Patent application number | Description | Published |
20100215912 | HARD-COATED MEMBER, AND ITS PRODUCTION METHOD - The hard-coated member of the present invention having a compression-stress-loaded hard coating having a thickness of 5 μm or more, the hard coating having a face-centered cubic structure having a composition represented by (Me | 08-26-2010 |
20140017469 | HARD-COATED MEMBER AND ITS PRODUCTION METHOD, AND INDEXABLE ROTARY TOOL COMPRISING IT - A hard-coated member comprising a substrate made of cemented carbide or high-speed steel and a titanium carbonitride layer formed on the substrate by a chemical vapor deposition method, the titanium carbonitride layer comprising first to third layers each having a columnar crystal structure in this order from the side of the substrate, the second layer being smaller than the first layer in carbon concentration, and the third layer being smaller than the second layer in carbon concentration, and an indexable rotary tool comprising it. The first layer is formed by using a starting material gas comprising a TiCl | 01-16-2014 |
20150240353 | HARD-COATED TOOL AND ITS PRODUCTION METHOD - A hard-coated tool comprising a titanium carbonitride layer formed directly on a WC-based cemented carbide substrate by a chemical vapor deposition method; the titanium carbonitride layer having a composition comprising 74-81% by mass of titanium, 13-16% by mass of carbon and 6-10% by mass of nitrogen; the titanium carbonitride layer having a structure comprising columnar crystal grains having an average transverse cross section diameter of 0.01-0.22 μm; a layer of W diffused from the substrate to the titanium carbonitride layer having an average thickness of 30-200 nm; and the titanium carbonitride layer having an X-ray diffraction peak of a (422) plane in a 2θ range of 122.7-123.7°. | 08-27-2015 |
Patent application number | Description | Published |
20140209366 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers. | 07-31-2014 |
20140210082 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device. The semiconductor device includes: a first board; a second board joined to the first board; a connection terminal provided between the first board and the second board and electrically connecting the first board and the second board; and an electronic component on at least one of the first board and the second board. The connection terminal serves as an antenna. | 07-31-2014 |
20140370365 | BATTERY AND METHOD FOR PRODUCING THE SAME - A battery includes a supporting substrate, resin layers, and a plurality of cells. Each resin layer includes a first resin and has 0.5 MPa to 10 MPa in tensile strength. The cells are stacked on the supporting substrate with the resin layers between the cells. | 12-18-2014 |
20150303424 | BATTERY BUILT-IN BOARD AND METHOD FOR MANUFACTURING THE SAME - A battery built-in board includes a battery component comprising a battery and an insulation part covering the battery, a first insulation layer in which the battery component is placed, and a second insulation layer formed on the first insulation layer and covering the battery component. Rigidity of the insulation part is lower than that of the first insulation layer and the second insulation layer. | 10-22-2015 |