Patent application number | Description | Published |
20090236631 | Bidirectional PNPN silicon-controlled rectifier - The present invention discloses a bidirectional PNPN silicon-controlled rectifier comprising: a p-type substrate; a N-type epitaxial layer; a P-type well and two N-type wells all formed inside the N-type epitaxial layer with the two N-type wells respectively arranged at two sides of the P-type well; a first semiconductor area, a second semiconductor area and a third semiconductor area all formed inside the P-type well and all coupled to an anode, wherein the second semiconductor area and the third semiconductor area are respectively arranged at two sides of the first semiconductor area, and wherein the first semiconductor area is of first conduction type, and the second semiconductor area and the third semiconductor area are of second conduction type; and two P-type doped areas respectively formed inside the N-type wells, wherein each P-type doped area has a fourth semiconductor area neighboring the P-type well and a fifth semiconductor area, and wherein both the fourth semiconductor area and the fifth semiconductor area are coupled to a cathode, and wherein the fourth semiconductor area is of second conduction type, and the fifth semiconductor area is of first conduction type. | 09-24-2009 |
20090273006 | Bidirectional silicon-controlled rectifier - The present invention discloses a bidirectional silicon-controlled rectifier, wherein the conventional field oxide layer, which separates an anode structure from a cathode structure, is replaced by a field oxide layer having floating gates, a virtual gate or a virtual active region. Thus, the present invention can reduce or escape from the bird's beak effect of a field oxide layer, which results in crystalline defects, a concentrated current and a higher magnetic field and then causes abnormal operation of a rectifier. Thereby, the present invention can also reduce signal loss. | 11-05-2009 |
20090287435 | SYSTEM-LEVEL ESD DETECTION CIRCUIT - An ESD detection circuit for detecting a level of an ESD voltage on a power rail is provided. The ESD detection circuit includes a resistive component, a diode unit, and a controller. The resistive component is coupled between a detection node and a ground node corresponding to the power rail. The diode unit is coupled between the power rail and the detection node in a forward direction toward the power rail. The controller, coupled to the detection node, is used for determining the level of the ESD voltage based on the voltage of the detection node and the breakdown voltage of the diode unit. | 11-19-2009 |
20100033164 | TRANSIENT NOISE DETECTION CIRCUIT - A transient noise detection circuit for detecting a level of a transient noise voltage is disclosed. The transient noise detection circuit comprises a triggering circuit, a rectifying circuit, and a controller. The triggering circuit is coupled between a power rail and a ground node. When the triggering circuit receives a transient noise, the triggering circuit generates a triggering signal. The rectifying circuit comprises a rectifying unit and a current-limiting unit coupled in series. When the rectifying unit receives the triggering signal from the triggering circuit, the rectifying unit will be triggered by the triggering signal. The controller is coupled to a detection node between the rectifying unit and the current-limiting unit. The controller is used for determining the level of the transient noise voltage based on the voltage of the detection node. | 02-11-2010 |
20120146151 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE - An electrostatic discharge (ESD) protection device including a substrate, a first doped region, a second doped region, and a third doped region, a gate and a plurality of contacts is disclosed. The substrate includes a first conductive type. The first doped region is formed in the substrate and includes a second conductive type. The second doped region is formed in the substrate and includes the second conductive type. The third doped region is formed in the substrate, includes the first conductive type and is located between the first and the second doped regions. The gate is formed on the substrate, located between the first and the second doped regions and comprises a first through hole. The contacts pass through the first through hole to contact with the third doped region. | 06-14-2012 |
Patent application number | Description | Published |
20110063434 | Monitor system for monitoring riverbed elevation change at bridge pier - A monitor system for monitoring riverbed elevation changes at bridge piers is revealed. The monitor system includes a container, a rail, a holder, a photographic unit, a processor and a transmission unit. The container is disposed at a pier under the water and the rail is mounted in the container. The holder is arranged at the rail and is moved on the rail. The photographic unit is disposed on the holder to capture a monitor image of a riverbed under the water. As to the processor, it processes the monitor image so as to learn elevation change of the riverbed under the water. By the transmission unit, the riverbed elevation change is sent to a remote monitor unit so as to get the riverbed elevation according to the riverbed elevation change. Thus the riverbed elevation change at the bridge pier is monitored in real time. | 03-17-2011 |
20110242309 | MULTI-LENS MONITORING SYSTEM FOR BED ELEVATION AROUND A PIER - The present invention relates to a multi-lens monitoring system for bed elevation around a pier according to the present invention comprises a container, a holder, a plurality of photographing units, and a processing module. The container is disposed on the pier; the holder is disposed inside the container; and the plurality of photographing units are disposed on the holder for photographing the bed under water and producing a monitoring image. The processing module is used for activating one of the plurality of photographing units for photographing the bed under water. The processing module also analyzes the monitoring image, gives the elevation variation of the bed, and transmits the elevation variation of the bed to a remote monitoring unit for real-timely monitoring and recording. During the monitoring process, the processing module will change activating one of the plurality of photographing units according to the monitoring image, and hence the electrical power can be saved. | 10-06-2011 |
20110255735 | PROBE MONITORING SYSTEM FOR RIVERBED ELEVATION MONITORING AT BRIDGE PIERS - A probe monitoring system for riverbed elevation monitoring at bridge piers is revealed. The system includes a housing, a measuring rod, a moving member, a control module, a photographic unit and a sensing unit. The housing is fixed on the pier. Both the moving member for driving the measuring rod and the control module for control of the moving member are mounted in the housing. When the control module drives the measuring rod to move downward and the sensing unit on the bottom of the measuring rod approaches the riverbed, a sensing signal is sent to the control module. Thus the moving member stops moving the measuring rod and the photographic unit takes pictures of the measuring rod to generate an image. Then the riverbed elevation is obtained according to the image or the movement of the moving member and is sent to a remote monitor unit for real-time monitoring. | 10-20-2011 |
20120127300 | TELESCOPIC PROBE MONITORING SYSTEM FOR RIVERBEDELEVATION MONITORING AT BRIDGE PIERS - A telescopic probe monitoring system for riverbed elevation monitoring at a bridge pier is revealed. The system includes a measurement module for measuring riverbed elevation under water and a control module. The measurement module includes a housing, a multi-layer tube, a driving member with scales, a photographic unit for capturing images, and a sensing unit. The control module controls the driving member to extend the multi-layer tube. Thus the sensing unit on the bottom of the multi-layer tube contacts the riverbed and then sends a sensing signal to the control module for stopping pushing the multi-layer tube and controlling the photographic unit to capture images of the driving member. According to the images and movement of the measurement module, the control module learns the riverbed elevation and sends the riverbed elevation to a remote monitor unit for real-time monitoring of the riverbed elevation. | 05-24-2012 |
Patent application number | Description | Published |
20110182554 | PHOTOELECTRIC CONNECTION SYSTEM WITH WAVEGUIDES - A photoelectric connection assembly includes a circuit board defining conductive pads on a first surface thereof and waveguides embedded therein, an electrical connector assembled to the circuit board and a light transmission module. The electrical connector includes a seat defining a first receiving cavity for receiving the conversion module and a second receiving cavity below the first receiving cavity, a cover rotatably associated with a rear end of the seat and rotating to shield the first receiving cavity and conductive terminals loaded on the seat. The terminals include contacting portions extending in the first receiving cavity for electrical connection with the conversion module and leg portions connecting with the conductive pads. The light transmission module is received in the second receiving cavity and includes conversion module. | 07-28-2011 |
20110188817 | OPTICAL BOARD HAVING SEPARATED LIGHT CIRCUIT HOLDING MEMBER AND OPTICAL LAYER - An optical board ( | 08-04-2011 |
20110223791 | BURN-IN-TEST SOCKET INCORPORATING WITH ACTUATING MECHANISM PERFECTING LEVELING OF DRIVING PLATE - A socket connector ( | 09-15-2011 |
20120076461 | ELECTRICAL SOCKET HAVING OPTICAL MODULE - An electrical socket ( | 03-29-2012 |
20120164887 | ELECTRICAL CONNECTOR WITH A COVER TRANSITIONALLY ASSEMBLED ON AN INCLINED SLIDING SLOT - An electrical connector includes an insulative housing defining a mounting face, a pair of pivotal grooves on opposite sides of a rear end of the housing and a pair of locking recesses in front of the pivotal grooves respectively; a plurality of contacts arranged in the housing and a metal shell defining a pair of pivotal posts assembled in the pivotal grooves and a pair locking tabs to couple with the pair of locking recesses in a condition that the metal shell rotates to cover on the insulating housing and move forwards. The pair of pivotal posts therebetween defines an axis paralleling to the mounting face and the axis of the pair of pivotal posts is closer gradually to the mounting face during forward movement of the metal shell. | 06-28-2012 |
20130244464 | ELECTRICAL CONNECTOR FOR FPC - An electrical connector includes an insulative housing, a plurality of contacts and an actuator. The insulative housing defines a front opening and a back receiving space. The receiving space defines a horizontal plane and a vertical plane connecting each other. The contacts include retaining portions, contacting portions and pressing portions. Each contacting portion and corresponding pressing portion extends oppositely from the retained portion. The actuator includes a base portion and several separate costal parts extending from the base portion. Adjacent costal parts are connected by a shaft and the pressing portions are against to the shaft. The actuator rotates around the shaft and defines a cambered surface at the costal parts, the cambered surface slides between the horizontal plane and the vertical plane. | 09-19-2013 |
20140099816 | TEST SOCKET WITH LOWER AND UPPER RETAINING COVER - A test socket includes an insulating seat defining a package-receiving room and loaded with a plurality of terminals, a retaining member retained on the insulating seat, a first cover and a second cover. The retaining member defines a first end and a second end. The first cover is assembled to the first end of the retaining member via a pivot pin at a lower end thereof The second cover is assembled to the second end of the retaining member via a second pivot pin at a lower end thereof The second cover presses against the first cover and is locked after the two covers rotate to close the package-receiving room. The first cover defines a pair of wheels at an upper end thereof and rolling along the second cover during the covers rotate downwards. | 04-10-2014 |
20140213113 | ELECTRICAL CONNECTOR AND ELECTRICAL CONTACTS OF THE SAME - An electrical contact for being loaded in an electrical connector electrically connecting an IC module to a printed circuit board (PCB) includes a first contact, a second contact and an elastic arm. The first contact includes a first mating portion and a first connecting portion. The first mating portion defines a first contacting end for connecting with the IC socket. The second contact includes a second mating portion and a second connecting portion. The second contacting portion defines a second contacting end for connecting with the PCB. The first and second connecting portions are coupled with each other, the first elastic element rings around the first mating portion of the first contact and presses against the second connecting portion of the second contact. | 07-31-2014 |
20150207268 | DUAL ORIENTATION ELECTICAL CONNECTOR ASSEMBLY - An electrical connector assembly includes a first connector and a second connector. The first connector includes a first terminal group and a first magnetic element around the first terminal group, the first terminal group defines a first central terminal and two first outer terminals located at both sides of the first central terminal. The second connector includes a second terminal group and a second magnetic element, the second terminal group defines a second central terminal, a second outer terminal and an elastic terminal located at both sides of the second central terminal. When the first connector is engaging with the second connector, the first and second magnetic elements are attached to each other, the first central terminal is contacting the second central terminal, the second outer terminal is contacting either of the first outer terminals and the elastic terminal is elastically abutting against the first magnetic element. | 07-23-2015 |
20160028191 | ELECTRICAL CONNECTOR WITH METALLIC SHELL FUNCTIONED AS NEGTIVE TERMINAL - An electrical connector includes an insulative housing, a positive terminal received in the housing and a metallic shell shielding around the mating portion. The housing has a base portion and a mating portion extending forwardly from the base portion. The metallic shell shields around the mating portion to form a first mating cavity opening forwardly and surrounding an outer surface of the mating portion. The mating portion has a second mating cavity recessed from a front face thereof to be separated from the first mating cavity and opening forwardly. The positive terminal has a contacting portion exposed in the second mating cavity. The metallic shell has at least one elastic pressing portion extending into the first mating cavity to be used as a negative terminal | 01-28-2016 |
Patent application number | Description | Published |
20120026449 | LIQUID CRYSTAL DISPLAY PANEL - A liquid crystal display (LCD) panel including a first substrate, a second substrate, a liquid crystal layer, a photo-curable sealant, and a first light-shielding pattern is provided. The liquid crystal layer is disposed between the first substrate and the second substrate. The photo-curable sealant is disposed between the first substrate and the second substrate, wherein the photo-curable sealant surrounds and is in contact with the liquid crystal layer. The first light-shielding pattern is disposed on the first substrate, wherein a portion of the sidewall of the first light-shielding pattern is substantially aligned with a portion of the sidewall of the first substrate, and the first light-shielding pattern is only overlapped with an outer edge of the photo-curable sealant or is not overlapped with the photo-curable sealant. | 02-02-2012 |
20120171425 | DISPLAY PANEL - A display panel has a display region and a peripheral region that surrounds the display region. The display panel includes a first substrate, a second substrate, a display medium, and a sealant. The first substrate has a first trench in the peripheral region, and the first trench has at least one sidewall. The second substrate is located opposite to the first substrate. The display medium is located between the first substrate and the second substrate. The sealant is located in the peripheral region between the first substrate and the second substrate. Specifically, the sealant is located in the first trench, and a distance between a sidewall of the sealant and the sidewall of the first trench ranges from about 0 um to about 700 um. | 07-05-2012 |
20140340625 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - A display panel, including a device substrate, an opposite substrate, a sealant, and a display medium, is provided. A pixel array of the device substrate is located in a display region, and a periphery circuit of the device substrate is located in a non-display region, wherein the periphery circuit includes at least one driving device, a planarization layer, and at least one wire. The planarization layer covers the driving device. The wire is located on the planarization layer, and the wire is electrically connected with the driving device and disposed to overlap the driving device. The opposite substrate is located opposite to the device substrate, and the sealant is located in the non-display region therebetween and covers the wire. The display medium is located between the device substrate, the opposite substrate, and the sealant. A manufacturing method of a display panel is also provided. | 11-20-2014 |
Patent application number | Description | Published |
20090198819 | Method and System for Providing the Internet Service with Advertisement - A method for providing an Internet service with advertisement is provided. First, a computing device installs an ad-playing application and runs the ad-playing application to request a telecommunication network for a connection to the Internet. Then, the telecommunication network establishes the connection for it and transfers advertisement to the computing device. Then, the ad-playing application plays the advertisement on the screen of the computing device. Last, the telecommunication network disconnects the connection when the advertisement is not played on the computing device. Moreover, A system for providing the Internet service with advertisement is disclosed in the specification. | 08-06-2009 |
20090215441 | Electronic System - An electronic system is provided. The electronic system comprises: a processor, a mobile device, a plurality of expansion ports and an expansion device. The mobile device can work as a standalone system, wherein the mobile device comprises a plurality of first function modules. The expansion device comprises a plurality of second function modules, wherein the expansion device connects to the mobile device through the plurality of expansion ports. When the mobile device and the expansion device are connected together to form the electronic device, the first processor controls the electronic system to perform the plurality of first and second function modules. | 08-27-2009 |
20100180160 | Communication System and Method for Monitoring and Remote Debugging - A communication system and a method adapted in the communication system for monitoring and remote debugging are provided. The communication system comprises a server, at least one terminal device and a customer service team end. The terminal device is to generate a terminal device data, wherein the terminal device further sends the terminal device data either unsolicitedly or on demand to the server, wherein the data processor further generates report files according to the terminal device data. The customer service team end is to retrieve the terminal device data and the report file from the server for to monitoring and remote debugging. | 07-15-2010 |
20110188413 | WIRELESS REPEATER DEVICE, METHOD AND SYSTEM FOR IMPLEMENTING CONTROL OF THE SAME IN A WIRELESS NETWORK SYSTEM - The invention relates to a wireless repeater device, a method and a system for implementing control of the device remotely over a wireless network. It is featured that the wireless repeater device is able to be configured by a direct control mode, an on-site mode and a remote control mode. Through the claimed system, a remote operator may access the wireless repeater device over a wireless network. The wireless repeater device particularly has a control modem circuit which is enabled by a mobile identification scheme, and the configuration can be performed over a mobile communication network. The signals carried with the control parameters from an operator end may be delivered in the form of SMS messages. | 08-04-2011 |
20110300850 | TWO-WAY WIRELESS COMMUNICATION APPARATUS AND SYSTEM APPLYING THE SAME - Disclosed is a two-way wireless communication apparatus. According to one embodiment of the present invention, the two-way wireless communication apparatus mainly includes a mobile communication module and a femtocell module. The mobile communication module has a first antenna for extending wireless signals, especially for extending the outdoor mobile communication signals. The femtocell module has a second antenna for providing a mobile coverage, especially for the end devices that user uses indoor. More particularly, the claimed two-way wireless communication apparatus uses a signaling means to link the mobile communication module and the femtocell module, and to exchange the downlink and uplink signals there-between. The two-way wireless communication apparatus is preferably capable of bridging at least two mobile communication networks. | 12-08-2011 |
20120100812 | MOBILE COMMUNICATION METHOD AND DEVICE THEREOF - A mobile communication method includes the following steps: local base station information of at least one local base station is received from the at least one local base station. When present mode is under test mode, connection information is obtained to replace the local base station information. A test connection to one of the at least one local base station is established according to the connection information to obtain mobile communication service through the test connection. | 04-26-2012 |
Patent application number | Description | Published |
20150054070 | Electrostatic Discharge Protection Device and Manufacturing Method Thereof - The present invention discloses an electrostatic discharge (ESD) protection device and a manufacturing method thereof. The ESD protection device includes: a P-type well, a gate structure, an N-type source, an N-type drain, and a P-type lightly doped drain. The P-type lightly doped drain is formed in the P-type well, and at least part of the P-type lightly doped drain is beneath a spacer of the gate structure to reduce a trigger voltage of the electrostatic discharge protection device. | 02-26-2015 |
20150137232 | LATERAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention discloses a lateral double diffused metal oxide semiconductor (LDMOS) device and a manufacturing method thereof. The LDMOS device includes: drift region, an isolation oxide region, a first oxide region, a second oxide region, a gate, a body region, a source, and a drain. The isolation oxide region, the first oxide region, and the second oxide region have an isolation thickness, a first thickness, and a second thickness respectively, wherein the second thickness is less than the first thickness. The present invention can reduce a conduction resistance without decreasing a breakdown voltage of the LDMOS device by the first oxidation region and the second oxidation region. | 05-21-2015 |
Patent application number | Description | Published |
20110024892 | THERMALLY ENHANCED HEAT SPREADER FOR FLIP CHIP PACKAGING - A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first surface being coupled to a substrate; a thermal interface material disposed in thermal conductive contact with the second surface of the die; and a heat spreader adapted for dissipating heat from the die, the heat spreader disposed in thermal conductive contact with the thermal interface material. The heat spreader includes a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the chamber, the lid being mounted to the substrate and a wick layer positioned in the chamber. | 02-03-2011 |
20110215463 | COMPRESSIVE RING STRUCTURE FOR FLIP CHIP PACKAGING - Flip chip packages having warpage control and methods for fabricating such packages are described. In one embodiment, the flip chip package comprises a package substrate; a chip coupled to the package substrate; and a ring structure coupled to the package substrate and positioned laterally around the periphery of the chip so that a surface of the chip is exposed, wherein the ring structure comprises one or more compressive members, each of the one or more compressive members compressively opposed to a surface of the package substrate to counter or absorb stresses in the package substrate. | 09-08-2011 |
20120098118 | COMPLIANT HEAT SPREADER FOR FLIP CHIP PACKAGING - An integrated circuit chip package is described. The integrated circuit package comprises a substrate, a chip attached to the substrate, and a heat spreader mounted over the chip for sealing the chip therein. The heat spreader includes a thermally-conductive element having a side opposed to the top of the chip for transmitting heat away from the chip to the heat spreader, and a compliant element having a first portion attached to and positioned around the periphery of the thermally-conductive element and a second portion affixed to a surface of the substrate. | 04-26-2012 |
20120182694 | Lid Design for Reliability Enhancement in Flip Chip Package - In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening. | 07-19-2012 |
Patent application number | Description | Published |
20120287579 | Board-Level Package With Tuned Mass Damping Structure - A board-level package includes a printed circuit board, a semiconductor die package mounted on the printed circuit board, a tuned mass structure, and a support structure mounted to the printed circuit board and supporting the tuned mass structure. | 11-15-2012 |
20130082372 | Package on Packaging Structure and Methods of Making Same - A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first package has a first substrate and through vias through the first substrate. A first set of conductive elements is aligned with and coupled to the through vias of the first substrate. A solid thermal coupler is coupled to the first set of conductive elements and to a die of the second package. A second set of conductive elements is coupled to the die and a bottom substrate is coupled to the second set of conductive elements. The thermal coupler may be, e.g., an interposer, a heat spreader, or a thermal conductive layer. | 04-04-2013 |
20130087892 | Electrical Connection for Chip Scale Packaging - A system and method for providing a post-passivation opening and undercontact metallization is provided. An embodiment comprises an opening through the post-passivation which has a first dimension longer than a second dimension, wherein the first dimension is aligned perpendicular to a chip's direction of coefficient of thermal expansion mismatch. By shaping and aligning the opening through the post-passivation layer in this fashion, the post-passivation layer helps to shield the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion. | 04-11-2013 |
20130119529 | SEMICONDUCTOR DEVICE HAVING LID STRUCTURE AND METHOD OF MAKING SAME - A semiconductor device includes a substrate, a first die attached to the substrate, and a lid coupled to the substrate. The lid defines a cavity for engaging the first die, and the lid has a die enclosure barrier having ends extending downwardly into the cavity. The ends of the die enclosure barrier are attached to the substrate and a thermal interface material is disposed between the first die and the lid, thermally connecting the first die to the lid. | 05-16-2013 |
20140021594 | Packaging Structures and Methods for Semiconductor Devices - Packaging structures and methods for semiconductor devices are disclosed. In one embodiment, a substrate for packaging a semiconductor device includes a core substrate, an insulating material disposed over the core substrate, and conductive lines disposed in the insulating material. Contact pads are disposed over the insulating material and the conductive lines. The contact pads are disposed in an integrated circuit mounting region of the core substrate. A solder mask define (SMD) material is disposed over the insulating material. Portions of the contact pads are exposed through openings in the SMD material. A stress-relief structure (SRS) is disposed in the SMD material proximate the contact pads. The SRS is disposed entirely in the integrated circuit mounting region of the core substrate. | 01-23-2014 |
20140264813 | Semiconductor Device Package and Method - Various packages and methods of forming packages are disclosed. In an embodiment, a package includes a hybrid encapsulant encapsulating a chip attached to a substrate. The hybrid encapsulant comprises a first molding compound and a second molding compound that has a different composition than the first molding compound. In another embodiment, a package includes an encapsulant encapsulating a chip attached to a substrate. A surface of the chip is exposed through the encapsulant. The encapsulant comprises a recess in a surface of a first molding compound proximate the surface of the chip. A thermal interface material is on the surface of the chip and in the recess, and a lid is attached to the thermal interface material. | 09-18-2014 |
20140264815 | Semiconductor Device Package and Method - Various packages and methods are disclosed. A package according to an embodiment includes a substrate, a chip attached to a surface of the substrate with electrical connectors, a molding compound on the surface of the substrate and around the chip, an adhesive on a surface of the chip that is distal from the surface of the substrate, and a lid on the adhesive. In an embodiment, a region between the molding compound and the lid at a corner of the lid is free from the adhesive. In another embodiment, the lid has a recess in a surface of the lid facing the surface of the molding compound. | 09-18-2014 |
20150041987 | 3D Packages and Methods for Forming the Same - Embodiments of the present disclosure include a semiconductor device, a package and methods of forming a semiconductor device and a package. An embodiment is a semiconductor device including a molding material over a first substrate with a first opening having a first width in the molding material. The semiconductor device further includes a second opening having a second width in the molding material with the second width being greater than the first width. A first connector is in the first opening and a second connector is in the second opening. | 02-12-2015 |
20150123257 | Semiconductor Device Package and Method - Various packages and methods of forming packages are disclosed. In an embodiment, a package includes a hybrid encapsulant encapsulating a chip attached to a substrate. The hybrid encapsulant comprises a first molding compound and a second molding compound that has a different composition than the first molding compound. In another embodiment, a package includes an encapsulant encapsulating a chip attached to a substrate. A surface of the chip is exposed through the encapsulant. The encapsulant comprises a recess in a surface of a first molding compound proximate the surface of the chip. A thermal interface material is on the surface of the chip and in the recess, and a lid is attached to the thermal interface material. | 05-07-2015 |
20150179617 | THERMALLY ENHANCED HEAT SPREADER - A three dimensional integrated circuit (3DIC) includes a first substrate and a heat spreading structure embedded in the first substrate. The 3DIC further includes a die electrically connected to the first substrate, wherein the die is thermally connected to the heat spreading structure. The 3DIC further includes a plurality of memory units on the die, wherein the die is between the plurality of memory units and the first substrate, and the plurality of memory units is thermally connected to the heat spreading structure by the die. The 3DIC further includes an external cooling unit on the plurality of memory units, wherein the plurality of memory units is between the die and the external cooling unit, and the die is thermally connected to the external cooling unit by the plurality of memory units. | 06-25-2015 |
20150200190 | Package on Packaging Structure and Methods of Making Same - A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first package has a first substrate and through vias through the first substrate. A first set of conductive elements is aligned with and coupled to the through vias of the first substrate. A solid thermal coupler is coupled to the first set of conductive elements and to a die of the second package. A second set of conductive elements is coupled to the die and a bottom substrate is coupled to the second set of conductive elements. The thermal coupler may be, e.g., an interposer, a heat spreader, or a thermal conductive layer. | 07-16-2015 |
20160111409 | 3D Packages and Methods for Forming the Same - Embodiments of the present disclosure include a semiconductor device, a package and methods of forming a semiconductor device and a package. An embodiment is a semiconductor device including a molding material over a first substrate with a first opening having a first width in the molding material. The semiconductor device further includes a second opening having a second width in the molding material with the second width being greater than the first width. A first connector is in the first opening and a second connector is in the second opening. | 04-21-2016 |
Patent application number | Description | Published |
20120188184 | DISPLAY HAVING A FRAME, TOUCH DISPLAY, AND METHOD OF MANUFACTURING A FRAME - A display having a frame, a touch display, and a method of manufacturing a frame are provided. The display includes a first frame, a second frame, and a display panel. The first frame includes a bottom surface, a sidewall, and a strengthened structure. The sidewall connects the bottom surface to define an accommodation space. The strengthened structure connects a terminal of the sidewall away from the bottom surface, is located at a side of the sidewall facing the accommodation space, and is substantially parallel to the sidewall. The strengthened structure has a contact surface. The contact surface faces the bottom surface and is substantially parallel to the bottom surface. The second frame is configured in the accommodation space and has a locking portion that has a locking surface leaning against the contact surface of the strengthened structure. The display panel is accommodated in the second frame. | 07-26-2012 |
20140332361 | TOUCH INDUCTIVE UNIT AND TOUCH PANEL - A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other. | 11-13-2014 |