Kim, Bucheon-Si
Bong-Kil Kim, Bucheon-Si KR
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20090166719 | LDMOS SEMICONDUCTOR DEVICE MASK - Embodiments relate to an LDMOS semiconductor device mask that may reduce current leakage under a gate-off condition. According to embodiments, an LDMOS semiconductor device mask may include a moat mask to define a moat region, an NDT mask to define an N drift region, a PDT mask to define a P drift region, and a gate mask to form a gate. According to embodiments, a PDT mask may be configured to expose a field region of a semiconductor device. | 07-02-2009 |
20090166737 | Method for Manufacturing a Transistor - A method for manufacturing a transistor is disclosed, which is capable of improving matching characteristics of regions within a transistor or among transistors on a wafer, from wafer-to-wafer, or from lot-to-lot. The method includes forming a photoresist pattern on a semiconductor substrate including an isolation layer, forming a drift region by implanting first and second dopant ions using the photoresist pattern as a mask, forming a gate oxide layer on the semiconductor substrate, forming a poly gate on the gate oxide layer, forming source and drain regions a predetermined distance from the poly gate, and forming a silicide layer on the above structure. | 07-02-2009 |
20090170257 | METHOD OF MANUFACTURING MOS TRANSISTOR - A method of manufacturing a transistor may include: forming a first well over a silicon substrate; forming a first mask pattern over the silicon substrate and using the formed first mask pattern to form a second well; removing the first mask pattern; forming a second mask pattern over the silicon substrate and using the formed second mask pattern to form a first drift region; removing the second mask pattern; forming a third mask pattern and using the formed third mask pattern to form a second drift region; removing the third mask pattern; forming a field oxide film over the silicon substrate; and introducing first conductive impurity ions into an upper surface of the silicon substrate by channel ion implantation. | 07-02-2009 |
Bum Jun Kim, Bucheon-Si KR
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20140116176 | SHIFT LEVER FOR A VEHICLE TRANSMISSION - Disclosed is a shift lever for a vehicle transmission, which includes a rod provided in a mounting space to move linearly and having an upper part having an upper inclined surface and successive engaging grooves. An engaging protrusion is provided on an inner wall of a support section such that, when the rod moves, the engaging protrusion is engaged with one of the engaging grooves to afford a brisk, clear operation action when changing gears. A button is provided such that one end thereof extends to the inclined surface of the upper part of the rod, and another end thereof is exposed to the outside to enable that end to be pressed down to push the rod down. | 05-01-2014 |
20140345415 | ACCELERATOR PEDAL OF VEHICLE - An accelerator pedal for a vehicle includes: a foot pad to which a pedal effort is applied by a driver; a cover which is connected to correspondingly thereto; a vibration producer which is disposed between the foot pad and the cover and is vibrated by an electric signal; and a vibration transmitter which is extended in a longitudinal direction of the foot pad. | 11-27-2014 |
20140366677 | PEDAL DEVICE FOR VEHICLES - A pedal device for vehicles includes: a pedal arm provided in a pedal housing and connected to a pedal pad at a first end thereof, and rotated around a hinge shaft mounted to a second end of the pedal arm; a pressure member, a first end of which is held by the first end of the pedal arm, and a second end of which is placed between the hinge shaft and an inner surface of the pedal housing; and an elastic member provided between a middle portion of the pressure member and the inner surface of the pedal housing, and functioning to impose an elastic reaction force on the pressure member when a driver presses the pedal pad down. The elastic member brings the second end of the pressure member into frictional contact with the inner surface of the pedal housing. | 12-18-2014 |
Byeon Sam Kim, Bucheon-Si KR
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20120104129 | FOOD WASTE DISPOSAL APPARATUS - A food waste processing apparatus is disclosed. In the food waste processing apparatus according to the embodiment of the present invention, after food waste is dehydrated by a centrifugal force within the upper drum part and the lower drum part which are rotated to be discharged, it is discharged to the outside of the housing by the rotation of the lower drum part. That is, since food waste is dehydrated, discharged, and drained by one part, manufacturing costs can be reduced. Further, since food waste is broken up, dehydrated, discharged, and drained by one motor, manufacturing costs can be reduced further. Furthermore, since the lower drum part is vertically moved by a relatively simple structure of a cam, a structure of the rotary shaft, and an inertial force, manufacturing costs can be reduced still further. Food waste is dehydrated and discharged by a centrifugal force and the food waste within the housing is discharged to the outside of the housing by the discharge blade installed in the drum. That is, since food waste can be completely dehydrated, discharged, and drained, the food waste processing apparatus is very sanitary. | 05-03-2012 |
Byong-Nam Kim, Bucheon-Si KR
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20110163937 | MULTIBAND ANTENNA USING ELECTROMAGNETIC COUPLING - A multi-band antenna using electromagnetic coupling includes a first carrier; a first antenna pattern, which is formed on the first carrier and which includes a power feed part and a radiator part; a second carrier; and a second antenna pattern formed on the second carrier. The first and second carriers are arranged such that the first and second antenna patterns are separated by a particular distance, and the second antenna pattern is not connected to a ground or a power feed line but is formed independently on the second carrier to be fed by electromagnetic coupling with the power feed part of the first antenna pattern. Thus, the multi-band antenna can employ a single power feed setup. Also, the impact on the human body of the frequency signals generated by a terminal can be reduced, and property changes caused by the hand effect and the head effect can be minimized. | 07-07-2011 |
Byung-Kyu Kim, Bucheon-Si KR
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20120177391 | IMAGE FORMING APPARATUS AND METHOD OF CONTROLLING TRANSFER POWER THEREOF - An image forming apparatus including a transfer unit that transfers onto a transfer medium an image that is formed on a photosensitive medium; a power supply unit that provides a transfer power to the transfer unit; and a transfer power control unit that controls the transfer power that is provided to the transfer unit by the power supply unit. The transfer power control unit sets as a target voltage an output voltage of the power supply unit that is measured by supplying an initial transfer current to the transfer unit in a predetermined certain period before an image is transferred onto the transfer medium and controls the power supply unit to apply the set target voltage to the transfer unit while an image is being transferred onto the transfer medium. | 07-12-2012 |
20130308961 | IMAGE FORMING APPARATUS AND METHOD OF CONTROLLING DEVELOPING UNIT THEREOF - An image forming apparatus is provided. The image forming apparatus includes a developing unit which contains a mixture of toner and carrier, a toner sensor which is disposed in the developing unit, and a controller which determines a control voltage for the toner sensor using change information on a change in a quantity of electric charge which changes according to a time during which the image forming apparatus is used or paused, and drives the toner sensor using the determined control voltage and compensates for an output value of the toner sensor. Accordingly, toner can be prevented from being supplied excessively. | 11-21-2013 |
Dae Hoon Kim, Bucheon-Si KR
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20120153223 | ABSORBENT FOR CAPTURING CARDON DIOXIDE INCLUDING AMINO ACID HAVING MULTI AMINE GROUPS AND METAL HYDROXIDE - Provided is an absorbent for capturing carbon dioxide. The absorbent may include an amino acid with multiple amine groups and an alkali-metal hydroxide mixed with the amino acid and thus, may increase an absorption capacity for carbon dioxide. When a sterically hindered effect is induced to the amino acid with multiple amine groups, the absorption capacity for carbon dioxide may increase and heat of absorption reaction may decrease and thus, energy consumed for regeneration of an absorbent may be reduced. The absorbent for capturing carbon dioxide may include amino acid with multiple amine groups and the metal hydroxide, and may provide a functional group around the amine groups to cause an sterically hindered effect and thus, the absorption capacity for carbon dioxide and an carbon dioxide absorption rate may increase, and the capital cost for a carbon dioxide capturing process and an operating cost may be significantly reduced. | 06-21-2012 |
Da-Hye Kim, Bucheon-Si KR
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20120105746 | 3D GLASSES, 3D DISPLAY APPARATUS HAVING THE SAME AND CONTROL METHOD THEREOF - A 3D display apparatus includes a 3D panel which displays a 3D image, a first circular polarization film which is attached to a front side of the 3D panel and converts the 3D image to a circular polarization component by retarding a phase, and 3D glasses including a second circular polarization film which converts the circular polarization component converted by the first circular polarization film to a linear polarization component by retarding a phase, a liquid crystal unit which allows the linear polarization component to pass or isolates the linear polarization component from passing based on a state of the power, and a linear polarization plate which allows the linear polarization component to pass or isolates the linear polarization component from passing based on a direction of the linear polarization component. | 05-03-2012 |
Donghoon Kim, Bucheon-Si KR
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20120319234 | E-FUSE STRUCTURES AND METHODS OF OPERATING AND MANUFACTURING THE SAME - An e-fuse structure includes a first doped region and a second doped region formed in a substrate. The first doped region has a first conductivity type and the second doped region has a second conductivity type different from the first conductivity type. The first and second doped regions contact each other. A conductive pattern is disposed on the first and second doped regions and contacts the first and second doped regions. A first contact plug is disposed on the conductive pattern in an area corresponding to the first doped region, and a second contact plug is disposed on the conductive pattern in an area corresponding to the second doped region. | 12-20-2012 |
Donghwan Kim, Bucheon-Si KR
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20100271079 | POWER SEMICONDUCTOR DEVICE - Disclosed is a power semiconductor device including a bootstrap circuit. The power semiconductor device includes a high voltage unit that provides a high voltage control signal so that a high voltage is output; a low voltage unit that provides a low voltage control signal so that a ground voltage is output, and is spaced apart from the high voltage unit; a charge enable unit that is electrically connected to the low voltage unit and charges a bootstrap capacitor for supplying power to the high voltage unit when the high voltage is output, when the ground voltage is output; and a high voltage cut-off unit that cuts off the high voltage when the high voltage is output so that the high voltage is not applied to the charge enable unit, and includes a first terminal electrically connected to the charge enable unit and a second terminal electrically connected to the high voltage unit. | 10-28-2010 |
Dongmin Kim, Bucheon-Si KR
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20130217495 | MUSICAL SYSTEM FOR PROMOTING BRAIN HEALTH - A musical brain fitness system according to an exemplary embodiment of the present invention includes: a display device configured to display a visual signal according to selected music; a control box configured to control the display device by receiving input of a user; and a controller including an acceleration sensor, and configured to drive the acceleration sensor according to a movement of the user to transmit a signal to the control box, in which the control box compares the signal received from the controller with a signal controlling the display device, processes the comparison, and outputs a result of the comparison. | 08-22-2013 |
Dong Seok Kim, Bucheon-Si KR
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20130093056 | Semiconductor Device and Method of Manufacturing the Same - Provided is a semiconductor device. The semiconductor device includes a first insulation layer on a semiconductor substrate, the first insulation layer including a lower metal line, a second insulation layer on the first insulation layer, the second insulation layer including a metal head pattern, a thin film resistor pattern on the metal head pattern, a third insulation layer on the thin film resistor pattern, an upper metal line on the third insulation layer, a first via passing through the first, second, and third insulation layers to connect the lower metal line to the upper metal line, and a second via passing through the third insulation layer and the thin film resistor pattern to connect the metal head pattern to the upper metal line. | 04-18-2013 |
Dong-Su Kim, Bucheon-Si KR
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20120058774 | APPARATUS AND METHOD FOR DISPLAYING AUGMENTED REALITY INFORMATION - An apparatus and method for displaying augmented reality (AR) information on a terminal according to authorization for use of AR information provided from an AR system. The method includes recognizing a current location of the terminal; receiving authorization information of AR information receivable at the recognized current location; determining whether the AR information is available with reference to the authorization information for the AR information; and displaying the receivable AR information according to the determination result. Accordingly, the terminal recognizes its current location, determines the availability of AR information receivable at the recognized location, receives available AR information from the AR system according to the determination result, and displays the received available AR information in a window on a display of the terminal. | 03-08-2012 |
Eung Won Kim, Bucheon-Si KR
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20090291810 | Pedal Exercise Machine Having Arc Trajectory - A pedal exercise machine with pedals and arm levers operated in conjunction with each other. A base, a front frame and a center frame are coupled to each other and a pair of pedals move upwards and downwards in alternating directions. Pedal links connect the pedals to the base, arm levers couple to the front frame, and lever link units include a first lever link coupled to the corresponding arm lever and a second lever link connecting the first lever link to the corresponding pedal. Subsidiary pedal links connect the pedals to the center frame, a resistance pulley is provided in the center frame, and a crank having crank arms is coupled to the resistance pulley. A first actuating link is coupled to each pedal link at a predetermined angle. A second actuating link is rotatably coupled at both ends to the first actuating link and the corresponding crank arm. | 11-26-2009 |
Gwang-Sig Kim, Bucheon-Si KR
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20130292406 | DISPENSER FOR FOOD OR MEDICINE - A dispenser for food or medicine is provided to store contents such as food or medicine inside and discharging one or a certain amount of food or medicine at a time and improves productivity of components and convenience for assembly by improving a cover which has an elastic piece and a button and a rod formed in one body and improving a coupling structure of a blocking member, a base plate, and a cylindrical main body to a protrusion and a groove type coupling. | 11-07-2013 |
Hee-Dae Kim, Bucheon-Si KR
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20090166734 | TRENCH GATE MOSFET AND METHOD FOR FABRICATING THE SAME - A trench gate MOSFET and a fabrication method thereof includes forming a first epitaxial layer over a semiconductor substrate, and then forming a second epitaxial layer formed over the first epitaxial layer, and then forming a body region over the second conductive type second epitaxial layer, and then forming a circular cross-section in a portion of the body region by performing an ion implantation process on the body region such that a bottom area thereof has a circular cross-section. | 07-02-2009 |
20090166816 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating a semiconductor device may include: forming an oxide film pattern and a poly film pattern over a semiconductor substrate to expose a portion of the surface of the semiconductor substrate; and then forming a spacer composed of a first insulating material on sidewalls of the oxide film pattern and the poly film pattern; and then forming a second insulating film over the semiconductor substrate including the spacer and the poly film, the second insulating film having a first portion formed over the exposed portion of the semiconductor substrate, a second portion formed over the poly film pattern and a third portion formed at an incline between the first and second portions. | 07-02-2009 |
Heung Bae Kim, Bucheon-Si KR
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20130336512 | EARPHONE - Provided is an earphone capable of protecting a user's tympanic membrane, improving the durability thereof, and enjoying the further improved quality of sound by adjusting a medium-low pitched sound. In the earphone, a micro speaker mounted on a partition wall dividing an inner space is embedded in a housing. An earpiece is connected to the housing and is inserted into an external auditory canal, and a sound band adjustment unit is provided in the housing. | 12-19-2013 |
20140363034 | MICRO SPEAKER - Disclosed herein is a micro speaker capable of having a high-pitched sound speaker unit and a low-pitched sound speaker unit and allowing the respective speaker units to clearly reproduce an inherent sound without interference. The micro speaker for converting an electrical signal into an acoustic signal includes: a high-pitched sound speaker unit disposed in an outer case; and a low-pitched sound speaker unit disposed in the outer case together with the high-pitched sound speaker unit, wherein the high-pitched sound speaker unit and the low-pitched sound speaker unit are disposed in the outer case so that a high-pitched sound vibrating plate of the high-pitched sound speaker unit and a low-pitched sound vibrating plate of the low-pitched sound speaker unit have directions opposite to each other. | 12-11-2014 |
Homoon Kim, Bucheon-Si KR
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20130337962 | APPARATUS HAVING MULTI-OUTPUT DIFFERENTIAL GEAR - Provided herein is a multi-output differential gear apparatus, the apparatus including a first differential gear having a first output gear and a middle gear, and second differential gear having a second output gear and a third output gear. | 12-19-2013 |
20140123800 | ROBOT USING MULTI-OUTPUT DIFFERENTIAL GEAR - Provided herein is a robot using a multi-output differential gear, the robot comprising a driver; a differential gear configured to receive a driving power from the driver, and to drive in an interlocked manner with the driving power to generate at least three outputs differentiated from the driving power; and a motion section configured to drive in an interlocked manner with an output generated from the differential gear, and to apply an external resistance to the differential gear. | 05-08-2014 |
Hun Soo Kim, Bucheon-Si KR
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20110048691 | FAIL-SAFE AIR FLAP CONTROL APPARATUS FOR VEHICLE - A fail-safe air flap control apparatus for a vehicle includes a coolant temperature sensor, a control unit, an actuator, a movable unit, a flap unit, an elastic member and a solenoid unit. The coolant temperature sensor measures the temperature of a coolant. The control unit compares a value measured by the sensor to a reference value and generates a corresponding control signal. The actuator has a rotator which rotates in a clockwise or counterclockwise direction depending on the control signal. The movable unit linearly moves under rotational force of the rotator. The flap unit includes a flap housing having an air flow slot, a flap door mounted to the flap housing to openably close the air flow slot, and a connecting rod connected to the movable unit. The elastic member applies elastic force to the movable unit in a direction in which the flap door opens. The solenoid unit is controlled by the control signal of the control unit so as to either restrain movement of the movable unit and so maintain the flap door in a closed state or to release the movable unit. | 03-03-2011 |
20110073395 | APPARATUS FOR OPENING AND CLOSING AIR FLAP FOR VEHICLE - Disclosed herein is an apparatus for opening and closing an air flap for a vehicle. The apparatus for opening and closing an air flap may include a coolant temperature sensor provided at an engine to measure a coolant temperature of the engine, a control unit comparing a measurement value input from the coolant temperature sensor with a reference value stored therein, thus outputting a control signal, an actuator rotating in response to the control signal of the control unit, a power transmission unit connected to the actuator to transmit rotating force of the actuator, and a flap unit installed in an opening of a front end module carrier, and being selectively movable in a vertical direction in the opening by power transmitted from the power transmission unit to the flap unit to open or close the opening, thus permitting or preventing an inflow of air into the cooling module. | 03-31-2011 |
20110121733 | ADAPTIVE FRONT LIGHTING SYSTEM AND CONTROL METHOD OF THE SAME - Provided is an Adaptive Front Lighting System and a control method thereof, which includes a motor driver which controls a beam irradiation direction of a headlamp by operating a motor coupled to the headlamp according to a motor control signal, and generates a motor fault signal when fail occurs in the motor, a power supply unit which controls a magnitude of electric power supplied to the headlamp according to a power control signal, and a controller which selectively outputs the power control signal to the power supply unit according to the motor fault signal of the motor driver. | 05-26-2011 |
20110125373 | ADAPTIVE FRONT LIGHTING SYSTEM FOR PERFORMING HIGHWAY AND URBAN DISTRICT MODES OF FRONT LIGHTING - An adaptive front lighting system for performing highway and urban district modes of front lights is provided, which includes a leveling actuator rotating a light source of front lights of a vehicle in upward and downward directions, and a control unit judging a driving state of the vehicle as either of a highway driving state and an urban district driving state in accordance with a driving condition of the vehicle and determining a degree of rotation of the light source performed by the leveling actuator in accordance with a result of judgment. The driving condition includes at least one of a vehicle speed, external illumination, and frequency of vehicle stops. | 05-26-2011 |
20110128748 | METHOD OF CONTROLLING ADAPTIVE HEADLAMP - A method of controlling an adaptive head lamp including a control unit for detecting a driving signal of a vehicle to control an actuator which controls the head lamp in a horizontal or vertical direction in accordance with a control signal of the control unit, may include steps of, a) verifying whether an ignition of the vehicle is turned on or off, b) after the ignition of the vehicle is verified, driving the actuator to move the head lamp to a rightmost or leftmost position in the horizontal direction, or a lowermost or uppermost position in the vertical direction, c) driving the actuator by a predetermined number of pulses previously set in a micro stepping manner in a direction opposite to a driving direction of the headlamp at the step b), and d) setting a position of the head lamp determined at the step c) as an initial position. | 06-02-2011 |
20110133647 | METHOD AND APPARATUS FOR PROVIDING HIGH BEAM IN LED HEADLAMP - A method for selectively providing a low beam state and a high beam state of an LED headlamp, may include driving an engine of a vehicle, switching on a multi-function switch to turn on at least a second LED module to emit a high beam after driving the engine to perform the high beam state of the LED headlamp, and converting a low beam state of at least a first LED module into a high beam state to perform the high beam state of the LED headlamp. | 06-09-2011 |
20110295462 | SYSTEM FOR CONTROLLING CLOCK FOR VEHICLE USING GPS INFORMATION - A system for controlling a clock for a vehicle using Global Positioning System (GPS) information, may include a GPS reception unit for receiving the GPS information from satellites, a clock oscillator for measuring a time value by generating clocks, a switch unit for supplying a user-changed time value by manipulation thereof, a display unit for displaying a current time, and a control unit for, when power of the vehicle is applied, displaying the current time to the display unit by outputting a sum of the time value of the clock oscillator and the user-changed time value of the switch unit, and, when invalid information has been received from the GPS reception unit, storing the user-changed time value reset using the switch unit and then outputting the current time. | 12-01-2011 |
20120024923 | TELESCOPIC BICYCLE CARRIER - A telescopic bicycle carrier installed on a vehicle so as to be able to load a bicycle outside the vehicle, may include a guide rail located inside a bumper of the vehicle and fixed to an end of a body of the vehicle, a guide frame slidably installed on the guide rail along a lengthwise direction of the vehicle, a pair of expansion brackets installed on lateral sides of the guide frame and slidable toward or away from each other with respect to the guide frame in a widthwise direction of the vehicle through the guide frame, bicycle wheel fixtures pivotally installed on the pair of expansion brackets to fix wheels of the loaded bicycle, and bicycle body fixtures pivotally installed on the pair of expansion brackets to fix a body of the loaded bicycle, wherein the pair of expansion brackets may be received inside the bumper along with the guide frame in a retracted state where the expansion brackets slide toward each other into the guide frame, and may be extracted from the bumper along with the guide frame if necessary. | 02-02-2012 |
20120141764 | MULTI GLASS FIBER BONDED HIGH STRENGTH PLASTIC BACK BEAM - A multi-glass fiber bonded high-strength plastic back beam for a vehicle bumper, which may be made of glass fiber and thermoplastic resin, may include a first fiber resin layer in which long fiber or short fiber may be bonded with thermoplastic resin, and a second fiber resin layer in which continuous fiber may be bonded with thermoplastic resin, wherein, when the first fiber resin layer may be independently attached onto the second fiber resin layer by heating, the long fiber or short fiber of the first fiber resin layer may be configured not to permeate between the continuous fibers of the second fiber resin layer. | 06-07-2012 |
20140174842 | IMPACT ABSORBING APPARATUS OF VEHICLE - An impact absorbing apparatus of a vehicle includes a back beam to secure an impact absorbing space while retreating rearward at the time of a collision accident with a pedestrian. This makes it possible to prevent direct contact between the back beam, which is a rigid body, and the pedestrian. Therefore, injury to the pedestrian may be significantly decreased. | 06-26-2014 |
Hyung-Soon Kim, Bucheon-Si KR
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20120229159 | TEST INTERFACE BOARD AND TEST SYSTEM INCLUDING THE SAME - A test interface board includes a wiring group, a plurality of contact portions, and a control device. The wiring group includes a main wire operatively coupled to a channel of a tester, and a plurality of sub-wires operatively coupled to the main wire. The plurality of contact portions are operatively coupled to the plurality of sub-wires, and contact first electrodes of a plurality of semiconductor devices. The control device includes a plurality of switching devices operatively coupled to the plurality of sub-wires, a memory configured to store an identification number, and a controller configured to open and close the plurality of switching devices in response to a control signal corresponding to the identification number from among a plurality of control signals. | 09-13-2012 |
Hyun Jung Kim, Bucheon-Si KR
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20110177810 | PLMN SELECTION METHOD AND APPARATUS IN PORTABLE TERMINAL - A Public Land Mobile Network (PLMN) selection method in a roaming portable terminal and an apparatus thereof are provided. The PLMN selection method includes, determining whether a registered PLMN being a finally registered PLMN is valid when a PLMN selection event occurs, determining whether there is a stored Active PLMN list when the registered PLMN is invalid, selecting a PLMN using the active PLMN list when there is the stored Active PLMN list, and camping on a specific cell of the selected PLMN. Since the portable terminal does not attempt to register in an HPLMN when a PLMN selection event occurs, the portable terminal can be rapidly and efficiently registered in a suitable PLMN | 07-21-2011 |
Hyunmin Kim, Bucheon-Si KR
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20130163291 | SWITCH CIRCUIT, POWER SUPPLY DEVICE INCLUDING THE SAME, AND DRIVING METHOD THEREOF - The present invention relates to a switch circuit, a power supply including the same, and a method for driving the power supply. When a load of the power supply represents an overload state, a sense resistor for controlling a drain current flowing through a power switch is controlled. In this instance, the sense resistor is controlled according to an on-time of the power switch. | 06-27-2013 |
Hyun Ok Kim, Bucheon-Si KR
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20100214244 | ELECTRONIC DEVICE AND METHOD FOR CONTROLLING ELECTRONIC DEVICE - An electronic device includes an infrared temperature sensor and can detect a user's finger arranged within a detection distance even though the user's finger does not contact the electronic device. Movement of the user's finger is also detected. A pointer positioned and moving according to the position and movement of the user's finger is displayed on a screen of the portable electronic device, and a predetermined function corresponding to the movement of the finger may be performed. A method for controlling the electronic device includes detecting that a user's finger is positioned within a detection distance of an infrared temperature sensor, and displaying a pointer corresponding to a position of the user's finger on a display screen. The method also may include moving the pointer or performing a function corresponding to the movement direction of the pointer. | 08-26-2010 |
Hyun-Seung Kim, Bucheon-Si KR
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20120142159 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - Methods for fabricating a semiconductor device are provided wherein, in an embodiment, the method includes the steps of forming a gate electrode on a semiconductor substrate, forming a trench by recessing the semiconductor substrate in the vicinity of the gate electrode, doping an anti-diffusion ion into a portion of the semiconductor substrate in the trench, and growing an impurity-doped epitaxial layer on the semiconductor substrate doped with the anti-diffusion ion. | 06-07-2012 |
20120299154 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEBICE - A semiconductor device having an improved negative bias temperature instability lifetime characteristic is manufactured by forming a first insulating layer on a substrate, performing a first nitridation on the first insulating layer to form a second insulating layer, and sequentially performing a first and second anneal on the second insulating layer to form a third insulating layer, wherein the second anneal is performed at a higher temperature and with a different gas than the first anneal. A second nitridation is performed on the third insulating layer to form a fourth insulating layer, and a sequential third and fourth anneal on the fourth insulating layer forms a fifth insulating layer. The third anneal is performed at a higher temperature than the first anneal, and the fourth anneal is performed at a higher temperature than the second anneal and with a different gas than the third anneal. | 11-29-2012 |
Hyun-Tae Kim, Bucheon-Si KR
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20100163980 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes an isolation layer formed on and/or over a semiconductor substrate to define an isolation layer, a drift area formed in an active area separated by the isolation layer, a pad nitride layer pattern formed in a form of a plate on the drift area, and a gate electrode having step difference between lateral sides thereof due to the pad nitride layer pattern. | 07-01-2010 |
Jae Bang Kim, Bucheon-Si KR
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20100223738 | WATER CIRCULATION APPARATUS AND METHOD FOR DRUM WASHING MACHINE - A water circulation apparatus and method of a drum washing machine is disclosed. The water circulation apparatus includes a tub, a drain hose connected to the tub, a muddiness detecting sensor detecting a degree of muddiness of wash water being discharged through the drain hose after being used for rinsing laundry, a drain pump located in the drain hose to pump the wash water being discharged through the drain hose, a circulation hose connected to the drain hose at a discharge side of the drain pump to supply the wash water into a drum, a supply valve located at a connecting portion between the drain hose and the circulation hose to selectively supply the wash water pumped by the drain pump to the drain hose of a drain port side or to the circulation hose, and a controller controlling operations of the drain pump and the supply valve. | 09-09-2010 |
Jae Gap Kim, Bucheon-Si KR
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20140205691 | MEDICAL COMPOSITION CONTAINING STAUNTONIA HEXAPHYLLA EXTRACT - Disclosed is an antipyretic drug comprising a | 07-24-2014 |
Jae Man Kim, Bucheon-Si KR
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20130347007 | METHOD FOR EVENT PROCESSING USING HIERARCHICAL STRUCTURES AND EVENT PROCESSING SYSTEM THEREOF - Provided is a method for event processing and a system for using the same. The system for event processing in a computer may include an interface to detect an input associated with an event, an event definition engine which defines the event using a plurality of event components and a corresponding event component wrapper wrapping each of the plurality of event components, an event processing engine which processes the event, and an event action module to generate an output based on the event. The event definition engine may determine a hierarchical relationship between the plurality of event components and assigns the hierarchical relationship in the corresponding event component wrapper. Moreover, the event processing engine may execute each of the event components according to the hierarchical relationship assigned in the event component wrapper. | 12-26-2013 |
Jang-Il Kim, Bucheon-Si KR
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20130194536 | LIQUID CRYSTAL DISPLAY - A liquid crystal display is provided. A liquid crystal display includes: a first substrate; a thin film transistor disposed on the first substrate; and a first electrode disposed on the thin film transistor and connected to an output terminal of the thin film transistor, wherein the first electrode includes a first region and a second region each including a plurality of minute branches separated from each other by open parts, portions of at least two minute branches among the plurality of minute branches are connected to form a plurality of minute plate branches, and wherein the minute plate branch has a wider width than a minute branch. | 08-01-2013 |
20140120795 | METHOD OF MANUFACTURING LIQUID CRYSTAL DISPLAY - A method of manufacturing a liquid crystal display includes: preparing a lower mother substrate, where lower cells, each including a thin film transistor, are provided on the lower mother substrate, and a lower alignment layer is disposed on the lower cells; preparing an upper mother substrate, where upper cells corresponding to the lower cells are provided on the upper mother substrate, and an upper alignment layer is disposed on the upper cells; providing a mother substrate assembly by providing a liquid crystal mixture layer between the lower and upper mother substrates and combining the lower and upper mother substrates; providing a pretilt of the liquid crystals by applying a voltage to a voltage application unit of the lower mother substrate; and curing an alignment supporting agents in the liquid crystal mixture layer or the lower and upper alignment layers by irradiating light to a side of the mother substrate assembly. | 05-01-2014 |
20140176838 | DISPLAY DEVICE - A display device comprising a display area and non-display area is provided. The display device includes a first substrate, a second substrate, a liquid crystal layer, and a connection part. The first substrate includes a first base substrate, a wiring part formed on the first base substrate, and a pixel electrode connected to a portion of the wiring part, the pixel electrode disposed in the display area. The second substrate includes a second base substrate, and a common electrode formed on the second base substrate. The liquid crystal layer is disposed between the first base substrate and the second base substrate. The connection part is formed between the first base substrate and the second base substrate connecting the common electrode and the portion of the wiring part, wherein the common electrode comprises an electric field control pattern formed in the non-display area between the connection part and the display area. | 06-26-2014 |
Ji Hee Kim, Bucheon-Si KR
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20100172996 | Chain-End Functionalized Methoxy Poly(Ethylene Glycol) and Metal Nano-Particles Using the Same - Disclosed is a chain-end functionalized methoxy poly(ethylene glycol) (mPEG), a process of preparing the same, a living methoxy poly(ethylene glycol) for preparing the functionalized methoxy poly(ethylene glycol), a nano-particles of transition metal or metal salt encapsulated in the micelle structure formed by the chain-end functionalized methoxy poly(ethylene glycol), and a method for preparing the nano-particles of transition metal or metal salt. | 07-08-2010 |
20120183706 | CELL PACKAGING MATERIAL AND METHOD FOR MANUFACTURING SAME - Cell packaging according to one embodiment of the present invention comprises: a base film layer; and a print layer provided beneath or on the base film layer, and including a binder resin and carbon black. The base film layer or print layer of the cell packaging is partially removed by means of laser irradiation to expose the layer under same. Therefore, according to the cell packaging of the invention, a wide range of shapes or logos, etc. can easily be externally displayed so as to be discernible by means of laser irradiation. By thus imparting discernibility and externality to the cell packaging, a labeling process for attaching a separate label to the cell packaging can be excluded. | 07-19-2012 |
Ji Hwang Kim, Bucheon-Si KR
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20120228780 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor device including a through via plug and a method of manufacturing the same. In the semiconductor device, since a redistributed interconnection pattern is disposed on a protection film of a convex-concave structure having a protrusion and a recessed portion, the semiconductor device may have improved reliability while preventing a leakage current. In the method of manufacturing the semiconductor device, since an end surface of through via structure is exposed by removing a protection film and an insulating film liner using a selective etching process, damage to the through via structure is minimized, thereby preventing copper contamination in a substrate. | 09-13-2012 |
20140038353 | SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING THE SAME - A method of manufacturing a semiconductor package includes preparing a parent substrate including package board parts laterally spaced apart from each other, mounting a first chip including a through-via electrode on each of the package board parts, forming a first mold layer on the parent substrate having the first chips, planarizing the first mold layer to expose back sides of the first chips, etching the exposed back sides of the first chips to expose back sides of the through-via electrodes, forming a passivation layer on the planarized first mold layer, the etched back sides of the first chips, and the back sides of the through-via electrodes, and selectively removing the passivation layer to expose the back sides of the through-via electrodes. | 02-06-2014 |
20140141569 | SEMICONDUCTOR DEVICES HAVING THROUGH-VIA AND METHODS OF FABRICATING THE SAME - In a method of fabricating a semiconductor device, a first sacrificial through-via is formed to fill a first via-hole extending from a first surface of a first substrate toward a second surface of the first substrate opposite the first surface. The first surface of the first substrate is bonded to a carrier. The first sacrificial through-via is exposed, and the first sacrificial through-via is selectively removed. After selectively removing the first sacrificial through-via, a conductive through-via is formed to fill the first via-hole. | 05-22-2014 |
20140148007 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate having a first side and a second side such that the first and second sides face each other, a through via plug penetrating the substrate, an insulating film liner, and an antipollution film. The insulating film liner is between the through via plug and the substrate and the insulating film liner has a recessed surface with respect to the second side. The antipollution film covers the second side and the antipollution film is on the recessed surface and between the through via plug and the substrate. | 05-29-2014 |
20140213017 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of semiconductor chips. The method further includes forming gaps between adjacent ones of the chips. The gaps may be formed using one or more chemicals or light which act to remove portions of the semiconductor substrate to expose the carrier fixing layer. Additional portions of the carrier fixing layer are then removed to allow for removal of the chips from the carrier. | 07-31-2014 |
20140291854 | SEMICONDUCTOR PACKAGES HAVING TSV AND ADHESIVE LAYER - A semiconductor package includes a first semiconductor chip on a substrate and having a plurality of through-silicon vias (TSVs). A second semiconductor chip having an active layer is on the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the active layer. Connection terminals extend through the adhesive layer and are connected to the TSVs and the active layer. Side surfaces of the adhesive layer are aligned with side surfaces of the second semiconductor chip. | 10-02-2014 |
Jin Ha Kim, Bucheon-Si KR
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20120244580 | IMMOBILIZATION OF PSICOSE-EPIMERASE AND A METHOD OF PRODUCING D-PSICOSE USING THE SAME - The present invention relates to a method of successively producing D-psicose from D-fructose or D-glucose by using a psicose-epimerase derived from | 09-27-2012 |
20140199732 | D-PSICOSE 3-EPIMERASE MUTANT WITH IMPROVED THERMAL STABILITY, AND CONTINUOUS PRODUCTION OF D-PSICOSE USING SAME - The present invention relates to a D-psicose 3-epimerase variant with improved thermostability by substituting an amino acid at a specific position of an amino acid sequence of a wild type D-psicose 3-epimerase. Further, the present invention provides a recombinant expression vector including a gene of the D-psicose 3-epimerase variant, and a recombinant strain transformed with the recombinant expression vector. Furthermore, the present invention provides an immobilized reactor prepared using the D-psicose 3-epimerase variant or the recombinant strain, and a method of continuously producing D-psicose using the immobilized reactor. | 07-17-2014 |
20140302564 | METHOD FOR STERILIZING MICROBIAL CELLS USING POLYETHYLENE GLYCOL-BASED NONIONIC SURFACTANT - A method for sterilizing microbial cells is provided. According to the method, microbial cells or a culture containing microbial cells are treated with a polyethylene glycol-based nonionic surfactant so that almost all of the microbial cells are sterilized while the enzyme activity expressed in the microbial cells is maintained at a high level. A method for sterilizing microbial cells and a material containing the sterilized microbial cells, in which the microbial cells are sterilized using a polyethylene glycol-based nonionic surfactant, can be used for foods so that the microbial cells are sterilized to be used in food production. Further, a material containing sterilized microbial cells can be used in processes for preparing tagatose, in which | 10-09-2014 |
Jinju Kim, Bucheon-Si KR
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20110300844 | METHOD FOR RESTRICTING COMMUNICATING SERVICE IN ROAMING IN MULTI MODE TERMINAL AND APPARATUS THEREFOR - A method for performing roaming in a dual mode terminal, which includes a first wireless communication module corresponding to a first communication network and a second wireless communication module corresponding to a second communication network, is disclosed. The method comprises acquiring a public land mobile network (PLMN) identifier by camping on the first communication network; determining whether connection to the first communication network is roaming by comparing roaming decision information included in the PLMN identifier with roaming decision information stored in the dual mode terminal; turning off the second wireless communication module if it is determined that connection to the first communication network is roaming; and transmitting and receiving a signal to and from the first communication network. | 12-08-2011 |
Jin Woo Kim, Bucheon-Si KR
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20100203605 | METHOD AND APPARATUS FOR FRACTIONATING LIGNOCELLULOSE-BASED BIOMASS - A method and apparatus for fractionating a lignocellulose-based biomass are provided. The method includes providing a lignocellulose-based biomass, extracting lignin from the biomass by adding a first solvent capable of dissolving the lignin, extracting xylose by adding a second solvent capable of dissolving hemicellulose to the biomass treated with the first solvent, and extracting the cellulose remaining in the biomass. In this method, a continuous process can be performed instead of a low efficiency batch-type process and components of the biomass can be obtained at high yield. | 08-12-2010 |
20100209976 | METHOD OF PRE-TREATING AND SACCHARIFYING ALGAE BIOMASS - Disclosed is a method of pre-treating and saccharifying an algae biomass, by dehydrating the algae biomass to have a water content of about 10% to about 70% by weight, cutting the algae biomass having a water content of about 10% to about 70% by weight to a predetermined size, and saccharifying the cut algae biomass using a hydrolysis catalyst and/or a hydrolase to yield a monosaccharide. | 08-19-2010 |
20100279372 | METHOD OF PRETREATING LIGNOCELLULOSE-BASED BIOMASS - Disclosed is a method of pretreating lignocellulose-based biomass by extracting lignin from biomass by adding a solvent for dissolving lignin to the lignocellulose-based biomass including lignin, hemicellulose and cellulose, and extracting the cellulose and/or hemicellulose by adding an ionic liquid to the remaining biomass after extracting the lignin. | 11-04-2010 |
Jong-Chen Kim, Bucheon-Si KR
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20140168991 | LED LAMP - Provided is an LED lamp in which a lens for diffusing light from an LED can be received in and fixed to a reflector without interfering with the outer side of the lens. The LED lamp of the present invention includes a lamp unit configured to emit light; a lamp housing unit configured to have the lamp unit embedded in the lamp housing unit and to have the front opened so that the light of the lamp unit is scanned to the front; a front cover unit fixed in front of the lamp housing unit and configured to have the inside hollowed; and glass fixed in front of the lamp housing unit by means of the front cover unit and configured to transmit the light of the lamp unit. | 06-19-2014 |
20140204595 | LED LAMP HAVING ADJUSTABLE ILLUMINATION ANGLE - An LED lamp includes: a lamp housing configured to have LEDs for emitting light embedded therein, have the front thereof opened so that the light of the LEDs is radiated, have an angle adjustment groove formed laterally and lengthily, and having outside concave-convex parts formed in a convex and arc shape on both sides of the angle adjustment groove; a guide block inserted into the angle adjustment groove of the lamp housing and fixed movably along the angle adjustment groove; a fixing block configured to have an inside concavo-convex part formed in a concave and arc shape under one side of the fixing block so that the inside concavo-convex part corresponds to the outside concave-convex parts of the lamp housing; a first fastening member configured to penetrate the inside concavo-convex part of the fixing block and fastened to the guide block inserted into the angle adjustment groove. | 07-24-2014 |
Jong Wan Kim, Bucheon-Si KR
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20100316235 | BONE CONDUCTION SPEAKER WITH VIBRATION PREVENTION FUNCTION - A bone conduction speaker having a vibration prevention structure is disclosed. In the speaker structure that a magnet and a voice coil are installed in the interior of a housing disposed in an inner side of an external casing of a bone conduction speaker and are engaged with a yoke, and a diaphragm is installed in an outer side of the yoke, there is provided a bone conduction speaker having a vibration prevention structure which comprises one or at least two ribs which are formed as an outer side of the diaphragm is outwardly extended; and an engaging part which is disposed in an end of each rib and is fixedly assembled to the casing. | 12-16-2010 |
Juhan Kim, Bucheon-Si KR
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20130162570 | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFATURING THE SAME - Disclosed is an LCD device which realizes decreased thickness, simplified process, and decreased cost by using a common electrode for formation of electric field to drive liquid crystal as a sensing electrode, and removing a touch screen from an upper surface of the liquid crystal panel, the LCD device comprising gate and data lines crossing each other to define plural pixels on a lower substrate; a pixel electrode in each of the plural pixels; plural common electrode blocks patterned at the different layer from the pixel electrode, wherein the common electrode blocks, together with the pixel electrode, forms an electric field, and senses a user's touch; and plural sensing lines electrically connected with the common electrode blocks, wherein, if the sensing line is electrically connected with one of the common electrode blocks, the sensing line is insulated from the remaining common electrode blocks. | 06-27-2013 |
20130328812 | TOUCH SENSOR INTEGRATED TYPE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device includes a plurality of first electrodes arranged on a substrate in parallel in a first direction; a plurality of second electrodes arranged in parallel in the first direction and a second direction crossing the first direction without contacting with the plurality of first electrodes; a plurality of first connecting wires, each first connecting wire being connected with at least one of the plurality of the first electrodes; and a plurality of second connecting wires, each second connecting wire connecting the second electrodes to each other in the second direction, wherein a touch driving voltage is supplied to the plurality of first connecting wires and a common voltage is supplied to the plurality of second connecting wires so that mutual capacitance is generated between the a plurality of first electrodes and the plurality of second electrodes. | 12-12-2013 |
Jung-Dae Kim, Bucheon-Si KR
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20110158072 | METHOD OF DETECTING APPROXIMATE TOUCH-DOWN, METHOD OF ADJUSTING HEAD FLYING HEIGHT USING THE DETECTED APPROXIMATE TOUCH-DOWN, AND DISK DRIVE - A method and apparatus to control a flying height of a head in a disk drive by detecting a flying state of the head just before it touches down to a disk. The method includes detecting approximate touch-down based on detecting a motion change of a head in a disk track direction by changing a flying height of the head on a rotating disk and determining that the head approaches a touch-down approximated flying height when the detected motion change of the head in the disk track direction exceeds a threshold value. | 06-30-2011 |
Jung-Hwan Kim, Bucheon-Si KR
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20100117181 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern. | 05-13-2010 |
20110133333 | MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE VIAS, CONDUCTIVE CAPS AND VARIABLE THICKNESS INSULATING LAYERS, AND METHODS OF FABRICATING SAME - Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the end surface, the conductive cap including a conductive cap body that extends across the end surface and a flange that extends from the conductive cap body along the conductive via sidewall towards the substrate face. Related fabrication methods are also described. | 06-09-2011 |
20110180892 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor chip having a first surface, a second surface and a pixel area, first adhesion patterns disposed on the first surface, second adhesion patterns disposed between the first adhesion patterns and the pixel area and disposed on the first surface, and external connection terminals disposed on the second surface, wherein the second adhesion patterns and the external connection terminals are disposed to overlap each other. | 07-28-2011 |
20110233755 | Semiconductor Housing Package, Semiconductor Package Structure Including The Semiconductor Housing Package, And Processor-Based System Including The Semiconductor Package Structure - A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected to the housing chip and may be disposed on the mold layer. The housing node may be in contact with the redistribution structures. The semiconductor housing package may be disposed on a semiconductor base package and may constitute a semiconductor package structure along with the semiconductor base package. The semiconductor package structure may be disposed on a processor-based system. | 09-29-2011 |
20120018871 | STACK PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A stack package usable in a three-dimensional (3D) system-in-package (SIP) includes a first semiconductor chip, a second semiconductor chip, and a supporter. The first semiconductor chip includes a through silicon via (TSV), and the second semiconductor chip is stacked on the first semiconductor chip and is electrically connected to the first semiconductor chip through the TSV of the first semiconductor chip. The supporter is attached onto the first semiconductor chip so as to be spaced apart from an edge of the second semiconductor chip. | 01-26-2012 |
20120018885 | SEMICONDUCTOR APPARATUS HAVING THROUGH VIAS - A semiconductor apparatus includes a base substrate and a logic chip disposed on the base substrate. The logic chip includes a memory control circuit, a first through silicon via, and a second through silicon via. The memory control circuit is disposed on a first surface of a substrate of the logic chip, and a memory chip is disposed on a second surface of the substrate of the logic chip. The first through silicon via electrically connects the memory control circuit and the memory chip, the second through silicon via is electrically connected to the memory chip and is configured to transmit power for the memory chip, the second through silicon via is electrically insulated from the logic chip, and the first surface of the substrate of the logic chip faces the base substrate. | 01-26-2012 |
20120074584 | MULTI-LAYER TSV INSULATION AND METHODS OF FABRICATING THE SAME - Provided is a semiconductor device. The semiconductor device may include a substrate and a stacked insulation layer on a sidewall of an opening which penetrates the substrate. The stacked insulation layer can include at least one first insulation layer and at least one second insulation layer whose dielectric constant is different than that of the first insulation layer. One insulation layer may be a polymer and one insulation layer may be a silicon based insulation layer. The insulation layers may be uniform in thickness or may vary as a distance from the substrate changes. | 03-29-2012 |
20120083097 | Methods of Forming a Semiconductor Package Using a Seed Layer and Semiconductor Packages Formed Using the Same - Provided is a method of forming a semiconductor package including providing a substrate having a first side and an opposite second side and providing a wafer having a plurality of semiconductor chips, each of the semiconductor chips having a conductive pad, wherein at least one of the substrate and the wafer includes a seed pattern. The first side of the substrate is bonded to the wafer with the conductive pad positioned adjacent to the first side of the substrate and the seed pattern positioned between the conductive pad and the first side of the substrate. A through hole is then formed penetrating the substrate from the second side of the substrate to expose the seed pattern. A through electrode is formed in the through hole using the seed pattern as a seed. Corresponding devices are also provided. | 04-05-2012 |
20120133041 | Semiconductor Devices Having Electrodes and Methods of Fabricating the Same - Some embodiments provide a semiconductor device including a substrate having a first surface and an opposite second surface. An electrode extends within the substrate towards the first surface and has a protruding portion extending from the first surface. A supporting portion extends from the first surface of the substrate to a sidewall of the protruding portion that supports the protruding portion. Methods of fabricating the same are also provided. | 05-31-2012 |
20120139097 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package may include a circuit substrate, a semiconductor chip mounted on the circuit substrate, a chip package interaction disposed between the circuit substrate and the semiconductor chip, a first molding portion covering part of the semiconductor chip and part of the chip package interaction, a second molding portion formed on the first molding portion, and an adhesion portion adhering the first and second molding portions to each other, the adhesion portion being disposed between the first and second molding portions. | 06-07-2012 |
20120156823 | METHOD OF FORMING SEMICONDUCTOR DEVICE - A method of forming a semiconductor device includes preparing a semiconductor substrate having a plurality of chips formed thereon and a scribe lane disposed between the chips, simultaneously forming a groove having a first depth in the scribe lane, and a through hole penetrating the chips and having a second depth. The chips are separated along the groove. The first depth is smaller than the second depth. | 06-21-2012 |
20120171814 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME - Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer. | 07-05-2012 |
20120193779 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip. The molding material may be on outer side surfaces of the homogeneous integral underfill material above the upper surface of the first chip, wherein, in view of a first cross sectional profile, the molding material is separated from sidewalls of the second chip by the homogeneous integral underfill material such that the molding material does not contact sidewalls of the second chip. | 08-02-2012 |
20120223433 | SEMICONDUCTOR PACKAGE INCLUDING CONNECTING MEMBER HAVING CONTROLLED CONTENT RATIO OF GOLD - A semiconductor package including connecting members having a controlled content ratio of gold capable of increasing durability and reliability by preventing an intermetallic compound having high brittleness from being formed. The semiconductor package includes a base substrate; a first semiconductor chip disposed on the base substrate; and a first connecting member for electrically connecting the base substrate and the first semiconductor chip, and comprising a first bonding portion that includes gold and has a first content ratio of gold that is controlled to prevent an intermetallic compound of AuSn | 09-06-2012 |
20120280405 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACURING THE SAME - Provided are semiconductor devices and methods of manufacturing the same. The semiconductor package includes a substrate, a first semiconductor chip mounted on the circuit substrate and having a first width, a second semiconductor chip overlying the first semiconductor chip and having a second width greater than the first width, and a first under filler disposed between the first and second semiconductor chips, covering a side surface of the first semiconductor chip and having an inclined side surface. | 11-08-2012 |
20120329249 | METHODS OF PROCESSING SUBSTRATES - Methods of manufacturing a plurality of semiconductor chips are provided. The method may include providing a middle layer between a substrate and a carrier to combine the carrier with the substrate, thinning the substrate; after thinning the substrate, separating the carrier from the substrate; and after the carrier is separated from the substrate, cutting the substrate to form the plurality of semiconductor chips, wherein the middle layer is adhered to the carrier with a first bonding force, and the middle layer is adhered to the substrate with a second bonding force, and wherein the second bonding force is greater than the first bonding force. | 12-27-2012 |
20130260551 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - In a semiconductor device, an organic insulation pattern is disposed between first and second rerouting patterns. The organic insulation pattern may absorb the physical stress that occurs when the first and second rerouting patterns expand under heat. Since the organic insulation pattern is disposed between the first and second rerouting patterns, insulating properties can be increased relative to a semiconductor device in which a semiconductor pattern is disposed between rerouting patterns. Also, since a seed layer pattern is disposed between the first and second rerouting patterns and the organic insulation pattern and between the substrate and the organic insulation pattern, the adhesive strength of the first and second rerouting patterns is enhanced. This also reduces any issues with delamination. Also, the seed layer pattern prevents the metal that forms the rerouting pattern from being diffused to the organic insulation pattern. Therefore, a semiconductor device with enhanced reliability may be implemented. | 10-03-2013 |
20130267057 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor chip having a first surface, a second surface and a pixel area, first adhesion patterns disposed on the first surface, second adhesion patterns disposed between the first adhesion patterns and the pixel area and disposed on the first surface, and external connection terminals disposed on the second surface, wherein the second adhesion patterns and the external connection terminals are disposed to overlap each other. | 10-10-2013 |
20140091460 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip. The molding material may be on outer side surfaces of the homogeneous integral underfill material above the upper surface of the first chip, wherein, in view of a first cross sectional profile, the molding material is separated from sidewalls of the second chip by the homogeneous integral underfill material such that the molding material does not contact sidewalls of the second chip. | 04-03-2014 |
20140210075 | METHODS FOR PROCESSING SUBSTRATES - A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer. | 07-31-2014 |
20140213039 | METHODS OF PROCESSING SUBSTRATES - Methods processing substrates are provided. The method may include providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting glue layer and thermosetting release layers provided on opposing sides of the thermosetting glue layer. | 07-31-2014 |
20140300004 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME - Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer. | 10-09-2014 |
Jung Joo Kim, Bucheon-Si KR
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20130001656 | VERTICALLY PINCHED JUNCTION FIELD EFFECT TRANSISTOR - A vertical junction field-effect transistor in a CMOS base-technology. The vertical junction field-effect transistor includes a semiconductor substrate having a source region and a drain region, a main-channel region formed between the source region and the drain region, a well region formed on the main-channel region between the source region and the drain region, vertical pinch-off regions formed at both source and drain ends or only on the source-end of the well region on the main-channel region in the source region and the drain region respectively, a source contact on the vertical pinch-off region in the source region, a drain contact on the vertical pinch-off region in the drain region, a gate contact on the well region between the source contact and the drain contact and shallow trench isolations formed on the well region. | 01-03-2013 |
Jung-Soo Kim, Bucheon-Si KR
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20140041972 | VOLUMETRIC BRAKING DEVICE - A volumetric braking device includes: a brake disk having an outer surface where a plurality of disk vanes are formed with a predetermined spacing therebetween; a cylinder case where the brake disk is arranged, and the internal space of a cylinder is sectioned into a plurality of spaces by the disk vanes; a piston-drive unit, which has a piston roller sliding on the brake disk, and where the compressed pressure resistance generated between the piston roller and any one disk vane and vacuum pressure resistance generated between the piston roller and another disk vane operate as a braking load for the brake disk to perform decelerating and braking operations; a drive motor, which receives an electrical signal from an ECU by a program to operate in a forward or reverse direction; and a drive unit operating module for operating the piston-drive unit by operating the drive motor. | 02-13-2014 |
Keon Ho Kim, Bucheon-Si KR
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20100182311 | Mobile terminal for generating 3-dimensional image - A mobile terminal can generate a 3-dimensional image by using a space code. The mobile terminal includes a light source unit that projects pattern lights to an object; a camera unit that picks-up images of the object exposed to the pattern lights; and a control unit that generates a space code from at least one of images picked up the camera, generates a space code image based on the space code, converts 2-dimensional coordinates of the space code image to 3-dimensional coordinates using a 3-dimensional coordinate equation, and generates a depth image using the 3-dimensional coordinates. | 07-22-2010 |
Ki Ho Kim, Bucheon-Si KR
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20100319878 | MULTILATERAL CONTINUOUS UNIFORM RAPID COOLING DEVICE OF DOUBLE COOLING STRUCTURE - Provided is a multilateral continuous uniform rapid cooling device of a double cooling structure in which drinking water such as a beverage or liquor can be rapidly and uniformly discharged without a limitation of amount immediately at an optimum cooling temperature to drink and can be drunken. The device includes: a cooling external tube in which a pair of cooling water pipes respectively are connected to one side and the other side that is opposite to the one side, of the cooling external tube and a cooling internal tube installed in the cooling external tube; a plurality of refrigerant circulating pipes, which are continuously installed inside and outside the cooling internal tube in a spring shape, extend thereto and have ends connected as a refrigerant circulating path of a cooling cycle through a bottom portion of the cooling internal tube and a bottom portion of the cooling external tube; and a plurality of drinking water pipes, which are adjacent to the refrigerant circulating pipes and are continuously installed inside and outside the cooling internal tube and in which drinking water is flowed in an end of the cooling internal tube, is rapidly cooled and is discharged into an end of the cooling external tube. | 12-23-2010 |
Ki Young Kim, Bucheon-Si KR
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20120153862 | APPARATUS OF DRIVING LIGHT EMITTING DIODE USING ERASABLE PROGRAMMABLE LOGIC DEVICE CHIP - Provided is an apparatus that drives a light emitting device using an erasable programmable logic device (EPLD) chip. The apparatus may include the light emitting device, and a driving unit to use the EPLD chip storing programming information corresponding to the light emitting device, and to drive the light emitting device based on the stored programming information. The EPLD chip may receive the programming information inputted from an external terminal, and may store the programming information in a predetermined storage space. | 06-21-2012 |
20140239816 | LIGHTING CONTROL SYSTEM AND METHOD FOR CONTROLLING THE SAME - Lighting control systems and a method of control the same are provided. For example, the lighting control system includes at least one lighting device transmitting and receiving a wireless communication signal and controlled by a received wireless communication signal, a lighting device authentication code including unique identification information assigned to the lighting device, and a user terminal having an image recognition unit, the user terminal configured to recognize the lighting device authentication code using the image recognition unit, extract the unique identification information from the lighting device authentication code recognized by the image recognition unit, pair the user terminal with the lighting device based on the extracted unique identification information, and control the at least one lighting device. | 08-28-2014 |
20140239852 | LIGHTING CONTROL SYSTEM AND METHOD FOR CONTROLLING THE SAME - A lighting control system and a method for controlling the same are provided. The lighting control system includes at least one lighting device transmitting a wireless communication signal having unique identification information and controlled by a received wireless communication signal, and a user terminal receiving the wireless communication signal transmitted from the at least one lighting device, sorting and registering the at least one lighting device according to a strength of the wireless communication signal transmitted from the at least one lighting device, and pairing the user terminal with the registered lighting device to control the lighting device. Accordingly, a plurality of lighting devices located in a remote area can be conveniently registered and controlled from a certain location. | 08-28-2014 |
Kwon Il Kim, Bucheon-Si KR
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20120273409 | MONOFILAMENT-REINFORCED HOLLOW FIBER MEMBRANE - A hollow fiber membrane is formed by embedding a braid having a spiral open weave of monofilaments only, to avoid a “whiskering” problem common in prior art multifilament braid-supported tubular membranes. The open weave is characterized by contiguous, circumferential, rhomboid-shaped areas of polymer film separated by monofilaments. When the braid is supported on a plasticized PVA cable it can be infiltrated with membrane polymer which, when coagulated embeds the braid positioning it around the lumen. The spiral weave, free of any circumferentially constricting monofilament, when embedded in film, allows the membrane to be biaxially distensible. In other words, the membrane has “give” not only in the axial or longitudinal direction but also in the radial direction. “Give” in the radial direction permits soiled membranes to be backwashed under higher pressure than in a comparable braid which is not radially distensible. | 11-01-2012 |
Kyung Hee Kim, Bucheon-Si KR
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20130254893 | APPARATUS AND METHOD FOR REMOVING MALICIOUS CODE - Disclosed are an apparatus and a method for removing a malicious code. Accordingly, the present invention provides a technology of mixing a cloud computing based network detecting scheme and a conventional malicious code detecting scheme for providing a detection engine to a client terminal according to a situation based on characteristics of the client terminal, helping efficiently cope with a malicious code. | 09-26-2013 |
Kyung Ho Kim, Bucheon-Si KR
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20130093658 | DISPLAY DEVICE - A display device includes gate lines, data lines, first wires and second wires extending in the directions of the gate lines and data lines, and pixels having a first subpixel and a second subpixel each. The first subpixel has a first subpixel electrode and a first switching element, and the second subpixel has a second subpixel electrode and second and third switching elements. The control terminals of the three switching elements are connected to the same gate line, and the input terminals of the first and second switching elements are connected to the same data line. The first and second switching elements have output terminals connected to the first and second subpixel electrodes, respectively. The second switching element's output terminal connects to the third switching element, which has an output terminal connected to a second wire. The first wires and the second wires are connected in a pixel. | 04-18-2013 |
20140028534 | DISPLAY DEVICE - A substantially rectangular display panel includes a first edge extending in a first major axis direction of the rectangular shape and a second edge extending in a second major axis direction of the rectangular shape, the second direction being different from the first direction. The display panel includes: a plurality of gate lines extending in the first direction; and a gate lines driver including a plurality of main stages sequentially connected to each other and configured for outputting gate signals to the gate lines, where the plurality of stages further includes one or more dummy stages arranged in a row along the second edge and not connected to the plurality of gate lines, and where a layout arrangement of a plurality of thin film transistors included in the main stage is different from a corresponding layout arrangement of corresponding thin film transistors included in the at least one dummy stage. | 01-30-2014 |
Kyungsue Kim, Bucheon-Si KR
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20120249045 | MEDIUM VOLTAGE INVERTER SYSTEM - A medium voltage inverter system is disclosed, the system including a coupled reactor magnetically connecting first and second reactors each connected to an output of first and second medium voltage inverters for driving a motor. | 10-04-2012 |
Kyung Sue Kim, Bucheon-Si KR
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20130193890 | MEDIUM VOLTAGE INVERTER CONTROL APPARATUS AND MEDIUM VOLTAGE INVERTER SYSTEM - An exemplary embodiment of the present disclosure includes a medium voltage inverter control apparatus and a medium voltage inverter system using the same. The medium voltage inverter control apparatus determines input voltage information by receiving an input voltage of a medium voltage inverter, compares an output command of the medium voltage inverter with an output of a first PLL unit to output a difference therebetween, and synchronizes the output command of the medium voltage inverter using the difference. | 08-01-2013 |
Min-Seon Kim, Bucheon-Si KR
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20100174935 | IMAGE FORMING APPARATUS AND METHOD OF CONTROLLING POWER CONSUMPTION THEREOF - A method of controlling power consumption of an image forming apparatus includes outputting information regarding power consumption of a plurality of operation units if a power consumption check mode is set, performing power save operation in which at least one operation unit from among the plurality of operation units is turned on and the remaining operation units are turned off if a power save mode is set. Accordingly, on/off of the plurality of operation units may be controlled in the power save mode based on power consumption of each of the operation units. | 07-08-2010 |
Minsuk Kim, Bucheon-Si KR
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20100271079 | POWER SEMICONDUCTOR DEVICE - Disclosed is a power semiconductor device including a bootstrap circuit. The power semiconductor device includes a high voltage unit that provides a high voltage control signal so that a high voltage is output; a low voltage unit that provides a low voltage control signal so that a ground voltage is output, and is spaced apart from the high voltage unit; a charge enable unit that is electrically connected to the low voltage unit and charges a bootstrap capacitor for supplying power to the high voltage unit when the high voltage is output, when the ground voltage is output; and a high voltage cut-off unit that cuts off the high voltage when the high voltage is output so that the high voltage is not applied to the charge enable unit, and includes a first terminal electrically connected to the charge enable unit and a second terminal electrically connected to the high voltage unit. | 10-28-2010 |
20150048449 | High Voltage Semiconductor Device and Method of Forming the Same - A high voltage semiconductor device includes a semiconductor substrate having a first conductivity type and including a low voltage part and a high voltage part, a semiconductor layer having a second conductivity type on the semiconductor substrate, a body region having the first conductivity type on the semiconductor layer, a first buried layer having the second conductivity type between the high voltage part of the semiconductor substrate and the semiconductor layer, and a second buried layer having the first conductivity type and having sidewalls inside sidewalls of the first buried layer and extending deeper into the substrate than the first buried layer. A surface of the body region adjacent the substrate is spaced apart from a surface of the second buried layer remote from the substrate such that a portion of the semiconductor layer is disposed therebetween. | 02-19-2015 |
Min-Suk Kim, Bucheon-Si KR
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20090243696 | HIGH VOLTAGE SEMICONDUCTOR DEVICE HAVING SHIFTERS AND METHOD OF FABRICATING THE SAME - Provided are a high-voltage semiconductor device including a junction termination which electrically isolates a low voltage unit from a high voltage unit, and a method of fabricating the same. The high voltage semiconductor device includes a high voltage unit, a low voltage unit surrounding the high voltage unit, and a junction termination formed between the high voltage unit and the low voltage unit and surrounding the high voltage unit to electrically isolate the high voltage unit from the low voltage unit. The junction termination includes at least one level shifter which level shifts signals from the low voltage unit and supplies the same to the high voltage unit, a first device isolation region surrounding the high voltage unit to electrically isolate the high voltage unit from the level shifter, and a resistor layer electrically connecting neighboring level shifters. | 10-01-2009 |
20100001343 | HIGH VOLTAGE SEMICONDUCTOR DEVICE INCLUDING FIELD SHAPING LAYER AND METHOD OF FABRICATING THE SAME - Provided are a high voltage semiconductor device in which a field shaping layer is formed on the entire surface of a semiconductor substrate and a method of fabricating the same. Specifically, the high voltage semiconductor device includes a first conductivity-type semiconductor substrate. A second conductivity-type semiconductor layer is disposed on a surface of the semiconductor substrate, and a first conductivity-type body region is formed in semiconductor layer. A second conductivity-type source region is formed in the body region. A drain region is formed in the semiconductor layer and is separated from the body region. The field shaping layer is formed on the entire surface of the semiconductor layer facing the semiconductor layer. | 01-07-2010 |
20130196480 | HIGH VOLTAGE SEMICONDUCTOR DEVICE INCLUDING FIELD SHAPING LAYER AND METHOD OF FABRICATING THE SAME - Provided are a high voltage semiconductor device in which a field shaping layer is formed on the entire surface of a semiconductor substrate and a method of fabricating the same. Specifically, the high voltage semiconductor device includes a first conductivity-type semiconductor substrate. A second conductivity-type semiconductor layer is disposed on a surface of the semiconductor substrate, and a first conductivity-type body region is formed in semiconductor layer. A second conductivity-type source region is formed in the body region. A drain region is formed in the semiconductor layer and is separated from the body region. The field shaping layer is formed on the entire surface of the semiconductor layer facing the semiconductor layer. | 08-01-2013 |
20130341718 | POWER SEMICONDUCTOR DEVICE - In one general aspect, a power semiconductor device can include a semiconductor substrate of a first conductivity type, and a semiconductor layer of a second conductivity type disposed on the semiconductor substrate. The semiconductor layer can include a high voltage unit, a low voltage unit disposed around the high voltage unit, and a level shift unit disposed between the high voltage unit and the low voltage unit. The power semiconductor device can include a first isolation region of the first conductivity type disposed between the high voltage unit and the level shift unit, and a second isolation region of the first conductivity type disposed between the low voltage unit and the level shift unit where the first isolation region and the second isolation region each are vertically aligned in the semiconductor layer and each extends to at least the semiconductor substrate. | 12-26-2013 |
Myeong Suk Kim, Bucheon-Si KR
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20140035454 | REFRIGERATOR - Disclosed therein is a refrigerator. The refrigerator includes: a refrigerator main body partitioned into a freezing room and a refrigeration room; a refrigerator door for opening and closing the refrigerator main body; pockets mounted on the inner face of the refrigerator door; and a sealing room provided to the pocket for separately storing articles by stopping a flow of cold air of the refrigerator main body. | 02-06-2014 |
Myoung-Seong Kim, Bucheon-Si KR
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20110163066 | Methods of manufacturing surface light source devices - Provided are methods of manufacturing a surface light source device, the methods include forming a first structure that includes a first substrate and a plurality of glass beads each partially embedded in the first substrate. A second structure is formed that includes a second substrate and an adhesive material layer formed on the second substrate. The first structure and the second structure are adhered to each other in such a way that the glass beads are each partially embedded into the adhesive material layer. | 07-07-2011 |
Nam-Soo Kim, Bucheon-Si KR
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20100163857 | Material for organic photoelectric device, and organic photoelectric device including the same - A material for an organic photoelectric device includes a compound represented by the following Formula 1: | 07-01-2010 |
20100213826 | Material for organic photoelectric device, and organic photoelectric device thereby - A material for an organic photoelectric device, the material including a compound represented by the following Chemical Formula 1: | 08-26-2010 |
20120012830 | MATERIAL FOR ORGANIC PHOTOELECTRIC DEVICE, AND ORGANIC PHOTOELECTRIC DEVICE THEREBY - A material for an organic photoelectric device, the material including a compound represented by the following Chemical Formula 1: | 01-19-2012 |
Sang Jun Kim, Bucheon-Si KR
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20130177047 | REPEATER USING DIGITAL FILTER AND METHOD FOR DIGITAL FILTERING USING THE SAME - A repeater using a digital filter is disclosed. The repeater comprises a MUX filter for filtering an RF signal received through an antenna or a signal to be transmitted through the antenna; a low noise amplifier for lowering noise of the signal filtered by the MUX filter; a down converter for converting the signal outputted from the low noise amplifier into an IF band signal to digitalize the signal; a digital filter for filtering the digital signal outputted form the down converter based on parameters inputted by a user; a filtering controller for controlling the digital filter by using al filtering coefficient calculated based on the parameters; an up converter for converting the signal filtered by the digital filter into an RF band signal; and a high power amplifier for amplifying the signal outputted from the up converter to a high power signal. | 07-11-2013 |
San Hong Kim, Bucheon-Si KR
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20090140339 | ESD Protection Device and Method for Manufacturing the Same - Disclosed is an electro-static discharge protection device. The electro-static discharge protection device can include a second conductive type epitaxial layer on a substrate; a second conductive type well on a first region above the second conductive type epitaxial layer; a first conductive type deep well in the second conductive type epitaxial layer between the second conductive type epitaxial layer and the second conductive type well; a plurality of active regions defined by a plurality of isolation layers above the second conductive type epitaxial layer; and a transistor and an ion implantation region in the active regions. | 06-04-2009 |
20090317949 | ESD Protecting Circuit and Manufacturing Method Thereof - An ESD protecting circuit and a manufacturing method thereof are provided. The ESD protecting circuit includes a device isolation layer, first and second high-concentration impurity regions, a third high-concentration impurity region of a complementary type, first and second conductive wells, and a fourth conductive impurity region. The ESD protecting circuit is configured as a field transistor without a gate electrode, and the high breakdown voltage characteristics of the field transistor are lowered by implanting impurity ions, providing an ESD protecting circuit with a low breakdown voltage and low leakage current. Because the leakage current is reduced, the ESD protecting circuit can be used for an analog I/O device that is sensitive to current fluxes. Also, an N-type well may protect a junction of the field transistor. | 12-24-2009 |
20100084711 | ELECTROSTATIC DISCHARGE PROJECTION SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - An electrical device, including a semiconductor device such an electrostatic discharge protection semiconductor device, and a method for manufacturing the same. An electrostatic discharge protection semiconductor device may include a substrate and a gate in and/or over the substrate. The gate may be multi-layered, and may include a gate oxide layer and a gate electrode. An electrostatic discharge protection semiconductor device may include a source region formed in and/or over a predetermined area of the substrate on a side of the gate, and a plurality of drain regions which may be sequentially multi-layered in and/or over the substrate on an opposing side of the gate in a vertical direction. At least one drain region may be overlapped with the gate in a horizontal direction. | 04-08-2010 |
20100109083 | Semiconductor Device and Method for Manufacturing the Same - Disclosed are a semiconductor device and a method for manufacturing the same. The semiconductor device includes at least two of first and second conductive-type high-voltage transistors and first and second conductive-type low-voltage transistors. The first conductive-type high-voltage transistor include a first conductive-type well in a semiconductor substrate, a device isolation film in the first conductive-type well, a gate pattern on the first conductive-type well, second conductive-type drift regions in the semiconductor substrate at opposite sides of the gate pattern, second conductive-type source and drain regions in the second conductive-type drift region, a pick-up region to receive a bias voltage, and a first latch-up inhibiting region under the pick-up region. Accordingly, it is possible to reduce and prevent latchup without using a double guard ring and to eliminate an additional process to form first and second latch-up inhibiting regions. | 05-06-2010 |
Seokho Kim, Bucheon-Si KR
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20100190333 | METHOD OF FORMING CONNECTION TERMINAL - A method of forming a connection terminal may include preparing a substrate, forming a first conductor of a tube shape having an opened upper portion on the substrate, forming a second conductor on the first conductor, and annealing the second conductor so that a portion of the second conductor extends in an internal space of the first conductor through the opened upper portion. | 07-29-2010 |
20130134603 | Semiconductor Devices Including Protected Barrier Layers - Provided are semiconductor devices and methods of manufacturing the same. the device may include a semiconductor substrate, a first conductive pattern provided in the semiconductor substrate to have a first width at a surface level of the semiconductor substrate, a barrier pattern covering the first conductive pattern and having a second width substantially greater than the first width, a second conductive pattern partially covering the barrier pattern and having a third width substantially smaller than the second width, and an insulating pattern disposed on a sidewall of the second conductive pattern. The second width may be substantially equal to or less than to a sum of the third width and a width of the insulating pattern. | 05-30-2013 |
Seok-Ho Kim, Bucheon-Si KR
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20090230548 | SEMICONDUCTOR PACKAGE AND MULTI-CHIP PACKAGE USING THE SAME - A semiconductor package may have a semiconductor chip that includes a chip pad formed on a substrate including an integrated circuit, and a passivation layer exposing the chip pad, a first redistribution wiring layer that is connected to the chip pad and extends on the semiconductor chip and includes a wire bonding pad to provide wire bonding and a first solder pad to connect the first redistribution wiring layer to a second semiconductor chip, and a second redistribution wiring layer that is connected to the first redistribution wiring layer on the first redistribution wiring layer and includes a second solder pad to connect the second redistribution wiring layer to a third semiconductor chip. | 09-17-2009 |
20100285635 | CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE CHIP STACK PACKAGE - A chip stack package includes a substrate, a plurality of chips, a plurality of adhesive layers and a plug. The substrate has a wiring pattern and a seed layer formed on the wiring pattern. Each of the chips has an electrode pad and a first through-hole that penetrates the electrode pad. The chips are stacked such that the first through-holes are aligned on the seed layer of the substrate. The adhesive layers are interposed between the substrate and one of the chips, as well as between the chips. Each of the adhesive layers has a second through-hole connected to the first through-hole. The plug fills up the first through-holes and the second through-holes and electrically connects the electrode pads to the wiring pattern of the substrate. A cross-sectional area of the plug in the second through-holes may be larger than that of the plug in the first through-holes. | 11-11-2010 |
20110046750 | METHOD FOR CONTROLLING DRIVING OF TEST DEVICE AND ANALYTIC DEVICE FOR PERFORMING THE SAME - A method and apparatus for controlling driving of a test device that analyzes a sample are provided. The method includes identifying a test device, executing a script containing a plurality of operations to be performed to analyze the sample contained in the test device, wherein the script includes a plurality of operation commands, wherein at least one operation command among the plurality of operation commands includes a conditional statement, and wherein at least one operation command among the plurality of operation commands is designated to be executed according to whether the conditional statement is satisfied. | 02-24-2011 |
20110104888 | SEMICONDUCTOR DEVICES HAVING REDISTRIBUTION STRUCTURES AND PACKAGES, AND METHODS OF FORMING THE SAME - Semiconductor devices and methods of forming the same, including forming a chip pad on a chip substrate, forming a passivation layer on the chip pad and the chip substrate, forming a first insulation layer on the passivation layer, forming a recess and a first opening in the first insulation layer, forming a second opening in the passivation layer to correspond to the first opening, forming a redistribution line in a redistribution line area of the recess, the first opening, and the second opening, forming a second insulation layer on the redistribution line and the first insulation layer, and forming an opening in the second insulation to expose a portion of the redistribution line as a redistribution pad. | 05-05-2011 |
20120156788 | BIOLOGICAL MATERIAL TEST DEVICE AND METHOD OF CONTROLLING THE SAME - A test device to automatically close an opening and closing unit when a predetermined amount of time has elapsed in a state that the opening and closing unit is open, and a method of controlling the same. The test device includes an opening and closing unit which opens and closes the test device; a display unit which displays information regarding the test device; and a controller which closes the opening and closing unit when a predetermined amount of time has elapsed while the opening and closing unit is open, and displays on the display unit a time remaining until the predetermined amount of time has elapsed. | 06-21-2012 |
20120167203 | MANAGEMENT SYSTEM OF TEST DEVICE AND MANAGEMENT METHOD THEREOF - Assigning identifiers to a plurality of test devices to manage the test devices, and displaying the assigned identifiers on the test devices to distinguish the test devices. | 06-28-2012 |
Seok-Jun Kim, Bucheon-Si KR
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20110250584 | Method for Screening Cancer Therapeutic Agent Using Galectin-3, GSK-3Betta, and Fascin-1 - Disclosed is a method for screening a novel cancer therapeutic agent. The cancer therapeutic agent exhibits down-regulation of galectin-3 and fascin-1 or interferes with the interaction between galectin-3 and GSK-3β. | 10-13-2011 |
Seong Woon Kim, Bucheon-Si KR
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20120185747 | METHODS OF ENCODING/DECODING FOR ERROR CORRECTION CODE UTILIZING INTERDEPENDENT PORTIONS OF CODEWORDS AND RELATED CIRCUITS - A method of encoding/decoding data for storage in and retrieval from a flash memory device, can be provided by generating a first error correction code on a combination of first user data to be stored in a first logical unit of storage in the flash memory device and padding data that is derived from second user data and an associated second error correction code stored in a second logical unit of storage in the flash memory device that is directly adjacent to the first logical unit of storage. The first user data and the first error correction code can be stored in the first logical unit of storage. | 07-19-2012 |
Sumi Kim, Bucheon-Si KR
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20120174026 | MOBILE TERMINAL AND CONTROLLING METHOD THEREOF - A mobile terminal and controlling method thereof are discussed, which facilitates a terminal to be used in further consideration of user's convenience. The method includes determining a first order and a second order for a plurality of home screens, if a first touch action is detected on a touchscreen, sequentially displaying a plurality of home screens on the touchscreen in the first order, and if a second touch action is detected on the touchscreen, sequentially displaying a plurality of home screens on the touchscreen in the second order. Accordingly, a terminal user is able to arrange a desired object on a desired one of a plurality of home screens more conveniently to suit terminal user's taste. | 07-05-2012 |
Sung-Iyong Kim, Bucheon-Si KR
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20090166797 | HIGH-VOLTAGE INTEGRATED CIRCUIT DEVICE INCLUDING HIGH-VOLTAGE RESISTANT DIODE - Provided is a high-voltage integrated circuit device including a high-voltage resistant diode. The device includes a low-voltage circuit region having a plurality of semiconductor devices, which operate with respect to a ground voltage, a high-voltage circuit region having a plurality of semiconductor devices, which operate with respect to a voltage that varies from the ground voltage to a high voltage, a junction termination and a first isolation region electrically isolating the low-voltage circuit region from the high-voltage circuit region, a high-voltage resistant diode formed between the low-voltage circuit region and the high-voltage circuit region, and a second isolation region surrounding the high-voltage resistant diode and electrically isolating the high-voltage resistant diode from the low-voltage circuit region and the high-voltage circuit region. Therefore, a leakage current of the high-voltage resistant diode can be prevented. | 07-02-2009 |
Ui-Hyun Kim, Bucheon-Si KR
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20130169767 | DISPLAY APPARATUS AND METHOD FOR CONTROLLING THEREOF - A display apparatus and a method for controlling thereof are provided. A display apparatus having a multi-view mode to concurrently provide different contents to different viewers includes a plurality of receivers operable in the multi-view mode to receive a plurality of different contents selected by multiple viewers, a video processor operable in the multi-view mode to process video data of the plurality of different contents received by the plurality of receivers; a video output which receives the video data processed by the video processor to display the plurality of different contents, an audio processor operable in the multi-view mode to process audio data corresponding to the selected contents, received by the receivers, and an audio output which outputs the processed audio data to a plurality of eyeglasses apparatuses for viewing the plurality of different contents, wherein a number of channels associated with the processed audio data output to the eyeglasses apparatus is different from a number of channels associated with the audio data received by the receivers. | 07-04-2013 |
Woo-Joong Kim, Bucheon-Si KR
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20120150834 | CREATION SUPPORTING SYSTEM USING METADATA BASED ON USER AND INFORMATION PROVIDING METHOD THEREOF - Provided is a creation supporting system and method using user-based metadata. According to the creation supporting system and method, metadata collected by a user for video content are stored so as to be provided to a creator. The creation supporting system includes a user terminal configured to receive evaluation data on video content from a user who watched the video content; a utilizer terminal configured to receive a search value from a utilizer desiring a search and request a video content search; and a service providing server configured to receive the evaluation data from the user terminal, construct metadata of video content, and compare the search value received from the utilizer server with the metadata for searching for a corresponding video content. | 06-14-2012 |
Woo Seok Kim, Bucheon-Si KR
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20120137993 | APPARATUS OF COOLING SYSTEM FOR VEHICLE AND CONTROLLING METHOD USING THE SAME - A cooling system of a vehicle may include a high and low temperature radiators that cool a high and low temperature coolants respectively circulating an engine and passing a water cooled intercooler and a low exhaust gas recirculation cooler of a turbo charger, a cooling fan that blows air to the high temperature radiator and the low temperature radiator, a high temperature coolant pump that pumps the high temperature coolant, a low temperature coolant pump that pumps the low temperature coolant, and a control portion that controls the high temperature coolant pump, the low temperature coolant pump, and the cooling fan according to driving conditions of the vehicle and environmental conditions. A controlling method may include detecting driving conditions of the vehicle and environmental conditions, setting an operating target for the cooling system and/or a lubrication system, and determining operating conditions for the cooling system and/or the lubrication system. | 06-07-2012 |
20140123642 | TURBO APPARATUS USING WASTE HEAT RECOVERY SYSTEM FOR VEHICLE - A turbo apparatus using a waste heat recovery system for a vehicle may include a waste heat recovery unit heating a working fluid by using waste heat of the vehicle, and an expander provided in a turbocharger and fluid-connected to the waste heat recovery unit, wherein the expander generates a rotational force by using the working fluid supplied from the waste heat recovery unit thereto and transmits the rotational force to a turbo shaft. | 05-08-2014 |
Yang Hee Kim, Bucheon-Si KR
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20140199732 | D-PSICOSE 3-EPIMERASE MUTANT WITH IMPROVED THERMAL STABILITY, AND CONTINUOUS PRODUCTION OF D-PSICOSE USING SAME - The present invention relates to a D-psicose 3-epimerase variant with improved thermostability by substituting an amino acid at a specific position of an amino acid sequence of a wild type D-psicose 3-epimerase. Further, the present invention provides a recombinant expression vector including a gene of the D-psicose 3-epimerase variant, and a recombinant strain transformed with the recombinant expression vector. Furthermore, the present invention provides an immobilized reactor prepared using the D-psicose 3-epimerase variant or the recombinant strain, and a method of continuously producing D-psicose using the immobilized reactor. | 07-17-2014 |
20140302564 | METHOD FOR STERILIZING MICROBIAL CELLS USING POLYETHYLENE GLYCOL-BASED NONIONIC SURFACTANT - A method for sterilizing microbial cells is provided. According to the method, microbial cells or a culture containing microbial cells are treated with a polyethylene glycol-based nonionic surfactant so that almost all of the microbial cells are sterilized while the enzyme activity expressed in the microbial cells is maintained at a high level. A method for sterilizing microbial cells and a material containing the sterilized microbial cells, in which the microbial cells are sterilized using a polyethylene glycol-based nonionic surfactant, can be used for foods so that the microbial cells are sterilized to be used in food production. Further, a material containing sterilized microbial cells can be used in processes for preparing tagatose, in which | 10-09-2014 |
Yang Seub Kim, Bucheon-Si KR
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20100086291 | CAMERA MODULE AND DRIVING METHOD THEREOF - Provided are a camera module and driving method thereof. The camera module includes first and second lens assemblies, and a power transmission member. The power transmission member includes a screw thread having a variable pitch for a distance between the first and second lens assemblies to be varied as the first and second lens assemblies move in engagement with the screw thread. | 04-08-2010 |
Yeong Geun Kim, Bucheon-Si KR
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20120030304 | DEVICE AND METHOD FOR HUMAN BODY COMMUNICATION NETWORK SYSTEM - Provided are a device and a method for recognizing a multiplex contact pattern in a human body communication network system, which may analyze a multiplex contact pattern of devices connected via a human body communication, may determine one of meaningful contact patterns as a group pattern, and may provide a communication service between devices in the group pattern or execute a related application. | 02-02-2012 |
Yeong-Sik Kim, Bucheon-Si KR
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20120262015 | RESOLVER OF ELECTRIC DRIVING MOTOR FOR VEHICLE - The present invention relates to a resolver of an electric driving motor for vehicle which comprises a rotor, a stator comprising a stator main body which encircles the rotor and teeth which extend from the stator main body to be wound by a coil, a terminal module comprising a terminal end which contacts the coil for an electric connection and a terminal main body which supports the terminal end, and a connector module comprising a connector main body which is detachably coupled to the terminal main body and a lead line which is connected to an outer device and supported by the connector main body and which contacts the terminal end for an electric connection if the connector main body is coupled to the terminal main body, thus simplifying manufacturing process and repairing process and reducing cost. | 10-18-2012 |
20130127451 | VARIABLE RELUCTANCE RESOLVER - The present invention relates to a resolver of an electric driving motor for vehicle which comprises a rotor, a stator comprising a stator main body which encircles the rotor and teeth which extend from the stator main body to be wound by a coil, a terminal module comprising a terminal end which contacts the coil for an electric connection and a terminal main body which supports the terminal end, and a connector module comprising a connector main body which is detachably coupled to the terminal main body and a lead line which is connected to an outer device and supported by the connector main body and which contacts the terminal end for an electric connection if the connector main body is coupled to the terminal main body, thus simplifying manufacturing process and repairing process and reducing cost. | 05-23-2013 |
Youngchae Kim, Bucheon-Si KR
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20130043503 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light emitting device, which includes a light transmissive electrode layer formed using a conductive thin film and an insulating thin film to substitute for a transparent electrode layer, comprises a substrate; a first semiconductor layer formed on the substrate; an active layer formed on the first semiconductor layer; a second semiconductor layer formed on the active layer; a light transmissive electrode layer formed on the second semiconductor layer, the light transmissive electrode layer having a structure in which at least one conductive thin film and at least one insulating thin film are deposited; and a first electrode formed on the light transmissive electrode layer, wherein the light transmissve electrode layer includes at least one contact portion for contacting the at least one conductive thin film with the first electrode. | 02-21-2013 |
Young Joo Kim, Bucheon-Si KR
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20130283721 | STEEL FRAME STRUCTURE USING U-SHAPED COMPOSITE BEAM - A steel frame structure includes brackets connected to columns to allow the columns to be connected to a girder. Each bracket includes a U-shaped plate having a bottom plate, side plates extended upwardly perpendicularly from both ends of the bottom plate, and base plates extended outwardly from the side plates, a vertical plate welded perpendicularly to the center of the bottom plate of the U-shaped plate in such a manner as to be parallel to the side plates, and a horizontal plate welded to the top end of the vertical plate in such a manner as to be parallel to the bottom plate of the U-shaped plate. The girder has a generally U-shaped section. | 10-31-2013 |
Yun-Kyoung Kim, Bucheon-Si KR
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20100316989 | METHOD FOR SCREENING AN INHIBITORY AGENT OF HBV PROLIFERATION BY USING THE INTERACTION BETWEEN HBV CAPSID AND SURFACE PROTEINS BASED ON CELLULAR IMAGING - The present invention relates to a method for screening an inhibitory agent of HBV proliferation by measuring the interaction (binding strength) between capsid protein and surface protein, necessary for the proliferation of HBV, by using cellular imaging, more precisely a method for measuring changes on cellular imaging caused by the interaction between a fusion protein containing PreS domain of HBV surface protein and PH (Pleckstrin homology) domain sequence and a fusion protein containing capsid protein and fluorescence protein (GFP) interacting with the said fusion protein. The method of the present invention detecting the interaction between proteins necessary for HBV proliferation at cellular level can be effectively used for the screening of a novel inhibitory agent of HBV proliferation at cellular level. | 12-16-2010 |