Patent application number | Description | Published |
20100200982 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Provided is a resin sealed semiconductor device including: a semiconductor element; a plurality of micro-balls including an internal terminal surface and an external connection electrode in two sides of the micro-balls; metal wires for electrically connecting the semiconductor element and an internal terminal surface; and a sealing body for sealing the semiconductor element, a part of each the plurality of the terminals, and metal wires with a sealing resin, in which a back surface of the semiconductor element is exposed from the sealing body, and a part of each the plurality of micro-balls are exposed as the external connection electrodes from a bottom surface of the sealing body in a projection manner. | 08-12-2010 |
20120068340 | Ball grid array semiconductor package and method of manufacturing the same - Provided is a BGA semiconductor package including: a substrate on which a semiconductor device is mounted; an adhesive for adhering the semiconductor device and the substrate to each other; a micro ball having conductivity, the micro ball being fitted into a through-hole provided in the substrate; a bonding wire for electrically connecting the semiconductor device and the micro ball to each other; and an encapsulation member for encapsulating, with an encapsulation resin, the semiconductor device, the adhesive, a part of the micro ball, and the bonding wire, only on a surface side of the substrate on which the semiconductor device is mounted, in which at least a part of a bottom surface of the micro ball has an exposed portion as an external connection terminal, which is exposed through the through-hole provided in the substrate as a bottom surface of the encapsulation member. | 03-22-2012 |
20120248298 | OPTICAL SENSOR AND METHOD OF MANUFACTURING THE OPTICAL SENSOR - An optical sensor has a glass base having a concave portion, and a glass lid is bonded to the base and overlies the concave portion to form an hermetically sealed cavity portion. A photoelectric conversion element is accommodated in the cavity portion. Internal wirings are each connected at one end to the photoelectric conversion element and extend through notches formed in a peripheral edge of the base. The other ends of the internal wirings are connected inside the notches to external wirings that extend along an outside surface of the base and terminate in external terminals. | 10-04-2012 |
20150123277 | BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A BGA semiconductor package includes a semiconductor device adhered by adhesive to a substrate, and a conductive micro ball fitted into a through-hole provided in the substrate. A bonding wire electrically connects the semiconductor device and the micro ball to each other. An encapsulation member made of resin encapsulates the semiconductor device, the adhesive, part of the micro ball, and the bonding wire, only on a surface side of the substrate on which the semiconductor device is mounted. At least a part of a bottom surface of the micro ball has an exposed portion as an external connection terminal, which is exposed through the through-hole provided in the substrate as a bottom surface of the encapsulation member. | 05-07-2015 |
20150147848 | RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A resin-encapsulated semiconductor device is manufactured by mounting semiconductor elements on respective die pad portions of a frame. Electrodes on the surface of the semiconductor elements are wire bonded to lead portions of the frame. The die pad portions, semiconductor elements and lead portions are encapsulated with resin, leaving a bottom surface part of the lead portions exposed. The lead portions are partially cut by a rotary blade from an upper side of the resin to form concave parts in the lead portions, which are wet-etched to form exposed lead upper end parts. A plated layer is formed on the lead upper end parts and the lead bottom surface parts. The remaining parts of the lead portions with the plated layer are cut to separate the resin-encapsulated semiconductor device into individual pieces. | 05-28-2015 |
Patent application number | Description | Published |
20120166176 | SPEECH TRANSLATION SYSTEM, DICTIONARY SERVER, AND PROGRAM - A conventional speech recognition dictionary, translation dictionary and speech synthesis dictionary used in speech translation have inconsistencies. Inconsistency among dictionaries can be solved with a dictionary server including an all-language group dictionary storage unit capable of having stored therein, for two or more languages, two or more all-language term information pieces for speech recognition, translation and speech synthesis, an information-for-speech-recognition sending unit that acquires information for speech recognition including speech recognition information of a term for all languages, and sends the information to one or more speech recognition servers, an information-for-translation sending unit that acquires information for translation including the written form of the term for all languages, and sends the information to one or more translation servers, and an information-for-speech-synthesis sending unit that acquires information for speech synthesis including speech synthesis information of a term for all languages, and sends the information to one or more speech synthesis servers. | 06-28-2012 |
20120197629 | SPEECH TRANSLATION SYSTEM, FIRST TERMINAL APPARATUS, SPEECH RECOGNITION SERVER, TRANSLATION SERVER, AND SPEECH SYNTHESIS SERVER - In conventional network-type speech translation systems, devices or models for recognizing or synthesizing speech cannot be changed in accordance with speakers' attributes, and therefore, accuracy is reduced or inappropriate output occurs in each process of speech recognition, translation, and speech synthesis. Accuracy of each processing of speech translation, translation, or speech synthesis is improved and appropriate output is performed in a network-type speech translation system by, based on speaker attributes, appropriately changing the server to perform speech recognition or the speech recognition model, appropriately changing the translation server to perform translation or the translation model, or appropriately changing the speech synthesis server or speech synthesis model. | 08-02-2012 |
20120221321 | SPEECH TRANSLATION SYSTEM, CONTROL DEVICE, AND CONTROL METHOD - Appropriate processing results or appropriate apparatuses can be selected with a control device that selects the most probable speech recognition result by using speech recognition scores received with speech recognition results from two or more speech recognition apparatuses; sends the selected speech recognition result to two or more translation apparatuses respectively; selects the most probable translation result by using translation scores received with translation results from the two or more translation apparatuses; sends the selected translation result to two or more speech synthesis apparatuses respectively; receives a speech synthesis processing result including a speech synthesis result and a speech synthesis score from each of the two or more speech synthesis apparatuses; selects the most probable speech synthesis result by using the scores; and sends the selected speech synthesis result to a second terminal apparatus. | 08-30-2012 |