Tien-Hao
Tien-Hao Chang, Taoyuan County TW
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20120205646 | DISPLAY WITH PHOTO SENSOR AND MANUFACTURING METHOD THEREOF - A display with a photo sensor is provided, wherein the photo sensor is integrated with an active device array substrate of the display and fabricated through an existing process to reduce the manufacturing cost. A photosensitive silicon-rich dielectric layer or any other photosensitive material layer having similar photosensitive characteristics (for example, a photosensitive semiconductor layer) is adopted to form the photo sensor with a lower electrode and a transparent upper electrode. Thereby, the fill factor of the photo sensor is maximized and noises caused by a backlight source electrode are eliminated. | 08-16-2012 |
20130270618 | TOUCH PANEL AND FABRICATING METHOD THEREOF - A touch panel and fabricating method thereof are provided. The patterned transparent conductive layer, disposed on the substrate, includes first electrodes. The photo-sensing layers are disposed on the first electrodes. The first patterned conductive layer includes gate electrodes, scan lines and second electrodes. The gate electrodes and the scan lines are disposed on the substrate. The second electrodes are disposed on the photo-sensing layers. The first electrodes, the photo-sensing layers and the second electrodes constitute photo-sensors. The second patterned conductive layer includes source electrodes and drain electrodes, wherein the gate electrodes, the channel layers, the source electrodes and the drain electrodes constitute read-out transistors and each of the read-out transistors is electrically connected to the corresponding photo-sensor respectively. | 10-17-2013 |
Tien-Hao Chang, Shenzhen City CN
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20150294632 | LIQUID CRYSTAL PANEL, DRIVING METHOD AND LIQUID CRYSTAL DEVICE - A liquid crystal panel includes a plurality of pixels arranged in a matrix form, a plurality of charge-filling gate lines, and a plurality of charge-sharing gate lines. Each pixel column electrically couples to one charge-filling gate line and one charge-sharing gate line. The charge-sharing gate line electrically coupled with the n-th pixel column is electrically coupled with the charge-filling gate line electrically coupled with the (n+m)-th pixel column The charge-filling gate line electrically coupled with each pixel column is inputted with first driving signal when the liquid crystal panel is driven in a 2D display mode and is inputted with second driving signals when the liquid crystal panel is driven in a 3D display mode. In addition, a driving method of the liquid crystal panel and the liquid crystal device incorporating the liquid crystal panel are disclosed. | 10-15-2015 |
Tien-Hao Chang, Hsin-Chu TW
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20130100079 | TOUCH DISPLAY DEVICE - A touch display device includes a first substrate, a second substrate, a plurality of sub-pixel regions, a plurality of display devices, a plurality of first optical touch sensor device and second optical touch sensor devices. The first substrate and the second substrate are disposed oppositely. The display devices are disposed in the sub-pixel regions, respectively, to provide images for a first display surface and a second display surface. The first optical touch sensor devices are disposed on the first substrate and at least corresponding to part of the sub-pixel regions for implementing touch input function on the first display surface. The second optical touch sensor devices are disposed on the first substrate and at least corresponding to part of the sub-pixel regions for implementing touch input function on the second display surface. | 04-25-2013 |
Tien-Hao Chang, Shenzhen, Guangdong CN
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20160139474 | LIQUID CRYSTAL DISPLAY PANEL AND ARRAY SUBSTRATE - A liquid crystal display panel and an array substrate are disclosed. A pixel electrode of each pixel unit of the array substrate is correspondingly connected with at least one data line. The pixel electrode includes multiple regions arranged as a matrix. The data line is disposed between adjacent two columns of the regions. Accordingly, the penetration ratio and the aperture ratio of the pixel unit are increased. | 05-19-2016 |
Tien-Hao Huang, Hsinchu County TW
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20120228745 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor package structure and a manufacturing method thereof are provided. The semiconductor package structure includes a semiconductor die, a thermally conductive film, a substrate, a plurality of electrically conductive film patterns, and at least one insulator. The thermally conductive film is disposed on the bottom of the semiconductor die. The substrate is substantially comprised of the electrically conductive material or semiconductor material. Furthermore, a first hole is disposed on and passed all the way through the substrate, and the semiconductor die is disposed in the first hole. The electrically conductive film patterns are disposed on the substrate, and not contacting with each other. In addition, the insulator is connected between the semiconductor die and the substrate. | 09-13-2012 |
Tien-Hao Huang, New Taipei City TW
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20110227186 | IMAGE SENSOR PACKAGE AND FABRICATION METHOD THEREOF - An image sensor package includes an image sensor die having an active side and a backside, wherein an image sensor device region and a bond pad are provided on the active side. A through-silicon-via (TSV) structure extending through the thickness of the image sensor die is provided to electrically connect the bond pad. A multi-layer re-distributed interconnection structure is provided on the backside of the image sensor die. A solder mask or passivation layer covers the multi-layer re-distributed interconnection structure. | 09-22-2011 |
Tien-Hao Huang, Zhongli City TW
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20100181589 | CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - The invention provides a chip package structure and method for fabricating the same. The chip package structure includes a carrier substrate. A plurality of isolated conductive layers is disposed on the carrier substrate. At least one chip is disposed on the carrier substrate, wherein the chip has a plurality of electrodes. The electrodes are electrically connected to the conductive layers. A conductive path is disposed in the carrier substrate, electrically connected to the electrodes through the conductive layers, wherein the conductive path comprises a plurality of laminating holes. | 07-22-2010 |
20140151730 | LED Packaging Construction and Manufacturing Method Thereof - LED packaging construction includes a substrate, a cavernous construction, a LED, and a reflection layer. The substrate is daubed with an insulation layer and a circuit layer on a surface on the substrate, wherein the substrate is made of metal, and the insulation layer is disposed between the circuit layer and the substrate. The cavernous construction is disposed on the substrate and surrounds the LED, and is formed by disposing a photoresist layer and patterning the photoresist layer. The circuit layer electrically connects the LED through a conducting wire. The reflection layer is at least disposed on a first surface of the cavernous construction, wherein the first surface surrounds the LED and faces toward the LED, and a part of light emitted from the LED is reflected by the reflection layer. | 06-05-2014 |
20140151741 | Semiconductor Construction, Semiconductor Unit, and Manufacturing Method Thereof - A semiconductor structure and its manufacturing method including multiple steps are provided. First, a patterned circuit board having a substrate and a patterned circuit layer is provided. The substrate includes a first surface, a second surface, at least one connecting channel, and at least one conductive through hole, wherein patterned circuit layer is disposed on the first surface, a second surface, and the inside wall of the conductive through hole. Then, the patterned circuit board is disposed on a carrier, and the patterned circuit layer disposed on one of the first surface and the second surface is touched with the carrier. Then, a filling process is applied. A filling material flows to the conductive through hole via the first surface or the second surface from the connecting channel. Then, a package material is provided to produce a semiconductor structure. | 06-05-2014 |
20140191274 | Substrate, Semiconductor Construction, and Manufacturing Method Thereof - A substrate includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is set to bond a die. The glue spreading pattern is placed in the die-bonding zone and includes a containing space. The die is placed on the glue spreading pattern, an area of a bottom of the die is greater than an area of an opening of the glue spreading pattern, the containing room of the glue spreading pattern is filled with a glue, and the die is bonded to the substrate by means of the glue. | 07-10-2014 |
Tien-Hao Huang, Taoyuan County TW
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20150060911 | OPTOELECTRONIC SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF - An optoelectronic semiconductor device comprises a substrate, at least one solid via plug, at least one optoelectronic semiconductor chip, a phosphor layer and a molding body. The at least one solid via plug penetrates through the substrate. The at least one optoelectronic semiconductor chip has a first electrode aligned to and electrically connected with the solid via plug. The phosphor layer covers at least one surface of the optoelectronic semiconductor chip. The molding body encapsulates the substrate, the optoelectronic semiconductor chip and the phosphor layer. The number of solid valid plugs, substrate surfaces, electrodes, bonding pad on each surface of the substrate for forming each optoelectronic semiconductor device can be, for example, two, respectively. | 03-05-2015 |
20150226382 | ELECTROLUMINESCENT DEVICE AND APPARATUS APPLYING THE SAME - An electroluminescence device comprises a sandwich structure and a first luminous unit. The sandwich structure comprises a first metal layer, an insulation layer, and a second metal layer stacked in sequence along a stacking direction. The first luminous unit is disposed on a sidewall of the sandwich structure parallel to the stacking direction, wherein the first luminous unit comprises a first electrode and a second electrode connected to the first metal layer and the second metal layer by a solder ball respectively. | 08-13-2015 |
Tien-Hao Yang, Suhih City TW
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20090003246 | Multimedia conference device - A multimedia conference device includes a main body, at least three legs, and a cylindrical portion. At least three legs are pivotally connected with the main body respectively at one end thereof. The cylindrical portion extends outward from a central area of the main body. | 01-01-2009 |
Tien-Hao Yang, Sijhih City TW
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20090002925 | Universal type keyboard - A universal type keyboard has a common design of an upper housing and key caps for different languages such that keyboards of different languages can be manufactured with a universal upper housing. | 01-01-2009 |
20090058808 | Computer mouse device - A mouse device includes a main body and a cover. The main body includes a roller wheel, a left key and a right key, wherein the roller wheel is sandwiched between the left key and the right key. The cover includes a right key cover and a left key cover to define an opening between thereof, wherein the right key cover and the left key cover are separately pivotally connected to the main body. When the cover lies against a top surface of the main body, the right key cover lies against the right key, the left key cover lies against the left key, and the opening exposes the roller wheel. | 03-05-2009 |