Patent application number | Description | Published |
20090150296 | REPUTATION IN ON-LINE CONSUMER MARKETS - Seller's reputation quantification technique embodiments are presented that quantify in monetary terms a risk of dissatisfaction to a potential buyer of a product or service from a seller in an on-line consumer market. Generally, this involves computing the monetary sales limit for the seller. This monetary sales limit represents an amount, which if a sum of the current prices of all the products and services currently offered by the seller is equal to or less than the amount, there would not be a significant risk to the buyer of being dissatisfied with the product or service. Given this, a risk of a potential buyer's dissatisfaction with a product or service purchased from the seller in view of a price the buyer wants to pay is assessed. The assessed risk is then provided to the potential buyer in the form of one or more risk indicators. | 06-11-2009 |
20090157494 | SCALABLE AUDIT-BASED PROTOCOL FOR PAY-PER-ACTION ADS - Systems and methods that account for payment of sales commission received by the merchant. An audit component simulates user behavior in purchasing items from the merchant in an advertising system, which encompasses interaction among a merchant (who advertise on websites/blogs); a trusted party (who monitors activities of the merchant), an advertisement publisher, and an advertisement consumer (e.g., buyer of the merchandise offered by the merchant). | 06-18-2009 |
20090164426 | SEARCH ENGINE PLATFORM - Systems and methods to perform efficient searching for web content using a search engine are provided. In an illustrative implementation, a computing environment comprises a search engine computing application having an essential pages module operative to execute one or more selected selection algorithms to select content from a cooperating data store. In an illustrative operation, the exemplary search engine executes on a received search query to generate search results. Operatively, the retrieved results can be generated based upon their joint coverage of the submitted search query by deploying a selected sequential forward floating selection (SFFS) algorithm executing on the essential pages module. In the illustrative operation, the SFFS algorithm can operate to iteratively add one and delete one element from the set to improve a coverage score until no further improvement can be attained. The resultant processed search results can be considered essential pages. | 06-25-2009 |
20110029501 | Search Engine Platform - Systems and methods to perform efficient searching for web content using a search engine are provided. In an illustrative implementation, a computing environment comprises a search engine computing application having an essential pages module operative to execute one or more selected selection algorithms to select content from a cooperating data store. In an illustrative operation, the exemplary search engine executes on a received search query to generate search results. Operatively, the retrieved results can be generated based upon their joint coverage of the submitted search query by deploying a selected sequential forward floating selection (SFFS) algorithm executing on the essential pages module. In the illustrative operation, the SFFS algorithm can operate to iteratively add one and delete one element from the set to improve a coverage score until no further improvement can be attained. The resultant processed search results can be considered essential pages. | 02-03-2011 |
Patent application number | Description | Published |
20110307798 | Merging Modifications to User Interface Components While Preserving User Customizations - An application displays a user interface (UI) component. A client can apply customizations to this UI component. After the client applies customizations to the UI component, the client modifies a solution set containing solutions that modify the UI component. After the client modifies the solution set, the application displays a new version of the UI component. Modifications provided by the solutions in the solution set are applied to the new version of the UI component. In addition, the customizations remain applied to the UI component without the client manually re-applying the customizations to the UI component. | 12-15-2011 |
20110314395 | SEQUENTIAL AND NON-SEQUENTIAL ACCESS TO RECORDS WITHIN A LIST - The disclosure provided herein allows a user of a web application to sequentially or non-sequentially open records from a single or multi-page list across page boundaries without leaving the current viewing window. According to one aspect, a list is provided having a number of records presented sequentially in one or more pages of a list. A selection of one of the records is received, and the content associated with the selected record is retrieved and provided. The list is again provided while presenting the content of the selected record. A new record, sequentially or non-sequentially listed with respect to the currently viewed record, is selected from the list, and in response to the selection, the content within the viewing window is replaced with content associated with the newly selected record. | 12-22-2011 |
20140372971 | PORTABLE BUSINESS LOGIC - Records in a computer system have associated logic rules. The logic rules can be created and modified using natural language expressions. The created or modified logic is converted to a form that can be run on a plurality of different clients, each using a different language. | 12-18-2014 |
20150248201 | CONTEXT AWARE COMMANDS - A client device identifies a current context of an application and sends that context to a command component on a server. The client device receives a set of commands that are valid for that context and displays the commands on the client device. When a user input is received changing the context, a new command set can be locally computed based on the set of commands received from the server, or the new context can be sent to the server to receive the new command set. | 09-03-2015 |
20150248202 | METADATA DRIVEN DIALOGS - Dialog metadata is used to generate a metadata driven dialog definition. The metadata can define logic that is run on the dialog, and customizations to the dialog are made by modifying the dialog metadata. | 09-03-2015 |
Patent application number | Description | Published |
20080209348 | Composing integrated systems using GUI-based applications and web services - A composer of integrated systems solves the technical problem of enabling graphical user interface applications (GAPs) to interoperate (e.g., exchange information) with each other and web services over the Internet, effectively and non-invasively. The system provides a user friendly visualization mechanism that interacts with an accessibility layer to enable organizations to economically and easily define web service driven information exchange between GAPs, by performing point-and-click, drag-and-drop operations on GAPs. The system allows users to rapidly create integrated systems composing GAPs enabled to interoperate with other GAPs and web services, so that organizations extend the life-cycle use of their legacy GAPs in business operations. | 08-28-2008 |
20080209356 | GUI-based application to web services conversion system - A web service creation system converts legacy application functionality to web services. The system captures the operation of the legacy application through an accessibility layer that monitors operator interaction with the application. The system then defines, creates, and deploys a web service that provides control over the application operation. As a result, the legacy application may be made accessible through web services and an organization may continue to realize a return on their significant investment in the creation of the legacy application. | 08-28-2008 |
20080209446 | Design tool for converting legacy applications to web services - A design tool assists with the conversion of legacy applications to web services. The design tool provides a flexible and visual design environment through which web services are defined, created, and deployed for controlling a legacy application. As a result, the legacy applications may be made accessible through web services to remote callers consonant with the wide spread adoption of web services. An organization may thereby extend the life-cycle of their legacy applications and continue to realize the benefit of substantial investment in the applications. | 08-28-2008 |
20110252420 | CLOUD REFERENCE MODEL FRAMEWORK - A computing device implemented method, in one embodiment, can include a cloud transformation module transforming content for a compute platform. Additionally, the method can include a cloud control module receiving the content from the cloud transformation module. The method can also include the cloud control module provisioning a virtual machine appliance to form the compute platform. Furthermore, the method can include a cloud instantiation module executing the provisioning of the cloud control module. In addition, the method can include a cloud appliance module adding middleware to a virtual machine to create the virtual machine appliance. Moreover, the method can include a cloud virtualization module producing a virtualized representation of the compute platform. | 10-13-2011 |
20120072581 | GENERIC CONTROL LAYER IN A CLOUD ENVIRONMENT - A computing system implemented method, in one embodiment, can include a cloud control module receiving a constraint for cloud architecture. In addition, the method can include the cloud control module receiving a plurality of cloud service provider capabilities. Furthermore, the method can include the cloud control module filtering the plurality of cloud service provider capabilities to identify a cloud service provider capable of satisfying the constraint. Moreover, the method can include the cloud control module outputting an instruction for a resource from the cloud service provider. | 03-22-2012 |
20150058489 | Generic Control Layer In A Cloud Environment - A computing system implemented method, in one embodiment, can include a cloud control module receiving a constraint for cloud architecture. In addition, the method can include the cloud control module receiving a plurality of cloud service provider capabilities. Furthermore, the method can include the cloud control module filtering the plurality of cloud service provider capabilities to identify a cloud service provider capable of satisfying the constraint. Moreover, the method can include the cloud control module outputting an instruction for a resource from the cloud service provider. | 02-26-2015 |
Patent application number | Description | Published |
20100094609 | Modeling electrical interconnections in three-dimensional structures - Disclosed are apparatus, methods and software that implement a partial element equivalent circuit (PEEC) method having global basis functions on cylindrical coordinates to determine wide-band resistance, inductance, capacitance, and conductance from a large number of three-dimensional interconnections in order to provide for the electrical design of system-in-package (SIP) modules, and the like. The apparatus, methods and software use a modal equivalent network from mixed potential integral equation with cylindrical conduction and accumulation mode basis functions, which reduces the matrix size for large three-dimensional interconnection problems. Combined with these modal basis functions, the mixed potential integral equations describe arbitrary skin and proximity effects, and allow determination of partial impedance and admittance values. Additional enhancement schemes further reduces the cost for computing the partial inductances. Therefore, the apparatus, methods and software can be used to construct accurate models of a large number of three-dimensional interconnection structures, including more than 100 bonding wires used for stacking integrated circuit chips, through-silicon via interconnections, and the like. | 04-15-2010 |
20100103639 | Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architectures - Disclosed are ferroelectric and ferromagnetic noise isolation structures that reduce electromagnetic interference and noise in integrated circuit devices and system architectures. Representative structures comprise two or more devices that are vertically disposed relative to one another, and a thin ferroelectric or ferromagnetic film layer disposed between the respective devices that isolates electromagnetic energy coupling from one device to another. | 04-29-2010 |
20100217576 | Multi-Layer Finite Element Method for Modeling of Package Power and Ground Planes - In a method for simulating electrical characteristics of a plurality of power planes, each power plane includes a plurality of geometric features. The geometric features of each power plane are projected onto a single planar construct. A polygonal mesh, including a plurality of pairs of interconnected nodes, that corresponds to the single planar construct is generated. The polygonal mesh is projected onto at least one power plane an equivalent circuit between each adjacent node of the plurality of interconnected nodes is projected onto the power plane. An equivalent capacitance is assigned between each node and a common ground planer. A finite element equation that includes a plurality of discrete terms is generated. The equation is solved, thereby determining the electrical characteristic value between each pair of adjacent nodes. | 08-26-2010 |
20100218145 | Multilayer finite difference methods for electrical modeling of packages and printed circuit boards - Disclosed are exemplary finite difference methods for electromagnetically simulating planar multilayer structures. The exemplary finite difference methods simulate multilayer planes by combining the admittance matrices of single plane pairs and equivalent circuit models for such single plane pairs based on multilayer finite difference approximation. Based on the methods, coupling between different layers through electrically large apertures can be modeled very accurately and efficiently. | 08-26-2010 |
20110006861 | Liquid Crystalline Polymer and Multilayer Polymer-Based Passive Signal Processing Components for RF/Wireless Multi-Band Applications - The present invention provides all organic fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, couplers and a combination of the above manufactured using liquid crystalline polymer (LCP) and other multilayer polymer based substrates. These devices are manufactured using one or more LCP layers having integrated passive components formed thereon to provide the density and performance necessary for multi-band wireless devices. In the designs involving multiple LCP layers, the LCP layers are separated by prepeg layers. In accordance with an aspect of the present invention, coplanar waveguide, hybrid stripline/coplanar waveguide and/or microstrip topologies are utilized to form the integrated passive components, and the devices can be mass produced on large area panels at least 18 inches by 12 inches with line widths smaller than 10 um. | 01-13-2011 |
20120150523 | Modeling of Multi-Layered Power/Ground Planes using Triangle Elements - In a method of simulating electrical characteristics of a circuit board having a plurality of features, the plurality of features is projected onto a planar construct. A Delaunay triangulation routine for generating a triangular mesh that corresponds to the single planar construct is executed on the digital computer. A routine that generates a Voronoi diagram corresponding to the triangular mesh. An equivalent circuit for each triangle is determined. The equivalent circuit includes exactly three sub-circuits that couple a vertex within the triangle to a vertex within an adjacent triangle and exactly one sub-circuit that couples the vertex within the triangle to a reference plane. A routine solves, for each triangle, an equation describing an electrical characteristic value based on the equivalent circuit corresponding to the triangle. A routine for generating a human-perceptible indication of the electrical characteristic value for each triangle is executed on the digital computer. | 06-14-2012 |
Patent application number | Description | Published |
20130067456 | APPLICATION CONFIGURATION FRAMEWORK FOR ENTERPRISE RESOURCE PLANNING APPLICATION INSTALLATION - A configuration application utilizes an application configuration framework to create a configuration questionnaire to dynamically manage an enterprise resource planning (ERP) application installation process. The configuration application imports an ERP system's metadata to configure the ERP application installation through the application configuration framework. The configuration application requests question parameters from a configuring user to configure the ERP application installation according to the metadata. Subsequently, the configuration application creates a configuration questionnaire for the ERP application installation based on the question parameters. | 03-14-2013 |
20130185178 | SOURCE DOCUMENT FRAMEWORK FOR ACCOUNTING SYSTEMS - A source document framework for accounting systems is described. An apparatus may comprise an accounting application arranged for execution by the processor circuit, the ERP application comprising a source document framework component arranged to create a new source document type to add to heterogeneous source document types, and a source document process component arranged to process source documents of the heterogeneous source document types, with at least one of the heterogeneous source document types including a previous source document type arranged for use with process logic specific to the previous source document type, and process one or more source documents of the new source document type with the process logic specific to the previous source document type. Other embodiments are described and claimed. | 07-18-2013 |
20140114816 | MULTIDIMENSIONAL MEASUREMENT BASIS FOR ACCOUNTING SYSTEMS - Techniques to provide a multi-measurement basis for accounting systems are described. A technique may include receiving data from a source document, documenting the received data as base multidimensional measurements that characterize an event, calculating derived multidimensional measurements that quantify the social, operational, and financial consequences of the event from the base multidimensional measurements. Derived measurements are linked to base measurements in measurement chains. Events that are related causally may be linked together in event chains. The measurement chains and event chains may be used to generate subledger journal entries, which may in turn be used to generate general ledger journal entries. An event may capture information about an event beyond what may be reflected in the source document. Other embodiments are described and claimed. | 04-24-2014 |
20140244342 | ACCOUNTING FOR CONTRACT FORMATION AND FULFILLMENT ACTIVITIES - Technologies are generally described for accounting for contract formation and fulfillment activities by combination event chaining and multidimensional measurement chaining, with event and measurement matching rules that apply variance and tolerance policies during evaluation. Building on chaining basis and derived measurements that participate in an equality relationship, chaining measurements may participate in a matching rule that applies tolerance policies. Furthermore, measurement chaining may be updated when the documented consequence of events are corrected or changed. | 08-28-2014 |
Patent application number | Description | Published |
20110276218 | WIRELESS VEHICLE SERVICING - Various embodiments include methods, systems, and computer-program products for wireless vehicle servicing. Instructions for performing a vehicle servicing operation may be received at a servicing terminal. Further, vehicle servicing operation data based on the instructions and data communication rules for communicating data to a vehicle computing system may be received. Servicing request data stored in computer-readable media may be generated and may include the vehicle servicing operation data and the one or more data communication rules. The servicing request data may be transmitted to the vehicle computing system and servicing return data may be received. Servicing status information may be presented on the servicing terminal based on the servicing return data. | 11-10-2011 |
20110276219 | EMBEDDED VEHICLE DATA RECORDING TOOLS FOR VEHICLE SERVICING - Various embodiments include tools for vehicle data recording for vehicle servicing. A methods, a computer for installation in a vehicle, and a computer program product may be provided for recording diagnostic vehicle data. An input may be received from memory including a plurality of vehicle data recording parameters which comprise a vehicle data recording configuration. A data recording trigger signal may also be received. Upon receipt of the trigger signal, diagnostic data may be received from one or more vehicle modules over a vehicle network communicating with the computer. The diagnostic data may be based on the vehicle data recording configuration. The diagnostic data may be stored in memory for diagnosing one or more vehicle concerns. | 11-10-2011 |
20130282254 | Wireless Vehicle Servicing - Various embodiments include methods, systems, and computer-program products for wireless vehicle servicing. Instructions for performing a vehicle servicing operation may be received at a servicing terminal. Further, vehicle servicing operation data based on the instructions and data communication rules for communicating data to a vehicle computing system may be received. Servicing request data stored in computer-readable media may be generated and may include the vehicle servicing operation data and the one or more data communication rules. The servicing request data may be transmitted to the vehicle computing system and servicing return data may be received. Servicing status information may be presented on the servicing terminal based on the servicing return data. | 10-24-2013 |
Patent application number | Description | Published |
20130120156 | SYSTEMS AND METHODS FOR REMOTELY CONTROLLING AN ADVANCED METERING INFRASTRUCTURE - A computer-implemented method for remotely controlling an AMI is disclosed. The method includes receiving at an AMI controller module, meter event data from a remote command and control module; generating, at a third module, rules for the management, implementation and compliance documentation of connect/disconnect orders; processing, at the third module, the meter event data based on those rules to aggregate, batch, filter, or prioritize execution of individual connect/disconnect orders; communicating the connect/disconnect execution orders and policy compliance verification information to the AMI controller module; and, at the AMI controller module, executing connect/disconnect operations via the command and control module. | 05-16-2013 |
20130144769 | SYSTEMS AND METHODS FOR ADVANCED METERING INFRASTRUCTURE CUSTOMER PORTAL - In accordance with one embodiment, a system is provided that uses historical and current energy usage data generated by advanced metering infrastructure (AMI) meters to allow users conduct an analysis of energy usage via a portal. In accordance with one embodiment, a tool is provided to allow customers to display an estimated next month bill. | 06-06-2013 |
20130145452 | SYSTEMS AND METHODS FOR MANAGING ADVANCED METERING INFRASTRUCTURE - A system for maintaining and hosting an AMI command and control application is disclosed. The system includes an AMI command and control application module in a network compartment for measuring energy usage from customer meters, managing an AMI network, and executing connect/disconnect orders; and a plurality of firewalls to provide a security perimeter to the AMI command and control application module when the module is accessed by a vendor network or a utility network. The AMI command and control application module includes a VPN concentrator and a 6 in 4 router to provide a security perimeter between the AMI command and control application module and the AMI network. | 06-06-2013 |
20140136424 | SYSTEM AND METHOD FOR CREATING A CUSTOMER PROFILE BASED ON HISTORY OF SERVICE - Disclosed is a system and method for providing a view of energy usage data or events generated by at least one AMI meter and customer profile information. The system and method involves the collection of information about a customer by different business units which are part of a service provider. The system and method includes a user computer having the capability of gathering data about a customer from the different business units, including energy usage data. The user computer may calculate a level of satisfaction of the customer with respect to that customer's interactions with the different business units and display icons reflecting such levels of satisfaction through use of widgets. | 05-15-2014 |
20150269587 | METHODS FOR PREDICTING CUSTOMER SATISFACTION AND DEVICES THEREOF - A method, non-transitory computer readable medium and utility management computing device for obtaining data associated with one or more electric utilities from a utility monitoring system. An asset reliability score and a consumption score is determined from the obtained data associated with the one or more electric utilities. Next, a customer satisfaction score is determined for the one or more electric utilities based on the determined asset reliability score and the consumption score. The determined customer satisfaction score for the one or more electric utilities is provided. | 09-24-2015 |
Patent application number | Description | Published |
20110147438 | CLAD SOLDER THERMAL INTERFACE MATERIAL - A clad solder thermal interface material is described. In one example the material has a first layer of solder, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature lower than the melting temperature of the first layer, and a third layer of solder clad to the first layer of solder opposite the second layer, the third layer having a melting temperature lower than the melting temperature of the first layer. | 06-23-2011 |
20110147914 | Clad Solder Thermal Interface Material - A clad solder thermal interface material is described. In one example the material has a a first layer of solder having a melting temperature lower than a temperature of a particular solder reflow furnace, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature higher than the temperature of the solder reflow furnace, and a third layer of solder clad to the second layer of solder opposite the first layer, the third layer having a melting temperature lower than the temperature of the solder reflow furnace. | 06-23-2011 |
20110159228 | Flip chip package containing novel underfill materials - Methods and associated structures of forming underfill material are described. Those methods may include applying an underfill to an interconnect structure comprising residue from a no clean flux, wherein the underfill comprises at least one of a functionalized nanofiller and a micron-sized filler. | 06-30-2011 |
20110266030 | MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT - The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages. | 11-03-2011 |
20110278044 | MAGNETIC ATTACHMENT STRUCTURE - The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package. | 11-17-2011 |
20110278351 | MAGNETIC PARTICLE ATTACHMENT MATERIAL - The present disclosure relates to the field of fabricating microelectronic packages, wherein a magnetic particle attachment material comprising magnetic particles distributed within a carrier material may be used to achieve attachment between microelectronic components. The magnetic particle attachment material may be exposed to a magnetic field, which, through the vibration of the magnetic particles within the magnetic particle attachment material, can heat a solder material to a reflow temperature for attaching microelectronic components of the microelectronic packages. | 11-17-2011 |
20110281375 | MAGNETIC MICROELECTRONIC DEVICE ATTACHMENT - The present disclosure relates to the field of fabricating microelectronic packages, wherein microelectronic devices of the microelectronic packages may have magnetic attachment structures comprising a magnetic material formed on an attachment structure. The microelectronic device may be aligned on a substrate with a magnetic field and then held in place therewith while being attached to the substrate. The microelectronic device may also be aligned with an alignment plate which magnetically aligns and holds the component in place while being packaged. | 11-17-2011 |
20110291276 | MAGNETICALLY SINTERED CONDUCTIVE VIA - The present disclosure relates to the field of fabricating microelectronic packages, wherein microelectronic components of the microelectronic packages may have sintered conductive vias comprising sintered metal and magnetic particles. | 12-01-2011 |
Patent application number | Description | Published |
20090321923 | MAGNETIC PARTICLE-BASED COMPOSITE MATERIALS FOR SEMICONDUCTOR PACKAGES - A semiconductor package is described. The semiconductor package includes a substrate and an integrated heat spreader disposed above and coupled with the substrate. A cavity is disposed between the substrate and the integrated heat spreader. A semiconductor die is disposed above the substrate and in the cavity. An array of first-level solder joints is disposed between the substrate and the semiconductor die. A layer of magnetic particle-based composite material is also disposed in the cavity. | 12-31-2009 |
20100159692 | ATTACHMENT USING MAGNETIC PARTICLE BASED SOLDER COMPOSITES - Electronic devices and methods for fabricating electronic devices are described. One method includes providing a first body with a plurality of composite bumps thereon, the composite bumps comprising a solder and magnetic particles. The method also includes applying a magnetic field to the magnetic particles to generate sufficient heat to melt the solder and form molten bump regions containing the magnetic particles therein. The method also includes coupling a second body to the first body through the molten bump regions, and cooling the molten bump regions to form solidified composite bumps coupling the second body to the first body. Other embodiments are described and claimed. | 06-24-2010 |
20100224993 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby - Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a substrate, curing the solder paste below a reflow temperature of the solder to form a solid composite hybrid bump on the conductive pads, forming a molding compound around the solid composite hybrid bump, and reflowing the hybrid bump, wherein the sacrificial polymer is substantially decomposed. | 09-09-2010 |
20100258927 | Package-on-package interconnect stiffener - Embodiments of the invention relate to a package-on-package (PoP) assembly comprising a top device package and a bottom device package interconnected by way of an electrically interconnected planar stiffener. Embodiments of the invention include a first semiconductor package having a plurality of inter-package contact pads and a plurality of second level interconnect (SLI) pads; a second semiconductor package having a plurality of SLI pads on the bottom side of the package; and a planar stiffener having a first plurality of planar contact pads on the top side of the stiffener electrically connected to the SLI pads of the second package, and a second plurality of planar contact pads electrically connected to the inter-package contact pads of the first package. | 10-14-2010 |
20110127663 | MAGNETIC PARTICLE-BASED COMPOSITE MATERIALS FOR SEMICONDUCTOR PACKAGES - A semiconductor package is described. The semiconductor package includes a substrate and an integrated heat spreader disposed above and coupled with the substrate. A cavity is disposed between the substrate and the integrated heat spreader. A semiconductor die is disposed above the substrate and in the cavity. An array of first-level solder joints is disposed between the substrate and the semiconductor die. A layer of magnetic particle-based composite material is also disposed in the cavity. | 06-02-2011 |
20110151624 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die - A coating for a microelectronic device comprises a polymer film ( | 06-23-2011 |
20130017650 | COATING FOR A MICROELECTRONIC DEVICE, TREATMENT COMPRISING SAME,AND METHOD OF MANAGING A THERMAL PROFILE OF A MICROELECTRONIC DIE - A coating for a microelectronic device comprises a polymer film ( | 01-17-2013 |
20130224444 | MAGNETIC ATTACHMENT STRUCTURE - The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package. | 08-29-2013 |
20130292838 | PACKAGE-ON-PACKAGE INTERCONNECT STIFFENER - Embodiments of the invention relate to a package-on-package (PoP) assembly comprising a top device package and a bottom device package interconnected by way of an electrically interconnected planar stiffener. Embodiments of the invention include a first semiconductor package having a plurality of inter-package contact pads and a plurality of second level interconnect (SLI) pads; a second semiconductor package having a plurality of SLI pads on the bottom side of the package; and a planar stiffener having a first plurality of planar contact pads on the top side of the stiffener electrically connected to the SLI pads of the second package, and a second plurality of planar contact pads electrically connected to the inter-package contact pads of the first package. | 11-07-2013 |
20140175644 | METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMPERATURE SOLDER AND STRUCTURES FORMED THERBY - Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure. | 06-26-2014 |
20140205851 | MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS - An interconnect structure for electrically joining two surfaces includes magnetic attachment structures and an anisotropic conductive adhesive (ACA). Magnetic attachment structures on a first surface are magnetically attracted to magnetic attachment structures on a second surface. Opposing magnetic attachment structures are joined via an ACA, which conducts electricity when compressed, and is electrically insulating when not compressed. The magnetic attraction between opposing magnetic attachment structures generates a sufficient force to maintain compression of the intervening ACA in order to sustain a desired level of electrical conductivity between the first surface and second surface. A method for joining two surfaces using the interconnect structure is disclosed. Additionally, a magnetic anisotropic conductive adhesive having magnetic conductive particles dispersed therein is disclosed. | 07-24-2014 |
20140322932 | INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR - Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed. | 10-30-2014 |
20150118870 | INTEGRATED CIRCUIT CONNECTORS - Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed. | 04-30-2015 |
20150194401 | FORMING SACRIFICIAL COMPOSITE MATERIALS FOR PACKAGE-ON-PACKAGE ARCHITECTURES AND STRUCTURES FORMED THEREBY - Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a substrate, curing the solder paste below a reflow temperature of the solder to form a solid composite hybrid bump on the conductive pads, forming a molding compound around the solid composite hybrid bump, and reflowing the hybrid bump, wherein the sacrificial polymer is substantially decomposed. | 07-09-2015 |
20150221609 | METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMPERATURE SOLDER AND STRUCTURES FORMED THERBY - Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure. | 08-06-2015 |
20150318630 | DOUBLE-MATED EDGE FINGER CONNECTOR - A double-mated edge finger connector that is configured to double the connector density without resorting to a reduction in pitch. A first connector defines a first slot configured to receive and permit horizontal displacement of an edge finger of a second board relative thereto, while a second connector defines a second slot configured to receive and permit horizontal displacement of an edge finger of a first board relative thereto, to thereby establish an electrical connection between the first board and the second board. | 11-05-2015 |
20150357736 | INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR - Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed. | 12-10-2015 |
Patent application number | Description | Published |
20140209562 | PLASMA ACTIVATED CONFORMAL FILM DEPOSITION - Methods of depositing a film on a substrate surface include surface mediated reactions in which a film is grown over one or more cycles of reactant adsorption and reaction. In one aspect, the method is characterized by the following operations: (a) exposing the substrate surface to a first reactant in vapor phase under conditions allowing the first reactant to adsorb onto the substrate surface; (b) exposing the substrate surface to a second reactant in vapor phase while the first reactant is adsorbed on the substrate surface; and (c) exposing the substrate surface to plasma to drive a reaction between the first and second reactants adsorbed on the substrate surface to form the film. | 07-31-2014 |
20150126042 | SOFT LANDING NANOLAMINATES FOR ADVANCED PATTERNING - Methods for depositing nanolaminate protective layers over a core layer to enable deposition of high quality conformal films over the core layer for use in advanced multiple patterning schemes are provided. In certain embodiments, the methods involve depositing a thin silicon oxide or titanium oxide film using plasma-based atomic layer deposition techniques with a low high frequency radio frequency (HFRF) plasma power, followed by depositing a conformal titanium oxide film or spacer with a high HFRF plasma power. | 05-07-2015 |
20150206719 | PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION - Methods of depositing a film on a substrate surface include surface mediated reactions in which a film is grown over one or more cycles of reactant adsorption and reaction. In one aspect, the method is characterized by intermittent delivery of dopant species to the film between the cycles of adsorption and reaction. | 07-23-2015 |
20150235835 | HIGH GROWTH RATE PROCESS FOR CONFORMAL ALUMINUM NITRIDE - Methods of depositing conformal aluminum nitride films on semiconductor substrates are provided. Disclosed methods involve (a) exposing a substrate to an aluminum-containing precursor, (b) purging the aluminum-containing precursor for a duration insufficient to remove substantially all of the aluminum-containing precursor in gas phase, (c) exposing the substrate to a nitrogen-containing precursor to form aluminum nitride, (d) purging the nitrogen-containing precursor, and (e) repeating (a) through (d). Increased growth rate and 100% step coverage and conformality are attained. | 08-20-2015 |
20150243883 | PLASMA ASSISTED ATOMIC LAYER DEPOSITION TITANIUM OXIDE FOR CONFORMAL ENCAPSULATION AND GAPFILL APPLICATIONS - The embodiments herein relate to methods and apparatus for depositing an encapsulation layer over memory stacks in MRAM and PCRAM applications. The encapsulation layer is a titanium dioxide (TiO | 08-27-2015 |
20150247238 | RF CYCLE PURGING TO REDUCE SURFACE ROUGHNESS IN METAL OXIDE AND METAL NITRIDE FILMS - Methods of reducing particles in semiconductor substrate processing are provided herein. Methods involve performing a precursor-free radio frequency cycle purge without a substrate in the process chamber by introducing a gas without a precursor into the process chamber through the showerhead and igniting a plasma one or more times after a film is deposited on the substrate by introducing a vaporized liquid precursor to the process chamber. | 09-03-2015 |
20150249013 | CAPPED ALD FILMS FOR DOPING FIN-SHAPED CHANNEL REGIONS OF 3-D IC TRANSISTORS - Disclosed herein are methods of doping a fin-shaped channel region of a partially fabricated 3-D transistor on a semiconductor substrate. The methods may include forming a multi-layer dopant-containing film on the substrate, forming a capping film comprising a silicon carbide material, a silicon nitride material, a silicon carbonitride material, or a combination thereof, the capping film located such that the multi-layer dopant-containing film is located in between the substrate and the capping film, and driving dopant from the dopant-containing film into the fin-shaped channel region. Multiple dopant-containing layers of the film may be formed by an atomic layer deposition process which includes adsorbing a dopant-containing film precursor such that it forms an adsorption-limited layer on the substrate and reacting adsorbed dopant-containing film precursor. Also disclosed herein are multi-station substrate processing apparatuses for doping the fin-shaped channel regions of partially fabricated 3-D transistors. | 09-03-2015 |
20150315706 | LOW VOLUME SHOWERHEAD WITH POROUS BAFFLE - A low volume showerhead in a semiconductor processing apparatus can include a porous baffle to improve the flow uniformity and purge time during atomic layer deposition. The showerhead can include a plenum volume, one or more gas inlets in fluid communication with the plenum volume, a faceplate including a plurality of first through-holes for distributing gas onto a substrate in the semiconductor processing apparatus, and a porous baffle positioned in a region between the plenum volume and the one or more gas inlets. The one or more gas inlets can include a stem having a small volume to improve purge time. The baffle can be porous and positioned between the stem and the plenum volume to improve flow uniformity and avoid jetting. | 11-05-2015 |
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20130341290 | FIBRILLATED FIBERS FOR LIQUID FILTRATION MEDIA - Fiber webs which are used in filter media are described herein. In some embodiments, the fiber webs include fibrillated fibers and optionally non-fibrillated fibers, amongst other optional components (e.g., binder resin). In some embodiments, the fiber webs include limited amounts of, or no, glass fiber. The respective characteristics and amounts of the fibrillated fibers are selected to impart desirable properties including mechanical properties and filtration properties (e.g., dust holding capacity and efficiency), amongst other benefits. | 12-26-2013 |
20140170918 | DURABLE FIBER WEBS - Fiber webs that may be coated and used in filter media are provided. In some embodiments, the fiber web is a non-woven web that is coated with a resin including at least two components (e.g., a first component and a second component) that may react with one another to form a copolymer. In some embodiments, the coated fiber web may be sufficiently self-supporting, durable, and strong, such that filter media and/or elements formed of the web do not require additional support structures (e.g., a scrim). | 06-19-2014 |
20150174509 | FILTER MEDIA WITH FINE STAPLE FIBERS - Filter media, including those suitable for hydraulic applications, and related components, systems, and methods associated therewith are provided. In some embodiments, a filter media may include a non-woven layer comprising blend of glass fibers and polymeric staple fibers. The polymeric staple fibers may have a relatively small diameter. The non-woven layer comprising the fiber may have desirable properties such as one or more of a low micron rating for beta efficiency, high dust holding capacity, and/or a low resistance to fluid flow. In certain embodiments, the filter media may include two or more layers, at least one of the layers including a non-woven layer comprising the fiber blend. In some such cases, the filter media may include one or more layers that serve to enhance the overall properties of the filter media. | 06-25-2015 |
20150328565 | SURFACE MODIFIED FILTER MEDIA - Surface modified filter media, including surface modified filter media having enhanced performance characteristics, are provided. In some embodiments, a filter media may comprise two or more layers designed to enhance fluid separation efficiency. One or more of the layers may have at least a portion of a surface that is modified to alter and/or enhance the wettability of the surface with respect to a particular fluid. In certain embodiments involving a filter media including more than one surface modified layer, at least one surface modified layer may have a greater air permeability and/or mean flow pore size than that of another surface modified layer. Such a configuration of layers may result in the media having enhanced fluid separation properties compared to filter media that do not include such modified layers or configuration of layers, all other factors being equal. The filter media may be well-suited for a variety of applications, including filtering fuel, air, and lube oil. | 11-19-2015 |
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20110279682 | Methods for Target Tracking, Classification and Identification by Using Foveal Sensors - A method of operating a sensor system may include the steps of sensing a predetermined area including a first object to obtain first sensor data at a first predetermined time, sensing the substantially same predetermined area including the first object to obtain second sensor data at a second predetermined time, determining a difference between the first sensor data and the second sensor data, identifying a target based upon the difference between the first sensor data and the second sensor data, identifying a material of the target and determining a target of interest to track based upon the material of the target. | 11-17-2011 |
20130256627 | Sensors Incorporating Freestanding Carbon NanoStructures - Sensors for detecting IR radiation, UV radiation, X-Rays, light, gas, and chemicals. The sensors herein incorporate freestanding carbon nanostructures, such as single-walled carbon nanotubes (“SWCNT”), atomically thin carbon sheets having a thickness of about between 1 atom and about 5 atoms (“graphene”), and combinations thereof. The freestanding carbon nanostructures are suspended above a substrate by a plurality of conductors, each conductor electrically connected to the carbon nanostructure. In one method of manufacture, a resonance chamber is formed under the carbon nanostructure by etching of the substrate, yielding a sensor wherein the resonance chamber is bounded by at least the substrate and the carbon nanostructure. | 10-03-2013 |
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20100153193 | VARIABLE-RATE TRANSPORT FEES BASED ON HAZARDOUS TRAVEL CONDITIONS - A system and method are responsive to actual or anticipated weather changes that are likely to have an adverse effect on roadway driving conditions in a given vehicle use area. Based on the anticipated severity of the weather condition, transport-related road and/or parking tolls and fees are increased in order to discourage unnecessary vehicle travel. Using a communication system such as a transponder network, changes in the tolls and fees can be transmitted to toll collection agencies, public parking facilities and other governmental and private enterprises responsible for the collection of vehicle transport fees. Rate change information and details of weather changes can also be transmitted to vehicles likely to be affected by the adverse condition and the consequent change in these fees. | 06-17-2010 |
20100156670 | PREEMPTIVE VARIABLE RATE TRAVEL FEES - Variable thoroughfare toll rates are applied in anticipation of an event impacting traffic flow. An event occurrence is identified and determined to cause a change in a normal traffic flow amount on an impacted section of a thoroughfare. A traveler is notified of the impacted section of the thoroughfare in association with an impacted section-choice toll rate, a bypass choice in association with a bypass-choice toll rate, and a future time period duration for an application of the bypass-choice and impacted section-choice rates. A notified traveler is charged a toll for using the thoroughfare as a function of the bypass-choice rate in response to choosing to travel upon the presented bypass choice, or as a function of an impacted section-choice toll rate in response choosing to travel upon the presented impacted section choice. | 06-24-2010 |
20100161392 | VARIABLE RATE TRAVEL FEE BASED UPON VEHICLE OCCUPANCY - Methods, including service methods, articles of manufacture, systems, articles and programmable devices are provided for charging travel fees or awarding benefits as a function of vehicle occupancy. Variable travel fee schedules include a plurality of different rate values, each rate value associated with ride-sharing service points of a vehicle infrastructure and vehicle occupancy counts. Occupants within a vehicle traveling via a vehicle infrastructure are counted, the counting generating discrete occupant counts correlated with the ride-sharing service points. Subsets of variable travel fee schedule rate values are selected as a function of association with discrete occupant counts and correlated ride-sharing service points. Owners, occupants or other parties associated with the vehicle are accordingly charged a travel fee or awarded a benefit as a function of the rate value subset and an amount of the vehicle traveling. | 06-24-2010 |