Patent application number | Description | Published |
20090026612 | SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor package having an improved connection structure and a method for manufacturing the same is described. The semiconductor package includes a substrate having a substrate body, connection pads that are located on one surface of the substrate body, and ball lands that are located on the other surface of the substrate body opposite the one surface. The ball lands are electrically connected to the connection pads. A semiconductor chip having bumps that are formed to correspond to the connection pads is connected to the substrate. An anisotropic conductive member having an insulation element is interposed between the substrate and the semiconductor chip to connect the substrate and the semiconductor chip. Electrically flowable conductive particles within the insulation element flow in the insulation element according to applied electric fields so as to arrange the electrically flowable conductive particles between the connection pads and the bumps. | 01-29-2009 |
20090166836 | STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE - A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads. | 07-02-2009 |
20090321953 | CIRCUIT SUBSTRATE HAVING CIRCUIT WIRE FORMED OF CONDUCTIVE POLARIZATION PARTICLES, METHOD OF MANUFACTURING THE CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE CIRCUIT WIRE - A circuit substrate includes a substrate body having a first terminal and a second terminal separated from the first terminal. A circuit wire includes a wiring unit for electrically connecting the first and second terminals by electrically connecting conductive polarization particles that include a first polarity and a second polarity that is opposite to the first polarity. The circuit wire also includes an insulation unit for insulating the wiring unit. | 12-31-2009 |
20100065958 | PAD REDISTRIBUTION CHIP FOR COMPACTNESS, METHOD OF MANUFACTURING THE SAME, AND STACKED PACKAGE USING THE SAME - A substrate includes a substrate; a number of pad redistribution chips stacked on the substrate and on one another after being rotated 90° in a predetermined direction relative to one another, the pad redistribution chips having a number of center pads positioned at the center thereof, a number of (+) edge pads positioned on an end thereof while corresponding to those of the center pads lying in (+) direction from a middle center pad located in the middle of the center pads, a number of (−) edge pads positioned on the other end thereof while corresponding to those of the center pads lying in (−) direction with symmetry to those of the center pads lying in the (+) direction, and a number of traces for electrically connecting the center pads to the corresponding (±) edge pads, respectively; a flexible PCB for electrically connecting the substrate to the pad redistribution chips; and an anisotropic dielectric film for electrically connecting the pad redistribution chips to the flexible PCB and the substrate to the flexible PCB. | 03-18-2010 |
20100140757 | SEMICONDUCTOR PACKAGE HAVING AN ANTENNA WITH REDUCED AREA AND METHOD FOR FABRICATING THE SAME - A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands. | 06-10-2010 |
20110121454 | STACK SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stack semiconductor package includes a first insulation member having engagement projections and a second insulation member formed having engagement grooves into which the engagement projections are to be engaged. First conductive members are disposed in the first insulation member and have portions which are exposed on the engagement projections. Second conductive members are disposed in the second insulation member in such a way as to face the first conductive members and have portions which are exposed in the engagement grooves. A first semiconductor chip is disposed within the first insulation member and is electrically connected to the first conductive members. A second semiconductor chip is disposed in the second insulation member and is electrically connected to the second conductive members. | 05-26-2011 |
20110233795 | STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE - A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads. | 09-29-2011 |
20110254167 | STACK PACKAGE HAVING FLEXIBLE CONDUCTORS - A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package. | 10-20-2011 |
20110275181 | SEMICONDUCTOR PACKAGE HAVING AN ANTENNA WITH REDUCED AREA AND METHOD FOR FABRICATING THE SAME - A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands. | 11-10-2011 |
20120061834 | SEMICONDUCTOR CHIP, STACKED CHIP SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND FABRICATING METHOD THEREOF - A semiconductor chip includes a silicon wafer formed with a via hole, a metal wire disposed in the via hole, and a filler that exposes a part of an upper portion of the metal wire while filing the via hole. | 03-15-2012 |
20120088336 | SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor package having an improved connection structure and a method for manufacturing the same is described. The semiconductor package includes a substrate having a substrate body, connection pads that are located on one surface of the substrate body, and ball lands that are located on the other surface of the substrate body opposite the one surface. The ball lands are electrically connected to the connection pads. A semiconductor chip having bumps that are formed to correspond to the connection pads is connected to the substrate. An anisotropic conductive member having an insulation element is interposed between the substrate and the semiconductor chip to connect the substrate and the semiconductor chip. Electrically flowable conductive particles within the insulation element flow in the insulation element according to applied electric fields so as to arrange the electrically flowable conductive particles between the connection pads and the bumps. | 04-12-2012 |
20120139128 | SEMICONDUCTOR PACKAGE AND A METHOD FOR SELECTING A CHIP IN THE SEMICONDUCTOR PACKAGE - A semiconductor package includes a first semiconductor chip formed with a first through-silicon via; a second semiconductor chip stacked over the first semiconductor chip and formed with a second through-silicon via; and a cantilever formed over the first semiconductor chip and electrically connected to the first through-silicon via or the second through-silicon via according to an electrical signal. | 06-07-2012 |
20120154020 | STACK PACKAGE AND METHOD FOR SELECTING CHIP IN STACK PACKAGE - A stack package having stacked chips includes first voltage dropping units respectively formed in the chips; second voltage dropping units respectively formed in the chips; first signal generation units connected in parallel to a first line formed by connecting the first voltage dropping units in series, respectively formed in the chips, and configured to apply high level signals according to a voltage of the first line; second signal generation units connected in parallel to a second line formed by connecting in series the second voltage dropping units, respectively formed in the chips, and configured to apply high level signals according to a voltage of the second line; and chip selection signal generation units respectively formed in the chips, and configured to combine signals outputted from the first signal generation units and the second signal generation units and generate chip selection signals. | 06-21-2012 |
20120299169 | STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE - A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads. | 11-29-2012 |
20120299199 | STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE - A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads. | 11-29-2012 |
20130001779 | STACK PACKAGE HAVING FLEXIBLE CONDUCTORS - A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package. | 01-03-2013 |
20130292820 | ELECTRONIC DEVICE PACKAGES INCLUDING BUMP BUFFER SPRING PADS AND METHODS OF MANUFACTURING THE SAME - Electronic device packages and related methods are provided. The electronic device package includes a first substrate having a first contact portion disposed thereon, a bump having a first contact surface connected to the first contact portion and a second contact surface disposed opposite to the first contact surface, and a buffer spring pad portion between the first contact portion of the first substrate and the first contact surface of the bump. The buffer spring pad portion includes at least two different conductive material layers which are stacked. | 11-07-2013 |
20150270229 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate. | 09-24-2015 |
Patent application number | Description | Published |
20130059187 | APPARATUS FOR PREVENTING DEFORMATION OF PLASTIC BATTERY PACK CASE FOR A VEHICLE - Disclosed is an apparatus and method for preventing deformation of a plastic battery pack case for a vehicle, in which the side of the battery pack case is subjected to reverse deformation to absorb the deformation occurring after compression molding and to ensure the dimensions of a mounting portion of various components including battery packs, thereby ensuring an internal space of the battery pack case. To this end, the present invention provides an apparatus for preventing deformation of a plastic battery pack case for a vehicle, the apparatus including: a base having a case insertion space; a fixing portion for fixing a battery pack case inserted into the case insertion space; and a deformation producing portion inserted into the battery pack case and preventing the case from being deformed by pressing the inside of the case to be reversely deformed in the lateral direction. | 03-07-2013 |
20130252059 | BATTERY PACK CASE ASSEMBLY FOR ELECTRIC AND HYBRID VEHICLES USING A PLASTIC COMPOSITE AND METHOD FOR MANUFACTURING THE SAME - Disclosed is a battery pack case assembly for an electric or hybrid vehicle and a method for manufacturing the same. The battery pack case assembly includes a case body and a cover. The case body receives a battery pack, and the cover is coupled to the case body. The case body is formed of a plastic composite in which a long fiber or a blend of a long fiber and a continuous fiber is used as a reinforcing fiber in a plastic matrix. A separate reinforced member is bonded to both side bracket parts for coupling to a vehicle body, and is formed of a plastic composite in which a long fiber, a continuous, or a blend of a long fiber and a continuous fiber is used as the reinforcing fiber in the plastic matrix. | 09-26-2013 |
20140352886 | BATTERY PACK CASE ASSEMBLY FOR ELECTRIC AND HYBRID VEHICLES USING A PLASTIC COMPOSITE AND METHOD FOR MANUFACTURING THE SAME - Disclosed is a battery pack case assembly for an electric or hybrid vehicle and a method for manufacturing the same. The battery pack case assembly includes a case body and a cover. The case body receives a battery pack, and the cover is coupled to the case body. The case body is formed of a plastic composite in which a long fiber or a blend of a long fiber and a continuous fiber is used as a reinforcing fiber in a plastic matrix. A separate reinforced member is bonded to both side bracket parts for coupling to a vehicle body, and is formed of a plastic composite in which a long fiber, a continuous, or a blend of a long fiber and a continuous fiber is used as the reinforcing fiber in the plastic matrix. | 12-04-2014 |
20150228946 | APPARATUS FOR PREVENTING DEFORMATION OF PLASTIC BATTERY PACK CASE FOR A VEHICLE - Disclosed is an apparatus and method for preventing deformation of a plastic battery pack case for a vehicle, in which the side of the battery pack case is subjected to reverse deformation to absorb the deformation occurring after compression molding and to ensure the dimensions of a mounting portion of various components including battery packs, thereby ensuring an internal space of the battery pack case. To this end, the present invention provides an apparatus for preventing deformation of a plastic battery pack case for a vehicle, the apparatus including: a base having a case insertion space; a fixing portion for fixing a battery pack case inserted into the case insertion space; and a deformation producing portion inserted into the battery pack case and preventing the case from being deformed by pressing the inside of the case to be reversely deformed in the lateral direction. | 08-13-2015 |
Patent application number | Description | Published |
20140157004 | APPARATUS AND METHOD FOR ENCRYPTION IN VIRTUALIZED ENVIRONMENT USING AUXILIARY MEDIUM - An apparatus and method for encryption in a virtualized environment using an auxiliary medium. The apparatus for encryption in a virtualized environment using an auxiliary medium includes a hypervisor unit for acquiring data for encryption from an auxiliary medium, and encrypting and providing protection target data of an application program using the data for encryption in response to an encryption request from the application program. A hypercall unit provides a virtualization interface between the application program and the hypervisor unit. | 06-05-2014 |
20160055347 | DATA ACCESS CONTROL METHOD IN CLOUD - A data access control method includes requesting, by the data owner unit, the generation of a data encryption key (DEK) from the manager unit, generating, by the manager unit, the DEK, generating, by the manager unit, the result of the Ciphertext Policy-Attribute Based Encryption (CP-ABE) of the DEK and a secret key used to decrypt the result of the CP-ABE encryption, and then responding, by the manager unit, to the data owner unit, obtaining, by the data owner unit, the DEK by performing the CP-ABE decryption of the result of the CP-ABE encryption using the secret key, encrypting, by the data owner unit, data with the obtained DEK, and uploading, by the data owner unit, the encrypted data and DEK information to the cloud. | 02-25-2016 |
Patent application number | Description | Published |
20100211808 | Data storage devices and power management methods thereof - A data storage device includes a data storage medium and a controller. The controller is configured to control at least one of a reading, erasing, and writing operation on the data storage medium. The controller includes an interface and a power management unit. The interface is configured to exchange at least one of a command, an address, and data with a host. The power management unit is configured to change the power mode of the interface into a power saving mode if: a command input from the host is not executed, data transfer is not actually executed in executing the command, or status information is not reported after the command is executed. | 08-19-2010 |
20110004817 | CRC MANAGEMENT METHOD PERFORMED IN SATA INTERFACE AND DATA STORAGE DEVICE USING CRC MANAGEMENT METHOD - A cyclic redundancy check (CRC) management method performed in a serial advanced technology attachment (SATA) interface and a data storage device using the CRC management method. A host interface connected to the SATA interface performs CRC computation on transmitted data to generate a first CRC code, determines whether a host interface block error or a data integrity error occurs, or the status of a data storage device needs to be reported to the host interface, generates a second CRC code, which is different from the first CRC code, according to the determination result. If a frame including the transmitted data and the second CRC code is transmitted to a host, the host performs CRC computation on a data FIS in the transmitted data to expect the first CRC code. Since the CRC code in the transmitted data is the second CRC code, the host recognizes that the transmitted data is wrong and provides an error notification to the data storage device. Accordingly, the host can be informed of the host interface block error, the data integrity error, or the status error of the data storage device, not a protocol error in the SATA interface. | 01-06-2011 |
20150227187 | DATA STORAGE DEVICE, METHOD THEREOF, AND DATA PROCESSING SYSTEM INCLUDING THE SAME - A data storage device includes a central processing unit (CPU); a peripheral device; a power management unit (PMU) configured to control a power supply to the CPU and the peripheral device; and a receiver configured to transmit a second signal to the PMU through a second transmission path after transmitting a first signal to the CPU through a first transmission path, the receiver being configured such that the first and second signals transmitted by the receiver are signals that were output from a host. | 08-13-2015 |
20160041604 | SEMICONDUCTOR DEVICE FOR REDUCING POWER CONSUMPTION IN LOW POWER MODE AND SYSTEM INCLUDING SAME - A semiconductor device can reduce power consumption in a low power mode and includes a first input/output circuit configured to detect a first entry signal transiting at a first time and output a detection signal indicating an entry into a power saving mode according to a result of the detection. A second input/output circuit is configured to receive a second entry signal transiting at a second time earlier than the first time, and a control circuit is configured to block power supplied to the second input/output circuit in response to the detection signal indicating the entry. | 02-11-2016 |
Patent application number | Description | Published |
20140170032 | METAL FILTER FOR PURIFYING EXHAUST GAS FROM SHIP, AND PREPARATION METHOD THEREOF - The present invention relates to a metal filter for purifying the exhaust gas from a ship, and a preparation method thereof. The purpose of the present invention is to provide: a metal filter for purifying the exhaust gas from a ship, capable of reducing nitrogen oxide by 85% or more at 250-300° C.; and a preparation method thereof. The metal filter for removing nitrogen oxide contained in the exhaust gas from a ship of the present invention comprises an integrated catalyst, wherein a metal substrate comprising irregularities is coated with a low temperature active catalyst in which vanadium (V), tungsten (W) and alumina sol are supported in a Ti-pillared clay (Ti-PILC) powdered support. | 06-19-2014 |
20150185158 | METHOD FOR MEASURING REACTION RATE OF REACTIVE MESOGEN - A method for measuring a reaction rate of a reactive mesogen and an alignment layer formed thereby, the method including coating an alignment material on a substrate. The alignment material includes a backbone and a reactive mesogen connected to the backbone. The reactive mesogen includes an unsaturated bond. The alignment material is irradiated with ultraviolet light, or is heated, to form the alignment layer. A marking compound, including a thiol group is coated on the alignment layer and reacts with remaining unreacted reactive mesogen, to form a marked mesogen. An amount of the marked mesogen is detected. A reactive ratio is measured by comparing an amount of the reactive mesogen before irradiating or heating with an amount of the marked mesogen. | 07-02-2015 |
20150293408 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes: a first insulating substrate, a second insulating substrate, a pixel electrode positioned on the first insulating substrate, a common electrode positioned on the first insulating substrate or the second insulating substrate, a first alignment layer positioned on the first insulating substrate, a second alignment layer positioned on the second insulating substrate, and a liquid crystal layer positioned between the first insulating substrate and the second insulating substrate. The first alignment layer and/or the second alignment layer include an additive and an alignment layer compound having a main chain, and a plurality of side chains connected to the main chain, and at least one of the plurality of side chains includes a vertical alignment group, and a reactive mesogen including two or more photoreactive groups, and the additive includes at least one compounds selected from the following | 10-15-2015 |
20160032190 | COMPOSITION FOR ALIGNING, DISPLAY PANEL AND METHOD OF MANUFACTURING SAME - A composition for aligning includes a macromolecular compound and a reactive mesogen. The macromolecular compound is formed by a condensation polymerization reaction of a dianhydride monomer, and a diamine monomer including a photo reactive group. Thus, the composition for aligning includes the reactive mesogen, so that the reactive mesogen is not included in a liquid crystal layer. | 02-04-2016 |
20160033824 | ALIGNMENT COMPOSITION, LIQUID CRYSTAL DISPLAY PANEL AND METHOD OF MANUFACTURING SAME - An alignment composition an alignment composition includes an alignment polymer and a reactive mesogen. The alignment polymer includes a polyimide backbone and a vertical alignment side chain combined with the polyimide backbone. The reactive mesogen may be represented by the following Chemical Formula 1. | 02-04-2016 |
20160103367 | LIQUID CRYSTAL DISPLAY PANEL - Provided are liquid crystal display (LCD) panels. The LCD panel of one embodiment comprises a first substrate; a second substrate which faces the first substrate; a liquid crystal layer which is interposed between the first substrate and the second substrate; and a liquid crystal alignment layer which is interposed between the liquid crystal layer and at least one of the first substrate and the second substrate and comprises one or more electron-pair donors selected from the group consisting of alky amine, aryl amine, heterocyclic amine, furan, and thiophene. | 04-14-2016 |