Miyasaka, Nagano
Fumihisa Miyasaka, Nagano JP
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20120161311 | WIRING BOARD AND SEMICONDUCTOR PACKAGE - A wiring board includes a stacked body having a plurality of insulating layers and a plurality of wiring layers which are alternately stacked, and a solder-resist layer being formed on one side of the stacked body and covering the wiring layer exposed to the one side of the stacked body. The insulating layer is exposed to the other side of the stacked body. The solder-resist layer is in a transparent or semitransparent light yellow color. | 06-28-2012 |
Katsuyoshi Miyasaka, Nagano JP
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20080297778 | OPTICAL AXIS ADJUSTING DEVICE AND OPTICAL AXIS ADJUSTING METHOD USING THE SAME - An optical axis adjusting device for adjusting an optical axis in an optical head device may include a rotatable part which is turnably mounted on a main base so that the optical head device is capable of being turned with an axis X which is set to be at a spot position of one of the return light beams of the two laser beams. The optical axis adjusting device may include a correcting means for converting an optical axis shift on the light receiving face when the other laser beam is emitted to a non-corresponding optical medium, into an optical axis shift on the light receiving face when the other laser beam is emitted to the other corresponding optical medium. | 12-04-2008 |
20090022034 | OPTICAL HEAD DEVICE AND METHOD OF ADJUSTING CHARACTERISTIC OF OPTICAL HEAD DEVICE - In an optical head device having a laser light source, an output adjusting member for adjusting the output of laser light emitted from the laser light source and a frame for supporting the laser light source and the output adjusting member, the output adjusting member has an adjusting circuit board for adjusting an electrical resistance value, and a plurality of circuits on which chip resistors and short lands are connected to one another in parallel are connected in series. | 01-22-2009 |
Kazuya Miyasaka, Nagano JP
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20120181077 | PRINTED CIRCUIT BOARD UNIT - A printed circuit board unit includes: a printed circuit board including a through hole including first and second inner surfaces opposite to each other; a terminal pin including an insertion portion inserted into the through hole; solder filled into the through hole, and joining the printed circuit board with the terminal pin, wherein the insertion portion includes a base portion abutting the first inner surface, and a protruding portion including: a projection surface projecting from the base portion to the second inner surface and abutting the second inner surface; and a recess surface located at a rear side of the projection surface and spaced apart from the first inner surface, and a length of the protruding portion a thickness direction of the printed circuit board is greater than a thickness of the printed circuit board. | 07-19-2012 |
Kozo Miyasaka, Nagano JP
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20140142084 | NITROGEN-CONTAINING AROMATIC HETEROCYCLIC COMPOUND - Provided is a compound useful as a prophylactic and/or therapeutic agent for bladder cancer. | 05-22-2014 |
Makoto Miyasaka, Nagano JP
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20100059012 | CYLINDER LINER, CYLINDER BLOCK AND PROCESS FOR THE PREPARATION OF CYLINDER LINER - The present invention a cylinder liner which controls gap formation at the interface between the cylinder liner and a cylinder block main body for accepting the cylinder liner therein, and serves to acquire closely contacting state and enhanced bonding strength between the cylinder liner and the cylinder block main body, and to provide a cylinder block, and further to provide a process for the preparation of the cylinder liner. | 03-11-2010 |
Sakae Miyasaka, Nagano JP
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20150245483 | CIRCUIT BOARD AND VEHICLE BRAKE HYDRAULIC PRESSURE CONTROL UNIT - One embodiment provides a circuit board having a substrate and an electrode portion which is provided on the substrate. The electrode portion includes: a quadrangular land which is provided on a front surface of the substrate; a solder layer which is laminated on the whole of a front surface of the land; and a pad which is joined to a front surface of the solder layer. When the electrode portion is seen from thereabove, an outer circumferential line of the pad touches each of four sides of the land. Exposed portions where the solder layer is exposed are formed individually at four corners of a front surface of the electrode portion. And, the exposed portions are formed to have the same shape. | 08-27-2015 |
Tadashi Miyasaka, Nagano JP
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20090166851 | Power semiconductor module - A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base. | 07-02-2009 |
Takeshi Miyasaka, Nagano JP
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20130002068 | OUTER ROTOR-TYPE MOTOR - In the outer rotor-type motor, coil leads can be efficiently wired in small spaces of stator units. The outer rotor-type motor comprises: a stator being constituted by a plurality of the stator units, in each of which a coil is sandwiched between stator yokes having magnetic pole teeth; a rotor having a rotor yoke, which includes a permanent magnet and which is capable of rotating together with an output shaft; and lead terminals of a driving circuit for energizing the coils. Each of the stator yokes is constituted by a plurality of yoke parts and formed into a ring shape, the stator yokes surround outer circumferences of the coils, and coil leads are extended outward from the inner side of each of the coils via a gap between the outer circumference of the coil and the magnetic pole teeth. | 01-03-2013 |
20140241915 | ELECTRIC FLUID PUMP - An electric fluid pump includes: a case including a recess portion into which a fluid flows; a rotor arranged in the recess portion; an axial member supporting the rotor; and a flange member insert-molded with the case and the axial member, secured to an end portion of the axial member, and buried in a bottom wall portion of the recess portion, wherein the flange member includes: a first flange portion; a reduced portion closer to an inner surface of the bottom wall portion than the first flange portion, and smaller than the first flange portion in a radial direction; and a second flange portion closer to the inner surface than the reduced portion, larger than the first flange portion in the radial direction, and partially exposed from the inner surface, and the inner surface is flat. | 08-28-2014 |
Teruaki Miyasaka, Nagano JP
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20100064817 | BOURDON TUBE PRESSURE GAUGE - The bourdon tube pressure gauge includes: a joint which is made of the resin and is attached to a pressure container; and a bourdon tube which is made of metal and has a rear end fixed to the joint. The joint comprises a fixation hole into which the rear end of the bourdon tube is inserted to be fixed by bonding, and an inside of the fixation hole is more widened than an opening of the fixation hole which serves as an insertion port for the bourdon tube. | 03-18-2010 |
20100180689 | BOURDON TUBE PRESSURE GAUGE - A bourdon tube pressure gauge includes a joint which is made of resin and attached to a pressure container, and a bourdon tube which is made of metal and provided with a base end part fixed to the joint. The joint is formed with a fixing hole to which the base end part of the bourdon tube is inserted and adhesively fixed, and a side face of the fixing hole is formed with a recessed part which is recessed in a flattened direction of the base end part of the bourdon tube that is inserted into the fixing hole. Further, the recessed part is formed toward a depth side of the fixing hole and at least a part of the recessed part which is formed on an inner side of the fixing hole is formed wider in the flattened direction than an opening part of the fixing hole which is an insertion port of the bourdon tube. | 07-22-2010 |
Toshiji Miyasaka, Nagano JP
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20100175917 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board (package) has a structure in which multiple wiring layers are stacked one on top of another with insulating layers each interposed between corresponding two of the wiring layers, and the wiring layers are connected to one another through vias formed in each of the insulating layers. In a peripheral region of the package, reinforcing patterns are provided on the same surfaces where the corresponding wiring layers are provided, respectively. Each of the reinforcing patterns is formed of a conductive layer formed on the same surface where the corresponding one of the wiring layers is provided, and is provided in an intermittent ring-like shape when viewed in a planar view. | 07-15-2010 |
Yasushi Miyasaka, Nagano JP
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20140061672 | SEMICONDUCTOR DEVICE - A semiconductor device includes an active region in which current flows when the semiconductor device is in an on state and a breakdown voltage structure portion which surrounds the active region. In the active region, a MOS gate structure includes, a p well region, an n | 03-06-2014 |
Yoichi Miyasaka, Nagano JP
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20090029032 | METHOD FOR DISCHARGING LIQUID MATERIAL, METHOD FOR MANUFACTURING COLOR FILTER, AND METHOD FOR MANUFACTURING ORGANIC EL ELEMENT - A method for discharging a liquid material includes performing a scan by moving a discharge target having a film formation area and a plurality of nozzles forming a nozzle row, and discharging a liquid material containing a functional material from the nozzles onto the film formation area by selectively applying one of drive waveforms generated using time division to an energy generation element in synchronization with the scan. The method includes applying a first drive waveform to a first nozzle and a second drive waveform having a different discharge timing to a second nozzle with the second nozzle being adjacent to the first nozzle, and setting the combination of the first and second drive waveforms so that the number of the energy generation elements to which the first drive waveform is applied is the same as the number of the energy generation elements to which the second waveform is applied. | 01-29-2009 |