Bradley, OH
Alistair Bradley, Dublin, OH US
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20100122583 | DESIGN OF WET/WET DIFFERENTIAL PRESSURE SENSOR BASED ON MICROELECTRONIC PACKAGING PROCESS - Method and system for a wet/wet differential pressure sensor based on microelectronic packaging process. A top cap with a hole can be attached to a topside of a MEMS-configured pressure sense die with a pressure sensing diaphragm in order to allow sensed media to come in contact with the topside of the pressure sensing diaphragm. An optional constraint with a hole for stress relief can be attached to a backside of the pressure sense die. Adhesive and/or elastomeric seals and/or solder can be utilized to seal the pressure sense die allowing sensed media to come in contact with both sides of the pressure sensing diaphragm without coming into contact with wirebonds and other metallized surfaces. The MEMS-configured pressure sense die can also be bonded to a substrate with standard die attach materials. Such microelectronic packaging processes yield a high performance and cost effective solution thereby providing wet-wet pressure sensing capability. | 05-20-2010 |
Alistair Bradley, Hilliard, OH US
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20120125114 | PRESSURE SENSOR - The present disclosure relates to sensors including pressure sensors. In some cases, the pressure sensor may include a membrane or diaphragm, multiple sense elements connected to one another in a bridge configuration and positioned on the membrane, and an amplifier coupled to an output of the bridge configuration and having an output, where the diaphragm, sense elements and amplifier may be formed on a singled substrate or formed integrally therewith, or both. In one example, the pressure sensor may sense a particular range of pressures applied to the sensor, and/or may include an amplifier that has a selectable gain for amplifying an output of the bridge. | 05-24-2012 |
Alistair D. Bradley, Dublin, OH US
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20080222884 | Packaging for chip-on-board pressure sensor - A method of packaging for chip-on-board pressure sensor that includes a buffer layer with a coefficient of thermal expansion (CTE) intermediate between the transducer and a main chip-on-board substrate by which thermally induced package stresses can be greatly reduced or eliminated. Additionally, the use of a buffer layer with higher stiffness (elastic modulus) than the chip-on-board substrate further prevents or reduces flexural (bending) stresses from being transferred to the transducer. Such a buffer layer also enables a wider choice of materials for bonding and stable performance of pressure sensor in harsh media and environmental conditions. The pressure transducer can be adhesively bonded to a ceramic layer, which in turn can be adhesively bonded to an epoxy laminate chip-on-board substrate. | 09-18-2008 |
20090096040 | Sensor geometry for improved package stress isolation - The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package. | 04-16-2009 |
20090212093 | PRESSURE SENSE DIE PAD LAYOUT AND METHOD FOR DIRECT WIRE BONDING TO PROGRAMMABLE COMPENSATION INTEGRATED CIRCUIT DIE - A method for direct die-to-die wire bonding incorporates a pressure sense die and a programmable compensation IC die that can be mounted on a ceramic substrate. The two die can be positioned beside each other such that wire bond pads on the pressure sense die and bonding leads on the compensation IC die are in same order. The pressure sense die and the compensation IC can be connected directly with wire bonds in order to reduce the number of wire bonds and to improve reliability. The pressure sense die can be designed with multiple wire bond pad patterns in order to be utilized with different programmable compensation IC dies. | 08-27-2009 |
20100301435 | SENSOR GEOMETRY FOR IMPROVED PACKAGE STRESS ISOLATION - The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package. | 12-02-2010 |
20110214504 | DISPOSABLE PRESSURE SENSOR SYSTEMS AND PACKAGES THEREFOR - A disposable pressure sensor system includes a disposable sensor assembly having at least one sensing element, carried on a housing or frame, and at least one electrical connector and/or mechanical connector for connecting the sensing element(s) to an external apparatus or device. The mechanical and/or electrical connectors are integrated in the housing or frame so that both the connector(s) and sensing element(s) are packaged in a single part. The assembly can be integrated in or attachable to a fluid carrying module, such as a dialysis cartridge, such that the sensing element(s) can sense the fluid in the module. | 09-08-2011 |
Alistair David Bradley, Hilliard, OH US
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20120144921 | INCREASED SENSOR DIE ADHESION - Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween. | 06-14-2012 |
20130031986 | JOINT BETWEEN A PRESSURE SENSOR AND A PRESSURE PORT OF A SENSOR ASSEMBLY - The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some illustrative cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In one example, the sensor unit may include a carrier carrying a sense element, where the carrier may extend into a recess of the pressure port and may be secured to the pressure port at an internal side thereof through the use of an adhesive layer. | 02-07-2013 |
Alistair David Bradley, Dublin, OH US
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20100206046 | FLOW-THROUGH PRESSURE SENSOR APPARATUS - A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area. | 08-19-2010 |
20110000318 | FORCE SENSOR APPARATUS - A force sensor apparatus and method of forming the same. The apparatus includes a force sense element that can be attached to a substrate. An actuator disposed in a hole formed within the cap is operably coupled to the force sense element for transferring force to the sense element in response to receiving a force from an external source. The force sense element is configured to sense the external force and generate an output signal representing the force. Preferably, one or more bond pads, associated with the force sense element and the substrate, can be electrically connected via wire bonding. A cover associated with an integrated flexible membrane can be mounted on the substrate in order to protect internal components associated with the force sensor apparatus from an external environment. | 01-06-2011 |
20110005326 | SENSOR PACKAGE ASSEMBLY HAVING AN UNCONSTRAINED SENSE DIE - A pressure detection mechanism having a pressure sense die which may be attached directly to a surface of an alumina-based substrate with an adhesive having an optimum thickness. The adhesive may be stress compliant and may be one or more of silicone, silicone-epoxy, epoxy or any other suitable adhesive material. A compensation and interface application specific integrated circuit may be attached to the surface of the package substrate. The pressure sense die may be electrically connected to the integrated circuit with bond wires. The integrated circuit may be electrically connected to trace conductors on the package substrate with bond wires, and trace conductors may be connected to stress compliant metal conductors or leads for external connection to a mounting surface such as a printed circuit board. Hard plastic, or like material, symmetric covers, with one or more pressure ports or vents, may be attached to both sides of the substrate. | 01-13-2011 |
Brett R. Bradley, Maple Heights, OH US
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20140306598 | FLUORESCENT LAMP WITH HIGH COLOR RENDERING INDEX AND COATING SYSTEMS THEREFOR - A coating system for a fluorescent lamp, and fluorescent lamps provided therewith. The coating system includes a phosphor-containing coating containing a mixture of phosphors that contain less than 10% weight rare earth phosphors. The phosphor-containing coating emits visible light having a color rendering index of at least 87 when excited by UV radiation. | 10-16-2014 |
Chad J. Bradley, Sagamore Hills, OH US
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20090193614 | DUST COLLECTION APPARATUS FOR DEMOLITION TOOL - A dust collection device for attaching to a demolition tool includes a hollow first body, a hollow second body, and a suction tube. The hollow first body can be configured to connect with an associated demolition tool. The hollow second body can connect with the first body and the two bodies can cooperate to define an internal space. The second body can be at least one of (i) selectively removable from and reattachable to the first body at or adjacent a distal end of the first body without damaging the first body or the second body and (ii) rotatable with respect to the first body. The suction tube can connect to at least one of the first body and the second body. The suction tube can define a passage in fluid communication with the internal space. | 08-06-2009 |
20090208345 | SUMP PUMP WITH EMERGENCY BACKUP SYSTEM - A flood control system for use in a structure having a basement floor below ground level is provided. The flood control system comprises a sump, a main pump positioned in the sump, and a secondary pump positioned in the sum. The secondary pump is raised relative to the main pump to a predetermined elevation. The main pump is energized when a height of water within the sump is at a first level. The secondary pump is energized when a height of water within the sump reaches a second, higher level and is de-energized when a height of water within the sump drops to a third level. A cover is releasably mounted to the sump. The cover includes a first section for covering the main pump and a separate second section for covering the secondary pump. At least one of the first and second sections is hingedly mounted to the sump. A controller is operatively connected to the main pump and the secondary pump. The controller is responsive to water level within the sump to selectively energize at least one of the main pump and the secondary pump. | 08-20-2009 |
Donald Bradley, Cincinnati, OH US
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20130269479 | GEARBOX AND SUPPORT APPARATUS FOR GEARBOX CARRIER - A gearbox support apparatus includes: a gearbox carrier having a central axis, the carrier configured to mount one or more rotating gears therein, the carrier including spaced-apart forward and aft walls, and a flexible center plate structure disposed between the forward and aft walls, an annular support ring disposed axially adjacent to the carrier; and a plurality of axially-extending torque fingers interconnecting the mounting ring and the center plate structure. | 10-17-2013 |
Donald Albert Bradley, Cincinnati, OH US
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20150354502 | ENGINE ARCHITECTURE WITH REVERSE ROTATION INTEGRAL DRIVE AND VANELESS TURBINE - A gas turbine engine comprises a fan, a compressor, a turbine having first stage blades and second stage blades, the first stage blades rotates in a first direction and the second stage blades rotates in a second direction opposite the first direction. The first stage blades are directly adjacent to one another, a drive in operable input connection with the fan and in operable output connection with the first stage blades and the second stage blades, the first stage blades and the second stage blades driving the fan through the drive. | 12-10-2015 |
20160032740 | VARIABLE-PITCH ROTOR WITH REMOTE COUNTERWEIGHTS - A pitch control mechanism includes: a rotor structure configured for rotation about a longitudinal axis; a row of blades carried by the rotor structure, each blade having an airfoil and a trunnion mounted for pivoting movement relative to the rotor structure, about a trunnion axis which is perpendicular to the longitudinal axis; a unison ring interconnecting the blades; an actuator connected to the unison ring and the rotor structure, operable to move the unison ring relative to the rotor structure; at least one moveable counterweight carried by the rotor structure, remote from the blades; and an interconnection between the blades and the counterweight, such that movement of the counterweight causes a change in the pitch angle of the blades. | 02-04-2016 |
James Darrell Bradley, Fairfield, OH US
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20140077116 | METHODS AND SYSTEMS FOR OPERATING AN INTEGRATED ACTUATOR - Methods and systems for operating an integrated actuator are provided. The integrated actuator comprises an actuator body, an extension rod coupled to the actuator body. The extension rod includes a piston valve and is configured for selective movement between a first position in a first mode of operation where the piston valve is fully open and a second position in a second mode of operation where the piston valve is less than fully open. The integrated actuator further comprises a flow body coupled to the actuator body such that the flow body houses the piston valve and a modulation device coupled to the extension rod. The modulation device is operable by movement of the extension rod and is configured to be fully open in the first mode of operation and is configured to be less than fully open in the second mode of operation. | 03-20-2014 |
Patrick Bradley, Kent, OH US
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20080242810 | Use of a Combination Chain Transfer and Activating Agent to Control Molecular Weight and Optical Density of Pd Catalyzed Norbornene Polymers - A method of controlling the molecular weight of poly(cyclic) olefin (norbornene-type) polymers and activating the polymerization thereof with a single material is provided. Such method include adding a chain transfer/activating agent to a mixture of monomer(s), catalyst, solvent and an optional cocatalyst and polymerizing the mixture to form a polymer. It is shown that the amount of chain transfer/activating agent in the mixture can serve to control the molecular weight of the resulting polymer, its percent conversion or both, and in some embodiments the optical density of the resulting polymer. | 10-02-2008 |
20110009578 | Use Of A Combination Chain Transfer And Activating Agent To Control Molecular Weight And Optical Density Of Pd Catalyzed Norbornene Polymers - A method of controlling the molecular weight of poly(cyclic) olefin (norbornene-type) polymers and activating the polymerization thereof with a single material is provided. Such method include adding a chain transfer/activating agent to a mixture of monomer(s), catalyst, solvent and an optional cocatalyst and polymerizing the mixture to form a polymer. It is shown that the amount of chain transfer/activating agent in the mixture can serve to control the molecular weight of the resulting polymer, its percent conversion or both, and in some embodiments the optical density of the resulting polymer. | 01-13-2011 |
Theodore Bradley, North Ridgeville, OH US
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20160136802 | Angle Stop Combination and Tool Handle - An angle stop wrench with an open first end sized for holding a plumbing component during an installation procedure. A side opening of a different size from the open first end is also included in the angle stop wrench for holding a plumbing component during the installation procedure. Finally, a hook end portion for holding and aligning a plumbing component during the installation procedure is also provided, where the hook portion is formed on an end portion spaced from the open first end portion. The angle stop wrench may be secured for storage within the handle of a second tool useful in the installation procedure. | 05-19-2016 |