Patent application number | Description | Published |
20090294287 | MICROCHIP ELECTROPHORESIS METHOD AND DEVICE - An separation method comprising a temperature control process useful for microchip electrophoresis such as microchip DGGE is provided along with a device therefor. | 12-03-2009 |
20090325622 | Communication Terminal, Mobile Communication System and Communication Method - A communication terminal capable of receiving communication information directed to a own station from a base station even when the own station has a small battery remaining amount and cannot transmit or receive directly to/from a base station and a mobile communication system including the communication terminal and a communication method are provided. | 12-31-2009 |
20100327779 | ORGANIC ELECTROLUMINESCENT DEVICE, EXPOSURE DEVICE, PROCESS CARTRIDGE, IMAGE FORMING APPARATUS, DISPLAY APPARATUS, AND METHOD FOR DRIVING ORGANIC ELECTROLUMINESCENT DEVICE - An organic electroluminescent device includes: a pair of electrodes; a first light-emitting region that is disposed between the pair of electrodes, and that emits light when a voltage is applied between the pair of electrodes such that one of the pair of electrodes serves as an anode; and a second light-emitting region that is disposed between the pair of electrodes, and that emits light when a voltage is applied between the pair of electrodes such that the other of the pair of electrodes serves as an anode. | 12-30-2010 |
20110228031 | EXPOSURE APPARATUS AND IMAGE FORMING APPARATUS - An exposure apparatus that emits light toward a latent-image bearing member configured to bear a latent image, the latent image formed on the latent-image bearing member being used in a developing process performed by a developing device. The exposure apparatus includes a first light-emitting unit including an organic electroluminescence element disposed along a main scanning direction of the latent-image bearing member, the first light-emitting unit emitting light toward the latent-image bearing member, and a second light-emitting unit disposed along the main scanning direction, the second light-emitting unit correcting an amount of light to which the latent-image bearing member is exposed in cooperation with the first light-emitting unit. | 09-22-2011 |
20110234738 | EXPOSURE DEVICE, IMAGE FORMING APPARATUS, AND IMAGE FORMING UNIT - The present invention provides an annular exposure device, including:
| 09-29-2011 |
20110242258 | EXPOSURE HEAD AND PRODUCING METHOD THEREOF, CARTRIDGE, AND IMAGE FORMING APPARATUS - The invention provides an exposure head including:
| 10-06-2011 |
20150023453 | WIRELESS COMMUNICATION DEVICE AND WIRELESS COMMUNICATION METHOD - A wireless communication device includes:
| 01-22-2015 |
Patent application number | Description | Published |
20090014498 | COMPRESSION BONDING DEVICE - A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the first and second pressing rubbers. The electric components are not subjected to a force for horizontally moving them because the first and second pressing rubbers are prevented from horizontal extension by a first dam member. Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device. | 01-15-2009 |
20090038753 | MOUNTING METHOD - A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained. | 02-12-2009 |
20090230171 | DEVICE FOR MOUNTING ELECTRIC COMPONENT - A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×10 | 09-17-2009 |
20100186894 | METHOD FOR PACKING ELECTRIC COMPONENTS ON A SUBSTRATE - A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the first and second pressing rubbers. The electric components are not subjected to a force for horizontally moving them because the first and second pressing rubbers are prevented from horizontal extension by a first dam member. Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device. | 07-29-2010 |
20110237028 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×10 | 09-29-2011 |
20120279653 | HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD - To improve the tact time of a heating apparatus, provided is a heating apparatus comprising a first pressing member that heats a heating target; a second pressing member that includes an elastic body, and sandwiches the heating target between the first pressing member and the elastic body; and a floating jig that thermally separates the first pressing member from the heating target, holds the heating target between the first pressing member and the second pressing member, and when one of the first pressing member and the second pressing member presses the heating target toward the other of the first pressing member and the second pressing member, thermally connects the heating target and the first pressing member. | 11-08-2012 |