Wu, Miaoli County
Chia-Hung Wu, Miaoli County TW
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20120255592 | PHOTOVOLTAIC PANEL AND MANUFACTURING METHOD THEREOF - A photovoltaic panel includes a photovoltaic array, an electrically conductive busbar, a plurality of electrically conductive fingers and an electrically conductive ribbon. The electrically conductive busbar is disposed on the photovoltaic array and having a plurality of connection ribs. The electrically conductive fingers are disposed on the photovoltaic array and connected with the connection ribs respectively. The electrically conductive ribbon is soldered on the electrically conductive busbar, wherein a gap is formed between each electrically conductive finger and the electrically conductive ribbon. | 10-11-2012 |
Chia Shui Wu, Miaoli County TW
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20090032256 | THROTTLE UNIT FOR DUMP BAILER AND METHOD OF BLOCKING A WATER OUT ZONE IN A PRODUCTION WELL UTILIZING THE SAME - A method of blocking a water out zone in a production well includes the steps of connecting a throttle unit to a dump bailer, wherein the throttle unit is internally defined a flowing space, which can be adjusted in size to thereby control a flow rate of cement for blocking the water out zone; loading the cement into the dump bailer; slowly lowering down the loaded dump bailer to the water out zone in the production well; opening an outlet of the dump bailer under control, so that the cement flows from the dump bailer into the throttle unit and is released at a flow rate preset by adjusting the size of the flowing space; allowing the released cement to load up in the water out zone and slowly permeate into a gravel layer in the production well before becoming cured to block the water out zone. | 02-05-2009 |
Chien-Hua Wu, Miaoli County TW
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20080200041 | STORAGE DEVICE - The present disclosure relates to a storage device. The storage device comprises a frame having a hole and a printed circuit board embedded in the frame, wherein the printed circuit board has an extended part for forming a connector. The connector may pass through the hole and is exposed out the frame for interfacing the storage device with a host device. At least one memory device is mounted to the printed circuit board and electrically connected to the printed circuit board. | 08-21-2008 |
20100238683 | FLEXIBLE LIGHT-EMITTING APPARATUS - A flexible light-emitting apparatus including a side light-emitting flexible light guide rod, two light emitting diodes, and two lenses is provided. The side light-emitting flexible light guide rod has a first end, a second end opposite to the first end, and a light-emitting surface connecting the first and the second ends. The LEDs are respectively disposed beside the first end and the second end and adapted for emitting light beams toward the side light-emitting flexible light guide rod, respectively. One of the lenses is located between the first end and the LED disposed beside the first end, and the other lens is located between the second end and the LED disposed beside the second end. Each of the light beams enters the side light-emitting flexible light guide rod through the corresponding lens and is transmitted to the outside of the side light-emitting flexible light guide rod through the light-emitting surface. | 09-23-2010 |
Chien I. Wu, Miaoli County TW
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20090032256 | THROTTLE UNIT FOR DUMP BAILER AND METHOD OF BLOCKING A WATER OUT ZONE IN A PRODUCTION WELL UTILIZING THE SAME - A method of blocking a water out zone in a production well includes the steps of connecting a throttle unit to a dump bailer, wherein the throttle unit is internally defined a flowing space, which can be adjusted in size to thereby control a flow rate of cement for blocking the water out zone; loading the cement into the dump bailer; slowly lowering down the loaded dump bailer to the water out zone in the production well; opening an outlet of the dump bailer under control, so that the cement flows from the dump bailer into the throttle unit and is released at a flow rate preset by adjusting the size of the flowing space; allowing the released cement to load up in the water out zone and slowly permeate into a gravel layer in the production well before becoming cured to block the water out zone. | 02-05-2009 |
Chih Mang Wu, Miaoli County TW
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20090073856 | OPTICAL HEAD WITH DIFFUSER STRUCTURE - An optical head for reading an object includes a hollow housing, a light source module, a diffuser structure and a light sensing module. The light source module is fixed in the hollow housing and provides an initial light ray. The diffuser structure is connected the hollow housing, receives the initial light ray, and processes the initial light ray into a uniform light ray for output. The initial light ray is reflected by the diffuser structure multiple times to form the uniform light ray. The light sensing module is fixed in the hollow housing and senses the uniform light ray reflected by the object. An optical axis of the light sensing module is substantially parallel to an axial direction of the diffuser structure. | 03-19-2009 |
20100006747 | OPTICAL HEAD THAT CAN BE EASILY ASSEMBLED - An optical head that can be easily assembled is for reading an image of an object and includes a housing, a diffuser, a light source module and a light sensing module. The diffuser is connected to the housing. The light source module has a substrate and a first light source mounted on a front side of the substrate. The front side of the substrate is fixed to an external surface of the diffuser. The first light source provides an initial light ray incident to the diffuser. The diffuser processes the initial light ray into uniform light for output. The light sensing module fixed in the housing senses reflected light, which is generated from the uniform light reflected by the object. | 01-14-2010 |
Chih-Wen Wu, Miaoli County TW
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20160026331 | TOUCH DISPLAY DRIVING CIRCUIT CAPABLE OF RESPONDING TO CPU COMMANDS - A touch display driving circuit capable of responding to CPU commands, including: a first interface receiving touch configuration data from a CPU and outputting touch report data to the CPU; a second interface coupling with a touch display module; a control unit executing a touch detection procedure on the touch display module via the second interface to derive touch detected data, and processing the touch detected data to generate the touch report data, wherein the touch detection procedure is determined according to the touch configuration data determining a connection configuration of at least one multiplexer and a weighting configuration of at least one touch point, and the content of the touch report data include a sensed pressure profile, a finger print, a palm print, an ear image, characteristics of a finger print, characteristics of a palm print, or characteristics of an ear image. | 01-28-2016 |
Chi Lung Wu, Miaoli County TW
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20100164143 | NUCLEATING AGENT AND INJECTION MOLDING METHOD OF POLYETHYLENE TEREPHALATE - The invention relates to a nucleating agent for polyethylene terephthalate and injection molding method thereof. The nucleating agent comprises a SiO | 07-01-2010 |
Chin-Lang Wu, Miaoli County TW
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20090108496 | METHOD FOR PACKAGING LIGHT EMITTING DIODE - A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode. | 04-30-2009 |
20090111951 | BLEND AND PACKAGING MATERIAL UTILIZING THE SAME - The disclosed is a blend including 20 to 80 parts by weight of polycarbonate, 20 to 80 parts by weight of polyarylate, and 20 to 80 parts by weight of copolymer having a formula as below: | 04-30-2009 |
20090111966 | COPOLYMER AND METHOD FOR MANUFACTURING THE SAME AND PACKAGING MATERIAL UTILIZING THE SAME - The disclosed is a copolymer having a formula as: | 04-30-2009 |
20130164510 | HIGH THERMALLY CONDUCTIVE COMPOSITES - Disclosed is a high thermally conductive composite, including a first composite and a second composite having a co-continuous and incompatible dual-phase manner. The first composite consists of glass fiber distributed into polyphenylene sulfide, and the second composite consists of carbon material distributed into polyethylene terephthalate. The carbon material includes graphite, graphene, carbon fiber, carbon nanotube, or combinations thereof. | 06-27-2013 |
Chung-Han Wu, Miaoli County TW
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20160118510 | SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME - A solar cell includes a semiconductor substrate, a boron back surface field (BSF) layer, a passivation layer, a back electrode layer and an aluminum local BSF layer. The semiconductor substrate has a front surface and a back surface opposite to each other. The boron BSF layer is disposed in the semiconductor substrate beneath the back surface. The passivation layer is disposed over the boron BSF layer and has an opening through the passivation layer. The back electrode layer is disposed in the opening. The aluminum local BSF layer is disposed in the semiconductor substrate beneath the opening and in contact with the boron BSF layer and the back electrode layer. | 04-28-2016 |
Chun-Ming Wu, Miaoli County TW
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20100279484 | Method of making multi-layer structure for metal-insulator-metal capacitor - The present invention discloses a method of making a multi-layer structure for metal-insulator-metal capacitors, in which, a bottom electrode plate layer is formed on a substrate, wherein a Ti/TiN layer serving as a top anti-reflection coating (top ARC) of the bottom electrode plate layer including a titanium layer and a titanium nitride layer formed on the titanium layer is formed using a first and a second physical vapor deposition (PVD) processes at a temperature ranging from 25 to 400° C., and then a first capacitor dielectric layer, a middle electrode plate layer, a second capacitor dielectric layer, and a top electrode plate layer are formed on the bottom electrode plate layer in an order from bottom to top. | 11-04-2010 |
Hsing-Hua Wu, Miaoli County TW
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20160118510 | SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME - A solar cell includes a semiconductor substrate, a boron back surface field (BSF) layer, a passivation layer, a back electrode layer and an aluminum local BSF layer. The semiconductor substrate has a front surface and a back surface opposite to each other. The boron BSF layer is disposed in the semiconductor substrate beneath the back surface. The passivation layer is disposed over the boron BSF layer and has an opening through the passivation layer. The back electrode layer is disposed in the opening. The aluminum local BSF layer is disposed in the semiconductor substrate beneath the opening and in contact with the boron BSF layer and the back electrode layer. | 04-28-2016 |
Jeah-Sheng Wu, Miaoli County TW
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20140124244 | CONDUCTIVE PLATE AND FILM EXHIBITING ELECTRIC ANISOTROPY - A method for making a conductive film exhibiting electric anisotropy comprises forming a nanomaterial on a substrate, the nanomaterial having a cluster of interconnected nanounits, each of which being substantially transverse to the substrate and having one end bonded to the substrate. The method further includes stretching the nanounits along a first direction to remove the nanomaterial from the substrate so as to form a conductive film having strings of interconnected nanounits, where the nanounits of the strings substantially extend in the first direction. A conductive plate and a method for making the same is also disclosed, where the method further comprises attaching the conductive film to a second substrate. | 05-08-2014 |
Kuei-Sheng Wu, Miaoli County TW
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20140061855 | CAPACITOR STRUCTURE AND FABRICATING METHOD THEREOF - A capacitor structure includes a first conductive structure, a dielectric structure, a first capacitor electrode, a capacitor dielectric layer, and a second capacitor electrode. The first conductive structure is disposed over a substrate. The dielectric structure is disposed over the substrate and partially enclosing the first conductive structure. The dielectric structure has a trench. A first surface of the first conductive structure is exposed through the trench of the dielectric structure. The first capacitor electrode is disposed on a bottom and a sidewall of the trench. The first capacitor electrode is electrically contacted with the first surface of the first conductive structure. The capacitor dielectric layer is disposed on a surface of the first capacitor electrode. The second capacitor electrode is disposed on a surface of the capacitor dielectric layer and filled in the trench. | 03-06-2014 |
20140332952 | SEMICONDUCTOR STRUCTURE AND METHOD FOR TESTING THE SAME - A semiconductor structure comprising a substrate, a dielectric layer, a conductor post, a first conductive layer structure and a second conductive layer structure is provided. The substrate comprises an opening structure. The dielectric layer is disposed on a sidewall of the opening structure. The conductor structure is disposed in the opening structure and covers the dielectric layer. The first and second conductive layer structures are electrically connected to the conductor post. A voltage difference is existed between the first and second conductive layer structures, such that a current is passing through the first conductive layer structure, the opening structure and second conductive layer structure. A resistance values is related to the voltage difference and the current. A dimension of the opening structure is 10 times greater than a dimension of the first and second conductive layer structures. | 11-13-2014 |
20150014828 | Semiconductor Device Having Shielding Structure - The present invention provides a semiconductor device with a shielding structure. The semiconductor device includes a substrate, an RF circuit, a shielding structure and an interconnection system. The substrate includes an active side and a back side. The RF circuit is disposed on the active side of the substrate. The shielding structure is disposed on the active side and encompasses the RF circuit. The shielding structure is grounded. The shielding structure includes a shielding TST which does not penetrate through the substrate. The interconnection system is disposed on the active side of the substrate. The interconnection system includes a connecting unit electrically connect a signal to the RF circuit. | 01-15-2015 |
20150041952 | SEMICONDUCTOR STRUCTURE - A semiconductor structure is provided. The semiconductor structure includes an interposer structure. The interposer structure includes an interposer substrate, a ground, through vias, a dielectric layer, and an inductor. The through vias are formed in the interposer substrate and electrically connected to the ground. The dielectric layer is on the interposer substrate. The inductor is on the dielectric layer. | 02-12-2015 |
20150332996 | INTERPOSER AND METHOD OF FABRICATING THE SAME - The present invention provides an interposer including multiple circuit designs and an uppermost circuit design disposed on the circuit designs. A maximum exposure region is defined as a maximum size which can be defined by a single shot of a lithographic scanner. The sizes of the circuit designs below the uppermost circuit design are smaller than the size of the maximum exposure region. Therefore, the circuit designs are respectively formed by only a single shot of the lithographic scanner. The uppermost circuit design has a length greater than the length of the maximum exposure region, so that the circuit design is formed by stitching two photomasks lithographically. | 11-19-2015 |
20160064314 | INTERPOSER STRUCTURE AND MANUFACTURING METHOD THEREOF - The present disclosure relates to an interposer structure and a manufacturing method thereof. The interposer structure includes a first dielectric layer, a conductive pad, and a bump. The conductive pad is disposed in the first dielectric layer, wherein a top surface of the conductive pad is exposed from a first surface of the first dielectric layer, the conductive pad further includes a plurality of connection feet, and the connection feet protrude from a bottom surface of the conductive pad to a second surface of the first dielectric layer. The bump is disposed on the second surface of the first dielectric layer, and the bump directly contacts to the connection feet. Through the aforementioned interposer structure, it is sufficient to achieve the purpose of improving the electrical performance of the semiconductor device and avoiding the signal being loss through the TSV. | 03-03-2016 |
20160093687 | CAPACITOR STRUCTURE AND FABRICATING METHOD THEREOF - The present invention provides a method for fabricating a capacitor structure, including the steps of: providing a substrate; forming a first conductive structure and a dielectric structure over the substrate, wherein the first conductive structure is enclosed by the dielectric structure; forming a first trench in the dielectric structure, so that a first surface of the first conductive structure is exposed through the first trench; forming a first capacitor electrode and a capacitor dielectric layer on a bottom and a sidewall of the first trench and on a top surface of the dielectric structure, so that the first capacitor electrode is electrically contacted with the first surface of the first conductive structure; and removing the first capacitor electrode and the capacitor dielectric layer on the top surface of the dielectric structure; forming a second capacitor electrode on a surface of the capacitor dielectric layer. A capacitor structure is also provided. | 03-31-2016 |
Kun Chan Wu, Miaoli County TW
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20090017518 | Magnetic particles and fabrication method thereof - A magnetic particle and fabrication method thereof. The magnetic particle comprises a polymer core, a magnetic material layer covering the polymer core, and a silicon containing layer covering the magnetic material layer. In addition, the magnetic particle may further comprise a coupling agent on the silicon containing layer, and an active molecule connected to the coupling agent. The magnetic particles provide controllable size, uniform diameter distribution, high magnetization, improved storage stability, and modified surface for targeting biomolecules for biomaterial separation and environmental analysis. | 01-15-2009 |
Kun-Lieh Wu, Miaoli County TW
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20130048530 | BIOSENSOR DISPOSABLE APPARATUS - A disposal apparatus for biosensor includes a coupling member and a capsular wrapper. The capsular wrapper includes a space having a closed end and an open end to hold a biosensor. The coupling member has a coupling portion connecting to the closed end and a test strip adapter with two ends respectively formed a test strip insertion end and a test strip extended slot. The test strip insertion end passes through the slot and inserts into a test strip loading port of the biosensor. The capsular wrapper encases the biosensor to allow the test strip insertion end to insert into the test strip loading port. Through coupling of the test strip adapter, the biosensor can perform testing. After the testing is finished, the coupling member and the test strip can be wrapped together by the capsular wrapper and be discarded, thus avoiding user being contaminating with samples on the test strip. | 02-28-2013 |
20140031636 | ELECTROCHEMICAL AND OPTICAL TEST SPECIMEN - An electrochemical and optical test specimen includes an electrochemical test portion and an optical test portion. The electrochemical test portion has an electrochemical blood sampling port. The optical test portion has an optical blood sampling port. The electrochemical test portion and optical test portion abut each other, and the electrochemical blood sampling port and optical blood sampling port are located on the same side. Thus one blood sampling operation at the electrochemical blood sampling port and optical blood sampling port can be finished simultaneously to perform electrochemical test and optical test at the same time. Therefore the advantages of the electrochemical and optical tests can be integrated to achieve higher accuracy and lower cost to meet test requirements. | 01-30-2014 |
Kuo-Yu Wu, Miaoli County TW
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20150364383 | METHOD OF CALIBRATING OR EXPOSING A LITHOGRAPHY TOOL - A method of calibrating or monitoring an exposing tool including forming a substrate pattern in a substrate, wherein forming the substrate pattern includes providing a first patterned photo resist layer having an etch coating layer disposed thereon and using the first patterned photo resist layer and the etch coating layer to pattern an underlying layer. The patterned underlying layer is then used as a masking element when etching the substrate pattern into the substrate. A second photo resist pattern is formed over the substrate pattern. An overlay measurement is executed of the second photo resist pattern to the substrate pattern. | 12-17-2015 |
Lin-Jung Wu, Miaoli County TW
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20150206951 | SEMICONDUCTOR STRUCTURE AND MANUFACUTURING METHOD OF THE SAME - Some embodiments of the present disclosure provide a semiconductor structure. The semiconductor structure includes a substrate, a high k dielectric layer disposed over the substrate, and a gate layer over the high k dielectric layer. The high k dielectric layer is partially crystallized and comprising an average thickness of from about 10 Å to about 30 Å. Some embodiments of the present disclosure provide a method for manufacturing a semiconductor structure. The method includes (i) forming a high k dielectric layer with a thickness of from about 10 Å to about 30 Å over a substrate, (ii) forming a gate layer over the dielectric layer, and (iii) transforming at least a portion of the dielectric layer from a first phase to a second phase by microwave irradiation. | 07-23-2015 |
Ming-Chih Wu, Miaoli County TW
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20150163534 | IP CAMERA, COMMUNICATION METHOD AND COMMUNICATION SYSTEM - An IP camera, a communication method and a communication system are provided. The IP camera includes an image capturing unit, a video processing unit and a connection processing unit. The image capturing unit captures a plurality of consecutive images. The video processing unit is coupled to the image capturing unit, and generates a first video stream and a second video stream according to the images. The connection processing unit is coupled to the video processing unit, processes the first video stream into a first packet stream, and processes the second video stream into a second packet stream. The connection processing unit transmits the first packet stream to a local area wireless network unit through a first wireless link, and the connection processing unit transmits the second packet stream to an external electronic device through a second wireless link. | 06-11-2015 |
Ming-Chou Wu, Miaoli County TW
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20160126904 | APPARATUS AND METHOD FOR CONTROLLING IMPEDANCE TUNING BY USING HYBRID CONTROL ALGORITHM - An impedance tuning control apparatus has a processing circuit and an output circuit. The processing circuit determines a first control setting according to a first performance metric, and performs a search operation with a search start point set by the first control setting to find a second control setting according to a second performance metric. The second performance metric is different from the first performance metric. The output circuit outputs a final control setting to a tuner, wherein the final control setting is derived from the second control setting. | 05-05-2016 |
Ming-Yi Wu, Miaoli County TW
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20130169486 | COMPOSITE ANTENNA STRUCTURE - A composite antenna structure includes a dielectric main body, a covering layer and a metallic transmission line structure. The dielectric constant of the dielectric main body is ranged from 1 to 200. The covering layer is disposed on the dielectric main body and has a pattern area defined thereon. The metallic transmission line structure is formed on the pattern area of the covering layer. | 07-04-2013 |
Min-Lun Wu, Miaoli County TW
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20080310161 | DIRECT-TYPE BACKLIGHT MODULE - The present invention is related to a direct-type backlight module. The module includes a plurality of lamps, a plurality of lamp holders, a frame and a bezel. The frame has a bottom plate, and the lamp holders and the frame are formed into one-body. The lamp holders are disposed on the bottom plate for fixing the lamps. The frame is disposed on the bezel. The direct-type backlight module of the present invention is advantageous in having a lower fabrication cost. | 12-18-2008 |
20100061085 | BACKLIGHT MODULE - A backlight module includes a case, a lamp, and a lamp clamping mechanism. The case has a bottom plate. The lamp is installed inside the case. The lamp clamping mechanism is connected to the bottom plate. The lamp clamping mechanism includes a base, a second clamping part, and a driving part. A first clamping part is disposed on the base. The second clamping part is installed on the base in a movable manner. The second clamping part is used for clamping the lamp with the first clamping part cooperatively when the second clamping part is moved to a first position so as to fix the lamp on the bottom plate. The driving part is pivotally disposed through the base. The driving part is used for rotating relative to the base so as to push the second clamping part from a second position to the first position on the base. | 03-11-2010 |
20150128495 | MULTIFUNCTIONAL PLANTING SYSTEM - A multifunctional planting system includes a supporter and a spraying device. The supporter includes a base and a plurality of lateral walls. The lateral walls are bent from the base to form a sunken structure for storing nutrient solution. The spraying device is disposed on the supporter. The spraying device includes an accommodating structure, a buckling component and a piezoelectric component. The nutrient solution is accommodated inside the accommodating structure. The buckling component passes through the accommodating structure. The piezoelectric component is disposed on a hollow portion of the buckling component. A plurality of tiny apertures are formed on the piezoelectric component. The piezoelectric component receives an electronic signal to generate oscillation. The oscillation transforms the liquid nutrient solution inside the accommodating structure into the gaseous nutrient solution. The gaseous nutrient solution is sprayed via the plurality of tiny apertures, and is condensed to flow into the sunken structure. | 05-14-2015 |
Shu-Feng Wu, Miaoli County TW
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20130168682 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a gate, a channel layer, a gate insulation layer, a source, a drain and a silicon-aluminum-oxide layer. The gate is disposed on a substrate. The channel layer is disposed on the substrate. The channel layer overlaps the gate. The gate insulation layer is disposed between the gate and the channel layer. The source and the drain are disposed on two sides of the channel layer. The silicon-aluminum-oxide layer is disposed on the substrate and covers the source, the drain and the channel layer. | 07-04-2013 |
Su-Ying Wu, Miaoli County TW
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20090275533 | FUSED BICYCLIC PYRIMIDINE COMPOUNDS AS AURORA KINASE INHIBITORS - Fused bicyclic pyrimidine compounds of formula (I): | 11-05-2009 |
Yu-Wen Wu, Miaoli County TW
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20110293971 | Battery Module - The present invention discloses a battery module including a casing capable of supporting a plurality of battery cells and having a circuit board holding structure, a circuit board held by the circuit board holding structure, a plurality of conducting buses disposed on the casing for electrically connecting the plurality of battery cells and the circuit board, and a plurality of battery cell sets, each of which including a battery holder and at least two battery cells, where any two of the plurality of battery cell sets are independent in structure and thereby can be affixed to the casing or detached from the casing respectively. | 12-01-2011 |