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Albert Wu
PALO ALTO, CA US
1. 20090212410 STACK DIE PACKAGES - integrated circuit package includes a substrate comprising a first contact 08-27-20092. 20090017593 METHOD FOR SHALLOW TRENCH ISOLATION - Methods for rounding the bottom corners of a shallow trench isolation structure are described herein 01-15-2009
3. 20080258291 Semiconductor Packaging With Internal Wiring Bus 10-23-2008
4. 20080246015 METHOD TO FORM HIGH EFFICIENCY GST CELL USING A DOUBLE HEATER CUT 10-09-2008