Shinya Nishimura
Shinya Nishimura, Chiba-Shi JP
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20100220764 | Differential scanning calorimeter - The differential scanning calorimeter includes: a heat sink, which stores a measuring sample and a reference material; a heater, which heats the heat sink; a cooling block, which is separated away from the heat sink, and positioned below the heat sink; a thermal resistor, which is connected between the heat sink and the cooling block, and forms a heat flow path therebetween; a cooling head, which is detachably fitted to the cooling block, and is cooled by an external cooling device; and differential heat flow detectors, which output a temperature difference between the measuring sample and the reference material as a heat-flow-difference signal, in which: the cooling block forms a side wall to fit the bore of the cooling head outward from the joint of the thermal resistance body; the top surface of the cooling head is lower than the joint. | 09-02-2010 |
20110188534 | DIFFERENTIAL SCANNING CALORIMETER - A differential scanning calorimeter ( | 08-04-2011 |
20110235671 | Thermal analyzer - To improve measurement accuracy by eliminating influence of a change of a temperature environment around a furnace of a thermal analyzer, the thermal analyzer includes a multilayer structure of at least two sealed layers for covering the furnace and its surroundings so as to isolate the furnace and its surroundings from an outside. An interlayer of the multilayer structure is loaded with a substance having a heat capacity equal to the heat capacity of a gas inside the furnace. | 09-29-2011 |
20130235899 | THERMAL ANALYZER - A thermal analyzer ( | 09-12-2013 |
Shinya Nishimura, Sakura-Shi JP
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20090078368 | METHOD OF PRODUCING COPPER-CLAD LAMINATE, METHOD OF PRODUCING COVERLAY, AND METHOD OF PRODUCING FLEXIBLE PRINTED CIRCUIT BOARD - A method of producing a copper-clad laminate by laminating a copper foil on a polyimide layer, wherein the polyimide layer is produced by imidating a polyamide acid which is obtained by reacting one of an aromatic diacid anhydride and alicyclic diacid anhydride and one of an aliphatic diamine and alicyclic diamine, with an acid having a pKa of 3 to 5. | 03-26-2009 |
20090082543 | METHOD OF PREPARING POLY(AMIC ACID) AND METHOD OF PREPARING POLYIMIDE - A method of preparing a poly(amic acid) includes a step of reacting an aromatic diacid anhydride or alicyclic diacid anhydride, an aliphatic diamine or alicyclic diamine, and an acid having a pKa of 3 to 5. A method of preparing a polyimide by imidating the resulting poly(amic acid) is also disclosed. | 03-26-2009 |
Shinya Nishimura, Fujisawa-Shi JP
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20120020600 | HIGH-STRENGTH BRASS ALLOY FOR SLIDING MEMBERS, AND SLIDING MEMBERS - A high-strength brass alloy for sliding members, consists of, by mass %, 17 to 28% of Zn, 5 to 10% of Al, 4 to 10% of Mn, 1 to 5% of Fe, 0.1 to 3% of Ni, 0.5 to 3% of Si, and the balance of Cu and inevitable impurities. The high-strength brass alloy has a structure that includes a matrix of a single phase structure of the β phase and includes at least one of Fe—Mn—Si intermetallic compounds in the form of aciculae, spheres, or petals dispersed in the β phase. | 01-26-2012 |
Shinya Nishimura, Otsu-Shi JP
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20130260181 | REVERSE CONNECTION PREVENTING STRUCTURE FOR USE IN BATTERY- DRIVEN OBJECT DETECTION DEVICE - Provided is a reverse connection preventing structure in a battery-driven object detection device, which has a simple structure capable of preventing reverse connection of even a battery whose projecting positive electrode is relatively lower in height. The structure has a holder for holding the battery including a first terminal for electrically connecting to a projecting positive electrode and a second terminal for electrically connecting to a negative electrode. The first terminal is formed in a printed circuit board. On the printed circuit board, an insulating member of less than 0.5 mm in thickness are provided around the circumference of the first terminal in such a manner as to allow the first terminal to come in contact with the positive electrode of the battery which is mounted correctly and as to prevent the first terminal from coming in contact with the negative electrode of the battery which is mounted reversely. | 10-03-2013 |
20150180258 | BATTERY TYPE DETERMINATION DEVICE AND BATTERY-DRIVEN ELECTRONIC DEVICE INCLUDING THE SAME - Provided are a battery type determination device with a simple configuration capable of easily and reliably determining the types of a plurality of batteries irrespective of shapes and characteristics of the batteries, and a battery-driven electronic device that includes the battery type determination device and allows usage of plural types of batteries. The battery type determination device is used in a battery-driven electronic device operable with plural types of batteries having different shapes and characteristics, and includes a determination signal generator for generating a determination signal that is allocated for each of the plural types of batteries without depending on shapes and characteristics of the batteries and is formed by combination of binary signals prescribed for each type of battery; and a determination controller for determining the type of each battery based on the generated determination signal. | 06-25-2015 |
20150187195 | BATTERY-POWERED SECURITY SENSOR SYSTEM - A security sensor system is provided which allows the stopping of the device due to the end of a battery life to be postponed by suppressing battery power consumption, which is caused due to an object detection operation of the security sensor system, after a low battery state is detected. The security sensor system is powered by a battery. When a low battery detector detects a reduction in the voltage of the battery, an object detection operation of the security sensor system is switched from a normal mode to a suppression mode. Consumption of the battery in the suppression mode is suppressed. | 07-02-2015 |
Shinya Nishimura, Tokyo JP
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20130109128 | MANUFACTURING METHOD FOR PHOTOVOLTAIC POWER DEVICE AND MANUFACTURING APPARATUS FOR PHOTOVOLTAIC POWER DEVICE | 05-02-2013 |
20150153292 | Thermal Analyzer - A thermal analyzer is provided with: a furnace tube; a pair of sample holders; a heating furnace; a measurement chamber; and a measurement unit arranged inside the measurement chamber. The sample holders are arranged inside the furnace tube and are provided with mounting faces on which a pair of sample containers are mounted respectively. The heating furnace has an opening through which a measurement sample is observable, the opening being located at a position above the center of a virtual segment which connects centers of gravity of the mounting faces of the sample holders. The opening is formed to have a size, as viewed in a direction perpendicular to the axial direction and the mounting faces, of 7 mm or more in the direction along the virtual segment and of 3 mm or more in the direction perpendicular to the virtual segment. | 06-04-2015 |
20150260665 | Thermal Analyzer - A thermal analyzer is provided with: a furnace tube; a sample holder; a heating furnace; a measurement chamber; and a measurement unit. The heating furnace comprises a fixing section to be fixed to the furnace tube. The furnace tube is configured to be attachable to and detachable from the heating furnace and provided with an engagement portion that is configured to be engaged with the fixing section at a variable position in the radial direction. A is configured to be detachable from the heating furnace and the furnace tube after inserting the furnace tube into the heating furnace and engaging the engagement portion of the furnace tube with the fixing section while the gap jig is interposed between the heating furnace and the furnace tube to maintain the gap between the heating furnace and the furnace tube in the radial direction to be in the predetermined distance. | 09-17-2015 |
20150264277 | Imaging Apparatus for Thermal Analyzer and Thermal Analyzer Including the Same - An imaging apparatus for a thermal analyzer is configured to image a heated sample inside a thermal analyzer main body section from an observation window provided in the thermal analyzer main body section. The imaging apparatus is provided with: an imaging device that is provided with a lens housing and a main body section; a holding section configured to hold the imaging device to have an orientation in which the lens housing is oriented toward the observation window, and the main body section is positioned on the opposite side of the observation window across the lens housing; and a cooling fan configured to provide airflow inside the holding section. The holding section is provided with a cooling air passage having an intake portion and an exhaust portion. At least a portion of the lens housing is arranged in the cooling air passage to be cooled by the airflow provided by the cooling fan. | 09-17-2015 |
Shinya Nishimura US
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20160005861 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device is provided with: a first conductivity type contact region; a second conductivity type body region; a first conductivity type drift region of; a trench formed through the contact region and body region from a front surface of the semiconductor substrate, wherein a bottom of the trench is positioned in the drift region; an insulating film covering an inner surface of the trench; a gate electrode accommodated in the trench in a state covered with the insulating film; and a second conductivity type floating region formed at a position deeper than the bottom of the trench, and adjacent to the bottom of the trench. The floating region includes a first layer adjacent to the bottom of the trench and a second layer formed at a position deeper than the first layer, wherein a width of the first layer is broader than a width of the second layer. | 01-07-2016 |
Shinya Nishimura, Toyota-Shi JP
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20160005861 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device is provided with: a first conductivity type contact region; a second conductivity type body region; a first conductivity type drift region of; a trench formed through the contact region and body region from a front surface of the semiconductor substrate, wherein a bottom of the trench is positioned in the drift region; an insulating film covering an inner surface of the trench; a gate electrode accommodated in the trench in a state covered with the insulating film; and a second conductivity type floating region formed at a position deeper than the bottom of the trench, and adjacent to the bottom of the trench. The floating region includes a first layer adjacent to the bottom of the trench and a second layer formed at a position deeper than the first layer, wherein a width of the first layer is broader than a width of the second layer. | 01-07-2016 |