Jyh-Ming
Jyh-Ming Hung, Dacun Township TW
Patent application number | Description | Published |
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20100181283 | DUAL METAL FOR A BACKSIDE PACKAGE OF BACKSIDE ILLUMINATED IMAGE SENSOR - A method for fabricating a semiconductor device with improved bonding ability is disclosed. The method comprises providing a substrate having a front surface and a back surface; forming one or more sensor elements on the front surface of the substrate; forming one or more metallization layers over the front surface of the substrate, wherein forming a first metallization layer comprises forming a first conductive layer over the front surface of the substrate; removing the first conductive layer from a first region of the substrate; forming a second conductive layer over the front surface of the substrate; and removing portions of the second conductive layer from the first region and a second region of the substrate, wherein the first metallization layer in the first region comprises the second conductive layer and the first metallization layer in the second region comprises the first conductive layer and the second conductive layer. | 07-22-2010 |
20100184242 | METHOD OF IMPLANTATION - Provided is a method of implanting dopant ions to an integrated circuit. The method includes forming a first pixel and a second pixel in a substrate, forming an etch stop layer over the substrate, forming a hard mask layer over the etch stop layer, patterning the hard mask layer to include an opening between the first pixel and the second pixel, and implanting a plurality of dopants through the opening to form an isolation feature. | 07-22-2010 |
Jyh-Ming Hung, Changhua City TW
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20080246063 | PHOTODIODE WITH MULTI-EPI FILMS FOR IMAGE SENSOR - The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a semiconductor substrate; a first epitaxy semiconductor layer disposed on the semiconductor substrate and having a first type of dopant and a first doping concentration; a second epitaxy semiconductor layer disposed over the first epitaxy semiconductor layer and having the first type of dopant and a second doping concentration less than the first doping concentration; and an image sensor on the second epitaxy semiconductor layer. | 10-09-2008 |
Jyh-Ming Kuo, Taipei TW
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20140137164 | IN-FLIGHT ENTERTAINMENT SYSTEMS AND METHODS FOR PROVIDING DIGITAL CONTENT IN AN AERIAL VEHICLE - An In-Flight Entertainment system is provided with a server unit and a display unit. The server unit is configured to maintain digital content. The display unit is configured to connect to the server unit through a wired network for receiving and presenting the digital content. The display unit further includes a wireless module for wirelessly transmitting the digital content received from the server unit to be presented by a first portable device. | 05-15-2014 |
Jyh-Ming Lee, Xinzhuang City TW
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20090194396 | Assembling structure of a quick installation/uninstallation switch - An assembling structure of a quick installation/uninstallation switch, including a layout fixing seat formed with a central opening and a transverse insertion slot intersecting the central opening. A locating member is inserted through the transverse insertion slot. The locating member is formed with a central hole corresponding to the central opening. A resilient locating member and at least one lateral projecting section with a guide slope are disposed on the circumference of the central hole. At least one resilient restoring member is disposed between the locating member and the layout fixing seat for restoring the locating member to its home position. A connecting end of a switch main body is fitted in the central opening. A lateral locating section with a guide slope is formed on a circumference of the connecting end corresponding to the lateral projecting section. A locating transverse slot is formed on the circumference of the connecting end. The resilient locating member is inlaid in the locating transverse slot. | 08-06-2009 |
Jyh-Ming Lin, Hsinchu City TW
Patent application number | Description | Published |
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20090113211 | PROCESSING UNIT INCLUDING A WIRELESS MODULE AND METHOD THEREOF - A processing unit includes a processing core and a wireless module directly connected to the processing core, wherein the wireless module is for providing wireless communications to the processing core. A multi-processor system includes a first processing unit having a first processing core and a first wireless module directly connected to the first processing core, the first wireless module for providing wireless communications to the first processing core; a second processing unit having a second processing core and a second wireless module directly connected to the second processing core, the second wireless module for providing wireless communications to the second processing core; and a wireless link between the first and second wireless modules; wherein the first processing unit is for communicating with the second processing unit via the wireless link. | 04-30-2009 |
Jyh-Ming Ting, Tainan TW
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20150114460 | CONDUCTIVE COMPOSITION AND APPLICATIONS THEREOF - The present invention relates to a conductive composition, comprising: poly-(3,4-ethylenedioxythiophene): poly-(styrenesulfonic acid); and a surfactant; in which the surfactant has a concentration of 1 to 10% by weight based on the total weight of the composition, and the conductive composition does not comprise any metal component. The present invention also relates to a cathode catalyst layer prepared by said conductive composition, and a method for preparing a cathode catalyst layer with said conductive composition. | 04-30-2015 |