Canale
Giuseppe Canale, Gorla Minore (va) IT
Patent application number | Description | Published |
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20100001511 | TELESCOPIC EXTENSION FOR AN ELECTRIC HOUSEHOLD APPLIANCE - A telescopic extension ( | 01-07-2010 |
Joseph E. Canale, Corning, NY US
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20100215936 | COATING FOR INHIBITING GLASS TO GLASS ADHERENCE - Cover slips having improved non-stick properties are provided and a method for making such cover slips is described. In one aspect the use of water-based, colloidal alkylpoly(alkoxy)silanes of formula [(R | 08-26-2010 |
Joseph Eugene Canale, Corning, NY US
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20120276689 | Glass Wafers for Semiconductor Fabrication Processes and Methods of Making Same - The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass. | 11-01-2012 |
Kimberly Anne Canale, Friendswood, TX US
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20140064016 | SELF-CLEANING MIXING DEVICES AND METHODS OF USING THE SAME - The invention relates to mixing devices, methods of operating mixing devices, and methods of blending a granular substrate with a coating material. These mixing devices and methods substantially prevent the agglomeration of solids and/or viscous liquids on rotational and/or static elements of the mixing device. | 03-06-2014 |
Leo Canale, Brooklin CA
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20110020690 | Cell Tab and Interconnect Assembly for a Battery Pack - A battery pack for a vehicle has battery cells with foil cell tabs that are welded to an interconnect. Nickel plated copper is bonded to aluminum for either a first set of the battery cells, a second set of the battery cells or for the interconnect. Similar materials are then adjacent to each other at the weld locations between the foil cell tabs and the interconnect to avoid welding of dissimilar metals. | 01-27-2011 |
Natalie Canale, Overland Park, KS US
Patent application number | Description | Published |
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20130047319 | SLEEVE THAT FUNCTIONS AS A WASHABLE MARKING SURFACE - Subject matter described in this disclosure is related to a sleeve that provides a marking surface on which to apply a washable marking medium. The sleeve may include a padding member and a marking-instrument holder. The padding member may be used to cushion an arm on which the sleeve is worn when the sleeve is being marked upon. | 02-28-2013 |
Nicolas Canale, Marseille FR
Patent application number | Description | Published |
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20140244079 | PROCEDURE FOR FACILITATING THE APPROACH TO A PLATFORM - A procedure for facilitating the approach to a platform [PF] with an aircraft [ | 08-28-2014 |
20140365044 | METHOD OF APPROACHING A PLATFORM - A method having a preparation stage for preparing an approach path ( | 12-11-2014 |
20140365045 | METHOD OF APPROACHING A PLATFORM - A method having a preparation stage for preparing an approach path ( | 12-11-2014 |
Paolo Canale, Rome IT
Patent application number | Description | Published |
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20140278779 | CHURN PREDICTION AND MANAGEMENT SYSTEM - A system and method for managing churn among the customers of a business is provided. The system and method provide for an analysis of the causes of customer churn and identifies customers who are most likely to churn in the future. Identifying likely churners allows appropriate steps to be taken to prevent customers who are likely to churn from actually churning. The system included a dedicated data mart, a population architecture, a data manipulation module, a data mining tool and an end user access module for accessing results and preparing preconfigured reports. The method includes adopting an appropriate definition of churn, analyzing historical customer to identify significant trends and variables, preparing data for data mining, training a prediction model, verifying the results, deploying the model, defining retention targets, and identifying the most responsive targets. | 09-18-2014 |
Silvio Canale, Turin IT
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20130206871 | GASEOUS-FUEL-INJECTOR DEVICE FOR INTERNAL-COMBUSTION ENGINES - In a gaseous-fuel-injector device for internal-combustion motor-vehicle engines, the valve body of the injector device has one or more auxiliary openings giving out onto an internal surface of the valve body in which the valve member of the injector device is slidably mounted. Said auxiliary openings are arranged in such a way as to enable the inflow of the gaseous fuel coming from the supply, not only into the inlet opening of the injector device, but also into the internal area of the valve body in which the valve member is slidably mounted, so as to obtain an effect of ventilation and flushing, by means of the flow of gaseous fuel, in an area where there tend to form deposits of the oily substances contained in the gaseous fuel. | 08-15-2013 |
Stefano Canale, Gorla Minore (va) IT
Patent application number | Description | Published |
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20120126533 | TELESCOPIC EXTENSION, IN PARTICULAR FOR A HOUSEHOLD APPLIANCE, AND ASSOCIATED HOUSEHOLD APPLIANCE - A telescopic extension, typically for a household appliance, is described, the extension comprising: a) an inner tube; b) an outer tube, wherein said inner and outer tubes are telescopically slidable with respect to each other, wherein said inner tube comprises deformations of predefined shape on its outer surface; c) a constraining device which is configured so as to block sliding of the inner tube with respect to the outer tube; d) a slider and elastic means, wherein said slider cooperates with said constraining device by means of said elastic means; and e) an actuating device operatively connected to said slider, wherein said actuating device extends over at least half the length of said outer tube, wherein said actuating device comprises a substantially cylindrical body fitted on at least part of the outer surface of said outer tube. | 05-24-2012 |
Steve Canale, Simi Valley, CA US
Patent application number | Description | Published |
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20110297329 | DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICATION - Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed. | 12-08-2011 |
20120080052 | DEVICES FOR METHODOLOGIES FOR HANDLING WAFERS - Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations such as solvent and plasma cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and wafer-cleaning operations are disclosed. | 04-05-2012 |
20120080132 | SECURING MECHANISM AND METHOD FOR WAFER BONDER - Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer. | 04-05-2012 |
20120080150 | FIXTURES AND METHODS FOR UNBONDING WAFERS BY SHEAR FORCE - Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed. | 04-05-2012 |
20120080832 | DEVICES FOR METHODOLOGIES RELATED TO WAFER CARRIERS - Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed. | 04-05-2012 |
20140182762 | SECURING MECHANISM AND METHOD FOR WAFER BONDER - Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer. | 07-03-2014 |
20140262053 | DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICATION - Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed. | 09-18-2014 |
20150034131 | DEVICES AND METHODOLOGIES TO CLEAN WAFERS WITH SOLVENT - Disclosed are devices and methodologies for cleaning wafers in wafer processing operations such as solvent cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and solvent cleaning operations are disclosed. | 02-05-2015 |