Tsung-Chi
Tsung Chi Chang, Taipei TW
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20110070021 | Fixing device for an extension tube of an exercise device - A fixing device for an extension tube of an exercise includes an outer tube and an inner tube received in the outer tube, wherein the extension tube extends through the inner tube. A quick release device laterally mounted to an outer periphery of the outer tube. The quick release device extends through the outer tube and the inner tube to quickly fixing/releasing the extension tube when adjusting the stretching distance of the extension tube. | 03-24-2011 |
Tsung Chi Huang, Taipei TW
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20100156693 | Programmable remote control system and method thereof - A programmable remote control system and the method thereof are provided to solve the problem of learning a controlling language at a huge time cost in the prior art. A control command group is remotely set and stored in the triggering end for positive and negative logic determination and control. The mechanism facilitates the provision of the control command group for actively transmitting messages. | 06-24-2010 |
20100161703 | Active monitoring system and method thereof - An active monitoring system and method thereof are provided to solve the problems of no real-time monitoring and bandwidth usage in the prior art. A triggering end detects a monitoring device to generate a device tag. The device tag is packed and actively sent to the server end via a network. The server end automatically generates an OPC tag for an integrating server to use. The mechanism can increase monitoring efficiency and bandwidth usage. | 06-24-2010 |
20120046966 | Health Management Application Development and Deployment Framework - Techniques are disclosed for developing health management applications and managing health issues associated with one or more individuals or subjects. For example, a health management system includes the following modules. A health data transformation and routing module converts raw health data to at least one common format and routes the common format health data to one or more other modules that at least one of process and store the common format health data. A health monitoring module receives at least a portion of the common format health data, processes the received data, and provides one or more notifications based on processing results. A health analytics module receives data from one or more other modules and generates health knowledge based on the received data. A health data and knowledge storage module stores data from one or more other modules. Each of the health data transformation and routing module, the health monitoring module, and the health analytics module include one or more application programming interfaces for use in at least one of adding and editing logic associated with the respective module. | 02-23-2012 |
Tsung Chi Lin, Hsinchu TW
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20080290375 | INTEGRATED CIRCUIT FOR VARIOUS PACKAGING MODES - The present invention provides an integrated circuit suitable for various packaging modes. This integrated circuit includes: a core circuit, a plurality of pads, and a selection circuit. The selection circuit is coupled between the core circuit and the pads for determining the connection state between the core circuit and the pads based on a control signal. When the control signal provides a first value, the core circuit and the pads will be in a first connection state, and the integrated circuit will be applied with a single-die package. However, when the control signal provides a second value, the core circuit and the pads will be in the second connection state, and the integrated circuit will be applied with a multi-die package. | 11-27-2008 |
Tsung-Chi Chen, Richland, WA US
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20150357174 | ION FUNNEL DEVICE - An ion funnel device is disclosed. A first pair of electrodes is positioned in a first direction. A second pair of electrodes is positioned in a second direction. The device includes an RF voltage source and a DC voltage source. A RF voltage with a superimposed DC voltage gradient is applied to the first pair of electrodes, and a DC voltage gradient is applied to the second pair of electrodes. | 12-10-2015 |
Tsung-Chi Chen, Taichung TW
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20090031447 | Use of a tospoviral nucleid acid molecule for broad-spectrum transgenic resistance against different tospoviruses - A use of a tospoviral nucleic acid molecule of the sequence of nt (nucleotide) 3975-4928 in accordance with GenBank Accession No. AF133128 or a full complement thereof comprising the steps of: (a) obtaining at least one fragment made from the tospoviral nucleic acid molecule; (b) obtaining a transgene from the at least one fragment; (c) introducing the transgene into a plant to generate a transgenic plant; (d) culturing the transgenic plant; (e) selecting a transgenic plant with broad-spectrum resistance; and (f) obtaining the transgenic plant with broad-spectrum resistance. | 01-29-2009 |
20090275013 | Method for preparing a monoclonal antibody to the common epitope of nonstructural NSs protein of watermelon silver mottle virus and assay for detection of serological related species in the genus tospovirus with the monoclonal antibody - The invention is an assay for detection of Watermelon silver mottle virus (WSMoV)-serogroup tospoviruses using a monoclonal antibody and a method for preparing the monoclonal antibody. A hybridoma cell line that produces a monoclonal antibody against the NSs proteins of WSMoV-serogroup tospoviruses was produced. The hybridoma cell line produces a monoclonal antibody binding with peptide SEQ ID No. 19. | 11-05-2009 |
Tsung-Chi Chen, Taipei County TW
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20090111957 | FLUORO-PONYTAILED BIPYRIDINE DERIVATIVES AND THEIR USE AS LIGANDS IN THE METAL-CATALYZED ATRP - The present invention also relates a metal complex complexing with the fluoro-ponytailed bipyridine derivatives, which is represented by the general formula (2): | 04-30-2009 |
Tsung-Chi Chen, New Taipei City TW
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20150357728 | TERMINAL CONNECTOR WITH IMPROVED ACTUATION STRUCTURE - A terminal connector includes a housing, at least one conductor-retaining terminal each including an insertion passage for receiving the conductor of one respective electrical wire inserted into the housing and two springy suspension arms bilaterally disposed near a rear side and respectively curving toward the inside of the insertion passage for clamping the conductor, and at least one slide block each including a sliding cover panel coupled to the housing two beveled pushing surfaces located at a bottom side of the sliding cover panel and movable with the sliding cover panel between a first position where the pushing surfaces are kept away from the springy suspension arms for allowing the springy suspension arms to clamp on the conductor and a second position where the pushing surfaces are engaged into the gap between the springy suspension arms to release the conductor from the constraint of the springy suspension arms. | 12-10-2015 |
Tsung-Chi Chen, Taichung City TW
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20150231657 | NOZZLE HAVING REAL TIME INSPECTION FUNCTIONS - A nozzle for emitting a fluid comprises a channel, a light source and a light sensor. The channel is configured to flow the fluid. The light source is configured to emit light towards a surface on which the fluid is applied and the light sensor is configured to receive reflected light from the surface. | 08-20-2015 |
Tsung-Chi Chiang, Hsin Kang Hsiang TW
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20090194896 | METHODS AND APPARATUS TO PREVENT MOLD COMPOUND FEEDER JAMS IN SYSTEMS TO PACKAGE INTEGRATED CIRCUITS - Methods and apparatus to preventing mold feeder jams in a system to package integrated circuits. An example method includes detecting if a mold compound tablet has a first alignment on a path and removing the mold compound tablet from the path if the mold compound tablet has a second alignment different from the first alignment. | 08-06-2009 |
Tsung-Chi Hsu, New Taipei City TW
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20120008896 | INTEGRATED OPTICS MODULE FOR MULTIPLEX TRANSCEVIER - The present invention relates to an integrate optics for multiplexer transceiver module, comprising: a substrate, a multiplexer, a first waveguide coupling device, a second waveguide coupling device and a third waveguide coupling device. In the present invention, the semiconductor materials and the semiconductor process are used to integrate variety of optical devices on a single semiconductor substrate (chip) by way of modular design and miniaturization, so as to carry out an integrated optics communication framework with high efficiency and low cost. Moreover, in the present invention, a plurality of optical receivers are integrated on the substrate by means of flip-chip bonding, so that, not only the objective of integrating the optical devices is accomplished but also the intensity of laser optical signal is increased. | 01-12-2012 |
Tsung-Chi Huang, Taipei Hsien TW
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20100265651 | SLIDING RAIL HAVING ANTI-TILTING MECHANISM - A sliding rail having anti-tilting mechanism is disclosed. The sliding rail includes a slidable connecting piece that is located at an enclosure and that has a fourth retaining portion, a slider whose outer side has a second slidable connecting portion and whose inner side has a resilient piece with a second retaining portion and a third retaining portion that is used to retain or release the fourth retaining portion, and a support with a first slidable connecting portion and a first retaining portion, wherein the second slidable connecting portion is connected with the first slidable connecting portion and moves in the forward and backward direction. When the slider and the support are located at the first relative location, the resilient piece retains the fourth retaining portion. When the slider and the support are located at the second relative location, the slidable connecting piece is released from the slider. | 10-21-2010 |
Tsung-Chi Lee, Taipei TW
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20120139404 | LIGHT SOURCE DEVICE OF BACKLIGHT MODULE AND LIGHT-EMITTING DIODE PACKAGE STRUCTURE OF THE LIGHT SOURCE DEVICE - A light source device of a backlight module includes a back frame unit and a light-emitting diode (LED) package structure. The back frame unit includes a thermal conductive base plate, and a casing part having a first plate spaced apart from and parallel to the base plate. The LED package structure is disposed between the base and first plates, and includes a package body having a light-emitting surface, and two lateral surfaces respectively facing the base plate and the first plate. A lead frame unit includes a lead frame partially exposed from the lateral surfaces of the package body to form first and second heat-conducting paths with the base and first plates, respectively. | 06-07-2012 |
20120224360 | ILLUMINATION LAMP - An illumination lamp comprises a lamp body, a light-emitting module, a power supply module, and a circuit module. The lamp body defines an inner space. The partitioning unit is disposed in the lamp body for dividing the inner space into a first space for receiving the power supply module, and a second space for receiving the circuit module. Due to the presence of the partitioning unit, thermal convection between the first and second spaces is prevented to reduce adverse influence of a high temperature of the circuit module on the power supply module. | 09-06-2012 |
20120230026 | LUMINAIRE HAVING INNER FLOW PATH - A luminaire includes a base, a light-emitting unit, and a lamp cover. The base includes a first tube part, a second tube part having an inner diameter smaller than that of the first tube part, and a joint part connected between the first and second tube parts. An inner flow path is defined by at least the first tube part, the joint part, and the second tube part in a coaxial manner. The lamp cover is fixed on the base for covering the light-emitting unit. As such, air heated by the light-emitting unit flows out of the inner flow path to thereby allow cold air to be sucked into the inner flow path. | 09-13-2012 |
20130163247 | LAMP BASE AND LAMP HAVING THE SAME - A lamp includes a lighting module and a lamp base. The lamp base includes a base unit. The base unit includes a first base element and a second base element. The first base element includes a plurality of first channels. The second base element includes a plurality of second channels that are in fluid communication with the second channels, respectively. The thermal conductivity of the second base element is lower than that of the first base element. The lighting module is disposed on the first base element. During operation of the lighting module, an airflow between the first channels and the second channels is accelerated for improving heat-dissipating efficiency due to a pressure difference caused by temperature difference between the first and second base elements. | 06-27-2013 |
Tsung-Chi Lu, Hsinchu City TW
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20130121218 | METHODS FOR PERFORMING AN EFFICIENT NETWORK SEARCH AND COMMUNICATIONS APPARATUSES UTILIZING THE SAME - A communications apparatus includes at least a first processor logic unit obtaining a support band list, a second processor logic unit generating a frequency search list for a first operating band and a frequency search list for a second operating band listed in the support band list, and a third processor logic unit performing power scan and cell search according to the frequency search lists. The frequency search list includes information regarding operating frequencies located in the corresponding operating band to be searched. The second operating band includes one or more operating frequencies overlapped with that of the first operating band, and the one or more operating frequencies of the second operating band overlapped with that of the first operating band is/are listed only in one of the frequency search list for the first operating band and the frequency search list for the second operating band. | 05-16-2013 |
Tsung-Chi Tsai, Tao Yuan Shien TW
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20080220599 | Method of fabricating short-gate-length electrodes for integrated III-V compound semiconductor devices - A method of fabricating short-gate-length electrodes for integrated III-V compound semiconductor devices, particularly for integrated HBT/HEMT devices on a common substrate is disclosed. The method is based on dual-resist processes, wherein a first thin photo-resist layer is utilized for defining the gate dimension, while a second thicker photo-resist layer is used to obtain a better coverage on the surface for facilitating gate metal lift-off. The dual-resist method not only reduces the final gate length, but also mitigates the gate recess undercuts, as compared with those fabricated by the conventional single-resist processes. Furthermore, the dual-resist method of the present invention is also beneficial for the fabrication of multi-gate device with good gate-length uniformity. | 09-11-2008 |
Tsung-Chi Wang, Kaohsiung City TW
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20150087222 | AIR EXCHANGE DEVICE - An air exchange device includes: an air-guiding tube having a first end and a second end opposite to the first end, the first end having a first inlet and a first outlet, and the second end having a second inlet and a second outlet; a partition settled inside the air-guiding tube and dividing a room inside the air-guiding tube into a first air-guiding space and a second air-guiding space, the first air-guiding space communicating with the first inlet and second outlet, and the second air-guiding space communicating with the first outlet and the second inlet; a fan arranged with the air-guiding tube and adapted to induce an airflow; and a control module connecting with at least one of the first and second ends of the air-guiding tube and electrically connecting with the fan. | 03-26-2015 |
Tsung-Chi Wang, Taipei City TW
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20110012138 | Light-Emitting Diode Die Packages and Methods for Producing Same - The present invention relates to a light-emitting diode die package. The LED die package includes a semiconductor base, at least two electrodes disposed on an electrode mounting surface of the semiconductor base, an insulation layer formed on the electrode-mounting surface and provided with two through holes for exposing the electrodes, a conductor-forming layer formed on the insulation layer and provided with two conductor-mounting holes in communication with the through holes, and conductor units formed within the through holes and the conductor-mounting holes in a manner electrically connected to the corresponding electrodes. The LED die package further includes a covering layer formed on a surface of the LED die opposite to the electrode-mounting surface and extending to an outer surface of the LED die. The covering layer is made of transparent material doped with phosphor powder. | 01-20-2011 |
20110073159 | Heat Dissipating Device and Module Using Same - The present invention relates to a heat dissipating device adapted for use in combination with a module provided with a mounting board. The heat dissipating device has a metallic heat-dissipating member including a body and a number of spaced-apart heat dissipating fins extending upwardly from the upper surface of the body. The body is formed at its central portion with a through hole adapted for receiving a protrusion block protruding from a back surface of the mounting board of the module opposite to a mounting surface on which electrical devices are mounted. The heat dissipating device further includes a pump unit, a fluid conduit and a fan unit disposed on the heat dissipating fins. | 03-31-2011 |
20110074296 | Light-Emitting Diode Illumination Apparatuses - The present invention relates to an LED illumination apparatus. The apparatus includes a body having a lower portion adapted for coupling to a power socket and an upper portion provided with a power source module accommodating chamber. A heat-dissipating module includes a funnel-shaped hollow case disposed at a top end of the upper portion and filled with a coolant fluid, wherein the hollow case has a small diameter open end adjacent to the body and a large diameter open end remote from the body. A light source module includes amounting substrate disposed at the small diameter open end, an LED mounted on the mounting substrate, and a power source module disposed within the power source module accommodating chamber in a manner electrically connected to and supplying working power to the LED. | 03-31-2011 |
20120018748 | LIGHT EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME - A light emitting diode device includes: at least one light emitting diode chip, which includes a semiconductor unit, two electrodes that are disposed on an electrode-mounting surface of the semiconductor unit, a light-transmissive insulating layer that is disposed on the electrode-mounting surface and that has two via holes, a reflective metal layer disposed on a portion of the light-transmissive insulating layer, a protective insulating layer that is disposed on the reflective metal layer, a conductor-receiving insulating layer that has two conductor-receiving holes respectively in communication with the via holes, and two conductor units that are formed respectively in the conductor-receiving holes; and a light-transmissive envelope layer that covers a surface of the light emitting diode chip opposite to the electrode-mounting surface, that extends to cover outer lateral surfaces of the light emitting diode chip, and that is doped with a fluorescence powder. | 01-26-2012 |
20120018760 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME - A method for fabricating light emitting diode packages includes: providing a light emitting diode wafer which has a plurality of light emitting diode chips, each of the light emitting diode chips including a semiconductor unit that has p-type and n-type electrode regions, and two electrodes; forming a light-transmissive insulating layer on the light emitting diode chips; forming a reflective metal layer on a portion of the light-transmissive insulating layer; forming a layer of insulating material on the light-transmissive insulating layer and the reflective metal layer, and performing exposing and developing treatments to form the layer of insulating material into a plurality of protective insulating structures; forming a conductor-receiving insulating layer on the light-transmissive insulating layer and the protective insulating structures; and performing a cutting process to obtain a plurality of light emitting diode packages each having at least one of the light emitting diode chips. | 01-26-2012 |
20120098143 | METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE - A method for packaging a semiconductor chip includes: providing a semiconductor wafer that has an upper surface and includes a plurality of chip regions, each of the chip regions having a semiconductor unit that includes at least one electrical-connecting pad; forming over the upper surface a photoresist layer, followed by forming a plurality of pad-exposing holes in the photoresist layer; filling a first conductive material in the pad-exposing holes, followed by reflowing; removing the photoresist layer, and forming over the upper surface a protective layer; grinding the protective layer; coating an insulated protective layer on the ground protective layer, and forming a plurality of via holes in the insulated protective layer; filling a second conductive material in the via holes, followed by reflowing; and removing the insulated protective layer. | 04-26-2012 |