Patent application number | Description | Published |
20100178754 | METHOD OF MANUFACTURING CMOS TRANSISTOR - A method of manufacturing a complementary metal-oxide semiconductor (CMOS) transistor includes: forming a semiconductor layer in which an n-MOS transistor region and a p-MOS transistor region are defined; forming an insulation layer on the semiconductor layer; forming a conductive layer on the insulation layer; forming a mask pattern exposing the n-MOS transistor region, on the conductive layer; generating a damage region in an upper portion of the conductive layer by implanting impurities in the conductive layer of the n-MOS transistor region using the mask pattern as a mask; removing the mask pattern; removing the damage region; and patterning the conductive layer to form an n-MOS transistor gate and a p-MOS transistor gate. Accordingly, gate thinning and formation of a step between the n-MOS transistor region gate and the p-MOS transistor region gate can be prevented. | 07-15-2010 |
20100210068 | Method of forming phase change memory device - Provided is a method of forming a phase change memory device, the method including washing and rinsing a phase change device structure. A phase change material layer may be formed on a semiconductor substrate. The phase change material layer may be etched so as to form a phase change device structure. The semiconductor substrate on which the phase change device structure is formed may be washed using a washing solution including a reducing agent containing fluorine (F), a pH controller, a dissolution agent and water. In addition, the semiconductor substrate on which the washing is performed may be rinsed. | 08-19-2010 |
20110136290 | ETCHING METHODS AND METHODS OF MANUFACTURING A CMOS IMAGE SENSOR USING THE SAME - In an etching method, a thin layer is formed on a first surface of a first substrate doped with first impurities having a first doping concentration. The thin layer is doped with second impurities having a second doping concentration lower than the first doping concentration. A second substrate is formed on the thin layer. A second surface of the first substrate is polished. The polished first substrate is cleaned using a cleaning solution including ammonia and deionized water. The cleaned first substrate is etched to expose the thin layer. | 06-09-2011 |
20120149185 | Methods Of Manufacturing Semiconductor Devices - Methods of manufacturing semiconductor devices include forming an integrated structure and a first stopping layer pattern in a first region. A first insulating interlayer and a second stopping layer are formed. A second preliminary insulating interlayer is formed by partially etching the second stopping layer and the first insulating interlayer in the first region. A first polishing is performed to remove a protruding portion. A second polishing is performed to expose the first and second stopping layer patterns. | 06-14-2012 |
20130065386 | MULTIPLE MOLD STRUCTURE METHODS OF MANUFACTURING VERTICAL MEMORY DEVICES - A first insulating interlayer is formed on a substrate including first and second regions. The first insulating interlayer has top surface, a height of which is greater in the first region than in the second region. A first planarization stop layer and a second insulating interlayer are formed. The second insulating interlayer is planarized until the first planarization stop layer is exposed. The first planarization stop layer and the first and second insulating interlayers in the second region are removed to expose the substrate. A lower mold structure including first insulation layer patterns, first sacrificial layer patterns and a second planarization stop layer pattern is formed. The first insulation layer patterns and the first sacrificial layer patterns are alternately and repeatedly formed on the substrate, and a second planarization stop layer pattern is formed on the first insulation layer pattern. | 03-14-2013 |
20130171788 | NON-VOLATILE MEMORY DEVICE HAVING VERTICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME - According to an example embodiment, a non-volatile memory device includes a semiconductor layer pattern on a substrate, a plurality of gate patterns and a plurality of interlayer insulating layer patterns that are alternately stacked along a side wall of the semiconductor layer pattern, and a storage structure between the plurality of gate patterns and the semiconductor layer pattern. The semiconductor layer pattern extends in a vertical direction from the substrate. The gate patterns are recessed in a direction from a side wall of the interlayer insulating layer patterns opposing the side wall of the semiconductor layer pattern. A recessed surface of the gate patterns may be formed to be vertical to a surface of the substrate. | 07-04-2013 |
20150200112 | METHODS OF FORMING CONDUCTIVE PATTERNS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME - The present disclosure herein relates to methods of forming conductive patterns and to methods of manufacturing semiconductor devices using the same. In some embodiments, a method of forming a conductive pattern includes forming a first conductive layer and a second conductive layer on a substrate. The first conductive layer and the second conductive layer may include a metal nitride and a metal, respectively. The first conductive layer and the second conductive layer may be etched using an etchant composition that includes phosphoric acid, nitric acid, an assistant oxidant and a remainder of water. The etchant composition may have substantially the same etching rate for the metal nitride and the metal. | 07-16-2015 |
20150255302 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method of manufacturing a semiconductor device. The method includes forming an underlying structure on a semiconductor substrate, forming a material layer on the semiconductor substrate having the underlying structure, the material layer including a first region having a first surface disposed at a first height from a surface of the semiconductor substrate and a second region having a second surface disposed at a second height lower than the first height, and planarizing the material layer. The planarization of the material layer includes coating an etchant on the material layer disposed on the semiconductor substrate, and selectively heating the first region of the material layer to increase an etch rate of the first region of the material layer more than an etch rate of the second region of the material layer. | 09-10-2015 |
20150355551 | SYSTEMS FOR REMOVING PHOTORESISTS AND METHODS OF REMOVING PHOTORESISTS USING THE SAME - A system for removing a photoresist includes a solution storage configured to store a preliminary photoresist removal solution, a solution activation unit configured to convert the preliminary photoresist removal solution from the solution storage into an activated photoresist removal solution, and a photoresist removal unit configured to receive the activated photoresist removal solution from the solution activation unit, and configured to load a substrate including a photoresist pattern formed thereon. | 12-10-2015 |