Patent application number | Description | Published |
20090211491 | Solution Or Dispersion For Base Surface Treatment Containing Titanium Oxide Doped With Metal Element, Method Of Treating Base Surface With The Liquid, And Surface-Treated Material Obtained By the Method - A surface-treating agent for imparting both water repellency or unsusceptibility to water absorption and excellent antifouling properties to a surface of a material, especially a material for outdoor use; and a material whose surface has been treated with the surface-treating agent. A solution or dispersion which contains a water repellent or water absorption inhibitor, preferably a water repellent or water absorption inhibitor of the silane, siliconate, silicone, silicone/silane composite, and/or fluorochemical type, and a titanium oxide doped with at least one metal element selected from the group consisting of copper, manganese, nickel, cobalt, iron, and zinc, preferably an amorphous titanium oxide or an amorphous titanium oxide which has been peroxidized at least partly, is used to form, on a surface of a base material and/or in a surface layer thereof, a layer comprising the water repellent or water absorption inhibitor and the titanium oxide doped with at least one metal element selected from the group consisting of copper, manganese, nickel, cobalt, iron, and zinc. | 08-27-2009 |
Patent application number | Description | Published |
20090102536 | DATA TRANSMISSION SYSTEM - A data transmission system is made up from: a transmission circuit ( | 04-23-2009 |
20090232248 | DATA RECEIVING DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING SUCH DATA RECEIVING DEVICE - A data receiving device comprises amplifying circuit | 09-17-2009 |
20100150289 | CLOCK REPRODUCING APPARATUS AND METHOD - A common mode of a waveform of a duobinary transmission signal (IN) is set to 0 and the size of a data eye is set to Veye; and reference potentials Vref_H and Vref_L are set to the following values: | 06-17-2010 |
20100327924 | WAVEFORM EQUALIZATION CIRCUIT AND WAVEFORM EQUALIZATION METHOD - A waveform equalization circuit includes: a decision feedback equalization unit that feeds back and equalizes an input signal; a clock phase adjustment unit that adjusts a clock phase of a signal equalized by the decision feedback equalization unit based on a signal determined with a prescribed potential as a threshold; and a duo-binary decoder that encodes, into a duo-binary signal, the signal determined with the prescribed potential as a threshold based on a clock adjusted by the clock phase adjustment unit from the signal equalized by the decision feedback equalization unit; wherein the equalized signal is generated by adding the duo-binary signal encoded by the duo-binary decoder to the input signal. A first post-tap of the input signal is equalized by the clock phase adjustment unit without feedback equalization by the decision feedback equalization unit. Second and subsequent post-taps of the input signal are fed back and equalized by the decision feedback equalization unit. | 12-30-2010 |
20120170692 | CLOCK DATA RECOVERY CIRCUIT AND CLOCK DATA RECOVERY METHOD - A clock data recovery circuit includes: a demodulation filter that receives a transmission signal transmitted by two orthogonal carrier waves having I and Q phases and executes demodulation to obtain a demodulated wave having an phase and a demodulated wave having a Q phase from the transmission signal; a first determination circuit that determines whether an absolute value of one of the two demodulated waves is greater than an eye opening maximum value at an ideal clock phase of the transmission signal; a second determination circuit that determines whether the one demodulated wave is greater than zero; a third determination circuit that determines whether the other one of the two demodulated waves is greater than zero; and a phase comparison unit that detects whether a phase of a clock signal included in the transmission signal is leading a phase of a data signal included in the transmission signal, based on determination results obtained by the first to third determination circuits. | 07-05-2012 |
Patent application number | Description | Published |
20080200636 | Epoxy Resin, Hardenable Resin Composition Containing the Same and Use Thereof - It is an object of the present invention, with respect to a phenol aralkyl type epoxy resin, to suppress any crystal precipitation, improve the quality manageability and operation efficiency at composition production and enhance the properties, including heat resistance, thereof. It is also intended to provide a resin composition that even when stored in the form of a varnish for a prolonged period of time, is resistant to crystal precipitation, excelling in storage stability and operation efficiency, and that gives a hardening product of low dielectric constant and low dielectric tangent excelling in heat resistance, water resistance and flame retardance. | 08-21-2008 |
20090054587 | EPOXY RESIN, EPOXY RESIN COMPOSITION, AND PREPREG AND LAMINATED PLATE USING THE EPOXY RESIN COMPOSITION - An object of the present invention is to provide an epoxy resin exhibiting superior heat resistance, dielectric properties, water resistance, and workability, a resin composition containing the epoxy resin, and a prepreg and a laminated plate. The epoxy resin of the invention is expressed by the following formula. (In the formula, R represents a hydrocarbon group having a carbon number of 1 to 4. m Represents an integer of 1 to 4 and when m is 2 to 4, R's may be the same or different. n Represents a positive number of 1 to 6 on average.) The epoxy resin composition of the invention contains the epoxy resin of the invention and a curing agent. | 02-26-2009 |
20090069513 | EPOXY RESIN, METHOD FOR PRODUCING SAME AND USE THEREOF - An object of the present invention is to provide a multifunctional epoxy resin that is in a liquid state and that has a multifunctional structure. The multifunctional epoxy resin can be used as a reactive diluent and also used for a wide range of applications such as a molding material, a casting material, a laminating material, a paint, an adhesive, and a resist. The epoxy resin of the present invention is produced by glycidylation of dipentaerythritol represented by formula (1): | 03-12-2009 |
20090286929 | Phenolic Resin, Process for Production Thereof, Epoxy Resin, and Use Thereof - A phenol aralkyl type phenolic resin represented by the general formula (1), wherein the total content of the compounds represented by formulae (2) to (4) is 58 to 92% as determined by GPC and the contents of the compounds represented by formulae (2) to (4) as determined by HPLC satisfy the following relationship: 0.60≦(2 | 11-19-2009 |
20100179353 | Modified Liquid Epoxy Resin as Well as Epoxy Resin Composition Using the Same and Cured Product Thereof - This invention provides a modified liquid epoxy resin having a low viscosity and a high performance, which is obtained by reacting a mixture of a bisphenol and a phenol aralkyl resin with an epiholohydrin. The bisphenol is preferable to be bisphenol F and is further preferable to have a bifunctional form purity as detected by gel permeation chromatography at UV 254 nm of not less than 95% by area in view of the fluidity. Moreover, the mixture of bisphenol and the phenol aralkyl resin is preferable to have a ratio of the phenol aralkyl resin of 10-70% by mass. | 07-15-2010 |
Patent application number | Description | Published |
20150076570 | Semiconductor Module and Method for Manufacturing the Same - There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder. | 03-19-2015 |
20150144392 | Multipolar Connector - A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector ( | 05-28-2015 |
20150270199 | Semiconductor Module - A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode. | 09-24-2015 |
20150289369 | Semiconductor Module - A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W | 10-08-2015 |
20150342074 | Semiconductor Module - To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module ( | 11-26-2015 |