Patent application number | Description | Published |
20080246073 | Nonvolatile Memory Devices Including a Resistor Region - Methods of forming a memory device include forming a device isolation layer in a semiconductor substrate including a cell array region and a resistor region, the device isolation layer extending into the resistor region and defining an active region in the semiconductor substrate. A first conductive layer is formed on the device isolation layer in the resistor region. The semiconductor substrate is exposed in the cell array region. A cell insulation layer is formed on a portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. A second conductive layer is formed on the cell insulation layer in the portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. The second conductive layer is etched to form a cell gate electrode in the cell array region and to concurrently remove the second conductive layer from the resistor region and the first conductive layer is etched in the resistor region to form a resistor. | 10-09-2008 |
20080265308 | METHODS OF FORMING FINFETS AND NONVOLATILE MEMORY DEVICES INCLUDING FINFETS - A FinFET includes a fin that is on a substrate and extends away from the substrate. A device isolation layer is disposed on the substrate on both sides of the fin. An insulating layer is between the fin and the substrate. The insulating layer is directly connected to the device isolation layer and has a different thickness than the device isolation layer. A gate electrode crosses over the fin. A gate insulating layer is between the gate electrode and the fin. Source and drain regions are on the fins and on opposite sides of the gate electrode. Related nonvolatile memory devices that include FinFETs and methods of making FinFETs and nonvolatile memory devices are also disclosed. | 10-30-2008 |
20090001451 | NON-VOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating a semiconductor device includes forming a fin-shaped active region including opposing sidewalls and a surface therebetween protruding from a substrate, forming a gate structure on the surface of the active region, and performing an ion implantation process to form source/drain regions in the active region at opposite sides of the gate structure. The source/drain regions respectively include a first impurity region in the surface of the active region and second impurity regions in the opposing sidewalls of the active region. The first impurity region has a doping concentration that is greater than that of the second impurity regions. Related devices are also discussed. | 01-01-2009 |
20090016112 | Method of Programming a Flash Memory Device - A non-volatile memory device includes an array of flash memory cells therein and a voltage generator. The voltage generator is configured to generate a program voltage (Vpgm), a pass voltage (Vpass), a blocking voltage (Vblock) and a decoupling voltage (Vdcp) during a flash memory programming operation. The blocking voltage is generated at a level that inhibits inadvertent programming of an unselected memory cell(s). This voltage level of the blocking voltage is set so that Vdcp01-15-2009 | |
20090250747 | NON-VOLATILE MEMORY DEVICES HAVING A MULTI-LAYERED CHARGE STORAGE LAYER - A non-volatile memory device includes a substrate having a first region and a second region. A first gate electrode is disposed on the first region. A multi-layered charge storage layer is interposed between the first gate electrode and the substrate, the multi-layered charge storage including a tunnel insulation, a trap insulation, and a blocking insulation layer which are sequentially stacked. A second gate electrode is placed on the substrate of the second region, the second gate electrode including a lower gate and an upper gate connected to a region of an upper surface of the lower gate. A gate insulation layer is interposed between the second gate electrode and the substrate. The first gate electrode and the upper gate of the second gate electrode comprise a same material. | 10-08-2009 |
20090253244 | Nonvolatile Memory Devices Having Gate Structures Doped by Nitrogen and Methods of Fabricating the Same - Nonvolatile memory devices are provided including an integrated circuit substrate and a charge storage pattern on the integrated circuit substrate. The charge storage pattern has a sidewall and a tunnel insulating layer is provided between the charge storage pattern and the integrated circuit substrate. A gate pattern is provided on the charge storage pattern. A blocking insulating layer is provided between the charge storage pattern and the gate pattern. The sidewall of the charge storage pattern includes a first nitrogen doped layer. Related methods of fabricating nonvolatile memory devices are also provided herein. | 10-08-2009 |
20090294837 | Nonvolatile Memory Devices Having a Fin Shaped Active Region - A nonvolatile memory device includes a semiconductor substrate and a device isolation layer on the semiconductor substrate. A fin-shaped active region is formed between portions of the device isolation layer. A sidewall protection layer is formed on the sidewall of the fin-shaped active region where source and drain regions are formed. Thus, it may be possible to reduce the likelihood of an undesirable connection between an interconnection layer connected to the source and drain regions and a lower sidewall of the active region so that charge leakage from the interconnection layer to a substrate can be prevented or reduced. The sidewall protection layer may be formed using the device isolation layer. Alternatively, an insulating layer having an etch selectivity with respect to an interlayer insulating layer may be formed on the device isolation layer so as to cover the sidewall of the active region. | 12-03-2009 |
20100008140 | NONVOLATILE MEMORY DEVICES SUPPORTING MEMORY CELLS HAVING DIFFERENT BIT STORAGE LEVELS AND METHODS OF OPERATING THE SAME - Nonvolatile memory devices include a memory cell array including a first memory cell and an adjacent second memory cell and a data input/output circuit configured to operate the first memory cell as an m-bit cell and to operate the second memory cell as an n-bit cell, wherein m is not equal to n. The first and second memory cells may be adjacent cells connected to same word line or to the same bit line. The memory cell array may include a third memory cell adjacent the first memory cell and the data input/output circuit may be further configured to operate the third memory cell as a k-bit cell. The first and second memory cells may be connected to the same word line and the first and third memory cells may be connected to the same bit line. The data input/output circuit may be configured to operate the first memory cell as a j-bit cell responsive to detecting a number of erase operations for the first memory cell meeting a predetermined criterion, wherein j is less than n. In some embodiments, j may be equal to m. | 01-14-2010 |
20100166075 | METHOD AND APPARATUS FOR CODING VIDEO IMAGE - A method and apparatus for coding a video image is provided, in which a first macro block is coded with intra coding modes, the number of which corresponds to the first macro block, a first intra coding mode having a minimum value and a first minimum value to which the first intra coding mode is applied are acquired, the first minimum value is compared with a threshold that is set for fast coding mode search, and it is determined whether to code a second macro block with intra coding modes, the number of which corresponds to the second macro block, based on the comparison. | 07-01-2010 |
20100314679 | CHARGE TRAPPING NONVOLATILE MEMORY DEVICES WITH A HIGH-K BLOCKING INSULATION LAYER - Provided is a charge trapping nonvolatile memory device. The charge trapping nonvolatile memory device includes: an active pattern and a gate electrode, spaced apart from each other; a charge storage layer between the active pattern and the gate electrode; a tunnel insulation layer between the active pattern and the charge storage layer; and a blocking insulation layer disposed between the charge storage layer and the gate electrode and including a high-k layer with a higher dielectric constant than the tunnel insulation layer and a barrier insulation layer with a higher band gap than the high-k layer. A physical thickness of the high-k layer is less than or identical to that of the barrier insulation layer | 12-16-2010 |
20110079838 | NON-VOLATILE MEMORY DEVICE - A method of fabricating a semiconductor device includes forming a fin-shaped active region including opposing sidewalls and a surface therebetween protruding from a substrate, forming a gate structure on the surface of the active region, and performing an ion implantation process to form source/drain regions in the active region at opposite sides of the gate structure. The source/drain regions respectively include a first impurity region in the surface of the active region and second impurity regions in the opposing sidewalls of the active region. The first impurity region has a doping concentration that is greater than that of the second impurity regions. Related devices are also discussed. | 04-07-2011 |
20110095356 | NONVOLATILE MEMORY DEVICES - Nonvolatile memory devices and methods of making the same are described. A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. Each of the transistors includes a channel region and source/drain regions. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers. | 04-28-2011 |
20110110161 | Method of Programming a Flash Memory Device - A non-volatile memory device includes an array of flash memory cells therein and a voltage generator. The voltage generator is configured to generate a program voltage (Vpgm), a pass voltage (Vpass), a blocking voltage (Vblock) and a decoupling voltage (Vdcp) during a flash memory programming operation. The blocking voltage is generated at a level that inhibits inadvertent programming of an unselected memory cell(s). This voltage level of the blocking voltage is set so that Vdcp05-12-2011 | |
20110111570 | METHODS OF FABRICATING NON-VOLATILE MEMORY DEVICES INCLUDING DOUBLE DIFFUSED JUNCTION REGIONS - A nonvolatile memory device includes a string selection gate and a ground selection gate on a semiconductor substrate, and a plurality of memory cell gates on the substrate between the string selection gate and the ground selection gate. First impurity regions extend into the substrate to a first depth between ones of the plurality of memory cell gates. Second impurity regions extend into the substrate to a second depth that is greater than the first depth between the string selection gate and a first one of the plurality of memory cell gates immediately adjacent thereto, and between the ground selection gate and a last one of the plurality of memory cell gates immediately adjacent thereto. Related fabrication methods are also discussed. | 05-12-2011 |
20110269879 | HIGH-STRENGTH POLYPHENYLENE SULFIDE/POLYETHYLENE TEREPHTHALATE BLEND RESIN COMPOSITION AND METHOD FOR PREPARING THE SAME - The present invention relates to a high-strength inflammable blend resin composition including a polyphenylene sulfide resin and a polyethylene terephthalate resin. More specifically, the resin composition of the present invention includes: a basic blend resin containing 10 to 80 wt. % of a polyphenylene sulfide resin, and 20 to 90 wt. % of a polyethylene terephthalate resin; and 0.1 to 20 parts by weight of a modified polystyrene or a styrene-based elastomer with respect to 100 parts by weight of the basic blend resin. | 11-03-2011 |
20120008423 | SETTING CIRCUIT AND INTEGRATED CIRCUIT INCLUDING THE SAME - A setting circuit includes a selection unit configured to select one of a predefined code and an external code in response to a test signal, and a setting information generation unit configured to generate setting information in response to the code selected by the selection unit. | 01-12-2012 |
20120168852 | NONVOLATILE MEMORY DEVICES - A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers. | 07-05-2012 |
20130152167 | APPARATUS AND METHOD FOR IDENTIFYING WIRELESS NETWORK PROVIDER IN WIRELESS COMMUNICATION SYSTEM - To check security of an Access Point (AP) in a wireless communication system, an operating method of a terminal includes, before completing connection to the AP, receiving a frame that informs the terminal of existence of the AP; extracting security test information from the frame; and testing the security of the AP using the security test information. | 06-13-2013 |