Patent application number | Description | Published |
20080204736 | Defect Inspection Method and Defect Inspection Apparatus - Provided are a defect inspection apparatus having a large range for receiving light scattering from fine defects while securing a sufficiently large signal strength; and a defect inspection method for the same. The defect inspection apparatus includes: a stage part capable of traveling relative to optical systems with a substrate to be inspected mounted on the stage part; an illumination optical system for illuminating an inspection area on the substrate; a detection optical system for detecting light coming from the inspection area on the substrate; an image sensor for converting, to a signal, an image which is formed on the image sensor by the detection optical system; a signal processor for detecting defects by processing the signal from the image sensor; and a plane reflecting mirror, arranged between the detection optical system and the substrate, for transmitting the light, which comes from the substrate, to the detection optical system. | 08-28-2008 |
20080291436 | Defect inspection system - A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is | 11-27-2008 |
20080297786 | INSPECTING DEVICE AND INSPECTING METHOD - An object of the invention is to provide an inspecting method and an inspecting device which can detect a foreign material and a pattern defect at a high speed and a high precision, and can suppress a cost increase, by correcting a photographed image of an inspected subject and regulating a direction of an image sensor photographing the inspected subject without depending only upon a positional displacement correcting control of a stage. In an inspecting method of inspecting an inspected subject mounted on a moving stage by photographing by an image sensor, the method determines a positional displacement amount between a target position and an actual position of the stage which moves for photographing, and carries out a sampling position correction in correspondence to the positional displacement amount, on the basis of a photographed image sampling from a photographed range of the target position which is photographed. | 12-04-2008 |
20090103079 | APPARATUS AND METHOD FOR INSPECTING DEFECT IN OBJECT SURFACE - An aspect of the invention provides a defect inspection apparatus being able to accurately inspect a micro foreign matter or defect at a high speed for an inspection target substrate in which a repetitive pattern and a non-repetitive pattern are mixed. | 04-23-2009 |
20090207405 | DEFECT INSPECTING APPARATUS - A defect inspecting apparatus of the invention solves a problem that in a defect inspecting apparatus, because of improving detection sensitivity of a microscopic defect by reducing a detection pixel size, a focal depth becomes shallow, a height of imaging is varied due to environmental change and the detection sensitivity of a defect becomes unstable. This apparatus comprises an XY stage, which carries a substrate to be inspected and scans in a predetermined direction, and a mechanism having a system of irradiating a defect on the inspected substrate at a slant and detecting the defect by a detection optical system disposed on the upper side, which corrects a height of imaging in real time for change in temperature and barometric pressure in order to keep the imaging in a best condition. | 08-20-2009 |
20100106443 | Defect Inspection Apparatus and Defect Inspection Method - A defect inspection apparatus includes: stages each mounting an inspecting object on which a circuit pattern having a group of parallel lines is formed, and each running perpendicular or parallel to the group of lines; an illumination optical system which illuminating a surface of the inspecting object with a slit beam being slit light so that a longitudinal direction of the slit beam is substantially perpendicular to the running directions of the stages, and which has a first inclined angle formed by the direction of the group of lines and a projection line, of an optical axis of the slit beam, to the inspecting object; a spatial filter that shields or transmits reflected and scattered light of the inspecting object according to a difference in distribution of orientation; and a detection optical system that detects the reflected and scattered light transmitted through the spatial filter by image sensors. Moreover, the illumination optical system illuminates the inspecting object with another slit beam from a direction opposite to an incident direction of the slit beam on a plane. | 04-29-2010 |
20100214561 | DEFECT INSPECTING APPARATUS - A defect inspecting apparatus of the invention solves a problem that in a defect inspecting apparatus, because of improving detection sensitivity of a microscopic defect by reducing a detection pixel size, a focal depth becomes shallow, a height of imaging is varied due to environmental change and the detection sensitivity of a defect becomes unstable. This apparatus comprises an XY stage, which carries a substrate to be inspected and scans in a predetermined direction, and a mechanism having a system of irradiating a defect on the inspected substrate at a slant and detecting the defect by a detection optical system disposed on the upper side, which corrects a height of imaging in real time for change in temperature and barometric pressure in order to keep the imaging in a best condition. | 08-26-2010 |
20100225903 | PATTERN DEFECT INSPECTION APPARATUS AND METHOD - A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished. | 09-09-2010 |
20100271473 | DEFECT INSPECTION SYSTEM - A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is | 10-28-2010 |
20100271627 | Defect Inspection Method and Defect Inspection Apparatus - Provided are a defect inspection apparatus having a large range for receiving light scattering from fine defects while securing a sufficiently large signal strength; and a defect inspection method for the same. The defect inspection apparatus includes: a stage part capable of traveling relative to optical systems with a substrate to be inspected mounted on the stage part; an illumination optical system for illuminating an inspection area on the substrate; a detection optical system for detecting light coming from the inspection area on the substrate; an image sensor for converting, to a signal, an image which is formed on the image sensor by the detection optical system; a signal processor for detecting defects by processing the signal from the image sensor; and a plane reflecting mirror, arranged between the detection optical system and the substrate, for transmitting the light, which comes from the substrate, to the detection optical system. | 10-28-2010 |
20120268734 | PATTERN DEFECT INSPECTION APPARATUS AND METHOD - A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished. | 10-25-2012 |
20120313650 | INSPECTION DEVICE AND INSPECTION METHOD - An inspection device for detecting small foreign bodies is provided with a first electrode and a second electrode disposed on either side of the inspection target, a power source connected to the aforementioned first electrode, a conveyance speed control unit for controlling the conveyance speed of the aforementioned inspection target, a current detection unit which, connected to the aforementioned second electrode, detects currents generated by changes in the static capacitance formed between the aforementioned first electrode and the aforementioned second electrode, and a defect detection unit which detects defects on the basis of the aforementioned current. Furthermore, the aforementioned second electrode rotates in the direction opposite of the conveyance direction of the aforementioned inspection target. Furthermore, the aforementioned power source includes a DC or an AC power source. | 12-13-2012 |
20130148113 | INSPECTION APPARATUS AND INSPECTION METHOD - The light scattered from the sample surface and foreign matter is imaged on an image intensifier and detected by a lens-coupled multi-pixel sensor such as a TDI sensor or a CCD sensor. The light scattered by surface roughness is spatially eliminated to detect the light scattered from foreign matter with increased sensitivity. A mechanism for shifting the image intensifier is incorporated to prevent a signal intensity decrease, which may be caused by a decrease in the sensitivity of the image intensifier. | 06-13-2013 |
20130182100 | DEFECT INSPECTION SYSTEM - A defect inspection system can suppress an effect of light from a rough surface or a circuit pattern and increasing a gain of light from a defect to detect the defect with high sensitivity. When a lens with a large NA value is used, the diameter is 10 | 07-18-2013 |
20130187667 | Inspection Equipment and Inspection Method - Foreign metal inspection equipment is provided with: a conveying device for conveying a sample to be subjected to inspection; electrodes positioned so as to face the surface of the sample; a measurement device for measuring the capacitance between the electrodes and the sample being conveyed by the conveying device; and a processing unit that inspects for foreign metal mixed in the sample on the basis of the change in capacitance measured by the measurement device. | 07-25-2013 |
20130250297 | INSPECTION APPARATUS AND INSPECTION SYSTEM - Disclosed here is a macro inspection apparatus for a sample such as a semiconductor wafer having a pattern formed thereon, the apparatus being capable of detecting abnormalities in dimension and size with high sensitivity. | 09-26-2013 |
20130269126 | APPARATUS AND METHOD FOR INSPECTING DEFECT IN OBJECT SURFACE - An aspect of the invention provides a defect inspection apparatus being able to accurately inspect a micro foreign matter or defect at a high speed for an inspection target substrate in which a repetitive pattern and a non-repetitive pattern are mixed. | 10-17-2013 |