Patent application number | Description | Published |
20090298237 | SEMICONDUCTOR MODULE - A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern. | 12-03-2009 |
20110028211 | INFORMATION SYSTEM, INFORMATION TERMINAL, AND INFORMATION COMMUNICATION METHOD - An information terminal may include, but is not limited to: a communication unit that receives, from a first server, a first animation and control information correlated to the first animation; a display unit that displays the first animation; and a control unit that controls the display unit to stop displaying the first animation and to start to display a second animation at a predetermined time based on the control information. | 02-03-2011 |
20110043981 | DISPLAY MODULE - A display module includes a display panel, a unit disposed on an outer side of the display panel, and an adhesive sheet with which the display panel and the unit are stuck together. The adhesive sheet has a first adhesive surface adhering to the display panel and a second adhesive surface adhering to the unit. The edge of the first adhesive surface and the edge of the second adhesive surface are displaced from each other in the adhesive surface direction. | 02-24-2011 |
20110205413 | SOLID-STATE IMAGING DEVICE, IMAGING UNIT, AND IMAGING APPARATUS - A solid-state imaging device includes an imaging element having a light receiving surface, and a cover member disposed over and opposite to the light receiving surface of the imaging element with a space therebetween. The cover member has a quartz plate, and the optical axis of the crystal of the quartz plate is parallel to the light receiving surface. | 08-25-2011 |
20110205414 | SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP DEVICE - A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident. | 08-25-2011 |
20120044415 | IMAGE PICKUP MODULE AND CAMERA - An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area. | 02-23-2012 |
20120211640 | IMAGING APPARATUS AND IMAGING SYSTEM - An intermediate member is disposed between a peripheral region and a third region, having been fixed to an imaging plate and a retaining plate. The intermediate member does not extend to between at least a part of a middle region and a forth region, such that a void is provided. The difference between the linear expansion coefficient of the imaging plate and the linear expansion coefficient of the intermediate member is smaller than the difference between the linear expansion coefficient of the retaining plate and the linear expansion coefficient of the intermediate member. | 08-23-2012 |
20120212637 | SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING SAME, AND CAMERA - A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member. | 08-23-2012 |
20120321244 | OPTICAL SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF - The optical semiconductor device includes a spot-size converter formed on a semiconductor substrate. The spot-size converter has a multilayer structure including a light transition region. The multilayer structure includes a lower core layer, and an upper core layer having a refractive index higher than that of the lower core layer. The width of the upper core layer is gradually decreased and the width of the lower core layer is gradually increased in the light transition region. Both sides and an upper side of the multilayer structure are buried by a semi-insulating semiconductor layer in the light transition region. Light incident from one end section of the spot-size converter is propagated to the upper core layer. The light transits from the upper core layer to the lower core layer in the light transition region, is propagated to the lower core layer, and exits from the other end section thereof. | 12-20-2012 |
20130286565 | ELECTRONIC COMPONENT, ELECTRONIC MODULE, THEIR MANUFACTURING METHODS, MOUNTING MEMBER, AND ELECTRONIC APPARATUS - A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition α | 10-31-2013 |
20130286566 | ELECTRONIC COMPONENT, MOUNTING MEMBER, ELECTRONIC APPARATUS, AND THEIR MANUFACTURING METHODS - A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part. | 10-31-2013 |
20130286592 | ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS - A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body. | 10-31-2013 |
20140153605 | OPTICAL DEVICE - An optical device includes a first substrate, having first and second surfaces, and a second substrate having a third surface. The first substrate includes: a laser unit, having an active layer and emitting light into the first substrate from the active layer; a reflecting mirror, having a plane obliquely intersecting an optical axis of light emitted from the laser unit, and being formed on the first surface so as to reflect the light toward the second surface; and a convex lens, being formed in a region on the second surface, the region including an optical axis of the light reflected by the reflecting mirror. The second substrate is provided with a grating coupler and an optical waveguide on the third surface, the optical waveguide having light incident on the grating coupler propagating therethrough. | 06-05-2014 |
20140237805 | METHOD OF MANUFACTURING MOUNTING MEMBER AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT - The method of the invention includes: placing a base member and a frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member in a state in which the base member is stacked with the frame member and a thermosetting adhesive agent is interposed between the base member and the frame member; adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent; and cooling the base member and the frame member from the curing temperature. The frame member in the state is warped so that a flatness error of the frame member after having been cooled becomes smaller than that in a case where the frame member is flat in the state. | 08-28-2014 |
20140240588 | ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS - A ferromagnetic body is provided at a front-surface side of a reference plane and located outside a region that overlaps an electronic device in a direction perpendicular to the reference plane, and a conductor is provided at a back-surface side of the reference plane and that overlaps the electronic device in the direction perpendicular to the reference plane. | 08-28-2014 |
20150084256 | STAMP-FACE PLATEMAKING DEVICE, MEDIUM HOLDER, AND MEDIUM HOLDER MANUFACTURING METHOD - A stamp-face platemaking device transports a medium holder inserted into a plate insertion portion to a printing unit. The medium holder holds a stamp face material in a plate-like member, and has a predetermined pattern in a side end portion thereof. An optical sensor detects the top end portion of the medium holder on a sensor scanning line in the inserting direction, and the pattern start point and the pattern end point of the predetermined pattern. At least one of the horizontal and vertical sizes of the stamp face material is set based on the positions of two of the detected end portions. When the pattern end point is detected, platemaking with the stamp face material is started. | 03-26-2015 |
20150116975 | ELECTRONIC COMPONENT, ELECTRONIC DEVICE, METHOD OF MANUFACTURING MOUNTED MEMBER, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT - A frame member includes a first portion, a second portion, and a third portion located between the first portion and the second portion, and wherein the lengths of the first portion and the second portion in a circumferential direction are longer than the length of the third portion in the circumferential direction, and a Young's modulus of the third portion is lower than the Young's moduli of the first portion and the second portion. | 04-30-2015 |
20150214695 | HORIZONTAL CAVITY SURFACE EMITTING LASER DEVICE - A horizontal cavity surface emitting laser device includes an active layer configured to generate light to be emitted in one direction along the one surface of a semiconductor substrate and in another direction opposite to the one direction. The device also includes a rear distributed Bragg reflector unit configured to reflect the light. The rear distributed Bragg reflector unit includes a waveguide layer configured to guide light and a distributed Bragg reflector configured to reflect the light in the waveguide layer. The device further includes an optical component configured to guide, in a direction different from the one direction and the other direction, the light emitted from an end of the rear distributed Bragg reflector unit in the one direction. The device further includes a front reflecting mirror configured to reflect the light emitted from the active layer in the other direction toward another surface side of the semiconductor substrate. | 07-30-2015 |
20150279770 | PACKAGE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MODULE - A package for mounting a semiconductor element includes a substrate including an upper face having a region where a semiconductor element is mounted, a lower face positioned on a side opposite to the upper face, and a side face connecting the upper face and the lower face and an electrode formed on the side face to extend in a direction from the lower face to the upper face. A width of the electrode at a first height in the direction from the lower face to the upper face is smaller than that of the electrode at a second height closer to the upper face than the first height in the direction from the lower face to the upper face. | 10-01-2015 |
Patent application number | Description | Published |
20100264199 | JOINING METHOD FOR METAL MEMBERS - The present invention provides a joining method for metal members, including: preparing an Fe-based metal member of Fe-based material, and an Al-based metal member of Al-based material; providing a Zn-based brazing filler metal between the Fe-based metal member and the Al-based metal member; and joining the Fe-based metal member and the Al-based metal member, wherein the Zn-based brazing filler metal includes: 2.0 mass % or less of Al; and the balance of Zn and inevitable impurities, and in the joining, the Zn-based brazing filler metal is heated such that a liquid phase of the Zn-based brazing filler metal is generated, and in solidification of the Zn-based brazing filler metal in a condition of the liquid phase, Zn primary crystal or eutectic of Zn and Al is crystallized. | 10-21-2010 |
20130270235 | METHOD FOR JOINING METALLIC MEMBERS, JOINT STRUCTURE AND BRAZING FILLER METAL - In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based brazing filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material. | 10-17-2013 |
20130272915 | METHOD FOR JOINING METALLIC MEMBERS, JOINT STRUCTURE AND BRAZING FILLER METAL - In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based brazing filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material. | 10-17-2013 |
20130273390 | METHOD FOR JOINING METALLIC MEMBERS, JOINT STRUCTURE AND BRAZING FILLER METAL - In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based brazing filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material. | 10-17-2013 |
20140305920 | ARC WELDING METHOD AND ARC WELDING APPARATUS - Provided is an arc welding method and arc welding apparatus for arc welding by a brazing filler metal two base materials subjected to a plating process. An arc welding method for arc welding two base materials, at least one of which has a plating layer thereon, by a brazing filler material, performs alternately a plating layer removal process of removing a plating layer by performing arc discharge at a first current value while moving a welding torch along a welding line in a state of stopping feed of the brazing filler metal, and a brazing filler metal welding process of welding the brazing filler metal to a position where the plating layer is removed, by performing arc discharge at a second current value smaller than the first current value while feeding the brazing filler metal in a state of stopping a movement of the welding torch. | 10-16-2014 |
Patent application number | Description | Published |
20090084339 | INTERNAL COMBUSTION ENGINE - A cylinder of an internal combustion engine is communicated with intake ports. Each of intake valves and each of fuel injection valves are provided to a corresponding one of the intake ports to inject fuel into a combustion chamber through a curved portion and an opening of the corresponding intake port. An injection axis of each fuel injection valve intersects with a surface of the corresponding intake valve placed in a close position at an intersecting point that is located on an upstream side of a central axis of the corresponding intake valve. | 04-02-2009 |
20090241905 | MOUNT STRUCTURE OF FUEL INJECTION VALVE AND FUEL INJECTION SYSTEM - A combustion chamber side end portion of a fuel injection valve is placed at a location that overlaps with an imaginary plane, which is perpendicular to a center axis of a cylinder and extends along a portion of a wall surface of an intake port where an intake valve protrudes, or is projected out from the imaginary plane toward a combustion chamber. Alternatively, a center of a fuel injecting side end port of the fuel injection valve, which injects fuel into intake air that flows in a branch port branched from the intake port, may be placed on the center axis side of the intake valve in a radial direction of the cylinder. Further alternatively, an upstream side fuel injection valve may inject fuel into intake air that flows in the intake port, and a downstream side fuel injection valve may inject fuel into intake air that flows in the branch port branched from the intake port. Alternatively, an injection quantity of fuel may be controlled for each of fuel injection valves, which injects fuel into intake air that flows in the corresponding branch port branched from the intake port. | 10-01-2009 |
20100250100 | Mount structure of fuel injection valve and fuel injection system - A combustion chamber side end portion of a fuel injection valve is placed at a location that overlaps with an imaginary plane, which is perpendicular to a center axis of a cylinder and extends along a portion of a wall surface of an intake port where an intake valve protrudes, or is projected out from the imaginary plane toward a combustion chamber. Alternatively, a center of a fuel injecting side end port of the fuel injection valve, which injects fuel into intake air that flows in a branch port branched from the intake port, may be placed on the center axis side of the intake valve in a radial direction of the cylinder. Further alternatively, an upstream side fuel injection valve may inject fuel into intake air that flows in the intake port, and a downstream side fuel injection valve may inject fuel into intake air that flows in the branch port branched from the intake port. Alternatively, an injection quantity of fuel may be controlled for each of fuel injection valves, which injects fuel into intake air that flows in the corresponding branch port branched from the intake port. | 09-30-2010 |
20130000605 | MOUNT STRUCTURE OF FUEL INJECTION VALVE AND FUEL INJECTION SYSTEM - A fuel injection system, and a structure for mounting a fuel injection valve to an internal combustion engine, that includes: a combustion chamber formed at an end surface of a piston that reciprocates in a cylinder; an intake port through which intake air drawn into the combustion chamber flows; and an intake valve that opens and closes a connection between the intake port and the combustion chamber, the fuel injection valve being placed to inject fuel into intake air in the intake port, wherein an end portion of the fuel injection valve located on a combustion chamber side thereof is placed at a location that overlaps with an imaginary plane perpendicular to a center axis of the cylinder and extends along a portion of a wall surface of the intake port where the intake valve protrudes, or is projected out from the imaginary plane toward the combustion chamber. | 01-03-2013 |
Patent application number | Description | Published |
20150151600 | VEHICLE HEIGHT ADJUSTMENT APPARATUS - A vehicle height adjustment apparatus includes: vehicle height adjustment units respectively provided to correspond to wheels of a vehicle body, and adjusting a vehicle height in response to the supply and discharge of a working fluid; a supply source of the working fluid; opening and closing valves interposed between the vehicle height adjustment units and the supply source; and a control unit adjusting the vehicle height for the vehicle height adjustment unit in a storage vehicle height range which is present within a vehicle height adjustable range of the vehicle height adjustment unit, and is set to be lower than a center value of a travelling vehicle height range attainable while travelling, wherein when a predetermined vehicle stop condition is satisfied, the control unit adjusts the vehicle height for the vehicle height adjustment unit to any position in the storage vehicle height range. | 06-04-2015 |
20150151601 | VEHICLE HEIGHT ADJUSTMENT APPARATUS - A vehicle height adjustment apparatus includes: vehicle height adjustment units respectively provided to correspond to wheels of a vehicle body, and adjusting a vehicle height in response to the supply and discharge of a working fluid; a pressure tank storing the working fluid; a compressor pressure-feeding the working fluid; opening and closing valves interposed between the vehicle height adjustment units and the pressure tank; a vehicle height acquisition unit acquiring a vehicle height value of the wheel; and a control unit controlling the vehicle height adjustment unit to adjust a vehicle height, and controlling the compressor, wherein when a vehicle height adjustment speed, calculated from the vehicle height value, is less than or equal to a predetermined threshold value, the control unit drives the compressor to pressure-feed the working fluid to the vehicle height adjustment units. | 06-04-2015 |
20150151602 | VEHICLE HEIGHT ADJUSTMENT APPARATUS - A vehicle height adjustment apparatus includes: vehicle height adjustment units respectively provided to correspond to wheels of a vehicle body, and adjusting a vehicle height in response to the supply and discharge of a working fluid; a supply source of the working fluid; opening and closing valves interposed between the vehicle height adjustment units and the supply source; and a control unit adjusting a vehicle height for each of the vehicle height adjustment units to at least one of a first vehicle height suitable for at least one of boarding and deboarding, and a second vehicle height suitable for travelling, wherein when the control unit acquires preparation information indicative of the transition of a preparation state to at least one of boarding and deboarding preparation states, the control unit adjusts the vehicle height adjustment units from the second vehicle height to the first vehicle height. | 06-04-2015 |
20150151603 | VEHICLE HEIGHT ADJUSTMENT APPARATUS - A vehicle height adjustment apparatus includes: vehicle height adjustment units respectively provided to correspond to wheels of a vehicle body, and adjusting a vehicle height in response to the supply and discharge of a working fluid; a pressure tank storing the working fluid; a compressor pressure-feeding the working fluid; a valve body block formed by opening and closing valves, and interposed between the pressure tank and the compressor, and the vehicle height adjustment units; and a control unit adjusting a vehicle height by controlling the valve body block, wherein the valve body block is connected to the pressure tank, and working fluid outlet and inlet of the compressor, and upon the completion of the pressure feed of the working fluid, the control unit controls such that the working fluid outlet and inlet are communicated with each other. | 06-04-2015 |