxide channel layer and in parallel to each other. A portion of the oxide channel layer is exposed between the source and the drain. The dielectric stacked layer is disposed on the substrate and includes plural of first inorganic dielectric layers with a first refraction index and plural of second inorganic dielectric layers with a second refraction index that are stacked alternately. At least one of the first inorganic dielectric layers directly covers the source, the drain and the portion of the oxide channel layer. The first refraction index is smaller than the second refraction index. | 01-23-2014 |
20140070216 | THIN FILM TRANSISTOR - A thin film transistor (TFT) is provided, which includes a substrate, a first gate layer, an insulation layer, a first source/drain layer, a second source/drain layer, a semiconductor layer, a passivation layer and a second gate layer. The first gate layer is disposed on the substrate. The insulation layer is disposed on the first gate layer. The first source/drain layer is disposed on the insulation layer. The second source/drain layer is disposed on the insulation layer. The semiconductor layer is disposed on the insulation layer and covers the first source/drain layer and the second source/drain layer. The passivation layer is disposed on the insulation layer and covers the semiconductor layer. The second gate layer is disposed on the passivation layer and contacts the first gate layer through a via so that the two gate layers keep a same voltage level. | 03-13-2014 |
Ya-Ting Tsai, Hsinchu TW
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20120023517 | Method and System for Measuring an Internet Protocol Television Channel Zapping Delay - A method for measuring an Internet Protocol Television (IPTV) channel zapping delay to be implemented using a system that includes a scheduling unit, a remote controller, a stream providing unit, a set-top box, and a packet analyzing unit, said method comprising: a) configuring the scheduling unit to control the remote controller to transmit a channel change signal to the set-top box, whereby the set-top box initiates communication of a plurality of packets with the stream providing unit; b) configuring the packet analyzing unit to capture the packets communicated between the set-top box and the stream providing unit; and c) configuring the packet analyzing unit to compute an IPTV channel zapping delay corresponding to the channel change signal on the basis of the packets captured in step b). A system for measuring an IPTV channel zapping delay is also disclosed. | 01-26-2012 |
Yi Heng Tsai, Hsinchu TW
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20120043626 | MICROSTRUCTURE DEVICE WITH AN IMPROVED ANCHOR - The present disclosure provides a system of fabricating a microstructure device with an improved anchor. A method of fabricating a microstructure device with an improved anchor includes providing a substrate and forming an oxide layer on the substrate. Then, a cavity is etched in the oxide layer, such that the cavity includes a sidewall in the oxide layer. A microstructure device layer is then bonded to the oxide layer over the cavity. Forming a microstructure device, a trench is etched in the device layer to define an outer boundary of the microstructure device. In an embodiment, the outer boundary is substantially outside of the sidewall of the cavity. Then, the sidewall of the cavity is etched away through the trench in the device layer, to thereby suspend the microstructure device over the cavity. | 02-23-2012 |
20120223613 | ELECTRICAL BYPASS STRUCTURE FOR MEMS DEVICE - An apparatus including a bypass structure for complementary metal-oxide-semiconductor (CMOS) and/or microelectromechanical system (MEMS) devices, and method for fabricating such apparatus, is disclosed. An exemplary apparatus includes a first substrate; a second substrate that includes a MEMS device; an insulator disposed between the first substrate and the second substrate; and an electrical bypass structure disposed in the insulator layer that contacts a portion of the first substrate, wherein the electrical bypass structure is electrically isolated from the MEMS device in the second substrate and any device included in the first substrate. | 09-06-2012 |
20120261830 | MEMS DEVICE ETCH STOP - The present disclosure provides a micro-electro-mechanical systems (MEMS) device and a method for fabricating such a device. In an embodiment, a MEMS device includes a substrate, a dielectric layer above the substrate, an etch stop layer above the dielectric layer, and two anchor plugs above the dielectric layer, the two anchor plugs each contacting the etch stop layer or a top metal layer disposed above the dielectric layer. The device further comprises a MEMS structure layer disposed above a cavity formed between the two anchor plugs and above the etch stop layer from release of a sacrificial layer. | 10-18-2012 |
20130126989 | Microstructure Device with an Improved Anchor - A microelectromechanical system (MEMS) device includes a substrate and an oxide layer formed on the substrate. A cavity is etched in the oxide layer. A microstructure device layer is bonded to the oxide layer, over the cavity. The microstructure device layer includes a substantially solid microstructure MEMS device formed in the microstructure device layer and suspended over a portion of the cavity. An anchor is formed in the device layer and configured to support the microstructure device, the anchor having an undercut in the oxide layer. The undercut has a length along the anchor that is less than one-half a length of an outer boundary dimension of the microstructure MEMS device. | 05-23-2013 |
20130140653 | MEMS DEVICE ETCH STOP - The present disclosure provides a micro-electro-mechanical systems (MEMS) device and a method for fabricating such a device. In an embodiment, a MEMS device includes a substrate, a dielectric layer above the substrate, an etch stop layer above the dielectric layer, and two anchor plugs above the dielectric layer, the two anchor plugs each contacting the etch stop layer or a top metal layer disposed above the dielectric layer. The device further comprises a MEMS structure layer disposed above a cavity formed between the two anchor plugs and above the etch stop layer from release of a sacrificial layer. | 06-06-2013 |
Yin-Yen Tsai, Hsinchu TW
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20110254436 | TRIPHENYLENE BASED AROMATIC COMPOUNDS AND OLEDS UTILIZING THE SAME - Disclosed is a triphenylene based aromatic compound, wherein a benzene center is substituted with a triphenylene group and another aromatic group such as triphenylenyl, pyrenyl, phenylvinyl, carbazolylphenyl, or arylanthryl in the meta position of the benzene center. The meta-substituted aromatic compound of the invention has better thermal stability (Tg) than the conventional para-substituted aromatic compound. The meta-substituted aromatic compound, served as a hole transporting layer or a host material applied in a light emitting layer in an OLED, is more preferable than the conventional para-substituted aromatic compound. | 10-20-2011 |
20120248429 | TRIPHENYLENE BASED AROMATIC COMPOUNDS AND OLEDS UTILIZING THE SAME - Disclosed is a triphenylene based aromatic compound, wherein a benzene center is substituted with a triphenylene group and another aromatic group such as triphenylenyl, pyrenyl, phenylvinyl, carbazolylphenyl, or arylanthryl in the meta position of the benzene center. The meta-substituted aromatic compound of the invention has better thermal stability (Tg) than the conventional para-substituted aromatic compound. The meta-substituted aromatic compound, served as a hole transporting layer or a host material applied in a light emitting layer in an OLED, is more preferable than the conventional para-substituted aromatic compound. | 10-04-2012 |
You-Chi Tsai, Hsinchu TW
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20120026577 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided. | 02-02-2012 |
Yuan Chih Tsai, Hsinchu TW
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20100208188 | Display Device and Method for Fabricating the same - A display device includes an array substrate, a display medium layer, a transparent layer and a sealant. The array substrate has a first region and a second region surrounding the first region. The display medium layer is disposed on the array substrate and located in the first region. The transparent layer with an upper surface is disposed on the display medium layer. The upper surface has a display region and a predetermined sealing region surrounding the display region. The sealant is formed on the array substrate and located in the second region. Also, the sealant surrounds the transparent layer and the display medium layer and covers the predetermined sealing region of the transparent layer. In addition, a method for fabricating the display device is also provided. Since the sealant surrounds the transparent layer and the display medium layer and covers the predetermined sealing region of the transparent layer, the packaging performance of the above display device may be improved. | 08-19-2010 |
20100230484 | Electronic Business Card - An electronic business card includes a data transmitting module, a storing module and a flexible display. The data transmitting module is used to transfer and receive at least a data. The storing module that is electrically connected to the data transmitting module is used to store the data, which has been received or will be transmitted by the data transmitting module. The flexible display used to display the data stored in the storing module is electrically connected to the storing module. In the electronic business card, the flexible display may improve portability and reduce the power-consumption, thus a use convenience of the electronic business card can be improved. | 09-16-2010 |
20100238144 | Flexible Display Panel - A flexible display panel includes a flexible panel body and at least one integrated circuit driver (IC driver). The flexible panel body has a first end surface, a second end surface, a plurality of side surfaces and at least one convex cambered surface. The first end surface has a display area. The second end surface is opposite to the first end surface. Each of the side surfaces connects the first end surface and the second end surface. Each adjacent two of the side surfaces connect each other. The convex cambered surface connects adjacent two of the side surfaces and connects the first end surface and the second end surface. The IC driver is disposed at the flexible panel body, located outside the display area, and adjacent to the convex cambered surface. In addition, another flexible display panel having a gravity-changing device is also provided. | 09-23-2010 |
20100238612 | Flexible Display Device - A flexible display device includes a display panel and a plurality of curving-restricting structures. The display panel has a display surface and a bottom surface opposite thereto. The display surface has a visible region and an outer region surrounding the visible region. The curving-restricting structures may be disposed on at least one of the outer region of the display surface and the bottom surface of the display panel. Each curving-restricting structure has a top surface and at least a slanted side wall. The top surfaces of adjacent curving-restricting structures are spaced with each other, and the slanted side walls of adjacent curving-restricting structures face each other. When the flexible display device are curved to a predetermined extent, adjacent curving-restricting structures may resist against with each other to prevent the display panel from being unduly curved to be damaged, and thus a use reliability of the flexible display device is improved. | 09-23-2010 |
20100323576 | Fabricating Method of Flexible Display Device - In a fabricating method of flexible display device, firstly, a sacrificial layer is formed on a first rigid substrate. Secondly, a first flexible substrate is formed on the sacrificial layer. The bonding force of the sacrificial layer absorbing a breaking-bond light may be broken and the first flexible substrate is transparent for the breaking-bond light. Moreover, the transmission rate of visible light of the first flexible substrate is larger than that of the sacrificial layer. Then, the sacrificial layer is illuminated by the breaking-bond light for breaking the bonding force of the sacrificial layer to separate the first rigid substrate from the first flexible substrate. Since the first rigid substrate has a high transmission rate of visible light, may be separated from the first flexible substrate by the first breaking-bond light with low energy, the cost of fabricating the flexible display device may display the images with real color. Therefore, the chromatic performance of the flexible display device may be enhanced. | 12-23-2010 |
20120026577 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided. | 02-02-2012 |
20120081650 | REFLECTIVE DISPLAY APPARATUS - A reflective display apparatus includes a transparent substrate, a reflective substrate, a display layer and a transparent gluing layer. The transparent gluing layer is disposed between the transparent substrate and the display layer and the refractive indices of the transparent gluing layer and of the transparent substrate are substantially the same. Therefore, the energy loss of light can be reduced at the interface between the transparent gluing layer and the transparent substrate, so the brightness of the image displayed by the reflective display apparatus may be increased. | 04-05-2012 |
20120081849 | FLEXIBLE DISPLAY DEVICE - A flexible display device includes a display panel and a plurality of curving-restricting structures. The display panel has a display surface and a bottom surface opposite thereto. The display surface has a visible region and an outer region surrounding the visible region. The curving-restricting structures is disposed on at least one of the outer region of the display surface and the bottom surface of the display panel. Each curving-restricting structure has a top surface and at least a slanted side wall. The top surfaces of adjacent curving-restricting structures are spaced with each other, and the slanted side walls of adjacent curving-restricting structures face each other. When the flexible display device are curved to a predetermined extent, adjacent curving-restricting structures may resist against with each other to prevent the display panel from being unduly curved to be damaged, and thus a use reliability of the flexible display device is improved. | 04-05-2012 |
20120307343 | ELECTROPHORETIC DISPLAY - Disclosed herein is an electrophoretic display, which includes a first substrate, an electrophoretic layer, a second substrate, a stress controlling layer and an adhesive layer. The first substrate includes at least one active device and at least one pixel electrode electrically coupled to the active device. The electrophoretic layer is disposed above the pixel electrode. The second substrate is disposed above the electrophoretic layer. The stress controlling layer is formed on a lower surface of the second substrate. The adhesive layer is disposed between the surface stressed layer and the electrophoretic layer, and is in contact with the stress controlling layer and the electrophoretic layer. The adhesion between the stress controlling layer and the adhesive layer is about 75% to 125% of the adhesion between the electrophoretic layer and the adhesive layer. | 12-06-2012 |
20130057464 | ELECTRO-PHORETIC DISPLAY DEVICE AND FABRICATING METHOD THEREOF - An electro-phoretic display device includes a first substrate, an active elements array, a driving circuit, a conductive flexible board, an electro-phoretic layer and a second substrate. The first substrate has a first surface defining a display area and a circuit area, and a second surface. The active elements array is disposed within the display area and the driving circuit is disposed within the circuit area and electrically connected to the active elements array. The conductive flexible board is partially disposed at the first substrate and electrically connected to the driving circuit. The electro-phoretic layer and the second substrate are sequentially disposed on the active elements array and the driving circuit. A fabricating method of electro-phoretic display device is also disclosed. | 03-07-2013 |
Yu-Cheng Tsai, Hsinchu TW
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20110193842 | LIQUID CRYSTAL DISPLAY AND METHODS OF DRIVING SAME - A liquid crystal display (LCD) and methods of driving same. In one embodiment, the LCD) includes a plurality of gate lines, {G | 08-11-2011 |
Yueh-Lin Tsai, Hsinchu TW
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20090015482 | GPS antenna module and manufacturing method thereof - A GPS (Global Positioning System) antenna module includes a substrate, a first insulating layer, and a second insulating layer. The substrate is set on a bottom surface of a patch antenna. The first insulating layer is coated on the substrate and a layout circuit is formed thereon. A plurality of electronic elements are integrated on the substrate according to the layout circuit. Furthermore, the second insulating layer is coated on the first insulating layer to completely shield the electronic elements integrated on the substrate. Hence, the distance between the electronic elements and the antenna of the present invention can be shortened, space on the PCB and in the shielding case is saved. Moreover, an optimal high frequency character can be achieved, the volume of the antenna module is effectively reduced, the process is simplified, and production costs are reduced. | 01-15-2009 |
20100007575 | COUPLED-LOOP CHIP ANTENNA - A loop antenna for communication is provided, which includes a microwave substrate, being a hexahedron; a first conductive layer, disposed on an upper surface of the substrate for forming a first loop; a second conductive layer, disposed on a first side surface of the substrate, and electrically connected to a feed-in point and a ground point; and a third conductive layer, disposed on a lower surface of the substrate for forming a second loop. The first conductive layer and the second conductive layer are electrically connected at the junction between the upper surface and the first side surface, and the second conductive layer and the third conductive layer are electrically connected at the junction between the first side surface and the lower surface. The antenna also has an appropriate bandwidth for wireless communication application. | 01-14-2010 |
Yuh-Ren Tsai, Hsinchu TW
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20110110283 | TRANSMITTER, RECEIVER, MULTI-CLASS MULTIMEDIA BROADCAST/MULTICAST SERVICE SYSTEM AND MODULATION METHOD THEREOF - A multi-class multimedia broadcast/multicast service (MBMS) system includes a transmitter and at least one receiver. The transmitter transmits N primary signals by N primary channels and an auxiliary signal by an auxiliary channel, wherein a resolution of the auxiliary signal is identical to a resolution of the primary signal with the highest resolution and the constellation mappings of the auxiliary signal and the primary signal with the highest resolution on the corresponding modulation constellations can be coupled. The receiver couples the primary signal with the corresponding auxiliary/virtual auxiliary signal to obtain a lower-resolution virtual auxiliary signal, which can also be coupled with the primary signal having the same resolution. Therefore, receiving quality of each resolution is improved by combining the primary signal and the corresponding auxiliary/virtual auxiliary signal. | 05-12-2011 |
20130195024 | Communication Method of Coordinated Multi-Point Transmission Systems - A communication method of coordinated multi-point transmission systems. Based on the Zadoff-Chu sequences, multiple training sequences are implemented, and the training sequences are a set of robust orthogonal training sequence (ROTS). Preamble signals that use the set of training sequences can be transmitted from multiple base stations/relay stations at the same time. In the case with the mixture signal of multiple preamble signals, user equipment can still use the received signal to estimate multiple carrier frequency offsets of the corresponding base stations/relay stations. | 08-01-2013 |
Yu-Huan Tsai, Hsinchu TW
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20110148326 | TWO-WIRED LED LIGHT ADJUSTING SYSTEM - A two-wired LED light adjusting system, for controlling the luminance adjustment for a LED lamp module. The light adjusting circuit includes a phase modulating circuit, a LED driving circuit and a controller. The phase modulating circuit generates a phase modulating voltage. The controller detects the phase modulating voltage of various waveforms. When the controller detects the phase modulating voltage of different waveforms, the controller controls the LED driving circuit to enable the LED lamp module to emit light of different luminance according to waveforms of the phase modulating voltage. | 06-23-2011 |
Yun-Ru Tsai, Hsinchu TW
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20110236747 | COMPOSITE MATERIAL FOR NEGATIVE ELECTRODE, METHOD FOR FABRICATING THE SAME AND ELECTROCHEMICAL DEVICE USING THE SAME - The present invention relates to a composite material for a negative electrode, including: a plurality of iron oxide particles; and a conductivity improver, which is selected form the group consisting of copper, cobalt, nickel, tin, antimony, bismuth, indium, silver, gold, lead, cadmium, carbon black, graphite, copper salt, cobalt salt, nickel salt, tin salt, antimony salt, bismuth salt, indium salt, silver salt, gold salt, lead salt, cadmium salt, copper hydroxide, cobalt hydroxide, nickel hydroxide, stannic hydroxide, antimony hydroxide, bismuth hydroxide, indium hydroxide, silver hydroxide, gold hydroxide, lead hydroxide, cadmium hydroxide and the combination thereof. In the case of applying the composite material for a negative electrode according to the present invention in an electrochemical device, the improved charge/discharge characteristics and high capacity can be achieved. In addition, the present invention further provides a method for fabricating the above-mentioned composite material for a negative electrode and an electrochemical device using the same. | 09-29-2011 |