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Anbiarshy N.F. Wu
CHIAYI CITY, TW
1. 20090091032 Bond Pad Design for Fine Pitch Wire Bonding 04-09-20092. 20080277659 Test structure for semiconductor chip - test structure for use in a semiconductor chip 11-13-2008
3. 20080246031 PCM pad design for peeling prevention - semiconductor structure is provided 10-09-2008