Patent application number | Description | Published |
20090320278 | ASSEMBLING DEVICE WITH COMPLEMENTARY RECEIVING MEMBERS - An assembling device for attaching a light guide plate and a reflecting member together is provided. The assembling device includes a first receiving member and a second receiving member. The first receiving member defines a first recess therein for accommodating the light guide plate. The second receiving member defines a second recess therein for accommodating the reflecting member. The assembling device has an open position and a closed position. The light guide plate is capable of being loaded in the first recess and the reflecting member is capable of being loaded in the second recess when the assembling device is in the open position. The first receiving member and the second receiving member are aligned with and parallel to each other when the assembling device is in the closed position. | 12-31-2009 |
20100046239 | LAMP HOUSING - A lamp housing includes a top plate and sidewalls. The top plate includes a first edge, a second edge, a first group of top-plate dissipation slots and a plurality of second top-plate dissipation slots. The first edge is opposite to the second edge. Each top-plate dissipation slot has the same width, and is rectangular. Each one of the plurality of first top-plate dissipation slots is separated by two widths thereof, and each of the plurality of second top-plate dissipation slots is separated by two widths thereof. The plurality of first top-plate dissipation slots is parallel and 20 to 24 slot widths away from the first edge toward the center of the top plate, and the plurality of second dissipation slots is parallel and 14 to 18 slot widths away from the second edge. A plurality of sidewall dissipation slots is provided on the sidewalls. | 02-25-2010 |
20100276118 | COOLING DEVICE FOR ILLUMINATION SOURCE - An exemplary cooling device includes a hollow cylinder and a number of fins. The hollow cylinder has a top end and an opposite bottom end. The fins are evenly distributed on an outer circumferentila surface of the hollow cylinder along radial directions. Each of the fins includes a first portion, a middle portion, and a second portion. A radial width of each fin measured along a direction perpendicular to a center axis of the hollow cylinder gradually decreases along each of the first and second portions toward the middle portion. | 11-04-2010 |
20110069930 | OPTICAL FIBER CONNECTOR HAVING STRENGTHENING UNIT - An optical fiber connector includes a shell, a lens and a strengthening unit. The shell includes a blind hole extended along a first direction for receiving a fiber and a through hole communicated with the blind hole and extended along a second direction perpendicular to the first direction. The lens is formed on the shell to align with a bottom of the blind hole. The lens is capable of optically coupling with the fiber in the blind hole. The strengthening unit is formed in the through hole. | 03-24-2011 |
20110097432 | INJECTION MOLD - An exemplary injection mold for manufacturing a fiber optic connector includes a first mold, a second mold, an insert, two first positioning bar, and four second positioning bars. The first mold and the second mold cooperatively define a mold cavity. The mold cavity includes two lens molding recesses. The two inserts are attached to the second mold and located in the mold cavity. A dimension of each second bar in cross section is substantially smaller than that of each first positioning bar. One first positioning bar and two second positioning bars are arranged around each insert to position the insert, such that the inserts is suspended in the mold cavity and precisely aligns with the respective molding recesses. | 04-28-2011 |
20110156082 | LED MODULE - An exemplary LED module includes a ceramic substrate, a heat spreader, a heat sink, an LED die, and a packaging layer. The substrate defines a hole extending therethrough from a top side to a bottom side thereof. The heat spreader is disposed in the hole with a top side thereof substantially coplanar with the top side of the substrate. An outer circumferential surface of the heat spreader contacts an inner circumferential surface of the substrate around the hole. The heat sink is attached to the top sides of the substrate and the heat spreader. The LED die is attached to a bottom side of the heat spreader, and the packaging layer encapsulates the LED die. | 06-30-2011 |
20110179927 | CUTTING STRUCTURE FOR PLASTIC FILM - A cutting structure for plastic film includes a bracket, a first roller, a second roller, a tachometer, a processor, a monitor and a cutter. The bracket includes a bottom and two sidewalls extending from the bottom along a same direction. The first roller includes a shaft fixed to the sidewalls and a sleeve rotatably sleeving on the shaft. The second roller is pivotally connected to the sidewalls. The tachometer is disposed on one end of the second roller and configured for measuring the rotation speed of the second roller. The processor is configured for reading the rotation speed and further calculating a rotation distance of the second roller. The monitor is configured for displaying the rotation distance. | 07-28-2011 |
20110244068 | APPARATUS FOR MOLDING OPTICAL FIBER CONNECTOR - An apparatus for molding optical fiber connector is provided. The optical fiber connector includes a main body. The main body has a blind hole for receiving an optical fiber two opposite surfaces being substantially parallel with the blind hole, and a lens portion aligned with the blind hole. The apparatus comprises a molding cavity and an insert for forming the blind hole. The molding cavity includes a central portion for forming the main body, a lens-forming portion for forming the lens portion, and two lateral portions for forming the corresponding surfaces. The molding cavity includes a first gate and a second gate for introducing molding material into the molding cavity. The first gate is located between the insert and one of the two lateral portions and the second gate is defined between the insert and the other one of the lateral potions. | 10-06-2011 |
Patent application number | Description | Published |
20100118454 | ESD PROTECTION CIRCUITRY WITH MULTI-FINGER SCRS - Self-triggered Multi-finger SCRs used in ESD protection circuitry capable of turning on all SCR fingers of the multi-finger SCRs include a first source, a second source, N SCR units, (N−1) diodes, and N resistors. Each of the N SCR units includes a first node, a second node coupled to the second source, and a trigger node. An nth diode of the (N−1) diodes is coupled between a first node of an nth SCR unit and a trigger node of an (n+1)th SCR unit. An nth resistor is coupled between the first node of the nth SCR unit and the first source, wherein n and N are integers. The (N−1) diodes can be replaced by directly coupled the first node of the nth SCR unit to the trigger node of the (n+1)th SCR unit when a trigger pulse is applied at the trigger node of a first SCR unit. | 05-13-2010 |
20110043953 | ESD PROTECTION CIRCUIT WITH MERGED TRIGGERING MECHANISM - An ESD protection circuit has a merged triggering mechanism. The ESD protection circuit comprises: an ESD detection circuit, for detecting an ESD voltage to generate a control signal; a first type ESD protection device, for outputting a first trigger current; a second type ESD protection device, for receiving a second trigger current; and a trigger circuit, for constituting a conductive path according to the control signal, such that the trigger circuit can receive the first trigger current from the first type ESD protection device and outputs the second trigger current to the second type ESD protection device. | 02-24-2011 |
20110207409 | ELECTROSTATIC DISCHARGE CIRCUIT USING INDUCTOR-TRIGGERED SILICON-CONTROLLED RECTIFIER - A representative electrostatic discharge (ESD) protection circuit includes a silicon-controlled rectifier comprising an alternating arrangement of a first P-type semiconductor material, a first N-type semiconductor material, a second P-type semiconductor material and a second N-type semiconductor material electrically coupled between an anode and a cathode. The anode is electrically coupled to the first P-type semiconductor material and the cathode is electrically coupled to the second N-type semiconductor material. The ESD protection circuit further includes an inductor electrically coupled between the anode and the second P-type semiconductor material or between the cathode and the first N-type semiconductor material. | 08-25-2011 |
20120099228 | ESD PROTECTION FOR RF CIRCUITS - An electrostatic discharge (ESD) circuit, adaptive to a radio frequency (RF) device, which includes a RF circuit coupled between a VDD power rail and a VSS power rail and having a RF I/O pad, includes an ESD clamp circuit coupled between a VDD power rail node and the VSS power rail node and a LC-tank structure coupled between the VDD power rail node and the VSS power rail node and to the RF I/O pad. The LC-tank structure includes a first ESD block between the VDD power rail node and the RF I/O pad, and a second ESD block between the VSS power rail node and the RF I/O pad. At least one of the first and second ESD blocks includes a pair of diodes coupled in parallel with each other and an inductor coupled in series with one of the pair of diodes. | 04-26-2012 |
20120170161 | ELECTROSTATIC DISCHARGE CIRCUIT FOR RADIO FREQUENCY TRANSMITTERS - A representative electrostatic discharge (ESD) protection circuit includes a silicon-controlled rectifier (SCR) that is electrically coupled to the output of a power amplifier; an ESD detection circuit that triggers the SCR responsive to detect an electrostatic discharge on an ESD bus; and an ESD clamp circuit that is coupled to the first voltage line. | 07-05-2012 |
Patent application number | Description | Published |
20080200123 | Mobile Phone, Wireless Transmission System, and Related Method Capable of Auto-Adjusting Call Alarms - A mobile phone capable of auto-adjusting call alarms collocates with a wireless transmission device that is separated from the mobile phone and can be carried by a user. The mobile phone includes a receiving device and a processing unit. The receiving device is used for receiving signals transmitted from the wireless transmission device. The processing unit is coupled to the receiving device for determining a distance between the wireless transmission device and the receiving device and for determining call alarms of the mobile phone according to the distance between the wireless transmission device and the receiving device. The processing unit sets the call alarms of the mobile phone to a preset alarm mode when the processing unit determines that the distance between the wireless transmission device and the receiving device is greater than a predetermined distance. | 08-21-2008 |
20100177059 | SENSING CIRCUIT AND METHOD FOR A CAPACITIVE TOUCH PANEL - A sensing method and circuit for a capacitive touch panel sense the capacitance variation of a lateral capacitor formed at the intersection of two traces of the capacitive touch panel, to distinguish a real point from a ghost point. A sensing cycle includes two non-overlapping clock phases. In the first clock phase, the voltages across the lateral capacitor and across a sensing capacitor are set. In the second clock phase, the voltage at a first terminal of the lateral capacitor is changed, and a second terminal of the lateral capacitor is connected to a first terminal of the sensing capacitor, causing a voltage variation at a second terminal of the sensing capacitor. This voltage variation is used to determine whether the intersection is touched. The sensing method and circuit reflect the status of the lateral capacitor in real-time and prevent the location of the touch point from being misjudged. | 07-15-2010 |
20100200310 | GROUP SCANNING CIRCUIT AND METHOD FOR A CAPACITIVE TOUCH SENSOR - For object detection, a two-step group scan to the traces of a capacitive touch sensor is performed, thereby dramatically shortening the overall scanning time and reducing noise effect. After all the traces are scanned by the pre-scan step to find out the trace of a touch point, the trace of the touch point and traces adjacent thereto are scanned by the re-scan step for more accurate positioning of the touch point. | 08-12-2010 |
20110037723 | FRONT-END SIGNAL DETECTOR AND METHOD FOR IMPROVING NOISE IMMUNITY OF A CAPACITIVE TOUCH SENSOR - A front-end signal detector and a method for improving noise immunity of a capacitive touch sensor start counting a preset time to trigger an interrupt signal responsive to a positive or negative edge of a periodic noise, to break the path through which a demodulated signal comes into a low-pass filter, to prevent noise from accumulating in the low-pass filter, and consequently mitigate the influence of the noise on the detection signal generated by the front-end signal detector. | 02-17-2011 |
20130194234 | SENSING CIRCUIT AND METHOD FOR A CAPACITIVE TOUCH PANEL - A sensing method and circuit for a capacitive touch panel sense the capacitance variation of a lateral capacitor formed at the intersection of two traces of the capacitive touch panel, to distinguish a real point from a ghost point. A sensing cycle includes two non-overlapping clock phases. In the first clock phase, the voltages across the lateral capacitor and across a sensing capacitor are set. In the second clock phase, the voltage at a first, terminal of the lateral capacitor is changed, and a second terminal of the lateral capacitor is connected to a first terminal of the sensing capacitor, causing a voltage variation at a second terminal of the sensing capacitor. This voltage variation is used to determine whether the intersection is touched. The sensing method and circuit reflect the status of the lateral capacitor in real-time and prevent the location of the touch point from being misjudged. | 08-01-2013 |
Patent application number | Description | Published |
20090179222 | SILICON CONTROLLED RECTIFIER - A silicon controlled rectifier structure of polygonal layouts is provided. The polygonal first conductive type doped region is located in the middle of the polygonal second conductive type well. The first conductive type well shaped as a polygonal ring surrounds the second conductive type well and the second conductive type doped region is located within the first conductive type well and shaped as a polygonal ring concentric to the first conductive type well. | 07-16-2009 |
20110149449 | HIGH-VOLTAGE-TOLERANT ESD CLAMP CIRCUIT WITH LOW LEAKAGE CURRENT FABRICATED BY LOW-VOLTAGE CMOS PROCESS - An electrostatic discharge (ESD) clamp circuit is provided, which includes a plurality of identical module circuits. The anode of the first module circuit is coupled to the cathode of the ESD clamp circuit. The anode of each of the other module circuits is coupled to the cathode of the previous module circuit. The cathode of the last module circuit is coupled to the ground terminal of the ESD clamp circuit. Each module circuit includes a conduction path and a detection circuit. The detection circuit is coupled to the anode, the cathode and the conduction path of the module circuit. When the rising speed of the voltage at the anode of the module circuit surpasses a threshold value, the detection circuit makes the conduction path conducting. | 06-23-2011 |
20110198678 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT - An electrostatic discharge (ESD) protection circuit, suitable for an input stage circuit including a first N channel metal oxide semiconductor (NMOS) transistor, is provided. The ESD protection circuit includes an P channel metal oxide semiconductor (PMOS) transistor and an impedance device, in which the PMOS transistor has a source coupled to a gate of the first NMOS transistor, and a drain coupled to a source of the first NMOS transistor, and the impedance device is coupled between a gate of the PMOS transistor and a first power rail to perform a initial-on ESD protection circuit. The ESD protection circuit formed by the PMOS transistor and the resistor is capable of increasing the turn-on speed of the ESD protection circuit and preventing the input stage circuit from a CDM ESD event. | 08-18-2011 |
20120290046 | LOAD-ADAPTIVE BIOELECTRIC CURRENT STIMULATOR - The disclosure relates to a load-adaptive bioelectrical current stimulator, which comprises a current output module, an adaptation module and a control module. The current output module generates a stimulus current to an electrode. The adaptation module detects the electrical status of the stimulus current passing through the electrode and generates a feedback signal to the control module. According to the feedback signal, the control module controls the current output module to stabilize the output status of the stimulus current adaptively. Thereby, the load-adaptive bioelectrical current stimulator can use the feedback control mechanism to regulate the value of the stimulus current to adapt to variation of load impedance. | 11-15-2012 |
20130172958 | CURRENT STIMULATOR - The disclosure relates to a current stimulator, which comprises a high voltage output module, a voltage control module and a charge pump module. The high voltage output module includes a plurality of stacked transistors, and receives an input control signal able to turn on/off the current stimulator and a first voltage. A second voltage is generated by adding the voltages output by all the transistors to the first voltage and then output to the voltage control module. The voltage control module outputs a voltage control signal able to stabilize the stimulus current for the load according to the second voltage and the load impedance variation. The charge pump regulates the first voltage according to the voltage control signal, and outputs the regulated first voltage to the high voltage output module. Thereby, the current stimulator can adaptively stabilize the stimulus current, responding to load impedance variation. | 07-04-2013 |
20130314826 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT - An electrostatic discharge (ESD) protection circuit, suitable for an input stage circuit including a first N channel metal oxide semiconductor (NMOS) transistor, is provided. The ESD protection circuit includes an P channel metal oxide semiconductor (PMOS) transistor and an impedance device, in which the PMOS transistor has a source coupled to a gate of the first NMOS transistor, and a drain coupled to a source of the first NMOS transistor, and the impedance device is coupled between a gate of the PMOS transistor and a first power rail to perform a initial-on ESD protection circuit. The ESD protection circuit formed by the PMOS transistor and the resistor is capable of increasing the turn-on speed of the ESD protection circuit and preventing the input stage circuit from a CDM ESD event. | 11-28-2013 |
Patent application number | Description | Published |
20120169491 | RELAY NODE PLACEMENT METHOD IN WIRELESS BODY SENSOR NETWORK - The present invention provides a Relay Node Placement Method in Wireless Body Sensor Network. It provides a sensor data collection location and a plurality of sensor locations. Then based on those sensor locations and their corresponding time delays, a sensor location data group is generated, then based on the sensor location data group, a set cover problem is set up. Through an approximation algorithm, within linear time, the solution of that set cover problem is then solved so as to decide the minimal quantity of the first relay nodes of the trunk of human body; moreover, based on a given human body model, a plurality of second relay node candidate locations, those first relay node and the sensor data collection location, a minimal spanning tree problem is set up so as to decide a plurality of second relay node locations. | 07-05-2012 |
20120173189 | METHOD AND MODULE FOR MEASURING ROTATION AND PORTABLE APPARATUS COMPRISING THE MODULE - The invention discloses a method and a module for measuring rotation and a portable apparatus comprising said module. The module of the present invention is adapted for measuring rotation of a target, and the module includes a first sensor, a second sensor and a processor. The first sensor is disposed at a first location of the target, for sensing a first centripetal acceleration and a first tangential acceleration when the target is rotated. The second sensor is disposed at a second location of the target, for sensing a second centripetal acceleration and a second tangential acceleration when the target is rotated. The processor is coupled to the first sensor and the second sensor, for receiving the first centripetal acceleration and the first tangential acceleration from the first sensor, receiving the second centripetal acceleration and the second tangential acceleration from the second sensor, and calculating the rotation angle of the target accordingly. | 07-05-2012 |
20130334551 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device comprising: a substrate having a first surface and a second surface, wherein the second surface is opposite to the first surface; a semiconductor structure formed on the first surface of the substrate, comprising a first type semiconductor layer, an active layer and a second type semiconductor layer; and an isolation region separating at least the active layer into a first part and a second part, wherein the first part is capable of generating the electromagnetic radiation, and the second part comprises a breakdown diode. | 12-19-2013 |
20140193932 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a light-emitting device comprises the steps of: providing a first substrate; forming a semiconductor structure on the first substrate, wherein the semiconductor structure comprises a first type semiconductor layer, a second type semiconductor layer, and an active layer between the first type semiconductor layer and the second type semiconductor layer; forming an isolation region through the second type semiconductor and the active layer to separate the semiconductor structure into a first part and a second part on the first substrate; and injecting an electrical current with a current density to the second part to make the second part to be permanently broken-down; wherein after the second part is permanently broken-down, the first part is capable of generating electromagnetic radiation and the second part is incapable of generating electromagnetic radiation. | 07-10-2014 |
20140264411 | LIGHT EMITTING DEVICE - This disclosure discloses a light-emitting chip comprises: a light-emitting stack, having a side wall, comprising an active layer emitting light; and a light-absorbing layer having a first portion surrounding the side wall and being configured to absorb 50% light toward the light-absorbing layer. | 09-18-2014 |
20150144984 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device comprises a semiconductor stack comprising a side, a first surface and a second surface opposite to the first surface, wherein the semiconductor stack further comprises a conductive via extending from the first surface to the second surface; a transparent conductive layer formed on the second surface; a first pad portion and a second pad portion formed on the first surface and electrically connected to the semiconductor stack; and an insulating layer formed between the first pad portion and the semiconductor stack and between the second pad portion and the semiconductor stack. | 05-28-2015 |
20150235857 | METHOD OF FORMING SUBSTRATE PATTERN - According to an exemplary embodiment, a method of forming a substrate pattern having an isolated region and a dense region is provided. The method includes the following operations: forming a first photoresist layer over the substrate; exposing the first photoresist layer through a first mask corresponding to the isolated region; developing the first photoresist layer to form a first pattern; forming a second photoresist layer over the substrate and the first pattern; exposing the second photoresist layer through a second mask corresponding to the substrate pattern; developing the second photoresist layer to form a second pattern; and etching the first pattern and the substrate to form the substrate pattern in the isolated region and the dense region. | 08-20-2015 |