Patent application number | Description | Published |
20090022003 | MEMORY CELL STRUCTURES, MEMORY ARRAYS, MEMORY DEVICES, MEMORY CONTROLLERS, AND MEMORY SYSTEMS, AND METHODS OF MANUFACTURING AND OPERATING THE SAME - Example embodiments are directed to memory cell structures, memory arrays, memory devices, memory controllers, and memory systems using bipolar junction transistor (BJT) operation. | 01-22-2009 |
20090097332 | Semiconductor memory device - A semiconductor memory device includes a memory cell array including a plurality of memory cells having a transistor with a floating body, a source line driver configured to control the source lines to select the memory cells in response to an address signal, a source line voltage generation unit configured to generate a source line target voltage, receive an source line output voltage from the source line driver, compare the level of the source line output voltage with the level of the source line target voltage, generate a source line voltage of which the level is adaptively varied according to a temperature, and a sense amplifier configured to sense a difference in current flowing through the bit lines in response to data read from a selected memory cell, amplify the difference to a level having high output driving capability and output the amplified current. | 04-16-2009 |
20090175063 | SEMICONDUCTOR MEMORY DEVICE INCLUDING MEMORY CELL ARRAY HAVING MEMORY CELLS USING FLOATING BODY TRANSISTORS - A semiconductor memory device includes a memory cell array, which includes a cell array having multiple cell blocks. Each cell block includes source and word lines arranged in one direction, bit lines arranged in a perpendicular direction, and memory cells having corresponding floating bodies. Adjacent memory cells share source or drain regions to form common source or drain regions, respectively. The source regions are arranged in a word line direction and connected to corresponding source lines, and the drain regions are arranged in the bit line direction and connected to corresponding bit lines. Gates of the memory cells are arranged in the word line direction and are connected to form the word lines. The source lines are formed on a layer of the word lines, and the bit lines are formed at a different layer to be insulated from the word and source lines. | 07-09-2009 |
20090175098 | SEMICONDUCTOR MEMORY DEVICE INCLUDING FLOATING BODY TRANSISTOR MEMORY CELL ARRAY AND METHOD OF OPERATING THE SAME - A semiconductor memory device includes a memory cell array including a plurality of memory cells, where each memory cell includes a transistor with a floating body region in which majority carriers are accumulated in a steady state. In write and read operations, a first data state corresponding to the steady state is written to and read from at least one selected memory cell of the memory cell array by supplying a first bipolar current through the at least one selected memory cell, and a second data state is written to and read from the at least one selected memory cell by supplying a second bipolar current which is smaller than the first bipolar current through the at least one selected memory cell. In a refresh operation, memory cells of the memory cell array storing the second data state are refreshed | 07-09-2009 |
20090262587 | Semiconductor memory device - A semiconductor memory device includes a plurality of memory cell array blocks connected to word lines, source lines, and bit lines, each memory cell array including memory cells each having a transistor with a floating body, a reference voltage generator configured to have a reference memory cell and generate a reference voltage for bit line sensing corresponding to a current flowing into a reference memory cell during a data read operation, first and second prechargers configured to precharge a bit line connected to non-selected memory cells to the reference voltage in response to first and second precharge control signals during the data read operation, and a sense amplifier configured to sense and amplify a voltage difference between a bit line connected to the selected memory cells and a bit line connected to the non-selected memory cells during the data read operation. | 10-22-2009 |
20090278194 | Capacitorless one-transistor semiconductor memory device having improved data retention abilities and operation characteristics - A capacitorless one transistor (1T) semiconductor device whose data storage abilities are increased and leakage current is reduced is provided. The capacitor-less 1T semiconductor device includes a buried insulating layer formed on a substrate, an active region formed on the buried insulating layer and including a source region, a drain region and a floating body formed between the source region and the drain region, and a gate pattern formed on the floating body, wherein the floating body includes a main floating body having the same top surface height as one of the source region and the drain region, and a first upper floating body formed between the main floating body and the gate pattern. | 11-12-2009 |
20090290402 | Semiconductor memory devices and methods of arranging memory cell arrays thereof - A semiconductor memory device and a method of arranging a memory cell array of the semiconductor device are provided. The semiconductor memory device has a memory cell array including a word line pair including a first word line and a second word line that are arranged in a first direction, a source line arranged in the first direction between the first word line and the second word line, a bit line pair including a first bit line and a second bit line arranged in a second direction perpendicular to the first direction, a first memory cell including a gate connected to the first word line and first and second regions respectively connected to the second bit line and the source line, and arranged in a third direction between the first direction and the second direction, and a second memory cell including a gate connected to the second word line, a third region and the second region respectively connected to the first bit line and the source line, and arranged in the third direction. The first word line and the second word line are simultaneously activated. Therefore, disturbance that may be generated between adjacent memory cells in the semiconductor memory cell can be prevented, integration density of the semiconductor memory device can be enhanced, and the number of word lines to be driven may be reduced to employ a sub-word line structure. | 11-26-2009 |
20100018760 | Semiconductor device and semiconductor package including the same - A semiconductor device includes a first substrate including at least one first well region and first impurity regions on portions of the substrate and a bias voltage plate on a surface of the substrate. A semiconductor device may be of a three dimensional stack structure, and in example embodiments, the semiconductor device may further include a through contact plug substantially perpendicularly penetrating at least one substrate and at least one bias voltage plate. Therefore, a design margin of a semiconductor device may be enhanced and a bias voltage may be provided reliably. | 01-28-2010 |
20100090280 | Transistors, semiconductor memory cells having a transistor and methods of forming the same - Transistors, semiconductor memory cells having a transistor and methods of forming the same are provided, the transistors may include a semiconductor substrate having a first semiconductor region. A gate pattern may be disposed on the first semiconductor region. Spacer patterns may each be disposed on a sidewall of the gate pattern. Second semiconductor regions and a third semiconductor regions may be disposed in the semiconductor substrate. The second semiconductor regions may be disposed under the spacer patterns. The third semiconductor regions may be disposed adjacent to the second semiconductor regions. The first semiconductor region may have a higher impurity ion concentration than the second semiconductor regions. | 04-15-2010 |
20100118616 | Semiconductor memory device - A semiconductor memory device having shared sense amplifiers is provided. The semiconductor memory device has a bit-line selector disposed closer to a memory cell array than a column decoder. When the column decoder outputs a bit-line indication signal corresponding to the number of bit lines, the bit-line selector selects a plurality of bit lines in response to the bit-line indication signal. Thus, it is possible to reduce the number of signals output from the column decoder. | 05-13-2010 |
20100118631 | Semiconductor memory devices with mismatch cells - A semiconductor memory device having the mismatch cell makes a capacitance difference between a bit line pair relatively large during a read operation using at least one dummy memory cell as a mismatch cell selected together with a corresponding memory cell. Therefore, data of a semiconductor memory device may be detected more easily. | 05-13-2010 |
20100124135 | Semiconductor memory devices having hierarchical bit-line structures - The semiconductor memory device includes a memory cell array and a switching circuit. The memory cell array includes a plurality of first memory cells connected between word lines and first local bit lines, and a plurality of second memory cells connected between the word lines and second local bit lines. The switching circuit is configured to respectively connect the first local bit lines to first global bit lines during a first sensing period, and to respectively connect the second local bit lines to second global bit lines during a second sensing period of a reading operation. The semiconductor memory device further includes a sensing circuit configured to sense and amplify data from the first global bit lines during the first sensing period, and to sense and amplify data from the second global bit lines during the second sensing period of the reading operation. | 05-20-2010 |
20100149886 | Semiconductor memory device and method for operating the same - In example embodiments, the semiconductor memory device, and the method for operating the semiconductor memory device, includes a memory cell array having a plurality of memory cells each formed of a transistor having a floating body. The transistors are coupled between a plurality of word lines, a plurality of source lines and a plurality of bit lines. Additionally, the memory cell array includes a controller configured to read data from at least one of the memory cells and restore data to the memory cell storing a first data state through a bit operation of the memory cell. The controller restores data to the memory cell by applying a first source-line control voltage to a selected source line and applying a first word-line control voltage to a selected word line in a first period of a read operation. Also, the controller is configured to restore data to the memory cell, which is storing a second data state, by applying a second source-line control voltage to the selected source line and applying a second word-line control voltage to the selected word line in a second period of the read operation. | 06-17-2010 |
20100149898 | Antifuses and program circuits having the same - Antifuses and program circuits having the same. The antifuses are embodied as a transistor. When a first power supply voltage is applied to a source, a first program voltage for causing impact ionization is applied to a gate and drain, and a second program voltage for causing channel initiated secondary electron/channel initiated secondary hole (CHISEL/CHISHL) is applied to a well, a dielectric material may be ruptured between the gate adjacent to the drain and the well so that an antifuse may be programmed. | 06-17-2010 |
20100173503 | TRAP CHARGE EQUALIZING METHOD AND THRESHOLD VOLTAGE DISTRIBUTION REDUCING METHOD - A method reduces a threshold voltage distribution in transistors of a semiconductor memory device, where each transistor includes a nitride liner. The method includes injecting electrons into a charge trap inside and outside the nitride liner of the transistors, and partially removing the electrons injected into the charge trap inside and outside the nitride liner to equalize trapped charges in the transistors. | 07-08-2010 |
20110013464 | Semiconductor memory device having hierarchical bit line structure and method of driving the semiconductor memory device - The semiconductor memory device includes a first memory cell array including at least one first memory cell and at least one second memory cell corresponding to the at least one first memory cell, a first low bit line connected to the at least one first memory cell, a first low complementary bit line connected to the at least one second memory cell, a first switch unit having a first terminal connected to the first low bit line, a second switch unit having a first terminal connected to the first low complementary bit line, a first global bit line connected to a second terminal of the first switch unit, a first global complementary bit line connected to a second terminal of the second switch unit, and a plurality of sensing amplifying units connected to the first global bit line and the first global complementary bit line. | 01-20-2011 |
20110013469 | Redundancy circuits and semiconductor memory devices - A redundancy circuit includes at least one fuse set circuit and a fuse control circuit. The at least one fuse set circuit includes a plurality of fuse cells, each of the plurality of fuse cells having a first transistor and a second transistor having same sizes. The first transistor has a first contact resistance and the second transistor has a second contact resistance different from the first contact resistance. Each of the plurality of fuse cells stores a fuse address indicating a defective cell in a repair operation and outputs a repair address corresponding to the stored fuse address. The fuse control circuit, connected to the plurality of fuse cells, controls the plurality of fuse cells in response to a program signal and a precharge signal such that the corresponding fuse address is stored in each of the fuse cells. | 01-20-2011 |
20110221001 | Memory cell structures, memory arrays, memory devices, memory controllers, and memory systems, and methods of manufacturing and operating the same - Example embodiments are directed to memory cell structures, memory arrays, memory devices, memory controllers, and memory systems using bipolar junction transistor (BJT) operation. | 09-15-2011 |
20110305069 | NONVOLATILE MEMORY DEVICE USING RESISTANCE MATERIAL AND MEMORY SYSTEM INCLUDING THE NONVOLATILE MEMORY DEVICE - A nonvolatile memory device includes: a memory array including a plurality of memory banks which are arranged in a first direction; a write global bit line and a read global bit line extending in the first direction to be shared by the memory banks; a write circuit connected to the write global bit line and disposed on a first side of the memory array; and a read circuit connected to the read global bit line and disposed on a second side of the memory array opposite the first side of the memory array, wherein each of the memory banks extends in a second direction different from the first direction and comprises a plurality of nonvolatile memory cells, each of the nonvolatile memory cells having a variable resistive element whose resistance value varies according to data stored therein. | 12-15-2011 |
20120033489 | MEMORY DEVICE, PRECHARGE CONTROLLING METHOD THEREOF, AND DEVICES HAVING THE SAME - A pre-charge controlling method and device are provided. The pre-charge controlling method includes pre-charging a first global bit line with a first pre-charge voltage by using at least a first pre-charge circuit located between a plurality of sub arrays included in a memory cell array and pre-charging the first global bit line with a second pre-charge voltage by using a second pre-charge circuit located outside the memory cell array. | 02-09-2012 |
20120039141 | VOLTAGE CONTROL METHOD AND MEMORY DEVICE USING THE SAME - A memory device is provided, which includes a plurality of global bit lines, a discharge line, a switching circuit configured to connect the plurality of global bit lines to the discharge line in response to a discharge enable signal, a first discharge circuit configured to apply a first voltage that is higher than a ground voltage to the discharge line, a precharge circuit configured to apply a precharge voltage to a selected global bit line among the plurality of global bit lines, and a second discharge circuit configured to discharge the selected global bit line to a second voltage that is higher than the ground voltage. | 02-16-2012 |
20120063244 | VOLTAGE GENERATOR, NONVOLATILE MEMORY DEVICE COMPRISING VOLTAGE GENERATOR, AND METHOD OF OPERATING VOLTAGE GENERATOR - A voltage generator comprises a first booster that generates a first high voltage, and a second booster that generates a second high voltage by boosting an external voltage. The first booster comprises a comparator that controls a boosting operation with reference to the fed back first high voltage and uses the second high voltage as a drive voltage. | 03-15-2012 |
20120092946 | MEMORY DEVICES AND MEMORY SYSTEMS INCLUDING DISCHARGE LINES AND METHODS OF FORMING - A non-volatile memory device can include a word line that is operatively coupled to a non-volatile memory cell. A local bit line can be operatively coupled to the non-volatile memory cell. A discharge line that is associated with the local bit line can be configured to discharge the local bit line and a discharge diode can be electrically coupled between the local bit line and the discharge line. | 04-19-2012 |