Regan
Regan Mandryk, Saskatoon CA
Patent application number | Description | Published |
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20140121017 | SYSTEMS AND METHODS FOR CONTROLLING USER INTERACTION WITH BIOFEEDBACK GAMING APPLICATIONS - Systems and methods of controlling user interaction with an application. The systems and methods include executing an application, providing a graphical overlay coupled to the application where the graphical overlay is configured to display a visualization or a visual effect, measuring at least one engagement characteristic to provide a measured condition and providing the visualization based on the measured condition. Examples of engagement characteristic include user physiological condition, type of the application selected, duration of time spent interacting with the application, duration of time spent interacting with one or more input receiving devices, pressure exerted over one or more input receiving devices and noise level of the user. | 05-01-2014 |
Regan Nayve, San Jose, CA US
Patent application number | Description | Published |
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20100221497 | Device with Protective Layer - A fluid impermeable protective layer is described for a structure that has a 3-dimensional profile. The 3-dimensional profile can include actuators. The protective layer is applied so that there are no breaches in the protective layer and so that the protective layer is not too thick to prevent the actuators from being able to properly function. | 09-02-2010 |
Regan Nayve, Kanagawa JP
Patent application number | Description | Published |
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20120194617 | METHOD OF MANUFACTURING SUBSTRATE AND SUBSTRATE, METHOD OF MANUFACTURING LIQUID DROP EJECTING HEAD AND LIQUID DROP EJECTING HEAD, AND LIQUID DROP EJECTING DEVICE - The present invention provides a method of manufacturing a substrate which forms a wiring pattern on a substrate having a plurality of through-holes. In the method, the wiring pattern is formed, after burying a filling material into the through-holes and planarizing a surface of the substrate. The filling material may be a conductive material, and a portion of the conductive material may be removed after the wiring pattern is formed. Removal of the portion of the conductive material may be carried out after a protective film, which protects the wiring pattern, is formed. The filling material may be a conductive material and a sacrificial material, and the sacrificial material may be removed after the wiring pattern is formed. | 08-02-2012 |