Patent application number | Description | Published |
20080296140 | MOVABLE CONTACT ELEMENT AND SWITCH USING THE SAME - A movable contact element includes a cover sheet to which a movable contact having a dome shape is bonded and which is stacked on a top surface of a pressure sensitive conductive sheet. The movable contact element is bonded to a top surface of a substrate having a fixed contact formed thereon, thereby forming a switch. Through the construction, it is possible to obtain the movable contact element, which has a simple construction and can perform various operations, and the switch using the same. | 12-04-2008 |
20100301925 | PRESSURE SENSITIVE SWITCH AND INPUT DEVICE USING PRESSURE SENSITIVE SWITCH - There is provided a pressure sensitive switch including: a cover; a slide portion that is stored in the cover and is slidable by being pressed in a horizontal direction; a pressing unit including a pressure portion that has an inner side face brought into contact with the slide portion and can be moved by being pressed by the slide potion; a sheet resistive body that has an upper face brought into contact with the pressing unit; and a conductive plate that is disposed on the lower side of the sheet resistive body with a predetermined gap arranged therebetween. The slide portion is slidable within a horizontal plane, and the pressing portion presses the sheet resistive body by sliding the slide portion, and a resistance value between the sheet resistive body and the conductive plate changes in accordance with a change in a slide operation force for sliding the slide portion. | 12-02-2010 |
20110102060 | RESISTIVE SHEET, PRESSURE-SENSITIVE SWITCH, AND INPUT DEVICE - A resistive sheet includes a flexible cover sheet, a wiring part provided on the bottom face of the cover sheet, and ring, circular-arc, or spiral resistive layer connected to the wiring part. This resistive layer has uneven bottom face. The resistive sheet also includes a spacer layer whose bottom face is disposed at a position lower than the resistive layer. The wiring part is sandwiched between the bottom face of the cover sheet and the spacer layer. | 05-05-2011 |
20120133586 | INPUT DEVICE - An input device comprises a rotatable magnet member, a lower casing and an upper casing. The rotatable magnet member has a magnet, a spherical part and a rod-like shaft. The magnet is formed into a ring-shaped disc with a through hole in the center, and magnetized with N and S poles alternately along the circumferential direction. The rod-like shaft having a flange portion near a first end is inserted in the through hole, and both ends protrude from the through hole. The lower casing rotatably supports the rod-like shaft of the rotatable magnet member. There is a space provided between an outer peripheral surface of a part of the rod-like shaft inside the through hole and an inner wall of the through hole over the entire peripheries, and the flange portion is press-fitted and fixed to the spherical part. | 05-31-2012 |
Patent application number | Description | Published |
20090008776 | Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method - In an electronic component mounted body, an electrode of a first electronic component and an electrode of a second electronic component are electrically connected by a solder connecter, and the solder connecter contains solder and insulation filler. Alternatively, a solder bump is formed on the electrode of the electronic component, and the solder bump includes the insulation filler. | 01-08-2009 |
20090078746 | BUMP FORMING METHOD AND BUMP FORMING APPARATUS - A method for forming bumps | 03-26-2009 |
20090102064 | CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME - A connection structure (package | 04-23-2009 |
20090200522 | CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES USING THE SAME, AND ELECTRIC CONNECTION METHOD BETWEEN ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE USING THE SAME - The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided. | 08-13-2009 |
20090315649 | DIFFERENTIAL TRANSMISSION LINE INCLUDING TWO TRANSMISSION LINES PARALLEL TO EACH OTHER - In a differential transmission line, a substrate has first and second surfaces parallel to each other, and a first grounding conductor is formed on the second surface of the substrate. A dielectric layer is formed on the first grounding conductor, and a second grounding conductor is formed on the dielectric layer. First and the second signal conductors are formed to be parallel to each other on the first surface of the substrate. The first signal conductor and the first and second grounding conductors constitutes a first transmission line, and the second signal conductor and the first and second grounding conductors constitutes a second transmission line. A slot is formed in the first grounding conductor to sterically intersect with the first and second signal conductors and to be orthogonal to a longitudinal direction thereof, and a connecting conductor is formed for connecting the first grounding conductor with the second grounding conductor. | 12-24-2009 |
20100001411 | METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY, AND MUTUAL CONNECTION STRUCTURE BETWEEN SUBSTRATES - A resin containing conductive particles and a gas bubble generating agent is supplied between a first substrate and a second substrate, and then the resin is heated to generate gas bubbles from the gas bubble generating agent contained in the resin so that the resin is self-assembled between electrodes. Then, the resin is further heated to melt the conductive particles contained in the resin, thereby forming connectors between electrodes. A partition member sealing the gap between the substrates is provided near a peripheral portion of the resin, and gas bubbles in the resin are discharged to the outside through the peripheral portion of the resin where the partition member is absent. | 01-07-2010 |
20100007033 | METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCTURE, AND CONNECTION STRUCTURE BETWEEN SUBSTRATES - A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates. | 01-14-2010 |
20110204366 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY - A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided. | 08-25-2011 |
20110204367 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE DISPLAY - A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided. | 08-25-2011 |
20140124777 | BUILT-UP SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE - A method for manufacturing a build-up substrate, the build-up substrate comprising an insulating layer and a wiring pattern layer stacked over a circuit substrate, said method comprising the steps of: (i) applying a photoactive metal oxide precursor material to one or both sides of the circuit substrate with a wiring pattern, and drying the applied photoactive metal oxide precursor material to form an insulating film; (ii) forming an opening for a via hole in the insulating film by exposure and development of the insulating film; (iii) applying a heat treatment to the insulating film to convert the insulating film into a metal oxide film, thereby forming a build-up insulating layer of the metal oxide film; and (iv) plating the build-up insulating layer to form via holes in the openings, forming a metal layer on the build-up insulating layer, and etching the metal layer to form a build-up wiring pattern; and (v) repeating the steps from (i) to (iv) at least one time. | 05-08-2014 |
20140131076 | CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE COMPOSITE - In the present invention, a ceramic substrate composite comprising, on a ceramic substrate, a conductor pattern composite and an insulating layer is provided. The ceramic substrate composite of the present invention is characterized in that the conductor pattern composite and the insulating layer are provided on the ceramic substrate with each other so that the insulating layer overlaps a part of the conductor pattern composite; and wherein the conductor pattern composite is composed of a conductor portion and an insulating portion that exists locally in the conductor portion, the insulating portion being an insulating material that constitutes the insulating layer. | 05-15-2014 |
20150076545 | ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING SAME - There is provided a method for manufacturing an electronic component package. The method includes the steps: (i) disposing a metal pattern layer on an adhesive carrier; (ii) placing at least one kind of electronic component on the adhesive carrier, the placed electronic component being not overlapped with respect to the metal pattern layer; (iii) forming a sealing resin layer on the adhesive carrier, and thereby producing a precursor of the electronic component package; (iv) peeling off the adhesive carrier of the precursor, whereby the metal pattern layer and an electrode of the electronic component are exposed at the surface of the sealing resin layer; and (v) forming a metal plating layer such that the metal plating layer is in contact with the exposed surface of the metal pattern layer and the exposed surface of the electrode of the electronic component. | 03-19-2015 |
20150084080 | LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME - There is provided a light-emitting device comprising a light-emitting element and a substrate for light-emitting element. The light-emitting element is in a mounted state on a mounting surface of the substrate, the mounting surface being one of two opposed main surfaces of the substrate. The substrate is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer. The mounted light-emitting element is in an overlapping relation with the voltage-dependent resistive layer. A reflective layer is provided on at least one of the substrate and the voltage-dependent resistive layer such that the reflective layer is located adjacent to the first electrode which is in contact with a substrate exposure surface of the voltage-dependent resistive layer. | 03-26-2015 |
20150155251 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME - There is provided a semiconductor device. The semiconductor device of the present invention includes a semiconductor element and a metal buffer layer in an electrical connection to the semiconductor element. The metal buffer layer and the semiconductor element are in a connection with each other by mutual surface contact of the metal buffer layer and the semiconductor element. The metal buffer layer is an external connection terminal used for a mounting with respect to a secondary mount substrate, and the metal buffer layer serves as a buffer part having a stress-relaxation effect between the semiconductor element and the secondary mount substrate. | 06-04-2015 |
20150214129 | ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME - There is provided a method for manufacturing an electronic component package, wherein a package precursor is provided, in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed at a surface of the sealing resin layer. In the manufacturing method of the present invention, a combination of a formation process of a plurality of metal plating layers and a patterning process of the metal plating layers is provided to form a step-like metal plating layer, the formation process being performed by sequential dry and wet plating processes with respect to the package precursor, the patterning process being performed by a patterning of at least two of the metal plating layers. | 07-30-2015 |
20150221842 | ELECTRONIC COMPONENT PACKAGE AND METHOD FOR PRODUCING SAME - There is provided a method for manufacturing an electronic component package. The method includes (i) providing a package precursor in which an electronic component is embedded such that an electrode of the electronic component is exposed at a surface of a sealing resin layer; (ii) forming a first metal plating layer such that the first metal plating layer is in contact with the exposed surface of the electrode of the electronic component; (iii) disposing a metal foil in face-to-face spaced relationship with respect to the first metal plating layer; and (iv) forming a second metal plating layer, wherein in the step (iv), the second metal plating layer is formed to fill a clearance between the first metal plating layer and the metal foil with the second metal plating layer, and thereby integrating the metal foil, the first metal plating layer and the second metal plating layer with each other. | 08-06-2015 |
20150228619 | ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME - There is provided a method for manufacturing an electronic component package, wherein a first electronic component and a second electronic component are placed on a carrier, and a sealing resin layer is formed on the carrier, followed by the carrier being peeled away to be removed, and thereby providing a package precursor in which the first and second electronic components are embedded such that an electrode of at least one of the first and second electronic components is exposed at a surface of the sealing resin layer. Upon the placing of the first and second electronic components, the first and second electronic components are positioned such that their height levels differ from each other. After the removal of the carrier, a metal plating layer is formed such that the metal plating layer is in contact with the exposed surface of the electrode of the at least one of the first and second electronic components. | 08-13-2015 |
20150236233 | ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing an electronic component package comprises: (i) preparing a metal foil having opposed principal surface “A” for placement of an electronic component and principal surface “B”, and a through-hole located in an electronic component-placement region of the principal surface “A”; (ii) placing the electronic component on the metal foil such that the electronic component is positioned in the electronic component-placement region, and an opening of the through-hole is capped with an electrode of the electronic component; (iii) forming a sealing resin layer on the principal surface “A” such that the electronic component is covered with the sealing resin layer; and (iv) forming a metal plating layer on the principal surface “B”. A dry plating process and a subsequent wet plating process are performed to form the metal plating layer in the (iv) such that the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated with each other. | 08-20-2015 |
20150280093 | LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, AND BODY HAVING LIGHT EMITTING DEVICE MOUNTED THEREON - There is provided a light-emitting device comprising a light-emitting element, an element electrode, an extending-wiring electrode and a support. In the light-emitting device of the present invention, the light-emitting element is supported and secured by the support in such a form that a principal surface of the support and an active surface of the light-emitting element are approximately flush with each other. Further, the extending-wiring electrode is in a surface contact with the element electrode such that the extending-wiring electrode extends beyond a periphery of the light-emitting element to the principal surface of the support, wholly covering the active surface of the light-emitting element. | 10-01-2015 |
Patent application number | Description | Published |
20090163632 | CYCLOOLEFIN COPOLYMER - A novel cycloolefin copolymer that can be employed in the production of molding with fewer defects, for example, fewer gel particles (fish eyes). There is provided a cycloolefin copolymer comprising 80 to 20 mol % of repeating units derived from an α-olefin monomer and 20 to 80 mol % of repeating units derived from at least one cycloolefin monomer selected from the group consisting of monomer of the general formula (I), monomer of the general formula (II), monomer of the general formula (III), monomer of the general formula (IV) and monomer of the general formula (V), wherein with respect to the repeating units derived from cycloolefin monomer, the proportion thereof being present in the form of dimer (Rd) is 50 mol % or below and the proportion thereof being present in the form of trimer (Rt) 5 mol % or above. | 06-25-2009 |
20130167928 | SOLAR CELL SEALING SHEET AND FLEXIBLE SOLAR CELL MODULE - An object of the present invention is to provide a solar cell encapsulant sheet which makes it possible to suitably produce flexible solar cell modules in which the solar cell encapsulant sheet is well adhered to a solar cell element by encapsulating a solar cell element by roll-to-roll processing in a continuous manner without the need to perform a crosslinking process and without causing wrinkles and curls. The present invention provides a solar cell encapsulant sheet including a fluoropolymer sheet and an adhesive layer that includes a maleic anhydride-modified olefin resin on the fluoropolymer sheet, the maleic anhydride-modified olefin resin being a resin in which an α-olefin-ethylene copolymer that includes 1 to 25% by weight of α-olefin units is graft-modified with maleic anhydride, and a total amount of maleic anhydride being 0.1 to 3% by weight. | 07-04-2013 |
20130203203 | MANUFACTURING METHOD FOR FLEXIBLE SOLAR CELL MODULES - An object of the present invention is to provide a method for producing a flexible solar cell module which makes it possible to suitably produce flexible solar cell modules in which a solar cell element and a solar cell encapsulant sheet are well adhered to each other by encapsulating a solar cell by roll-to-roll processing in a continuous manner without the need to perform a crosslinking process and without causing wrinkles and curls. The present invention is a method for producing a flexible solar cell module, including thermocompression bonding of a solar cell encapsulant sheet to at least a light-receiving surface of a solar cell element that includes a flexible substrate and a photoelectric conversion layer on the flexible substrate by pressing the solar cell encapsulant sheet and the solar cell element together between a pair of heating rolls, the solar cell encapsulant sheet including a fluoropolymer sheet and an adhesive layer on the fluoropolymer sheet, the adhesive layer including a silane-modified polyolefin resin. | 08-08-2013 |
20130203204 | METHOD FOR MANUFACTURING FLEXIBLE SOLAR BATTERY MODULE - An object of the present invention is to provide a method for producing a flexible solar cell module which makes it possible to encapsulate a solar cell in a continuous manner without the need to perform a crosslinking process and highly efficiently produce flexible solar cell modules in which a solar cell and a solar cell encapsulant sheet are well adhered to each other without causing wrinkles and curls. The present invention is a method for producing a flexible solar cell module, including thermocompression bonding of a solar cell encapsulant sheet to at least a light-receiving surface of a solar cell element that includes a flexible substrate and a photoelectric conversion layer on the flexible substrate by pressing the solar cell encapsulant sheet and the solar cell element together between a pair of heating rolls, the solar cell encapsulant sheet including a fluoropolymer sheet and an adhesive layer on the fluoropolymer sheet, the adhesive layer including an ethylene-glycidyl methacrylate copolymer resin, the ethylene-glycidyl methacrylate copolymer resin including 5 to 10% by weight of glycidyl methacrylate units. | 08-08-2013 |
20130210186 | METHOD FOR MANUFACTURING FLEXIBLE SOLAR CELL MODULE - An object of the present invention is to provide a method for producing a flexible solar cell module which makes it possible to suitably produce flexible solar cell modules in which a solar cell element and a solar cell encapsulant sheet are well adhered to each other by encapsulating a solar cell by roll-to-roll processing in a continuous manner without the need to perform a crosslinking process and without causing wrinkles and curls. The present invention is a method for producing a flexible solar cell module, including thermocompression bonding of a solar cell encapsulant sheet to at least a light-receiving surface of a solar cell element that includes a flexible substrate and a photoelectric conversion layer on the flexible substrate by pressing the solar cell encapsulant sheet and the solar cell element together between a pair of heating rolls, the solar cell encapsulant sheet including a fluoropolymer sheet and an adhesive layer on the fluoropolymer sheet, the adhesive layer including at least one ethylene copolymer selected from the group consisting of ethylene-unsaturated carboxylic acid copolymers and ionomers of ethylene-unsaturated carboxylic acid copolymers, the ethylene copolymer including 10 to 25% by weight of unsaturated carboxylic acid units. | 08-15-2013 |
20140349195 | METHOD FOR PRODUCING PROPYLENE-BASED RESIN MICROPOROUS FILM AND PROPYLENE-BASED RESIN MICROPOROUS FILM - Provided is a method for producing a propylene-based resin microporous film capable of forming a high-performance lithium ion battery. The method for producing a propylene-based resin microporous film includes an extrusion step of melt-kneading a propylene-based resin in an extruder, and extruding the resin to obtain a propylene-based resin film; a first stretching step of uniaxially stretching the propylene-based resin film at a surface temperature of −20 to 100° C.; second stretching step of repeating, a plurality of times, a stretching basic step in which the propylene-based resin film after the first stretching step is uniaxially stretched at a surface temperature that is equal to or lower than a temperature lower than the melting point of the propylene-based resin by 10 to 100° C., wherein between successive stretching basic steps, the stretching ratio in the forward-side stretching basic step is adjusted so as to be lower than that of the backward-side stretching basic step; and an annealing step of annealing the propylene-based resin film after the second stretching step. | 11-27-2014 |
20140356730 | PROPYLENE-BASED RESIN MICROPOROUS FILM, SEPARATOR FOR BATTERY, BATTERY, AND METHOD FOR PRODUCING PROPYLENE-BASED RESIN MICROPOROUS FILM - The present invention provides a propylene-based resin microporous film which has excellent lithium ion permeability, can constitute a high-performance lithium ion battery, and can prevent a short circuit between a positive electrode and a negative electrode due to dendrites. | 12-04-2014 |
20150303428 | HEAT-RESISTANT SYNTHETIC RESIN MICROPOROUS FILM, METHOD OF PRODUCING THE SAME, SEPARATOR FOR NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY, AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY - A heat-resistant synthetic resin microporous film is provided which is excellent in both heat resistance and permeability to ions such as lithium ions and does not make its production line dirty. A method of producing the heat-resistant synthetic resin microporous film is also provided. The production method of a heat-resistant synthetic resin microporous film includes causing 5 to 25 parts by weight of a radical-polymerizable monomer including a trifunctional or higher polyfunctional acrylic monomer to adhere to 100 parts by weight of a synthetic resin microporous film, and then irradiating the synthetic resin microporous film with ionizing radiation at an absorbed dose of 10 to 150 kGy. | 10-22-2015 |
Patent application number | Description | Published |
20100201678 | DRIVING DEVICE, DRIVING METHOD AND PLASMA DISPLAY APPARATUS - A first ramp waveform (RW | 08-12-2010 |
20100253673 | PLASMA DISPLAY DEVICE AND METHOD FOR DRIVING THE SAME - Disclosed here is a method for driving a plasma display panel and a plasma display device capable of providing image display with a high contrast ratio and excellent quality by stabilizing an address discharge. According to the method, which is the method for driving a plasma display panel in which discharge cells are formed at intersections of scan electrodes, sustain electrodes and data electrodes, the field—that contains at least one sub-field having the all-cell initializing operation—and the field—that is formed of sub-fields having the selective-cell initializing operation only—are set at a ratio of 1:N (where, N takes an integer of 1 or greater). At the same time, at least in one sub-field of the field having the selective-cell initializing operation only, the scan-pulse width employed for the selective-cell initializing field is determined longer than the scan-pulse width employed for the field containing the all-cell initializing operation. | 10-07-2010 |
20120075283 | PLASMA DISPLAY PANEL DRIVE METHOD AND PLASMA DISPLAY DEVICE - In a driving method for a plasma display panel, in the initializing period in at least one of a plurality of subfields, selective initializing operation is performed that selectively causes initializing discharge only in a discharge cell having undergone address discharge in an immediately preceding address period. The selective initializing operation includes the step of applying first voltage to the sustain electrode and applying an up-ramp waveform voltage to the scan electrode, the step of applying a first down-ramp waveform voltage to the scan electrode and then applying a positive rectangular voltage to it, and the step of applying second voltage higher than the first voltage to the sustain electrode and applying a second down-ramp waveform voltage to the scan electrode. | 03-29-2012 |
20120105516 | PLASMA DISPLAY PANEL DRIVING METHOD AND PLASMA DISPLAY DEVICE - An image display region is divided into a plurality of partial display regions, the scan electrodes included in each partial display region are classified into two scan electrode groups: a scan electrode group formed of the odd-numbered scan electrodes; and a scan electrode group formed of the even-numbered scan electrodes. Scan pulses are sequentially applied to one scan electrode group, and then scan pulses are sequentially applied to the other scan electrode group. The pulse width of the scan pulses applied to the first through predetermined-number-th scan electrodes belonging to the one scan electrode group is set to be longer than the pulse width of the scan pulses applied to the remaining scan electrodes belonging to the one scan electrode group. The pulse width of the scan pulses applied to the first through predetermined-number-th scan electrodes belonging to the other scan electrode group is set to be longer than the pulse width of the scan pulses applied to the remaining scan electrodes belonging to the other scan electrode group. | 05-03-2012 |
20120293469 | PLASMA DISPLAY PANEL DRIVING METHOD AND PLASMA DISPLAY DEVICE - Stable address discharge is caused in a plasma display panel. For this purpose, the image display region of the panel is divided into a plurality of partial display regions, and scan electrodes in each partial display region are classified into two scan electrode groups based on the arranging sequence of the scan electrodes on the panel. The two scan electrode groups are a first scan electrode group including odd-numbered scan electrodes, and a second scan electrode group including even-numbered scan electrodes, In each partial display region in the address period, an overshoot address operation is performed. To the scan electrodes to which scan pulses are to be applied from the first time to a predetermined-number-th time in each scan electrode group, scan pulses are applied where the pulse cycle is set longer than that of the scan pulses to be applied to the other scan electrodes. | 11-22-2012 |
20130033478 | METHOD FOR DRIVING PLASMA DISPLAY PANEL AND PLASMA DISPLAY DEVICE - The luminance of black level of a display image is reduced to improve the contrast, the address discharge is stably caused, and the image display quality of a plasma display apparatus is improved. For this purpose, a specific-cell initializing subfield having an initializing period in which a forced initializing operation is performed in a specific discharge cell is disposed, a pre-reset period is disposed after a sustain period in the subfield immediately before the specific-cell initializing subfield. In the pre-reset period, first auxiliary discharge is caused in the discharge cell having undergone sustain discharge in the sustain period immediately before the pre-reset period. Then, second auxiliary discharge is caused in the discharge cell where the forced initializing operation is performed in the initializing period of the specific-cell initializing subfield immediately after the pre-reset period. | 02-07-2013 |
20140049529 | METHOD FOR DRIVING PLASMA DISPLAY PANEL AND PLASMA DISPLAY DEVICE - In a plasma display apparatus, the address discharge is stabilized, the contrast is sharpened, and the image display quality is improved. A first up-ramp waveform voltage is applied to the scan electrode, and then a voltage causing no discharge to the scan electrode is applied to the scan electrode, in the sustain period of a weak-discharge sustain operation subfield in a discharge cell that is to be subjected to a forced initializing operation in the initializing period of the subfield immediately after the weak-discharge sustain operation subfield. A second up-ramp waveform voltage is applied to the scan electrode after generation of the first up-ramp waveform voltage, in the sustain period of the weak-discharge sustain-operation subfield in a discharge cell that is to be subjected to a selective initializing operation in the initializing period of the subfield immediately after the weak-discharge sustain-operation subfield. | 02-20-2014 |
20140055423 | IMAGE-DISPLAY-DEVICE DRIVE METHOD, IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY SYSTEM - Discharge for detecting the position coordinates of an electronic pen is caused stably, and the position coordinates are detected accurately. For this purpose, in a driving method of an image display device, an image display subfield, a y-coordinate detection subfield, and an x-coordinate detection subfield are included in one field. In an initializing period of the x-coordinate detection subfield, a first voltage is applied to data electrodes and a first down-ramp voltage is applied to scan electrodes. In the initializing period of the image display subfield, a second voltage is applied to the data electrodes and a second down-ramp voltage is applied to the scan electrodes. The voltage derived by subtracting an arrival voltage of the first down-ramp voltage from the first voltage is set higher than the voltage derived by subtracting an arrival voltage of the second down-ramp voltage from the second voltage. | 02-27-2014 |
20140062971 | IMAGE-DISPLAY-DEVICE DRIVE METHOD, IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY SYSTEM - Discharge for detecting the position coordinates of an electronic pen is caused stably, and the position coordinates are detected accurately. For this purpose, in a driving method of an image display device, an image display subfield, a y-coordinate detection subfield, and an x-coordinate detection subfield are included in one field. In the x-coordinate detection subfield, an x-coordinate detection waiting period is set in which a voltage higher than an x-coordinate detection voltage is applied to the scan electrodes and a voltage lower than the voltage of x-coordinate detection pulses is applied to the data electrodes. After the x-coordinate detection waiting period, the x-coordinate detection voltage is applied to the scan electrodes, and the x-coordinate detection pulses are sequentially applied to the data electrodes. | 03-06-2014 |
20140062972 | IMAGE-DISPLAY-DEVICE DRIVE METHOD, IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY SYSTEM - Discharge for detecting the position coordinates of an electronic pen is caused stably, and the position coordinates are detected accurately. For this purpose, in a driving method of an image display device, an image display subfield group constituted of image display subfields, a timing detection subfield, a y-coordinate detection subfield, and an x-coordinate detection subfield are set in one field. In the timing detection subfield, a plurality of timing detection pulses for causing timing detection discharge in discharge cells is applied to scan electrodes and sustain electrodes alternately. | 03-06-2014 |
20140062973 | IMAGE-DISPLAY-DEVICE DRIVE METHOD, IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY SYSTEM - Discharge for detecting the position coordinates of an electronic pen is caused stably, and the position coordinates are detected accurately. For this purpose, in a driving method of an image display device, an image display subfield group constituted of image display subfields, a y-coordinate detection subfield, and an x-coordinate detection subfield are set in one field. An initializing period, in which an up-ramp voltage and a down-ramp voltage are applied to the scan electrodes, is set in the x-coordinate detection subfield, and the x-coordinate detection subfield is disposed immediately after the y-coordinate detection subfield. | 03-06-2014 |
20140085242 | IMAGE-DISPLAY-DEVICE DRIVE METHOD, IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY SYSTEM - Discharge for detecting the position coordinates of an electronic pen is caused stably, and the position coordinates are detected accurately. For this purpose, in a driving method of an image display device, an image display subfield, a y-coordinate detection subfield, and an x-coordinate detection subfield are set in one field. In the y-coordinate detection subfield, a y-coordinate detection voltage of positive voltage is applied to data electrodes and y-coordinate detection pulses of negative polarity are sequentially applied to the scan electrodes. In the x-coordinate detection subfield, an x-coordinate detection voltage of negative voltage is applied to scan electrodes and x-coordinate detection pulses of positive polarity are sequentially applied to data electrodes. | 03-27-2014 |
Patent application number | Description | Published |
20100127196 | PIEZOELECTRIC DRIVEN CONTROL VALVE - Stable flow control is made possible even under high-temperature environments by relieving tensional force applied to a piezoelectric element when a piezoelectric actuator is retracted. Thus, a piezoelectric driven control valve includes: a body having a valve seat; a metal diaphragm to contact with and separate from the valve seat; an actuator box supported ascendably and descendably on the body; a split base fixed to the body; a disc spring pressing and urging the actuator box downward to bring the metal diaphragm into contact with the valve seat; and a piezoelectric actuator housed inside the actuator box and that extends upward with application of voltage to press the actuator box upward against the elastic force of the disc spring, and a precompression mechanism, for applying a compression force constantly to piezoelectric elements in the piezoelectric actuator, provided between the split base and the piezoelectric actuator. | 05-27-2010 |
20100229976 | FLOW RATE RATIO VARIABLE TYPE FLUID SUPPLY APPARATUS - A flow rate ratio variable type fluid supply apparatus includes a flow rate control system supplying gas of flow rate Q that is diverted to first flow diverting pipe passage and second flow diverting pipe passage with prescribed flow rates Q | 09-16-2010 |
20120223265 | CAM CONTROL VALVE - A cam control valve includes a valve casing having a fluid passage and valve seat, a valve disc seated on the valve seat to open and close the fluid passage, a valve stem holding down the valve disc so it contacts the valve seat, a cam acting on the valve stem to hold it down, a motor rotating the cam, a motor holder holding the motor, a supporting frame fixed to the valve casing and supporting the motor holder so it moves vertically, an elastic member biasing the motor holder towards spacing from an upper side portion of the supporting frame, and height adjustable screws suspending the motor holder from the supporting frame, and adjusting a height of the motor holder with respect to the supporting frame, wherein the height adjustable screws are slidably inserted into the upper side portion of the supporting frame and screwed into the motor holder. | 09-06-2012 |
20130186471 | CALIBRATION METHOD AND FLOW RATE MEASUREMENT METHOD FOR FLOW RATE CONTROLLER FOR GAS SUPPLY DEVICE - In a gas supply device supplying many different gases to a gas use portion through many flow rate controllers, a flow rate controller calibration unit includes a build-up tank with inner volume, an inlet side on-off valve and an outlet side on-off valve V | 07-25-2013 |
20130220433 | APPARATUS FOR DIVIDING AND SUPPLYING GAS AND METHOD FOR DIVIDING AND SUPPLYING GAS BY USE OF THIS APPARATUS - A gas dividing/supplying apparatus includes a pressure-type flow control system, a plurality of divided flow passages connected in parallel with each other and through which gas flowing from the pressure-type flow control system is divided and supplied to a process chamber, thermal-type mass flow sensors disposed in the divided flow passages, respectively, motor-operated valves disposed on a downstream side of the thermal-type mass flow sensors, respectively, and switching-type controllers that control opening and closing of the motor-operated valves, respectively, and, in the apparatus, the switching-type controllers perform switching between valve opening control for maintaining the motor-operated valves at a predetermined fixed valve opening degree based on a valve opening control command signal and divided flow control for regulating an opening degree of each of the motor-operated valves by feedback control based on a flow detection signal of the thermal-type mass flow sensor by a divided flow control command signal. | 08-29-2013 |
20140013838 | FLOW RATE MEASUREMENT DEVICE AND FLOW RATE MEASUREMENT METHOD FOR FLOW RATE CONTROLLER FOR GAS SUPPLY DEVICE - A flow rate measurement device includes a branched pipe passage having an inlet side end portion detachably joined in a branched manner to an upstream portion of on-off valve V | 01-16-2014 |
20150059859 | APPARATUS FOR DIVIDING AND SUPPLYING GAS AND METHOD FOR DIVIDING AND SUPPLYING GAS - An apparatus for dividing and supplying gas is provided with a flow rate control device, a plurality of divided flow passages of gas flowing from the flow rate control device, thermal-type mass flow sensors disposed to the divided flow passages, electrically-operated valves disposed on a downstream side of the thermal-type mass flow sensors, controllers that control the electrically-operated valves, and a flow ratio setting calculator that calculates a total flow rate, then calculates flow rates of the divided flow passages, and then inputs the calculated flow rates as set flow rates to each controllers. One of the divided flow passages with the highest set flow rate is put in an uncontrolled state, and opening degree for each of the rest divided flow passages is controlled, and then feedback control of the divided flow rate of each of the divided flow passages is implemented by each of the controllers. | 03-05-2015 |
20150114499 | VARIABLE ORIFICE TYPE PRESSURE-CONTROLLED FLOW CONTROLLER - In a variable orifice type pressure-controlled flow controller that includes a pressure control unit and a variable orifice unit, computes a flow rate of a fluid distributed through an orifice of the variable orifice unit as Q | 04-30-2015 |