Kouya
Kenji Kouya, Kawasaki-Shi JP
Patent application number | Description | Published |
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20090237902 | MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING THE SAME - The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the integrated circuits and connected between the power supply wiring layer and the ground wiring layer to absorb noise from the integrated circuits. The power supply wiring layer includes through holes for connecting the decoupling capacitors to the power supply wiring layer and has a polygonal form formed by straight lines which link some of the through holes. | 09-24-2009 |
Mayumi Kouya, Fukuoka-Shi JP
Patent application number | Description | Published |
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20090266869 | ULTRASONIC VIBRATION BONDING RESONATOR - An ultrasonic vibration bonding resonator includes a resonance body, bonding working portions having a bonding working face and provided at a point of maximum oscillation on upper and lower surfaces of the resonance body and support portions provided at two points of minimum oscillation apart from the bonding working portions to opposite sides in a direction of ultrasonic vibration as projecting from front and back surfaces of the resonance body. Otherwise, it includes a resonance body, tool-attaching portions provided at a point of maximum oscillation on upper and lower surfaces of the resonance body, a bonding working portion having a bonding working face and attached to one of the tool-attaching portions with a screw, support portions provided at two points of minimum oscillation apart from the bonding working portion to opposite sides in a direction of ultrasonic vibration as projecting from front and back surfaces of the resonance body. Furthermore, it may includes a supporting device that includes an upper substrate, two lower substrates separated from each other in forward and backward directions and a resilient body. | 10-29-2009 |
20100320255 | RESONATOR FOR JOINING METAL MEMBERS TOGETHER UTILIZING ULTRASONIC VIBRATION - A resonator for joining metal members utilizing ultrasonic vibration includes an ultrasonic horn having a length of at least half wavelength of a resonance frequency of ultrasonic vibration transmitted from a vibrator, and a joining tool provided on the ultrasonic horn so as to project in a direction normal to a vibration transmission direction of the ultrasonic horn at a position of a point of a maximum vibration amplitude of the ultrasonic horn. The joining tool is formed into a linear bar made of a material excellent in acoustic property and is provided on a distal end thereof with a tool head projecting laterally. | 12-23-2010 |
Mayumi Kouya, Fukuoka JP
Patent application number | Description | Published |
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20110174347 | RESONATOR FOR ULTRASONIC MACHINING AND ULTRASONIC MACHINING EQUIPMENT - A resonator is used for ultrasonic machining and attached to the side or bottom of a liquid tank so as to pass through the liquid tank used in ultrasonic machining equipment for dipping a workpiece part in machining liquid given supersonic vibration. The resonator includes a working vessel formed in one end of the resonator within the liquid tank as a dent opening upward so as to enable the workpiece part to be inserted therein from above and part of the machining liquid in the liquid tank to be accommodated therein as separated from the machining liquid in the liquid tank. | 07-21-2011 |
Takuya Kouya, Nagoya JP
Patent application number | Description | Published |
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20100226110 | Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the same - A printed IC board has a multilayer printed wiring board and one or more bare IC chips. The multilayer printed wiring board has insulation layers made of PTFE, and wiring patterns formed on the insulation layers which are stacked to make a lamination structure. Electrode parts as parts of the wiring patterns are electrically connected to the bare IC chip. A copper member which serves as a reinforcing member is laid in a region formed in the insulation layers other than a first insulation layer. the region is formed directly below the electrode parts. The region is formed in a direction Z along a thickness of the stacked insulation layers. The region formed directly below the electrode parts in the insulation layers in the insulation layers other than the first insulation layer has a higher rigidity than the insulation layers. | 09-09-2010 |
20100238067 | Array antenna and radar apparatus - The array antenna includes a feed line, and a plurality of radiating element sections arranged at a predetermined arranging interval in a first direction, each of the radiating element sections including at least one radiating element fed a traveling wave through the feed line. The inter-element line length as a length of the feed line between each succeeding two of the radiating element sections is longer than the arranging interval in the first direction. | 09-23-2010 |
Takuya Kouya, Nagoya-City JP
Patent application number | Description | Published |
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20100218985 | INTEGRATED CIRCUIT MOUNTED BOARD, PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT MOUNTED BOARD - An integrated circuit mounted board includes a printed wiring board and an integrated circuit bare chip mounted on the printed wiring board. The printed wiring board includes a metal base, an insulating member made of an insulating material and disposed on the metal base, and a wiring pattern disposed on the insulating member. The wiring pattern includes an electrode part to which the integrated circuit bare chip is electrically coupled. The insulating member includes an under region being opposite to the electrode part. The metal base includes a metal substrate and a metal portion protruding from the metal substrate. The metal portion is buried in the under region of the insulating member. | 09-02-2010 |