Patent application number | Description | Published |
20080244255 | Method for not resetting memory while booting computer through hardware booting button thereof - A method for not resetting a memory while booting a computer through a hardware booting button is adapted to utilize a general hardware booting mode and increases steps that judges whether preset values are respectively stored in specific address of the memory. If it is the preset value, allowing the memory to be reset is not executed before booting sequences are executed, the booting sequences are directly processed and data stored in the memory is allowed to maintain so that it will not happen that the data stored in the memory is cleared to cause embarrassment to a user because the memory is not reset. | 10-02-2008 |
20090002937 | HEAT-DISSIPATING MODULE CONNECTING TO A PLURALITY OF HEAT-GENERATING COMPONENTS AND RELATED DEVICE THEREOF - A heat-dissipating module includes a heat pipe and a heat-dissipating device. The heat pipe has a first end and a second end. The first end is connected to a first heat-generating component. The second end is connected to a second heat-generating component. The heat-dissipating device is disposed on the heat pipe and is located between the first end and the second end. The heat-dissipating device is used for dissipating heat generated by the first heat-generating component and conducted from the first end of the heat pipe, and heat generated by the second heat-generating component and conducted from the second end of the heat pipe. | 01-01-2009 |
20100154838 | METHOD FOR REDUCING ADHESION OF DUST TO A FAN, AND HOUSING DEVICE HAVING A DUST REMOVING UNIT - A housing device includes a housing, a fan, and a dust removing unit. The housing defines an air passage. The fan is provided in the housing, and is located at a distal end of the air passage for exhausting air from the housing. The dust removing unit includes an airflow interfering member and an adhering member. The airflow interfering member is provided within the housing, and is located upstream of the fan for interfering with flow of air toward the fan. The adhering member is provided downstream of the airflow interfering member and upstream of the fan for adhering dust entrained in the air flowing toward the fan. The dust falling down onto the adhering member when the airflow is interfered by the airflow interfering member. | 06-24-2010 |
20100259889 | Electronic Device - An electronic device is provided, including a processing unit and a G-sensor electrically connected thereto. The G-sensor detects the posture of the electronic device and outputs a measurement signal to the processing unit accordingly. The processing unit produces a thermal control signal according to the measurement signal, so as to reduce heat generated from the electronic device or increase cooling efficiency of the electronic device. | 10-14-2010 |
20100275560 | HOUSING FOR A CENTRIFUGAL FAN, THE CENTRIFUGAL FAN, AND ELECTRONIC DEVICE HAVING THE CENTRIFUGAL FAN - A housing for a centrifugal fan includes a surrounding wall extending upwardly from a periphery of a bottom wall with an air inlet, and including a surrounding wall body defining an opening, a protruding wall body extending outwardly from the surrounding wall body, corresponding to the opening, and having a dust-discharging hole, and a shielding plate disposed on the protruding wall body. The surrounding wall body and the bottom wall cooperatively define an accommodation space communicated with the air inlet, and an air outlet communicated with the accommodation space. The protruding wall body, the shielding plate, and the bottom wall cooperatively define a turbulence space communicated with the accommodation space. The shielding plate is movable between a closed position to close the dust-discharging hole, and an open position to open the dust-discharging hole so as to permit fluid communication between the turbulence space and the outside environment. | 11-04-2010 |
20100296946 | PRESSURE SENSING DEVICE FOR ELECTRONIC DEVICE AND PRESSURE SENSING METHOD AND THERMAL DISSIPATION DEVICE THEREOF - A pressure sensing device for an electronic device includes a pressure sensing unit, a control unit, and an alarm unit. The pressure sensing unit is installed in the electronic device, and used for detecting fluid pressure to generate a pressure signal. The control unit is coupled to the pressure sensing unit, and used for determining variation in the fluid pressure in the electronic device according to the pressure signal and generating a control signal. The alarm unit is coupled to the control unit, and used for outputting an alarm signal according to the control signal to execute an alarm function. | 11-25-2010 |
20110235277 | HEAT PIPE CAPABLE OF TRANSFORMING DYNAMIC ENERGY INTO ELECTRIC ENERGY AND RELATED HEAT-DISSIPATING MODULE - A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a heat-dissipating end. The conductive capillary layer is formed on an inner wall of the conductive hollow case. A liquid stored in the conductive capillary layer can be heated to evaporate by the heat-generating component and then move toward the second end. The piezoelectric component is connected to the conductive capillary layer. The flexible component is disposed at a side of the piezoelectric component for being driven by the evaporated liquid so as to exert force upon the piezoelectric component. Thus, the piezoelectric component can generate electric energy, which can be transmitted from the conductive capillary layer to the conductive hollow case. | 09-29-2011 |
Patent application number | Description | Published |
20090184425 | Conductive line structure and the method of forming the same - The conductive line structure of a semiconductor device including a base; at least one patterned conductive layer formed over the base; a conductive line formed over the at least one patterned conductive layer; a protection layer that encompasses the top surface and sidewall of the conductive line to prevent undercut generated by etching. The structure further comprises an underlying layer under the conductive line. The underlying layer includes Ni, Cu or Pt. The conductive line includes gold or copper. The at least one patterned conductive layer includes at least Ti/Cu. The protection layer includes electro-less plating Sn, Au, Ag or Ni. | 07-23-2009 |
20120077340 | CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME - The conductive line structure of a semiconductor device including a base; at least one patterned conductive layer formed over the base; a conductive line formed over the at least one patterned conductive layer; a protection layer that encompasses the top surface and sidewall of the conductive line to prevent undercut generated by etching. The structure further comprises an underlying layer under the conductive line. The underlying layer includes Ni, Cu or Pt. The conductive line includes gold or copper. The at least one patterned conductive layer includes at least Ti/Cu. The protection layer includes electro-less plating Sn, Au, Ag or Ni. | 03-29-2012 |
20130313011 | INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal carrier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer. | 11-28-2013 |
20140102772 | PACKAGING CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE STRUCTURE - A packaging carrier includes an interposer, a dielectric layer and a built-up structure. The interposer has a first surface and a second surface opposite to each other, and a plurality of first pads and second pads located on the first surface and the second surface, respectively. The dielectric layer has a third surface and a fourth surface opposite to each other. The interposer is embedded in the dielectric layer. The second surface of the interposer is not covered by the fourth surface of the dielectric layer, and has a height difference with the fourth surface. The built-up structure is disposed on the third surface of the dielectric layer and electrically connected to the first pads of the interposer. | 04-17-2014 |
20140138142 | INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer. | 05-22-2014 |
20150097318 | MANUFACTURING METHOD OF INTERPOSED SUBSTRATE - A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal cattier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. | 04-09-2015 |
Patent application number | Description | Published |
20120055653 | Heat Dissipating Unit And Heat Dissipating Device Having The Heat Dissipating Unit - A heat dissipating unit includes a plurality of heat dissipating fins arranged in an annular array and each including a flow guide plate extending from an inner side to an outer side of the annular array, two connecting plates respectively connected to and forming an angle with two opposite sides of the flow guide plate, and an air inlet and an air channel communicating fluidly with each other. Each connecting plate includes a connecting hole, a slanting edge opposite to the flow guide plate, and a connecting portion projecting from the slanting edge. The connecting portions of the connecting plates of each heat dissipating fin engage respectively the connecting holes in the connecting plates of an adjacent heat dissipating fin. The heat dissipating fins overlap each other so that the air inlets of the heat dissipating fins are arranged in a staggered manner. | 03-08-2012 |
20120155023 | ELECTRONIC DEVICE - An electronic device includes a housing unit, a first electronic component, a heat-dissipating module, and an air-guide passage. The first electronic component, the heat-dissipating module, and the air-guide passage are disposed in the housing unit. The heat-dissipating module includes a fan unit and a heat-dissipating sink. The fan unit has a first air outlet zone and a second air outlet zone. The heat-dissipating sink is for dissipating heat generated by the first electronic component. The heat-dissipating sink is substantially aligned with the first air outlet zone. The air-guide passage is in spatial communication with the second air outlet zone and is formed with a passage air outlet. Air through the first air outlet zone flows in a first direction. Air through the passage air outlet is directed into the housing unit and flows in a second direction different from the first direction. | 06-21-2012 |
20130107461 | FIXING MECHANISM AND RELATED ELECTRONIC DEVICE | 05-02-2013 |
20130250513 | ELECTRONIC APPARATUS - An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space. | 09-26-2013 |
20130252532 | ELECTRONIC APPARATUS - An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space. | 09-26-2013 |
20130309061 | FAN CONTROL SYSTEM AND FAN CONTROLLING METHOD THEREOF - A fan control system and a fan controlling method thereof are disclosed. The fan control system is used to an electronic apparatus for controlling an air pump fan device. The fan controlling method includes following steps: setting a plurality of vibrating working periods of the air pump fan device; setting a plurality of vibrating frequencies of the air pump fan device, wherein each vibrating frequency has a different vibrating frequency value; detecting a temperature of the electronic apparatus; determining whether the temperature of the electronic apparatus exceeding a first setting temperature; and if yes, controlling the air pump fan device to vibrate according to the plurality of vibrating frequencies during the plurality of vibrating working periods, wherein adjacent vibrating working periods of the plurality of vibrating working periods correspond to different vibrating frequency values. | 11-21-2013 |
20140308128 | FAN SYSTEM - A fan system suitable for an electronic device is provided. The fan system includes a fan module and a fan protecting module. The fan module includes a base and a fan blade assembly. The base is disposed at the electronic device and has a chamber. The fan blade assembly includes a fan blade and a shaft portion. The fan blade is fixed on the shaft portion. The shaft portion is rotatably contained in the chamber. The fan protecting module includes an electromagnetic component and an accelerometer. The electromagnetic component is disposed at a position adjacent to the shaft portion. The accelerometer is disposed in the electronic device and coupled to the electromagnetic component. When an acceleration of the electronic device detected by the accelerometer is greater than a threshold value, the electromagnetic component applies magnetic force to the shaft portion to prevent the shaft portion from overly shifting or deflecting. | 10-16-2014 |
20140330877 | ELECTRONIC CALCULATOR AND CONTROL METHOD THEREOF - An electronic calculator and a control method thereof are provided. The electronic calculator includes a display module, a key array, and a processing chip. The key array includes a plurality of keys. The keys include at least a turn-on key. The turn-on key has a first hardware configuration and a second hardware configuration. The processing chip detects the triggering of the keys to execute corresponding calculation functions and control image display of the display module. The electronic calculator enters a turned-on state in response to the triggering of the turn-on key. When the turn-on key is triggered, the processing chip controls the electronic calculator to keep or clear an operation information stored before the electronic calculator is turned off according to whether the turn-on key is set to the first hardware configuration or the second hardware configuration. | 11-06-2014 |
20140332185 | HEAT INSULATING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND HEAT DISSIPATING SYSTEM INCLUDING THE SAME - A heat dissipating system is disclosed to be disposed in a casing of an electronic apparatus in which a heat source is disposed. The heat dissipating system includes a heat dissipating device and a heat insulating device. The heat dissipating device is in contact with the heat source and has a predetermined heat dissipating path for dissipating heat generated by the heat source. The heat insulating device includes a first layer that is in contact with one of the heat source and the heat dissipating device, and a second layer that is bonded to the first layer and that cooperates with the first layer to define an evacuated space therebetween. | 11-13-2014 |
20140345830 | DC MOTOR DEVICE AND DC FAN USING THE SAME - A heat dissipating device includes a substrate, a plurality of fins, and a heat pipe. The substrate has a plurality of retaining holes. Each of the fins includes a heat dissipating sheet and a retaining sheet extended from the heat dissipating sheet and passing through one of the retaining holes. The heat pipe is disposed on the fins. | 11-27-2014 |
20150018053 | PORTABLE ELECTRICAL DEVICE WITH HEAT DISSIPATION MECHANISM - A portable electrical device with heat dissipation mechanism includes a housing with an acoustic hole, an earphone receptacle with a earphone hole, and two fans. The earphone receptacle and the fans are disposed in the housing. The fans are respectively located adjacent to the acoustic hole and the earphone hole, and generate airflow passing through the acoustic hole and the earphone hole. Thus, the portable electrical device dissipating heat utilizes the holes existing on the housing, without additional heat-dissipation holes. | 01-15-2015 |
20150022138 | FORCE FEEDBACK MECHANISM AND RELATED ELECTRONIC DEVICE AND OPERATION METHOD - A force feedback mechanism disposed inside a casing for vibration balance of the casing is disclosed in the present invention. The force feedback mechanism includes an accelerator, a force generator and a controller. The accelerator detects an acceleration parameter of the casing. The force generator respectively generates an effective force at a first direction and a second direction. The first direction is substantially opposite to the second direction. The controller is electrically connected to the accelerator and the force generator. The controller obtains and analyzes absolute value and vector of the acceleration parameter, and drives the force generator to generate the corresponding effective force according to the absolute value and the vector. | 01-22-2015 |
20150030437 | Fan Device and Electronic Device Thereof - A fan device and an electronic device thereof are disclosed. The fan device is disposed in a casing of the electronic device and adjacent to a board of the casing, wherein the board has a first state and a second state. The fan device includes a plurality of fan blades, a shaft, and a ball. The shaft is connected to the plurality of fan blades and allows the plurality of fan blades rotating with the shaft, wherein at least one end of the shaft has a ball accommodating portion and an opening. The ball is disposed in the ball accommodating portion and limited by the opening for not separate from the ball accommodating portion. When the board is in the first state, a gap is between the ball and the casing. When the board is in the second state, the board and the ball touch each other. | 01-29-2015 |
20150039138 | VIBRATION SUPPRESSING APPARATUS AND VIBRATION SUPPRESSING METHOD THEREOF - A vibration suppressing apparatus and a vibration suppressing method thereof are provided. The vibration amplitude, vibration frequency, and vibration phase of a vibration suppressing unit are adjusted in real-time according to the vibration amplitude, vibration frequency and vibration phase of a vibration source. | 02-05-2015 |
20150069856 | ELECTRONIC DEVICE MODULE, ELECTRONIC DEVICE THEREOF, PROTECTION ELEMENT THEREOF AND METHOD OF RAISING WORKING FREQUENCY THEREOF - An electronic device module, an electronic device thereof, a protection element thereof and a method of raising working frequency thereof are provided. The electronic device module comprises the electronic device and the protection element. The electronic device comprises a main body, a device detection element and a central processing unit (CPU), wherein the device detection element and the CPU are disposed within the main body. The protection element comprises a protection cover and a protection detection element, wherein the protection detection element is disposed on the protection cover. The CPU raises a working frequency thereof according to an approaching movement between the device detection element and the protection detection element. | 03-12-2015 |
20150116921 | ELECTRONIC DEVICE - An electronic device includes a first body, a second body, a first rotary shaft and a flexible display panel. The second body is movably connected to the first body and is adapted to lean against the first body or separate from the first body. The first rotary shaft is pivotally connected to the first body. The flexible display panel is connected between the first and second bodies. When the second body is at the first position, a first section of the flexible display panel is rolled around the first rotary shaft, and a second section of the flexible display panel is expanded between the first and second bodies. When the second body is at the second position, a part of the first section and the second section are expanded between the first and second bodies. | 04-30-2015 |
20150137723 | ELECTRONIC APPARATUS AND PROTECTING METHOD THEREOF - An electronic apparatus includes a first casing, a protected device, a detector, a first actuator and a controller. The protected device is spaced apart from the first casing by a first shortest distance. The detector is configured to detect a first early sign before a first collision of the first casing and the protected device. The controller is configured to actuate the first actuator after the detector detects the first early sign, causing an increase of the first shortest distance. | 05-21-2015 |