Patent application number | Description | Published |
20090175093 | APPARATUS FOR CONTROLLING COLUMN SELECTING SIGNAL FOR SEMICONDUCTOR MEMORY APPARATUS AND METHOD OF CONTROLLING THE SAME - An apparatus for controlling a column selecting signal of semiconductor memory apparatus comprising a column decoder that outputs a first column selecting signal, a signal control unit that outputs a second column selecting signal that is generated by controlling an enable period of the first column selecting signal, and an output control unit that outputs the first column selecting signal or the second column selecting signal in response to the input of a predetermined voltage detecting signal. | 07-09-2009 |
20100193021 | THIN FILM SOLAR CELL AND METHOD OF MANUFACTURING THE SAME - A thin film solar cell includes a first substrate, a transparent conductive layer on an inner surface of the first substrate, the transparent conductive layer having an uneven top surface and including through-holes, a light-absorbing layer on the transparent conductive layer, a reflection electrode on the light-absorbing layer, a second substrate facing and attached with the first substrate, and a polymeric material layer on an inner surface of the second substrate. | 08-05-2010 |
20110001559 | SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME - A semiconductor device and a method for driving the same rapidly detect failure of a through-semiconductor-chip via and effectively repairing the failure using a latching unit assigned to each through-semiconductor-chip via. The semiconductor device includes a plurality of semiconductor chips that are stacked, and a plurality of through-semiconductor-chip vias to commonly transfer a signal to the plurality of semiconductor chips, wherein each of the semiconductor chips includes a multiplicity of latching units assigned to the through-semiconductor-chip vias and the multiplicity of latching units of each of the semiconductor chips constructs a boundary scan path including the plurality of through-semiconductor-chip vias to sequentially transfer test data. | 01-06-2011 |
20110006391 | SEMICONDUCTOR DEVICE - A semiconductor device includes a plurality of stacked semiconductor chips; and a plurality of through-silicon vias (TSVs) including first TSVs and redundant TSVs and configured to commonly transfer a signal to the plurality of stacked semiconductor chips. At least one of the semiconductor chips includes a plurality of repair fuse units configured to store defect information as to at least one defect of the TSVs; and a plurality of latch units allocated to the respective TSVs and configured to store a plurality of signals indicating at least one TSV defect and outputted from the plurality of repair fuse units. | 01-13-2011 |
20120092062 | SEMICONDUCTOR SYSTEM - A semiconductor system includes a controller; a semiconductor device comprising a plurality of stacked semiconductor chips stacked over the controller, and a plurality of through-silicon vias (TSVs) configured to commonly transfer a signal to the plurality of stacked semiconductor chips; and a defect information transfer TSV configured to transfer TSV defect information sequentially outputted from at least one of the semiconductor chips to the controller, wherein the controller comprises: a plurality of first repair fuse units configured to set first fuse information based on the TSV defect information; and a plurality of first TSV selection units configured to selectively drive the TSVs in response to the first fuse information. | 04-19-2012 |
20120155200 | MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME, AND CONTROL METHOD THEREOF - A memory system includes a memory device, a control device configured to control the memory device, a first channel configured to transfer a row command from the control device to the memory device, and a second channel configured to transfer a column command from the control device to the memory device. | 06-21-2012 |
Patent application number | Description | Published |
20100197072 | Method of manufacturing a thin film solar cell - A method of manufacturing a thin film solar cell includes steps of preparing a substrate on which unit cells are defined, forming transparent conducive layers on the substrate and corresponding to the unit cells, respectively, the transparent conductive layers spaced apart from each other with a first separation line therebetween, forming light-absorbing layers on the transparent conductive layers and corresponding to the unit cells, respectively, the light-absorbing layers spaced apart from each other with a second separation line therebetween, forming a third separation line in each of the light-absorbing layers, the third separation line spaced apart from the second separation line, forming a reflection material layer by disposing a silk screen over the third separation line and applying a conductive paste, and forming reflection electrodes corresponding to the unit cells, respectively, by sintering the reflection material layer. | 08-05-2010 |
20100267193 | Method of manufacturing solar cell - A method of manufacturing a solar cell includes forming a transparent conductive layer on a substrate by depositing a transparent conductive oxide under room temperature, crystallizing the transparent conductive layer by irradiating a laser beam to the transparent conductive layer using a first laser; selectively etching the crystallized transparent conductive layer to form embossed and depressed patterns at a surface of the transparent conductive layer; forming transparent electrodes in unit cells by patterning the transparent conductive layer having the embossed and depressed patterns; forming a p-n junction semiconductor layer on the transparent electrodes and patterning the p-n junction semiconductor layer; and forming rear electrodes on the patterned p-n junction semiconductor layer by forming a metallic material layer and patterning the metallic material layer, the rear electrodes corresponding to the unit cells. | 10-21-2010 |
Patent application number | Description | Published |
20100237294 | Conductive polymer compound and organic photoelectric device including same - A conductive polymer compound includes: a conductive polymer; a first repeating unit represented by the following Chemical Formula 1; a second repeating unit represented by the following Chemical Formula 2; and a third repeating unit represented by the following Chemical Formula 3 and/or Chemical Formula 4, | 09-23-2010 |
20110111346 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes: (A) a polybenzoxazole precursor including a repeating unit represented by the Chemical Formula 1, a repeating unit represented by the Chemical Formula 2, or a combination thereof, and a thermally polymerizable functional group at least one terminal end of the polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound including a cross-linking functional group; and (E) a solvent. | 05-12-2011 |
20110159428 | Positive Type Photosensitive Resin Composition - This disclosure relates to a positive photosensitive resin composition including (A) a resin precursor including a polybenzoxazole precursor, a polyamic acid, or a combination thereof, (B) a dissolution-controlling agent having a boiling point ranging from about 210° C. to about 400° C. and a polarity ranging from about 1D to about 4D, (C) an acid generator, (D) a silane-based compound, and (E) a solvent. The polybenzoxazole precursor includes a repeating unit represented by Chemical Formula 1, or both of repeating units represented by Chemical Formulae 1 and 2 and has a thermally polymerizable functional group at least one end. The polyamic acid includes a repeating unit of Chemical Formulae 50 and 51. | 06-30-2011 |
20110253946 | CONDUCTIVE POLYMER, CONDUCTIVE POLYMER COMPOSITION, CONDUCTIVE POLYMER ORGANIC FILM, AND ORGANIC PHOTOELECTRIC DEVICE INCLUDING THE SAME - A conductive polymer, a conductive polymer composition, a conductive polymer organic film, and an organic photoelectric device including the same, the conductive polymer including repeating units represented by the following Chemical Formula 1, repeating units represented by the following Chemical Formula 2, and repeating units represented by the following Chemical Formula 3: | 10-20-2011 |
20120156614 | Novel Phenol Compounds and Positive Photosensitive Resin Composition Including the Same - Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same. | 06-21-2012 |
20120156616 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. | 06-21-2012 |
20120156622 | Ortho-Nitrobenzyl Ester Compound and Positive Type Photosensitive Resin Composition Including the Same - An ortho-nitrobenzyl ester compound including a compound represented by Chemical Formula 1, and a positive photosensitive resin composition including the same are provided. | 06-21-2012 |
20120326094 | CONDUCTIVE POLYMER, CONDUCTIVE POLYMER COMPOSITION, CONDUCTIVE POLYMER LAYER, AND ORGANIC PHOTOELECTRIC DEVICE INCLUDING THE CONDUCTIVE POLYMER LAYER - A conductive polymer, a conductive polymer composition, a conductive polymer layer, and an organic photoelectric device including the conductive polymer layer, the conductive polymer being doped with a polyacid copolymer, the polyacid copolymer being represented by the following Chemical Formula 1: | 12-27-2012 |
Patent application number | Description | Published |
20080311333 | Silicone Release Compositions with Controlled Peeling Force and Silicone Release Coating Films Coated with the Same - The invention pertains to a silicone release composition of which the peeling force can be controlled and also a silicone release film coated with the composition. With the inventive composition and the release film coated with the composition, it is possible to obtain a reproducible peeling force with a given value, and also possible to produce a uniformly coated release film without discharged harmful solvent. The silicone release film produced as such can have controlled peeling force with a stable peeling force characteristic compatible with viscous agent. To this end, the invention is characterized in that the silicone release composition of which the peeling force can be controlled according to the invention is a silicone water-dispersed release coating composition, contains organopolysiloxane, organopolysiloxane resin, organo hydrogen polysiloxane and platinum chelate catalyst, and meets the following math figure for peeling force:
| 12-18-2008 |
20090197100 | ANTISTATIC SILICONE RELEASE COATING FILMS - The invention relates to an antistatic silicone release film having a layer coated with an antistatic silicone release composition, and, used for semiconductors, electronics and display devices while addressing problems of static electricity generated when a general release film is separated from adhesive or an adhesive layer, and of contamination by such static electricity that causes critical product defects. The invention also relates to an antistatic silicon release film that can reduce product contamination caused by static electricity in peeling the film from adhesive or an adhesive layer, and achieves close adhesion between a substrate and a coated layer because of no interruption in curing a release layer, and also thereby has a stable release property. | 08-06-2009 |