Patent application number | Description | Published |
20080247585 | Electrical Module Comprising a Mems Microphone - An electrical module includes a base plate having an acoustic channel that opens into a first cavity at a first end and that is closed off by a microphone chip at a second end. The microphone chip borders a second cavity that opens to an exterior of the electrical module. The second cavity is separated from the acoustic channel by the microphone chip. | 10-09-2008 |
20080253056 | Adjustable Capacitor and Circuit Provided Therewith - A capacitor with a multilayer structure on a ceramic or crystalline substrate is proposed that comprises at least one lower and one upper electrode as well as a tunable dielectric arranged therebetween in which resonant oscillation modes of bulk acoustic waves can be propagated, wherein, by suitable selection regarding material and thickness and a suitable number of layers in the multilayer structure, the latter is tuned such that the resonant frequencies of the oscillation modes lie outside of band ranges used in mobile telephones. Circuits with tunable capacitors that find multiple uses inside terminal devices for mobile communication are additionally proposed. | 10-16-2008 |
20080267431 | Mems Microphone - A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm. | 10-30-2008 |
20090001553 | Mems Package and Method for the Production Thereof - A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate. | 01-01-2009 |
20090011554 | Component With Sensitive Component Structures and Method for the Production Thereof - An electrical component has electrically conducting structures placed on an electrically isolating or semiconductive substrate and component structures sensitive to a voltage or an electrical arcing and galvanically separated from one another. To prevent an arcing between the galvanically separated component structures, the component structures are short-circuited with a shunt line having a smaller cross-section than the remaining electrical conductor tracks. The shunt lines can be burnt through by application of an electrical current at any given time, whereby a galvanic separation of the component structures is effected, if necessary, for the function of the component. | 01-08-2009 |
20090129611 | Microphone Membrane And Microphone Comprising The Same - The invention relates to a microphone membrane (M | 05-21-2009 |
20090255337 | ROTATING MOTION SENSOR - A rotating motion sensor includes at least one electroacoustic resonator to stimulate a surface acoustic wave. The at least one electroacoustic resonator is configured so that rotation of the at least one electroacoustic resonator about an axis of rotation causes a change in resonance frequency of the at least one electroacoustic resonator. The at least one electroacoustic resonator includes oscillating structures configured to oscillate in a first direction that is a direction of propagation of the surface acoustic wave and/or a second direction that is transverse to the direction of propagation of the surface acoustic wave. | 10-15-2009 |
20100176899 | COMPONENT HAVING STRESS-REDUCED MOUNTING - A component ( | 07-15-2010 |
20100272302 | Arrangement Comprising a Microphone - An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier. | 10-28-2010 |
20110018076 | MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component - A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side. | 01-27-2011 |
20110186943 | MEMS Package and Method for the Production Thereof - A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate. | 08-04-2011 |
20110233690 | SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING METHOD - On a carrier ( | 09-29-2011 |
20110298064 | SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES - Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout. | 12-08-2011 |
20120093346 | MEMS MICROPHONE - A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the −3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package. | 04-19-2012 |
20120224726 | MEMS-MICROPHONE - A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided. | 09-06-2012 |
20120275634 | MEMS MICROPHONE - A microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed. | 11-01-2012 |
20130119492 | Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method - The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip. | 05-16-2013 |
20130140656 | MEMS Microphone And Method For Producing The MEMS Microphone - The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO | 06-06-2013 |
20130328448 | PIEZO ACTUATOR WITH PROTECTION AGAINST ENVIRONMENTAL INFLUENCES - A piezo actuator with protection against environmental influences comprises a layer stack ( | 12-12-2013 |
20150056725 | METHOD FOR PRODUCING A SENSOR - The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap. | 02-26-2015 |