Tenmei
Hiroyuki Tenmei, Chiyoda-Ku JP
Patent application number | Description | Published |
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20100171213 | SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE - A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate. | 07-08-2010 |
20140183730 | SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE - A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate. | 07-03-2014 |
Hiroyuki Tenmei, Tokyo JP
Patent application number | Description | Published |
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20090109641 | Wafer of circuit board and joining structure of wafer or circuit board - A wafer (or a circuit board), which is used to perform three-dimensional mounting, has protrusion | 04-30-2009 |
20090134498 | SEMICONDUCTOR APPARATUS - The present invention includes a semiconductor element provided with an electrode passing through front and back sides. The electrode is formed as a cylinder including a hollow portion, and stress relaxing material is provided in the hollow portion, which is used to reduce stress that is induced between the semiconductor element and the electrode. The stress relaxing material is an elastic body made of resin material. | 05-28-2009 |
20130140067 | WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD - A wafer (or a circuit board), which is used to perform three-dimensional mounting, has protrusion | 06-06-2013 |
Hiroyuki Tenmei, Odawara JP
Patent application number | Description | Published |
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20090072414 | BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED THEREBY - A bonding method (three-dimensional mounting) of semiconductor substrates is provided to sequentially bond a principal surface of a silicon wafer on which coupling bumps are formed, and a principal surface of the other silicon wafer on which pads are formed, by an adhesive applied to at least one of the principal surfaces. However, there is a problem of poor electrical coupling due to displacement of the bumps and the pads when bonded together. The present invention solves such a problem by conducting temporary positioning of the silicon wafers, adjusting the positions of the coupling bumps and pads while confirming the positions by a method such as x-ray capable of passing through the silicon wafers, and bonding the bumps and the pads together while hardening an interlayer adhesive provided between the principal surfaces of the silicon wafers by thermocompression. | 03-19-2009 |