Patent application number | Description | Published |
20080197826 | SWITCHING POWER SUPPLY CONTROLLER WITH TRANSIENT GAIN CHANGE - A switching power supply controller has a nominal loop gain and transient loop gain that is only activated in response to an abrupt load change in one direction. The transient loop gain may be implemented with a series-connected diode and resistor combination arranged in a feedback configuration with an error amplifier. A large load change in one direction may swing the output of the error amplifier and forward bias the diode to create a non-linear gain change. | 08-21-2008 |
20110005814 | CIRCUIT BOARD VIA STRUCTURE AND METHOD FORMING THE SAME - A printed circuit board (“PCB”) ( | 01-13-2011 |
20110216759 | METHOD FOR PUBLISHING, QUERYING AND SUBSCRIBING TO INFORMATION BY A SIP TERMINAL IN A VoIP NETWORK SYSTEM, SIP TERMINAL, SIP APPLICATION SERVER, SIP INFORMATION CENTER AND VoIP NETWORK SYSTEM - The invention provides method for publishing, querying, subscribing to information by a SIP terminal in a VoIP network system, a SIP terminal, a SIP application server, a SIP information center and the VoIP network system. Wherein the VoIP network system is deployed with SIP information center for storing and providing at least the information. The method for publishing information by a SIP terminal in a VoIP network system comprises: creating a publishing request with the information to be published embedded in at the SIP terminal; sending the publishing request from the SIP terminal to the SIP information center via the SIP application server; recording the information in the SIP information center's database; and notifying the new information update to the subscribed SIP terminals. | 09-08-2011 |
20140276706 | Therapeutic Cryoablation System - A cryoablation system has a gas source which provides a working nitrogen gas at room temperature and at a constant set pressure, a liquid generator which is coupled to the gas source to receive the working gas, and which then generates a working cryogen fluid, and a catheter coupled to the liquid generator for receiving the working cryogen, the catheter having a distal section having a freezing element which delivers the working cryogen to a treatment location, the catheter also having a balloon positioned adjacent the distal section. | 09-18-2014 |
Patent application number | Description | Published |
20090284927 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture. | 11-19-2009 |
20100073876 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a first fin unit and two second fin units arranged on the base. The base has a substrate and two parallel heat spreaders extending integrally and perpendicularly from the substrate. The first fin unit is arranged on the substrate and sandwiched between the heat spreaders. A plurality of first channels are defined in the first fin unit and parallel to the heat spreaders. Each of the second fin units is perpendicularly arranged on the substrate and located at a lateral, outer side of one of the heat spreaders. A plurality of second channels are defined in each of the second fin units and extend along a different direction compared to that of the first channels. | 03-25-2010 |
20100073880 | HEAT DISSIPATION DEVICE - A heat dissipation device includes two heat pipes, three extruded heat sinks and a heat conducting plate. Each heat pipe has a substantially G-shaped configuration and includes a heat absorbing section and first and second heat dissipating sections. The first and second heat dissipating sections extend along opposite directions, wherein the second heat dissipating section is located above the first heat dissipating section. Each heat sink includes a main body and a plurality of fins extending from the main body. The main body of each heat sink has a same profile with that of each heat pipe. Each heat pipe is sandwiched between the main bodies of two adjacent heat sinks. The heat conducting plate is attached to the main bodies of the heat sinks and the heat absorbing sections of the heat pipes. | 03-25-2010 |
20100147496 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device includes a heat sink and a helical heat pipe assembly. The heat sink includes a hollow cylindrical body and a number of fins extending inwardly from an inner surface of the body to an axis of the body. The helical heat pipe assembly is wrapped on an outer surface of the body and helically extends along an axial direction of the body. | 06-17-2010 |
20100243207 | THERMAL MODULE - A thermal module comprises a flat heat spreader, a fin unit arranged above the heat spreader and a plurality of solid poles interconnecting the heat spreader with the fin unit. The heat spreader defines a chamber therein. A working fluid is filled in the chamber. A wick structure is received in the chamber and attached to an inner wall of the heat spreader surrounding the chamber. The fin unit comprises a plurality of fins stacked together. | 09-30-2010 |
20100243229 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed. | 09-30-2010 |
20100258287 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base, a cover and plurality of columned fins. The base protrudes a plurality of studs from a top surface thereof. The cover defines a plurality of recesses and orifices therein. The columned fins each have a head received in corresponding recess of the base and a body extending from the head through the cover. The base joints with the cover by the studs of the base riveted in the orifices of the cover. The base cooperates with the cover to sandwich the heads of the fins therebetween to thereby secure the columned fins to the cover. | 10-14-2010 |
20140337207 | METHOD, DEVICE, SERVER, AND SYSTEM FOR MAKING PAYMENT WITH A MESSAGING APPLICATION ON A MOBILE DEVICE - A first aspect of the present disclosure provides a device, server and system for making a payment from a messaging application on a mobile device. A second aspect of the disclosure provides a method of associating a payer account number with a mobile device. Further provided herein is a method of performing a payment transaction from a messaging application on a mobile device, wherein the payment transaction is initiated by a message or a 2D image from an OpenID with the messaging application, a 2D image from a website, or a mobile application from the merchant. | 11-13-2014 |
Patent application number | Description | Published |
20090097147 | Plane waves to control critical dimension - The present invention describes an aperture including: an opaque plate; two sliver openings located in the opaque plate, the two sliver openings having rectangular shapes, the two sliver openings being parallel to each other. | 04-16-2009 |
20090104569 | Plane waves to control critical dimension - The present invention describes an aperture including: an opaque plate; two sliver openings located in the opaque plate, the two sliver openings having rectangular shapes, the two sliver openings being parallel to each other. | 04-23-2009 |
20090296055 | LENS HEATING COMPENSATION SYSTEMS AND METHODS - Methods for calibrating a photolithographic system are disclosed. A cold lens contour for a reticle design and at least one hot lens contour for the reticle design are generated from which a process window is defined. Aberrations induced by a lens manipulator are characterized in a manipulator model and the process window is optimized using the manipulator model. Aberrations are characterized by identifying variations in critical dimensions caused by lens manipulation for a plurality of manipulator settings and by modeling behavior of the manipulator as a relationship between manipulator settings and aberrations. The process window may be optimized by minimizing a cost function for a set of critical locations. | 12-03-2009 |
20100162199 | THREE-DIMENSIONAL MASK MODEL FOR PHOTOLITHOGRAPHY SIMULATION - A three-dimensional mask model of the invention provides a more realistic approximation of the three-dimensional effects of a photolithography mask with sub-wavelength features than a thin-mask model. In one embodiment, the three-dimensional mask model includes a set of filtering kernels in the spatial domain that are configured to be convolved with thin-mask transmission functions to produce a near-field image. In another embodiment, the three-dimensional mask model includes a set of correction factors in the frequency domain that are configured to be multiplied by the Fourier transform of thin-mask transmission functions to produce a near-field image. | 06-24-2010 |
20130042211 | Lithography Model for 3D Topographic Wafers - Described herein is a method for simulating an image formed within a resist layer on a substrate resulting from an incident radiation, the method comprising: calculating a forward propagating electric field or forward propagating magnetic field resultant from the incident radiation at a depth in the resist layer; calculating a backward propagating electric field or backward propagating magnetic field resultant from the incident radiation at the depth in the resist layer; calculating a radiation field at the depth in the resist layer from the forward propagating electric field or forward propagating magnetic field and from the backward propagating electric field or backward propagating magnetic field while ignoring an interference between the forward propagating electric field or forward propagating magnetic field and the backward propagating electric field or backward propagating magnetic field. | 02-14-2013 |
20130139118 | THREE-DIMENSIONAL MASK MODEL FOR PHOTOLITHOGRAPHYSIMULATION - A three-dimensional mask model of the invention provides a more realistic approximation of the three-dimensional effects of a photolithography mask with sub-wavelength features than a thin-mask model. In one embodiment, the three-dimensional mask model includes a set of filtering kernels in the spatial domain that are configured to be convolved with thin-mask transmission functions to produce a near-field image. In another embodiment, the three-dimensional mask model includes a set of correction factors in the frequency domain that are configured to be multiplied by the Fourier transform of thin-mask transmission functions to produce a near-field image. | 05-30-2013 |
20130204594 | Lithography Model For 3D Resist Profile Simulations - Described herein is a method for simulating a three-dimensional spatial intensity distribution of radiation formed within a resist layer on a substrate resulting from an incident radiation, the method comprising: calculating an incoherent sum of forward propagating radiation in the resist layer and backward propagating radiation in the resist layer; calculating an interference of the forward propagating radiation in the resist layer and the backward propagating radiation in the resist layer; and calculating the three-dimensional spatial intensity distribution of radiation from the incoherent sum and the interference. | 08-08-2013 |
20130212543 | LENS HEATING AWARE SOURCE MASK OPTIMIZATION FOR ADVANCED LITHOGRAPHY - A computer-implemented method for improving a lithographic process for imaging a portion of a design layout onto a substrate using a lithographic projection apparatus comprising an illumination source and projection optics, the method including computing a multi-variable cost function of a plurality of design variables that are characteristics of the lithographic process, at least some of the design variables being characteristics of the illumination source and the design layout, the computing of the multi-variable cost function accounting for lens heating effects; and reconfiguring the characteristics of the lithographic process by adjusting the design variables until a predefined termination condition is satisfied. | 08-15-2013 |
20140047397 | LENS HEATING COMPENSATION SYSTEMS AND METHODS - Methods for calibrating a photolithographic system are disclosed. A cold lens contour for a reticle design and at least one hot lens contour for the reticle design are generated from which a process window is defined. Aberrations induced by a lens manipulator are characterized in a manipulator model and the process window is optimized using the manipulator model. Aberrations are characterized by identifying variations in critical dimensions caused by lens manipulation for a plurality of manipulator settings and by modeling behavior of the manipulator as a relationship between manipulator settings and aberrations. The process window may be optimized by minimizing a cost function for a set of critical locations. | 02-13-2014 |
20140195993 | THREE-DIMENSIONAL MASK MODEL FOR PHOTOLITHOGRAPHY SIMULATION - A three-dimensional mask model of the invention provides a more realistic approximation of the three-dimensional effects of a photolithography mask with sub-wavelength features than a thin-mask model. In one embodiment, the three-dimensional mask model includes a set of filtering kernels in the spatial domain that are configured to be convolved with thin-mask transmission functions to produce a near-field image. In another embodiment, the three-dimensional mask model includes a set of correction factors in the frequency domain that are configured to be multiplied by the Fourier transform of thin-mask transmission functions to produce a near-field image. | 07-10-2014 |
20150135146 | THREE-DIMENSIONAL MASK MODEL FOR PHOTOLITHOGRAPHY SIMULATION - A three-dimensional mask model of the invention provides a more realistic approximation of the three-dimensional effects of a photolithography mask with sub-wavelength features than a thin-mask model. In one embodiment, the three-dimensional mask model includes a set of filtering kernels in the spatial domain that are configured to be convolved with thin-mask transmission functions to produce a near-field image. In another embodiment, the three-dimensional mask model includes a set of correction factors in the frequency domain that are configured to be multiplied by the Fourier transform of thin-mask transmission functions to produce a near-field image. | 05-14-2015 |
Patent application number | Description | Published |
20110165729 | METHOD OF PACKAGING SEMICONDUCTOR DEVICE - Quad Flat No-Lead packaged devices are manufactured using two singulation operations with two different saw blades of varying widths with the first singulation operation using a wider saw blade than the second singulation operation. Between singulation operations, the exposed portions of the leads are plated with a solderable metal. By performing the second singulation operation within the first cut made by the first singulation, at least half of the exposed metal of the leads remains plated. Thus, better solder joints may be formed, which allows for simpler visual inspection. | 07-07-2011 |
20110218161 | CYCLOASTRAGENOL MONOGLUCOSIDE, PREPARATION, PHARMACEUTICAL COMPOSITION AND APPLICATION THEREOF - This invention provides a method for preparing cycloastragenol monoglucoside CMG (cycloastragenol-6-O-β-D-glucoside), comprising the steps of: a. using astragaloside IV or Astragali extracts prepared by a conventional method as raw materials and adding an appropriate solvent thereinto to form a raw material solution; b. adding hydrolase and allowing for hydrolysis at a constant temperature to obtain a hydrolysate; c. separating the hydrolysate with macroporous adsorption resin; and d. obtaining the product by purification and separation. The present invention further provides cycloastragenol-6-O-β-D-glucoside prepared according to the method of this invention as well as its use in the preparation of a medicament for treating cardiovascular diseases and pharmaceutical compositions comprising the same. | 09-08-2011 |
20110281922 | AMIDE THIAZOLE DERIVATIVE, PREPARATION METHOD AND USES THEREOF - The present invention relates to the field of drugs associated with treating diabetes. Particularly, the present invention relates to a dipeptidyl peptidase-IV inhibitor having the structure shown by formula (I), which contains amide thiazole structure and has an effect on treating diabetes, and a preparation method and a pharmaceutical composition containing it, as well as use thereof in manufacture of the drugs for treating the diabetes, | 11-17-2011 |
20120248590 | SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREFOR - A semiconductor package is assembled using first and second lead frames. The first lead frame includes a die flag and the second lead frame includes lead fingers. When the first and second lead frames are mated, the lead fingers surround the die flag. Side surfaces of the die flag are partially etched to form an extended die attach surface on the die flag, and portions of the top surface of each of the lead fingers also are partially etched to form lead finger surfaces that are complementary with the etched side surfaces of the die flag. A semiconductor die is attached to the extended die attach surface and bond pads of the semiconductor die are electrically connected to the lead fingers. An encapsulating material covers the die, electrical connections, and top surfaces of the die flag and lead fingers. | 10-04-2012 |
20130072521 | THIENOPYRIDINE ESTER DERIVATIVE CONTAINING CYANO GROUP, PREPARATION METHOD, USE AND COMPOSITION THEREOF - A compound with the structure of the formula (I) or a pharmaceutically acceptable salt, a preparation method and use thereof are disclosed in the present invention, wherein R is cyano group. The compound provided by the present invention has an antiplatelet aggregation activity and can be used in preparing a medicament for preventing or treating cardiac and cerebral vascular diseases such as coronary artery syndromes, myocardial infarction and myocardial ischemia which are caused by platelet aggregation. | 03-21-2013 |
20140246767 | SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME - A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process. | 09-04-2014 |
20150274799 | GLP-1 ANALOGUE, ITS PREPARATION METHODS AND USE THEREOF - Provided is a GLP-1 analogue having the structure as shown in the general formula A: | 10-01-2015 |