Patent application number | Description | Published |
20100061467 | INFORMATION PROCESSING APPARATUS, ENCODING METHOD AND SIGNAL TRANSMISSION METHOD - There is provided an information processing apparatus including a data encoding unit that generates an encoded signal by encoding first input data based on CMI (Coded Mark Inversion) coding rules and encoding second input data using errors of the CMI coding rules, a clock signal addition unit that generates a transmission signal by synchronously adding a clock signal having an amplitude value larger than that of the encoded signal to the encoded signal generated by the data encoding unit, and a signal transmission unit that transmits the transmission signal generated by the clock signal addition unit. | 03-11-2010 |
20100275092 | SIGNAL PROCESSOR AND ERROR CORRECTION PROCESS - A signal processor, which includes: a signal receiving section for receiving signals encoded under a predetermined code rule; a rule violation detecting section for detecting code rule violation included in the signals received by the signal receiving section; an error range specifying section for specifying a range in which an error bit is included out of a bit string which constitutes the signals on the basis of a position of the code rule violation detected by the rule violation detecting section; and an error correcting section for correcting one error bit in the range specified by the error range specifying section so that the code rule violation detected by the rule violation detecting section is eliminated. | 10-28-2010 |
20120253206 | MEASUREMENT APPARATUS, MEASUREMENT METHOD, INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM - A measurement apparatus includes a signal generation unit generating a measurement signal for measuring a bioelectrical impedance, a first electrode pair making contact with the left and right sides of a body of a person under measurement to supply the measurement signal generated to the body, a second electrode pair placed adjacent to the first electrode pair and making contact with the left and right sides of the body, a bioelectrical impedance measurement unit measuring the bioelectrical impedance of the person under measurement based on an electrical signal obtained from the second electrode pair in response to supplying of the measurement signal, and an electrocardiogram signal measurement unit measuring an electrocardiogram signal of the person under measurement based on the electrical signal obtained from the second electrode pair. The bioelectrical impedance measurement unit and the electrocardiogram signal measurement unit concurrently operate in parallel. | 10-04-2012 |
20120310071 | MEASUREMENT APPARATUS, MEASUREMENT METHOD, PROGRAM AND INFORMATION PROCESSING APPARATUS - A measurement apparatus according to the present disclosure including a plurality of transparent electrodes provided on a surface of a display, an acquisition part acquiring an imaging signal obtained by imaging the surface of the display from an inside of the display, a configuring part configuring electrode pair candidates from the plurality of transparent electrodes based on the imaging signal acquired in a state that a subject touches the surface of the display, an electrocardiographic waveform signal measurement part measuring electrocardiographic waveform signals of the subject using respective electrode pair candidates configured, and a determination part determining a measurement electrode pair from the electrode pair candidates based on the electrocardiographic waveform signals measured using respective electrode pair candidates. This measurement apparatus is applicable to, for example, performing a personal authentication process of the subject based on the electrocardiographic waveform signal. | 12-06-2012 |
Patent application number | Description | Published |
20100196804 | Mask inspection apparatus and image creation method - Provided is a mask inspection apparatus including: emitting unit for emitting electron beams onto a sample; electron detecting unit for detecting the quantity of electrons produced, by the emission of the electron beams, from the sample with patterns formed thereon; image processing unit for generating image data for the patterns on the basis of the electron quantity; and controlling unit for controlling the emitting unit, the electron detecting unit, and the image processing unit. The controlling unit calculates, from the size of a designated observation area of the sample, a division number of divisional images that are synthesized to form a joint image that covers the entire designated observation area. The controlling unit determines divisional areas so that adjacent divisional areas partially overlap each other. The controlling unit acquires SEM images for the respective divisional areas. The controlling unit synthesizes the SEM images of the divisional areas on the basis of coordinate data for the divisional areas and on the basis of edge information for patterns included in the overlapping regions, and thereby creates an SEM image of a wide field of view that covers the observation area. | 08-05-2010 |
20110049362 | Pattern measuring apparatus and pattern measuring method - A pattern measuring apparatus includes: an electron irradiating unit for radiating an electron beam onto a sample while scanning; an image data acquiring unit for acquiring an image of a pattern on the basis of an amount of electrons generated from the sample where the pattern is formed, by the radiation of the electron beam; a measurement region setting unit for setting paired measurement regions each including a pattern edge in the image of the pattern; and a controlling unit for calculating a distance between pattern edges in the paired measurement regions by detecting a shape of the pattern edge in each measurement region, respectively. The control unit calculates edge characteristic curves by finding moving averages of edge profiles by use of predetermined moving average widths, respectively, each edge profile representing the pattern edge in one of the measurement regions with position coordinates of each of measurement points arranged at predetermined intervals, and defines the positions of peak values of the edge characteristic curves as edge positions of the patterns in the measurement regions. | 03-03-2011 |
20110249108 | Mask inspection apparatus and mask inspection method - A mask inspection apparatus includes irradiation means for irradiating a sample with an electron beam, electron detection means for detecting a quantity of electrons generated from the sample having a pattern formed thereon by the irradiation with the electron beam, image processing means for generating image data of the pattern on the basis of the quantity of the electrons, and control means for creating a line profile and a differential profile of the pattern formed on the sample on the basis of the quantity of the electrons detected by the electron detection means. The control means detects a rising edge and a falling edge of the pattern on the basis of the differential profile, and then generates mask data of a multi-level structure on the basis of data of the edges and the image data created by the image processing means. | 10-13-2011 |
20110249885 | Mask inspection apparatus and image generation method - A mask inspection system includes irradiation means for irradiating a sample with an electron beam, electron detection means for detecting a quantity of electrons generated from the sample, image processing means, storage means, and control means for calculating the number of divided images, which foam an entire combined image, on the basis of a size of a specified observed area of the sample, determining divided areas in such a way that divided images adjacent to each other overlap with each other, acquiring the divided images of the respective divided areas, and storing the divided images in the storage means, the divided images forming an entire combined image. The control means extracts two divided images adjacent to each other in a predetermined sequence starting from a specified one of the divided images. For each of the two divided images adjacent to each other, the control means then detects an image of a same pattern formation area included in an overlap area, and determines the detected image to be a combination reference image. The control means then combines the two divided images adjacent to each other on the basis of the combination reference image to thereby form an entire SEM image of the observed area. | 10-13-2011 |
20120112066 | Defect review apparatus and defect review method - A defect review apparatus includes: an electron scanning part which irradiates and scans an electron beam over an observation region on a surface of a sample; four electron detectors arranged around the optical axis of the electron beam with 90° intervals; and a signal processing unit which generates multiple pieces of image data of the observation region on the basis of detection signals from the electron detectors, the multiple pieces of image data respectively taken in different directions. When a pattern in the observation region is a line-and-space pattern, the defect inspection unit performs defect detection on the basis of a subtract between two pieces of the image data respectively taken in two predetermined directions with the optical axis of the electron beam in between. | 05-10-2012 |
20130105691 | PATTERN MEASUREMENT APPARATUS AND PATTERN MEASUREMENT METHOD | 05-02-2013 |
20130234020 | PATTERN INSPECTION APPARATUS AND METHOD - A pattern inspection apparatus configured to perform pattern inspection based on a SEM image previously measures distortion amount data representing a magnitude distribution of positional displacement caused by distortion of the SEM image in a scanning direction. When the pattern inspection is performed, the apparatus makes design data and the SEM image correspond to each other by adjusting at least one of the design data and the SEM image on the basis of the distortion amount data, and places a measurement region on the SEM image on the basis of a correspondence between the design data and the SEM image. The apparatus may further find a matching rate between a pattern of the design data and a pattern of the SEM image. | 09-12-2013 |