Patent application number | Description | Published |
20140235032 | METHOD FOR PRODUCING TRANSPARENT SOI WAFER - The method for producing a transparent SOI wafer is provided and includes treating a bonded wafer at a first temperature of 150 to 300° C. as a first heat treatment; cutting off an unbonded portion of the bonded wafer by irradiating a visible light laser from a silicon wafer side of the heated bonded wafer to a boundary between the bonded surface and an unbonded circumferential surface, while keeping an angle of 60 to 90° between the incident light and a radial direction of the silicon wafer; subjecting the silicon wafer of the bonded wafer having the unbonded portion cut off to grinding, polishing, or etching to form a silicon film; and heat-treating the bonded wafer having the silicon film formed at a second temperature of 300 to 500° C. as a second heat treatment which is higher than the first temperature. | 08-21-2014 |
20140308800 | METHOD FOR MANUFACTURING COMPOSITE WAFERS - This invention provides a method for manufacturing composite wafers in which at least two composite wafers can be obtained from one donor wafer, and in which the chamfering step can be omitted. Provided is a method for manufacturing composite wafers comprising: bonding surfaces of at least two handle wafers and a surface of a donor wafer which has a diameter greater than or equal to a sum of diameters of the at least two handle wafers and which has a hydrogen ion implantation layer formed inside thereof by implanting hydrogen ions from the surface of the donor wafer, to obtain a bonded wafer; heating the bonded wafer at 200° C. to 400° C.; and detaching a film from the donor wafer along the hydrogen ion implantation layer of the heated bonded wafer, to obtain the composite wafers having the film transferred onto the at least two handle wafers. | 10-16-2014 |
20140322546 | THERMALLY OXIDIZED HETEROGENEOUS COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A thermally oxidized heterogeneous composite substrate provided with a single crystal silicon film on a handle substrate, said heterogeneous composite substrate being obtained by, prior to a thermal oxidization treatment at a temperature exceeding 850° C., conducting an intermediate heat: treatment at 650-850° C. and then conducting the thermal oxidization treatment at a temperature exceeding 850° C. | 10-30-2014 |
Patent application number | Description | Published |
20100190097 | Pellicle for photolithography - There is provided a pellicle for photolithography having a plurality of air vents formed in a pellicle frame for photolithography and having the air vents covered with a dustproof filter in which the air vents in the frame are counterbored and a counterbored wall surface of the air vents is tapered. | 07-29-2010 |
20110132258 | Pellicle for lithography and a method for making the same - There is provided a pellicle in which the frame is chamfered along all of its horizontal edges (as viewed when the pellicle frame is laid flat), and in particular those edges of the frame where the membrane-bonding frame face meets the external side walls of the frame are chamfered to the extent of C:0.01 mm-C:0.12 mm; in relation to this chamfer, a method is also provided wherein, after attaching a preformed pellicle membrane to the membrane-bonding frame face, the excessive part of the preformed membrane which extends beyond outer edges of the frame face is cut off in a manner wherein a blade of a knife is caused to scour the chamfer over the membrane in a manner such that the knife blade is kept in such an angle that the blade gets in a face-to-face contact with the chamfer face or that the blade touches only that edge of the frame where the chamfer face meets the first frame face while the knife blade is moved along the chamfered edge of the frame. | 06-09-2011 |
20110280503 | Method for hermetically closing an air-tight bag for pellicle - There is provided a method for air-tightly enclosing a pellicle case in a filmy bag which protects the pellicle case against dust without the use of a plurality of bags or without modifying the filmy bag except for folding it like origami and eventually consolidating with an adhesive material: in short the opening of the bag is folded a number of times compactly. | 11-17-2011 |
20120247069 | METHOD FOR STORING A PELLICLE - There is provided a method for packing a pellicle container in plastic resin bags, which is meant to prevent foreign particles from reaching the pellicle container and eventually the product pellicle; the points of the invention lie in that bags are either antistatic or of special cleanroom-use grade prepared and preserved in a cleanroom environment. | 10-04-2012 |
20130065164 | PELLICLE FOR LITHOGRAPHY AND A METHOD OF MAKING THEREOF - A pellicle is proposed wherein the mask-bonding agglutinant layer coated on one annular face of the pellicle frame is designed to have a cross-section which is trapezoidal (including the case of rectangle) so that the angle alpha (α) included between the side wall of the agglutinant layer and said annular face is 90 degrees or smaller. | 03-14-2013 |