52nd week of 2013 patent applcation highlights part 29 |
Patent application number | Title | Published |
20130342941 | SIGE BASED GATE DRIVEN PMOS TRIGGER CIRCUIT - Some embodiments of the present disclosure relate to a low-power, area efficient ESD protection device that provides ESD protection to an ESD susceptible circuit. The ESD protection device has a trigger circuit with a resistor. The resistor has a first terminal connected to the first external pin and a second terminal connected directly to a gate of a SiGe based PMOS shunt transistor. The trigger circuit generates a trigger signal that drives the gate of the PMOS device to shunt power away from the ESD susceptible circuit when an ESD event is present. The SiGe based PMOS shunt transistor has a lower gate leakage than a conventional NMOS shunt transistors, thereby providing for an ESD circuit with a low leakage current at small gate lengths. | 2013-12-26 |
20130342942 | AC POWER CONDITIONING CIRCUIT - A multi-coil choke for an AC power conditioner includes a magnetic core having first, second and third parallel legs. A first coil wrapped around the first leg terminates in first and second leads at respective ends. A second coil wrapped around the second leg terminates in first and second leads at respective ends. A third coil wrapped around the third leg terminates in first and second leads at respective ends. A fourth coil is formed from a proximal portion of the second lead of said first coil. The fourth coil is wrapped around a distal portion of the second lead of the third coil. A fifth coil is formed from a proximal portion of the second lead of the third coil. The fifth coil is wrapped around a distal portion of the second lead of the first coil. AC power conditioners using one or more such chokes are also disclosed. | 2013-12-26 |
20130342943 | INPUT PROTECTION CIRCUIT - In an input protection circuit, one end of a resistive element of a protection circuit is connected to an intermediate impedance point of a terminating device, which is connected between a pair of external terminals of a low amplitude differential interface circuit. The other end of the resistive element is connected to an anode terminal of a diode element. A cathode terminal of the diode element is connected to a reference potential terminal. As a result, even when one of external terminals of a low-breakdown voltage circuit is erroneously in contact with a signal terminal (i.e., a bus terminal which is always pulled up via a high resistance resistor) of the socket to be pulled up to a high voltage, the elements forming the circuit are greatly protected from deterioration and damages at low costs, while maintaining the quality of transmission signals. | 2013-12-26 |
20130342944 | ELECTRONIC CIRCUIT - An electronic circuit is provided that has a function of protecting an IC element ( | 2013-12-26 |
20130342945 | METHOD FOR MONITORING A DISCONNECTION DEVICE, IN PARTICULAR A SERVICE PLUG OR A SERVICE SOCKET, IN A BATTERY SYSTEM, AND CORRESPONDING MONITORING DEVICE - A method is used to monitor a disconnection device of a battery system having a battery with a plurality of battery cells. The method includes using a monitoring device, which is connected to the disconnection device, to detect a negative voltage or a positive voltage which is applied to connections of the disconnection device. The method also includes evaluating the detected applied negative voltage or positive voltage to establish a functional state of the disconnection device. The method also includes initiating measures to protect the battery system against manipulation of its disconnection device when a value of detected applied negative voltage or positive voltage exceeds a predetermined threshold value. | 2013-12-26 |
20130342946 | PARALLEL PROTECTION CIRCUIT FOR SOLAR MODULE - A parallel protection circuit for a solar module, comprising a field effect transistor for blocking current reversal, a driver module for driving the field effect transistor, and a protection module for preventing the gate of the field effect transistor from high-voltage puncturing. The driver module and the protection module are serially connected to each other to form the control module of the parallel protection circuit, and the control module is connected in parallel with the solar module at two output polarities of the solar module. The gate of the field effect transistor is connected between the driver module and the protection module, the source terminal of the field effect transistor is connected to the negative terminal of the solar module, and the drain terminal of the field effect transistor and the positive terminal of the solar module form two protected output polarities. The protection module may be a resistance, a diode string, or a Zener diode, and so on. The parallel protection circuit reduces the loss in a solar module protection circuit, thereby enhancing the power generation capacity of a solar cell in the early morning, evening and rainy days. In addition, the present invention has the characteristics of simple structure, great versatility, low production cost, and can play a significant role in promoting solar energy applications. | 2013-12-26 |
20130342947 | ABNORMAL VOLTAGE DETECTING DEVICE - An abnormal voltage detecting device monitors abnormal decrease in monitoring voltage during a start up period of a voltage generating apparatus. The abnormal voltage detecting device comprises a level shift circuit that generates a reference voltage for a start up period by reducing, in a predetermined amount, voltage from a reference voltage for soft starting, and further comprises a three input comparator that receives a monitoring voltage, a reference voltage Vref, and the reference voltage for the start up period, and that reverses a logical output when the monitoring voltage is lower than the reference voltage Vref and the reference voltage for the start up period. An abnormality detecting signal is delivered when the logical output of the three input comparator is reversed, and operation of an output circuit is inhibited until the reference voltage for the start up period exceeds a predetermined start up determining voltage. | 2013-12-26 |
20130342948 | A PROTECTION SYSTEM FOR AN IT ELECTRICAL DISTRIBUTION SYSTEM HAVING A FLOATING REFERENCE CONDUCTOR - A protection system for an IT electrical distribution system (EDS) has a floating reference conductor and two electrical conductors in the form of an active conductor and a neutral conductor. System includes two input terminals for electrically connecting to an MEN electrical power source that is upstream of system. Two output terminals are electrically connected to an electrical load in the form of an electrical motor for a compressor of an upright freezer display. Motor is downstream of the system. A protection device, in the form of an MCB, electrically connects terminals to allow a supply of electrical power from source to motor. MCB is responsive to a fault signal at a port for selectively electrically disconnecting at least one of terminals to prevent the supply of electrical power. A sentinel unit selectively generates the fault signal at port in response to the current in conductor being greater than a predetermined threshold. | 2013-12-26 |
20130342949 | LIGHTNING PROTECTION RADIO REMOTE UNIT, DISTRIBUTED BASE STATION, LIGHTNING PROTECTION SYSTEM AND METHOD - Embodiments of the present invention disclose a lightning protection radio remote unit RRU, which includes a primary circuit, a secondary circuit, and a working circuit, where the primary circuit and the secondary circuit are configured to convert a power supply output by a power supply system into a working power supply to power the working circuit; the shield layer located on the RRU side of the shielded cable and the shield layer located on the power supply system side of the shielded cable are grounded respectively; a surge over-voltage withstand capability between the primary circuit and the earth is not less than a lightning over-voltage; a surge over-voltage withstand capability between each inner conductor in the shielded cable and the shield layer of the shielded cable is not less than the lightning over-voltage. | 2013-12-26 |
20130342950 | Systems and Methods for Determining Actuation Duration of a Relay - An example system for determining the actuation duration of a relay can include a relay, a current-sensing device, and a controller. The relay can have an actuation coil, and armature, and a first and second contact. The current-sensing device can measure a current through the actuation coil. The controller can actuate the relay. The controller can also receive from the current-sensing device a plurality of measurement values for the current through the actuation coil. The controller can determine an actuation duration based on a local minimum value for the plurality of measurement values. The actuation duration can correspond to a duration of a movement of an armature of the relay from the first contact of the relay to the second contact of the relay. An actuation delay of the relay can be calculated based on the zero-crossing time of an input voltage value and the actuation duration. | 2013-12-26 |
20130342951 | Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system - A clamping ring configured to be coupled to a chamber structure of a plasma processing chamber is disclosed. The clamping ring has a plurality of holes for accommodating a plurality of fasteners. The clamping ring includes a plurality of flanges disposed around an outer periphery of the clamping ring, adjacent flanges of the plurality of flanges being disposed such that a hole of the plurality of holes that is disposed in between the adjacent flanges is about equidistant from the adjacent flanges. The plurality of flanges are configured to mate with the chamber structure. The clamping ring and the flanges are dimensioned such that when the plurality of flanges mate with the chamber structure, recesses between adjacent ones of the plurality of flanges form gaps between the clamping ring and the chamber structure. | 2013-12-26 |
20130342952 | SUBSTRATE MOUNTING TABLE AND SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a processing chamber and a substrate mounting table. The processing chamber defines a processing space. The substrate mounting table includes a base and an electrostatic chuck, and is disposed in the processing space. The base has a coolant path formed therein. The electrostatic chuck is provided on the upper surface of the base through an adhesive layer formed by curing a liquid adhesive, and has an electrode therein. Here, a first adhesive region is provided on the upper surface of the base, and is adhered to the electrostatic chuck through the adhesive layer. The first adhesive region has a center portion recessed compared with the end portion of the first adhesive region. | 2013-12-26 |
20130342953 | HIGH VOLTAGE NON-COPLANAR INTERDIGITATED VARACTOR - A high voltage varactor that provides a large tuning ratio and a high DC biasing capability includes a non-coplanar interdigitated structure having a stacked structure with a plurality of substantially parallel coplanar first electrode fingers and a plurality of substantially parallel coplanar second electrode fingers. The plurality of substantially parallel coplanar second electrode fingers are interdigitated with the plurality of substantially parallel coplanar first electrode fingers and are not coplanar with the plurality of substantially parallel coplanar first electrode fingers. A voltage tunable dielectric layer may be interposed between the plurality of substantially parallel coplanar first electrode fingers and the plurality of substantially parallel coplanar second electrode fingers. The voltage tunable dielectric layer may be a BST layer, or any other voltage tunable dielectric layer. | 2013-12-26 |
20130342954 | ELECTRONIC DEVICE HAVING VARIABLE CAPACITANCE ELEMENT AND MANUFACTURE METHOD THEREOF - An electronic device having a variable capacitance element, includes a support substrate providing physical support, a pair of anchors formed on the support substrate, and having support portions in a direction perpendicular to a surface of the substrate, a movable electrode supported by the support portions of the pair of anchors, having opposing first and second side surfaces constituting electrode surfaces, and at least partially capable of elastic deformation, a first fixed electrode supported above the support substrate, and having a first electrode surface opposing to the first side surface of the movable electrode, and a second fixed electrode supported above the support substrate, and having a second electrode surface opposing to the second side surface of the movable electrode. | 2013-12-26 |
20130342955 | Metal-Oxide-Metal Capacitor - A semiconductor structure may implement a metal-oxide-metal capacitor. When layer design rules change from one layer to the next, the structure may change the direction of the interleaved plates of the capacitor. For example, when the metallization width or spacing design rules change from layer M3 to layer M4, the structure may run the capacitor traces in different directions (e.g., orthogonal to one another) on M3 as compared to M4. Among the layers that adhere to the same design rules, for example layers M1, M2, and M3, the structure may run the capacitor traces in the same direction in each of the layers M1, M2, and M3. In this way, the capacitor traces overlap to large extent without misalignment on layers that have the same design rules, and the structure avoids misalignment of the capacitor traces when the design rules change. | 2013-12-26 |
20130342956 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component has electrode layers stacked with ceramic layers, where the thickness of each electrode layer is controlled to 0.5 μm or less and the average size of crystal grains constituting the electrode layer is controlled to 0.1 μm or less. The occurrence of structural defects in the laminated ceramic electronic component can be suppressed and high continuity of the electrode layers stacked with the ceramic layers is ensured. | 2013-12-26 |
20130342957 | DIELECTRIC CERAMIC, METHOD OF MANUFACTURING DIELECTRIC CERAMIC, AND MULTILAYER CERAMIC CAPACITOR - A dielectric ceramic whose primary component is an ABO | 2013-12-26 |
20130342958 | MULTILAYER CERAMIC CAPACITOR, DIELECTRIC CERAMIC, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR - A dielectric ceramic that can be sintered at a sufficiently low temperature and has a desired specific resistance at a high temperature, and a multilayer ceramic electronic component (a multilayer ceramic capacitor and the like) using the dielectric ceramic are provided. The multilayer ceramic capacitor includes a multilayer body having a plurality of laminated dielectric ceramic layers, and a plurality of internal electrodes at interfaces between the dielectric ceramic layers; and external electrodes | 2013-12-26 |
20130342959 | CAPACITORS COMPRISING ORGANIZED ASSEMBLIES OF CARBON AND NON-CARBON COMPOUNDS - This invention relates generally to capacitors comprising organized assemblies of carbon and non-carbon compounds. This invention further relates to methods of making such organized structures. It also relates to devices containing such structures. In preferred embodiments, the organized structures of the instant invention take the form of nanorods or their aggregate forms. More preferably, a nanorod is made up of a carbon nanotube filled, coated, or both filled and coated by a non-carbon material. In particular, the present invention is directed to a capacitor electrode comprising a carbon nanotube filled with one or more non-carbon materials comprising titanium, a titanium compound, manganese, a manganese compound, cobalt, nickel, palladium, platinum, bromine, iodine, an interhalogen compound, or the combination thereof. | 2013-12-26 |
20130342960 | THIN FILM CAPACITOR - A thin film capacitor includes a lower electrode layer, a dielectric layer that is provided on said lower electrode layer, and an upper electrode layer that is formed on the dielectric layer. Wherein, the lower electrode layer contains at least a Ni electrode layer, the upper electrode layer configured with at least two layers of a Ni electrode layer and a Cu electrode layer, and the dielectric layer is in contact with both the Ni electrode layer of the lower electrode layer and the Ni electrode layer of the upper electrode layer. | 2013-12-26 |
20130342961 | MEMBRANE - A membrane includes a base material and a glued fixture. The base material has a plurality of pores, and is selected from a fiber fabric film, a blended fabric film and a non-fabric film. The glued fixture has a polymer material and a plurality of inorganic materials. The inorganic materials are glued on the pores by the polymer material to form a plurality of microporous structures. | 2013-12-26 |
20130342962 | HIGH TEMPERATURE SUPERCAPACITOR - A supercapacitor device having a housing and at least one supercapacitor cell disposed in the housing, where the supercapacitor cell may include: two working electrode layers separated by an electrode separator wherein each working electrode layer is electrically connected to a current collector supported upon an inert substrate layer; an electrolyte-impervious layer disposed between each working electrode layer and each conducting layer to protect the conducting layer; and an ionic liquid electrolyte disposed within the area occupied by the working electrode layers and the electrode separator, wherein the ionic liquid electrolyte has at least one cationic component comprising a central cation with an asymmetric arrangement of substituents bonded thereto. The ionic liquid electrolyte may be gelled by a silica gellant to inhibit electrolyte flow. The operating range of the supercapacitor device is at least 20-220° C. | 2013-12-26 |
20130342963 | Arrangement for Supercapacitor Device, Supercapacitor Device Comprising the Arrangment, Method for Fabricating an Arrangement - The arrangement for supercapacitor device comprises an electrode ( | 2013-12-26 |
20130342964 | HIGHLY POROUS ACTIVATED CARBON WITH CONTROLLED OXYGEN CONTENT - Nanoporous activated carbon material having a high specific capacitance in EDLCs and controlled oxygen content, and methods for making such activated carbon material. Reduction of oxygen content is achieved by (a) curing a carbon precursor/additive mixture in an inert or reducing environment, and/or (b) refining (heating) activated carbon material after synthesis in an inert or reducing environment. The inert or reducing environment used for curing or refining is preferably substantially free of oxygen. | 2013-12-26 |
20130342965 | CARBON NANOSTRUCTURE, CAPACITOR, METHOD FOR PROCESSING CARBON NANOSTRUCTURE, AND METHOD FOR PRODUCING CARBON NANOSTRUCTURE - A carbon nanostructure's geometry and electrical characteristics can be controlled. A method for processing a carbon nanostructure according to the present invention includes the steps of: preparing a carbon nanostructure (e.g., a carbon nanotube) (a CNT preparation step); and exposing the carbon nanotube to an energy beam (e.g., an electron beam) while vibrating the carbon nanotube (an exposure step). This facilitates modifying the carbon nanotube in length and electrical characteristics. | 2013-12-26 |
20130342966 | SOLID ELECTROLYTIC CAPACITOR AND METHOD OF PRODUCING SAME - To provide a solid electrolytic capacitor capable of high performance, the capacitor including: an anode element made of tantalum or niobium; a dielectric film disposed on the anode element; and a solid electrolytic layer disposed on the dielectric film, the dielectric film including: a first dielectric film made of an oxide of the tantalum or niobium, formed on a surface of the anode element; and a second dielectric film made of a composite metal oxide having a perovskite structure, formed on the first dielectric film. | 2013-12-26 |
20130342967 | METHOD FOR PREPARING CONDUCTIVE POLYMER DISPERSION, CONDUCTIVE POLYMER MATERIAL MADE THEREFROM AND SOLID ELECTROLYTIC CAPACITOR USING THE MATERIAL - The present invention provides a method for preparing a conductive polymer dispersion, including: adding a conductive compound, a polyanion, and an oxidant to a solvent; and polymerizing the conductive compound with microwaves. The present invention further provides a conductive polymer material made from the conductive polymer dispersion and a solid electrolyte capacitor using the conductive polymer material. Compared to a conventional method, the conductive polymer is prepared by the method of the present invention in a shorter time and environmental friendly. Moreover, the conductive polymer material made from the dispersion exhibits a high conductivity. | 2013-12-26 |
20130342968 | ENCLOSURE POWER DISTRIBUTION ARCHITECTURES - Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented along a first (e.g., vertical) axis within the enclosure, comprising a power interconnect configured to distribute power among a set of load boards oriented along a second (e.g., lateral) axis and respectively connecting with a set of load units oriented along a third (e.g., sagittal) axis, and a set of power supplies also oriented along the third axis. This orientation may compactly and proximately position the loads near the power supplies in the distribution system, and result in a comparatively low local current that enables the use of printed circuit boards for the distribution board and load boards. | 2013-12-26 |
20130342969 | APPARATUS FOR SECURING AN ELECTRONIC DEVICE TO THE BODY OF A USER - The present invention relates generally to an apparatus for securing an electronic device to the body of a user and more particularly, relates to an apparatus that includes an elongated band that may be secured around a user's arm, wrist, or waist that also includes a pouch for holding an electronic device, a rechargeable battery that may be charged using either solar energy or electrical power, and an electrical connector cable to connect the rechargeable battery to the electronic device and provide a constant charge to the electronic device while the user is engaged in physical activities such as jogging, hiking, or biking. | 2013-12-26 |
20130342970 | LOW-FORCE DUST SEAL - An electronic device may have polarizer layers, color filter layers, thin-film-transistor layers, and other display layers. A display layer may be separated from structures such as a display cover layer formed from clear glass or plastic and a touch sensor layer mounted on an inner surface of the display cover layer by an air gap. Cavities within an electronic device housing may serve as a source of dust and other contaminants. The air gap may be sealed against dust intrusion from a cavity within an electronic device using a dust sealing structure. The dust sealing structure may have a rectangular ring shape that runs around a rectangular peripheral portion of a display layer. The dust sealing structure may be formed from a tape-based structure, an elastomeric structure, a compressible foam structure, or a cured liquid structure. | 2013-12-26 |
20130342971 | EDGE ARMORED DISPLAY COVER PLATE - A display device comprising a display panel and a display cover plate positioned between the display panel and an observer. The display cover plate is housed within a protective frame (edge bracket) that protects edges of the display cover plate from damage. The edge bracket supports the edge portions of the display cover plate that are most likely to have flaws resulting from such operations as cutting and grinding, and minimizes flexing of the display cover plate, particularly at an edge, which could result in the formation of cracks at the flaw site and propagation of those cracks. | 2013-12-26 |
20130342972 | Apparatus Pertaining to a Deployable Keyboard and Corresponding Bottom Surface - A housing has a front surface and a back surface. A keyboard and a corresponding bottom surface move between a non-deployed configuration and a deployed configuration. A tray slides in and out of the housing along one or more slots that are formed internal to the housing. This tray can include an internal surface having a first side that contacts the keyboard and an opposing second side that contacts the aforementioned bottom surface when the latter components are non-deployed. When moving to the deployed configuration the keyboard and bottom surface first move substantially parallel to the housing and then move substantially perpendicular to the housing. Projections on these components can interact with corresponding tracks formed in the housing to direct at the least this perpendicular movement. | 2013-12-26 |
20130342973 | ELECTRONIC DEVICE - An electronic device is provided. The electronic device includes a metal housing, a first opening, a first metal line, a first grounding point and a first current zero point. The first opening passes through the metal housing. The first metal line is disposed inside the first opening, wherein a first end of the first metal line is electrically connected to a side of the first opening, and a second end of the first metal line has a first feeding point. The first grounding point and the first current zero point are located on the side of the first opening. The metal housing forms a first loop antenna to transmit or receive a first radio frequency signal by a first excitation path from the first feeding point to the first grounding point. | 2013-12-26 |
20130342974 | HINGE STRUCTURE AND PORTABLE DEVICE USING THE SAME - A hinge structure of the present disclosure to be used with an electrical conductor is provided. The hinge structure comprises a first positioning member, a second positioning member, and at least one electrical conductor. One side of the first positioning member forms a plurality of first fixing portions, the other side has a shaft. The shaft has two openings and a tunnel connecting the two openings for the passage of the electrical conductor. The shaft further forms a slot for receiving the electrical conductor. One side of the second positioning member has a sleeve portion, and the other side has a plurality of second fixing portions. The sleeve portion is rotatively engaged with the shaft, such that the hinge structure of the present disclosure may be reduced its dimensions. Accordingly, the portable electronic device applying the hinge structure may be light-weighted and miniaturized. | 2013-12-26 |
20130342975 | PANORAMA DISPLAY DEVICE, METHOD OF MANUFACTURING THE PANORAMA DISPLAY DEVICE, AND DISPLAY DEVICE - A panorama display device includes a first display panel flexibly hinged to provide a hinged part and a non-hinged part of the first display panel, a first polarization unit on the first display panel, the first polarization unit including a separated part separated from a remaining part of the first polarization unit, a second display panel flexibly hinged to provide a hinged part and a non-hinged part of the second display panel, and a second polarization unit on the second display panel, the second polarization unit including a separated part separated from a remaining part of the second polarization unit. The hinged part of the first display panel is hinged with the separated part of the first polarization unit. The hinged part of the second display panel is hinged with the separated part of the second polarization unit. The first and second display panels are connected to each other. | 2013-12-26 |
20130342976 | SUPPORT MECHANISM AND ELECTRONIC DEVICE USING SAME - A support mechanism includes a housing, a securing portion and a stylus. The housing defines a groove. The securing portion includes a plurality of arcuate portions and a slot defined among the plurality of arcuate portions, the slot communicating with the groove. The stylus includes a stylus tip, a stylus body and a spherical portion, the stylus tip positioned at a first end of the stylus body, and the spherical portion positioned at a second end of the stylus body, the stylus tip and the stylus body received in the groove, and the spherical portion received in the slot. When the spherical portion is rotated in the slot to a support position, the stylus is able to support the housing. | 2013-12-26 |
20130342977 | METHOD AND APPARATUS FOR PROCESSING HOUSING - A method for processing a housing for devices such as electronic devices. A hairline is formed on an inner surface of an inmold mold. In addition, a hairline is formed on an inmold film. The inmold film is positioned inside the inmold mold and a housing representing the hairline of the inmold mold and the hairline of the inmold film together is formed using inmold injection molding. | 2013-12-26 |
20130342978 | ELECTRONIC DEVICE WITH SLIDABLE TRAY - An electronic device includes a housing, a tray, and a latching mechanism. The housing defines a receiving channel and an opening communicating with the receiving channel. The tray is slidably received in the receiving channel and slidable out of the housing through. The latching mechanism includes a hook, at least one latching member rotatably connected to the housing and comprising a latching clamp for latchingly engaging the hook, a driving assembly, and at least one first resilient element configured to apply a spring force to the at least one latching member. The driving assembly is configured to drive the at least one latching member to rotate from a locking position where the hook is lockingly engaged with the latching clamp to a releasing position where the latching clamp disengages from the hook. | 2013-12-26 |
20130342979 | POWER DEVICE - A power device suited for being assembled in a chassis and connected with a plug is provided. The power device includes a housing, and a receptacle, a spring clamp, a position limiting element disposed on the housing. The plug is removably connected to the receptacle. The spring clamp has a moving end. The position limiting element is located between the spring clamp and the receptacle. The position limiting element and the moving end of the spring clamp are linked together to move between a first position and a second position relative to the housing. When the plug connects to the receptacle, the position limiting element is interfered with the plug and the spring clamp simultaneously so that the spring clamp is constrained at the first position. | 2013-12-26 |
20130342980 | SURFACE MOUNT DEVICE - A surface mount device in which a pin adapter that is integrally formed with a plurality of pins connects a base board and a main board is provided to enable an automatic mounting, to enable a reflow soldering, to increase the flexibility of design, and to satisfy requirements of customers. In the surface mount device, a pin adapter | 2013-12-26 |
20130342981 | WEARABLE ELECTRONIC DEVICE - An electronic device including a frame and a plurality of capsules is provided. The frame is configured to be wearable on a user, and the frame includes a bridge portion having a first mountable section, a first arm portion having a second mountable section, and a second arm portion having a third mountable section. The plurality of capsules is configured to be mounted on the first mountable section, the second mountable section, and the third mountable section of the frame. The bridge portion is configured to be supported by the nose of a user, the first arm portion has a first free end supported by an ear of the user, and the second arm portion has a second free end supported by the other ear of the user. | 2013-12-26 |
20130342982 | SECURITY SYSTEM INCLUDING MODULAR RING HOUSING - A modular building system arrangement includes a plurality of electrical building systems. Each electrical building system has a housing with a mechanical connector that is connectable with a like connector of each other building system housing. Members of any subset of the building system housings are connectable with each other to form a building system assembly. The building systems of the building system assembly conjointly define an electrically conductive pathway interconnecting each of the building systems of the building system assembly. The pathway carries power and/or data. | 2013-12-26 |
20130342983 | ELECTRONIC DEVICE AND EXPANSION CARD OF THE SAME - An electronic device includes an enclosure with a bottom wall and a sidewall, a motherboard mounted on the bottom wall, an expansion card, and an expansion unit. The sidewall defines a first opening and a second opening. The expansion card includes an edge connector, a number of first sockets exposed through the first opening, and an expansion socket unit. The expansion socket unit includes a second socket. The expansion unit includes an expansion socket exposed through the second opening. The expansion socket of the expansion unit is electrically connected to the second socket by cables. | 2013-12-26 |
20130342984 | ELECTRONIC MODULE WITH CONNECTOR AND ELECTRONIC DEVICE USING SAME - An electronic module includes a shell, a circuit board, and a connector. The shell defines a receiving slot. The circuit board includes a main body and an extension body connected to the main body. The main body of the circuit board is received in the shell, and the extension body of the circuit board extends out of the shell via the receiving slot. | 2013-12-26 |
20130342985 | COMPUTING DEVICE PROTECTOR - A computing device protector. A faceplate to limit access to an exposed surface of a computing device. The exposed surface of the computing device comprises control features and the faceplate is configured limit access to only a portion of the control features. The faceplate is configured to be positioned relative to the computing device such that the faceplate can be removed without requiring the computing device to be dismounted. | 2013-12-26 |
20130342986 | PIN CONNECTOR STRUCTURE AND METHOD - Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces. | 2013-12-26 |
20130342987 | Method, Apparatus, and System for Dissipating Heat of Memory with Liquid Cooling - An apparatus can be used to dissipate heat from a memory with liquid cooling. A liquid-cooling block is disposed on a main board such that the liquid-cooling block is adjacent to a memory slot. The liquid-cooling block includes a metal block, metal spring leaves fixed on two sides of the metal block, and a liquid channel that penetrates through the metal block. The metal spring leaves are configured to contact a memory bank in the memory slot and conduct heat that is generated during operation of the memory bank to the metal block. A liquid inlet pipe and a liquid outlet pipe are installed on the main board and located at two ends of the liquid-cooling block in a manner such that cooling liquid can enter the liquid-cooling block via the liquid inlet pipe and exit the liquid-cooling block via the outlet pipe to form a cooling liquid loop. | 2013-12-26 |
20130342988 | FASTENING DEVICE FOR HARD DISK DRIVE - A fastening device for two hard disk drives (HDDs) includes a tray, two brackets, and an engaging member. A first side plate of the tray defines a first slide slot extending forward, and a second slide slot extending backward. The brackets are respectively fastened to the HDDs. One of the brackets includes a first protrusion slidably received in the first slide slot, and the other bracket includes a second protrusion slidably received in the second slide slot. A first end of the engaging member is rotatably mounted to two end plates of the brackets facing each other, a second end of the engaging member is detachably mounted to the end paltes. | 2013-12-26 |
20130342989 | DISK DRIVE CARRIER APPARATUS FOR A COMPUTER SYSTEM - An apparatus for supporting a disk drive in a computer system may include a drive carrier and a drive carrier support configured to receive and support the drive carrier. The drive carrier may include a drive housing configured to house a disk drive, which may include an opening for providing external access to an electrical connector of the disk drive, and one or more drive carrier connectors. The drive carrier support may include a drive carrier body, one or more guidance structures for facilitating insertion of the drive carrier into the drive carrier support, and one or more support connectors configured to releasably engage with the one or more connectors of the drive carrier to provide a manually releasable coupling between the drive carrier and the drive carrier support. In a fully inserted position of the drive carrier, drive carrier connectors may engage with the drive carrier support connectors, and the disk drive electrical connector may connect with an electrical connector of a computer system. | 2013-12-26 |
20130342990 | HARD DRIVE TRAY DEVICE - A hard drive tray device applied in a server is provided. The server includes a housing. The hard drive tray device includes a rail member and a tray. The rail member is disposed at the inner wall of the housing. The tray is slidably engaged with the rail member so as to slide between an expanded position and a closed position relative to the housing. The tray includes a base for carrying two storage devices. The base has a hollow portion. The storage devices are respectively located at two sides of the hollow portion. When the tray slides to the expanded position, one of the storage devices and at least a part of the hollow portion are located outside the housing. | 2013-12-26 |
20130342991 | SERVER RACK - A server rack includes a rack, a first electronic device, a second electronic device, and an air block plate. The first electronic device is mounted in the front of the rack and arranged close to a left side of the rack. An opening is defined between the first electronic device and a right side of the rack. The second electronic device is mounted in the rear of the rack and arranged on a same level with the first electronic device. The air block plate is slantingly connected between the first electronic device and the second electronic device. A first end of the air block plate is connected to a right end of the first electronic device, and a second end of the air block plate opposite to the first end is connected to a left end of the second electronic device. | 2013-12-26 |
20130342992 | PASSIVE NOISE CANCELLATION FOR COMPUTER COOLING SYSTEMS - Methods and systems may provide for a computing system including an electrical component, a heat exchanger coupled to the electrical component, and a fan having a rotor with a plurality of blades, one or more inlet sides and one or more outlet sides disposed adjacent to the heat exchanger. The computing system may also include an obstruction disposed adjacent to at least one of the one or more inlet sides of the fan, wherein a tone to be generated by the obstruction reduces a tonal noise associated with the fan during operation. | 2013-12-26 |
20130342993 | AIR FLOW MANAGEMENT DEVICE FOR USE IN AN ELECTRONICS SYSTEM - A heat management system may include a generally planar printed circuit board extending in a first plane, heat-generating electrical components mounted on a first side of the PCB, and an air baffle coupled to the PCB and configured to direct air flow across some of the components. The air baffle may include a generally planar air baffle body extending in a second plane parallel to and offset from the first plane of the PCB such that at least one of the components is located in an area between the air baffle body and the PCB, an opening in the generally planar body, and a generally planar wing coupled to the air baffle body at a first side of the opening and extending toward the PCB at an askew angle relative to the first plane of the air baffle body, the wing being configured to facilitate air flow through the opening. | 2013-12-26 |
20130342994 | ELECTRONIC DEVICE HAVING FIXING MEMBER - An exemplary electronic device includes an electronic component, a heat dissipation device, a fixing member and a casing contained the electronic component, the heat dissipation device and the fixing member therein. The heat dissipation device thermally contacts the electronic component. The fixing member includes a main body and an engaging portion extending from the main body. The engaging portion fixes the heat dissipation device to the fixing member. Fasteners extend through the casing and engage the main body of the fixing member to secure the fixing member on the casing. | 2013-12-26 |
20130342995 | ADJUSTABLE AIR SUCTION DEVICE - The present disclosure relates to an adjustable air suction device, comprising a driving structure, an air suction structure, and a link structure. The driving structure and the air suction structure are disposed on a housing of an electronic device. The link structure is disposed inside the housing. Both ends of the link structure correspond to the driving structure and the air suction structure, respectively. The driving structure drives one end of the link structure to move towards a first direction, and drives the other end of the link structure to move towards a second direction. The other end of the link structure pushes the air suction structure, and projects from the housing. Besides, the air suction structure corresponds to a heat dissipating device of the electronic device and draws a great deal of fluids into the electronic device for dissipating the heat of the electronic components in the electronic device. | 2013-12-26 |
20130342996 | Electronic Interconnect Method and Apparatus - An electronics chassis has many removable boards on sleds that are interconnected by a honeycomb interconnect structure. Interconnect boards in Y-planes and Z-planes are orthogonal to each other and form cells. Cooling air flows through the cells in an X direction, parallel to surfaces of the interconnect boards. The removable boards have connectors that mate with an edge of Z-divider interconnect boards. Fans blow air through the cells in the honeycomb structure unimpeded since no boards are perpendicular to the airflow. Notches in the rear of the Z-divider boards provide airflow equalization allowing closer spacing of fans to the honeycomb structure. A sled carrier honeycomb structure is placed in front of the honeycomb interconnect structure to guide sleds into position. Sled carrier dividers are offset from the Z-divider boards to allow removable boards to align with Z-divider boards in the Z-planes, parallel to airflow. | 2013-12-26 |
20130342997 | ELECTRICAL CONNECTOR ASSEMBLY AND RETAINING DEVICE THEREOF - An retaining device of an electrical connector assembly for use with a heat dissipating device, includes a first chip, a fixing lever, and a second chip. The fixing lever has one end pivotally mounted to the first chip and another end capable of locked by the first chip. The second chip is integral formed with an elastic plate. The first chip and the second chip are two separated members, and the fixing lever and the elastic plate are used for pressing two opposite ends of the heat dissipating device. | 2013-12-26 |
20130342998 | Electronic Assembly with Detachable Components - An electronic assembly including a substrate, an electronic component, a fixture, and a housing. The substrate includes a first contact array. The electronic component includes a second contact array. The fixture includes an opening adapted to position the electronic component on the substrate and to connect the second contact array to the first contact array when the fixture is aligned at a first position on the substrate. The housing is adapted to hold the substrate populated with the electronic component. The housing includes a first conductive pathway adapted to connect from an external surface at the housing to the substrate in a serial continuous conductive path when the fixture is aligned at the first position on the substrate. The electronic assembly includes a sensing device connected to the continuous conductive path to detect the integrity of the electronic assembly. | 2013-12-26 |
20130342999 | SEMICONDUCTOR MODULE - A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic member having one end engaging with the case and an opposite end in abutting contact with the heat sink. The elastic member forms a gap between the case and the heat sink, and heat conductive grease is appliable to the gap to be interposed between the case and the heat sink. | 2013-12-26 |
20130343000 | THERMAL MANAGEMENT CIRCUIT BOARD FOR STACKED SEMICONDUCTOR CHIP DEVICE - A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board that has a plurality of thermally conductive vias. A second circuit board is mounted on the first circuit board over and in thermal contact with the thermally conductive vias. The second circuit board includes first side facing the first circuit board and a second and opposite side. | 2013-12-26 |
20130343001 | HEAT DISSIPATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein. | 2013-12-26 |
20130343002 | HEAT DISSIPATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively. | 2013-12-26 |
20130343003 | HEAT DISSIPATION DEVICE WITH FASTENER AND FLANGE - A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base. | 2013-12-26 |
20130343004 | Thermally Actuated Printed Circuit Board Retainers - Thermally actuated printed circuit board (PCB) retainer assemblies that utilize at least one thermally actuated element to secure a received PCB to a heat sink in accordance with embodiments of the invention are disclosed. In one embodiment, a thermally actuated PCB retainer assembly includes a heat sink having an elongated groove configured to receive a PCB and a PCB retainer that includes a pair of complementary elongated bodies each having a first elongated face and a second elongated face where the second elongated faces of the elongated bodies are disposed in a cooperative sliding relation and at least one thermally actuated element in contact with at least one of the elongated bodies such that the thermally actuated element applies a force on the at least one elongated body in response to temperature changes such that the elongated bodies move in the cooperative sliding relation. | 2013-12-26 |
20130343005 | THERMAL TRANSFER STRUCTURES COUPLING ELECTRONICS CARD(S) TO COOLANT-COOLED STRUCTURE(S) - Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure. | 2013-12-26 |
20130343006 | ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINES BY MEANS OF GENERATING A VACUUM - The invention relates to an electrical module ( | 2013-12-26 |
20130343007 | METHOD FOR MOUNTING CONNECTION PINS IN A COMPONENT CARRIER, A DIE TOOL FOR MOUNTING CONNECTION PINS, A COMPONENT CARRIER FORMING A MODULE FOR AN ELECTRONIC ASSEMBLY, AND SUCH AN ASSEMBLY - A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool. | 2013-12-26 |
20130343008 | CIRCUIT BOARD SYSTEM WITH MECHANICAL PROTECTION - A circuit board system including mechanical protection of electrical components includes a circuit board ( | 2013-12-26 |
20130343009 | DEFLECTING DEVICE FOR ELECTROMAGNETIC RADIATION - An apparatus includes active layers, and a first high resistive layer disposed between the active layers. The apparatus further includes second and third high resistive layers disposed on respective surfaces of the active layers, the second and third high resistive layers including first and second strip conductors, respectively, the first strip conductors being connected at an end by a first connecting conductor, the second strip conductors being connected at an end by a second connecting conductor, and the first connecting conductor being disposed perpendicularly to the second connecting conductor. The apparatus further includes first contact pads disposed on respective ends of the first connecting conductor, and second contact pads disposed on respective ends of the second connecting conductor. The apparatus further includes matching layers disposed on respective surfaces of the second and third high resistive layers. | 2013-12-26 |
20130343010 | CONDUCTIVE SUBSTRATE AND ELECTRONIC DEVICE COMPRISING SAME - Disclosed are an electric conducting substrate, comprising a transparent substrate and an electric conducting pattern comprising an electric conducting line provided on the transparent substrate, and an electronic device comprising the same. | 2013-12-26 |
20130343011 | MEDICAL OR DENTAL HANDLE - A medical or dental handle for driving a medical instrument, comprises a housing with a drive device accommodated therein and/or a supply line for a drive device, a first connection device for detachably connecting a medical or dental instrument and a second connection device for detachably connecting the handle to a media source and/or a drive unit, at least one electric component preferably comprising a light-emitting diode, at least one electric contact and an electric connecting device, which connect electrically the at least one electric component and the at least one electric contact, wherein the electric connecting device comprises a flexible circuit board in the interior of the handle. | 2013-12-26 |
20130343012 | DISPLAY DEVICE - A display device includes a set bracket having end portions bent in a predetermined angle, a display panel including a display formed on the set bracket, a bending portion integrally extended from the display and bent to correspond to a bent form of the set bracket, and a fastening portion integrally extended from the bending portion and fixed to the set bracket, and a set case configured to receive the set bracket and the display panel. | 2013-12-26 |
20130343013 | PORTABLE TERMINAL - Disclosed herein is a portable terminal, including: a case; a first substrate disposed at one side of the case; a second substrate spaced from the first substrate to form a battery installing space; and a connection substrate electrically connecting between the first substrate and the second substrate and disposed in parallel with a side of the case. | 2013-12-26 |
20130343014 | INDUCTIVELY COUPLED SHELVING SYSTEM - A shelving system for the display of items, such as retail products and merchandise, is disclosed. The shelving system includes a first sheet that forms a bottom layer. This first sheet rests on top of an existing display shelf. A second sheet is placed over the first sheet. The second sheet forms a top layer, and supports the products on the shelf. At least one inductive transmission coil is located between the first and second sheets. The coil is located along the front edge of the display shelf. A circuit board is electrically coupled to the transmission coil, and to a power source. The shelving display system provides a retrofit solution to provide power to the front edge of an existing display shelf. In an alternate embodiment, a ramp is used at the front of the existing display shelf to replace the first and second sheets. | 2013-12-26 |
20130343015 | Electronic Devices With Printed Circuit Boards Having Padded Openings - An electronic device may be provided with a printed circuit board having padded through-holes. The padded through-holes may be formed from openings in a printed circuit board substrate and elastomeric members in the openings. The elastomeric members may be conductive elastomeric members such as electrically or thermally conductive elastomeric members. The printed circuit board may be secured within a housing for the electronic device using engagement members that extend through padded through-holes. The engagement members may engage with the housing or with additional engagement members that are attached to the housing. The electronic device may include a cowling structure formed over electronic components on a surface of the printed circuit board. The cowling structure may be secured to the printed circuit board using attachment members that engage with the engagement members in the padded through-holes. | 2013-12-26 |
20130343016 | ELECTRONIC DEVICE AND HOUSING THEREOF - A housing for an electronic device includes a upper housing and a lower cover. The upper housing has an open end including two opposite inwardly protruding tabs. Each protruding tab defines a through hole. The lower cover has an inner surface including four posts, each of which includes a projection protruding from a lateral surface. A slot is defined between each projection and the inner surface. The inner surface defines two through openings aligned with the projections. Each projection defines a threaded hole opposite to the corresponding through opening. Each protruding tab engages one slot, thereby enabling each protruding tab to be slidable with respect to the lower cover. When each protruding tab slides to a predetermined position, each through hole is aligned with one through opening, allowing a screw to pass through the through hole and the corresponding one through opening and to be screwed into one threaded hole. | 2013-12-26 |
20130343017 | CIRCUIT HOUSING HAVING A PRINTED CIRCUIT BOARD WHICH IS POSITIONED IN SAID CIRCUIT HOUSING BY MEANS OF POSITIONING ELEMENTS - A circuit housing having a printed circuit board and a circuit and holes in which peg-like positioning elements projecting away from the housing engage for positioning the PCB relative to the housing, at least one positioning element projecting without play into one circular hole, another positioning element, accommodated in another hole, having spreading fingers separated from one another by at least one recess, projecting into/through the further hole, elastically transverse to the direction of an imaginary connecting line of the holes and a cross-section such that a) in the direction of the imaginary connecting line, there is play between the spreading fingers and a radially inner circumferential surface of the another hole on both sides, but b) the spreading fingers make contact by their diametrically opposite side faces with the inner face of the another hole perpendicular to the connecting line without play only along a contact line/point. | 2013-12-26 |
20130343018 | ELECTRICAL JUNCTION BOX - An electrical junction box ( | 2013-12-26 |
20130343019 | Retainer Assembly Having Positioning Features for Processing Circuitry used Within an Image Forming Device Supply Item - A retainer mountable on an exterior surface of an insertable supply item of an image forming device for holding a circuit board having processing circuitry with a plurality of contacts. A reference datum point in the retainer aligns the circuit board with the retainer while a pair of alignment devices align the retainer with respect to the supply item. The supply item is inserted into a frame with the image forming device have an electrical connector having a plurality of connecting pins. When the retainer and circuit board are mounted on the supply item and the supply item is inserted into the frame of the image forming device, the retainer aligns the plurality of connecting pins of the connector with corresponding ones of the plurality of contacts of the circuit board for electrical interconnection therebetween. | 2013-12-26 |
20130343020 | Electro-Static Shielding Apparatus, Electronic Device, and Method for Manufacturing said Electro-Static Shielding Apparatus - This invention provides an Electro-Static shielding apparatus, an electronic device, and a method for manufacturing said Electro-Static shielding apparatus. Said Electro-Static shielding apparatus comprises: a base layer; a printed circuit block embedded into the base layer; an Electro-Static shielding layer located on an upper surface of the base layer and at least covering sensitive areas, the sensitive areas are those corresponding to the areas required to be shielded on the printed circuit block; and an insulating layer for at least covering the Electro-Static shielding layer. According to the technical solution of this invention, an effective shielding effect can be achieved, moreover, the manufacture cost can be reduced and a good flatness will be reached. | 2013-12-26 |
20130343021 | Display Device - A display device includes a display panel, a first film-like printed circuit board including a first terminal portion, the first film-like printed circuit board extending from one side of the display panel in a direction away from the display panel, a touch panel provided so as to be opposed to the display panel, and a second film-like printed circuit board including a second terminal portion, the second film-like printed circuit board extending from one side of the touch panel in the direction away from the display panel, the one side of the touch panel corresponding to a side parallel with and adjacent to the one side of the display panel. The first terminal portion and the second terminal portion are provided so that a connecting direction of the first or second terminal portions is different from a connecting direction of the second or first terminal portions. | 2013-12-26 |
20130343022 | SINGLE LAYER LOW COST WAFER LEVEL PACKAGING FOR SFF SIP - In one embodiment of the invention, a system in package (SiP) is described which includes a plurality of device components with different form factors embedded within a molding compound layer. A surface for each of the device components is coplanar with a surface of the molding compound layer, and a single redistribution layer (RDL) formed on the coplanar surfaces of the molding compound layer and the plurality of device components. An active device die is electrically bonded to the single RDL directly vertically adjacent the plurality of device components. In an embodiment, the SiP is electrically connected to a circuit board with the active device die between the single RDL and the circuit board. In an embodiment, the SiP is electrically connected to a circuit board with the active device die over the single RDL and the circuit board. | 2013-12-26 |
20130343023 | ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME - In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more. | 2013-12-26 |
20130343024 | PRINTED CIRCUIT BOARD AND PRINTED WIRING BOARD - On a surface layer of a printed wiring board, main power supply patterns to be applied with different DC voltages are disposed in a second region. Power supply patterns are disposed on the surface layer, and the power supply patterns are led from the main power supply patterns to a first region. The power supply patterns connect power supply terminals of terminal groups in the second region. The power supply patterns connect the power supply terminals between the terminal groups in the first region. Power supply terminals of the terminal groups of a semiconductor package are electrically connected to the main power supply patterns by the power supply patterns. Thus, potential fluctuations are reduced and radiation noise is suppressed, and the number of layers of the printed wiring board is reduced. | 2013-12-26 |
20130343025 | MODULAR ELECTRONIC BUILDING SYSTEMS WITH MAGNETIC INTERCONNECTIONS AND METHODS OF USING THE SAME - Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together. | 2013-12-26 |
20130343026 | CONTROL PANEL - A control panel designed to be placed in a vertical plane, the control panel comprising the layered assembly of a flat base, of an elastomer sheet mounted against the base, the sheet being provided with openings and optionally with domes, and of a decorative fascia. The control panel is in addition provided with a means for protection against liquids made in one piece with the sheet, the protection means comprising elements projecting from the main surface of the sheet, the said elements being so arranged that when the control panel is in the substantially vertical plane and the liquid penetrates between the sheet and the decorative fascia, the liquid is guided along a determined course and re-emerges from the panel having avoided critical zones leading in particular to detectors. | 2013-12-26 |
20130343027 | METHOD FOR STACKING ELECTRONIC COMPONENTS - A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes:
| 2013-12-26 |
20130343028 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT - The invention specifies an electronic component which has a first electrode ( | 2013-12-26 |
20130343029 | CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS - A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal. | 2013-12-26 |
20130343030 | ELECTRICAL JUNCTION BOX - An electrical junction box has a fuse module ( | 2013-12-26 |
20130343031 | ELECTRICAL JUNCTION BOX - An electrical junction box has fuse attachment portions arranged side by side and open to a lateral side of a box body. Recesses ( | 2013-12-26 |
20130343032 | POLARIZATION STRUCTURES, METHODS OF MANUFACTURING POLARIZATION STRUCTURE AND DISPLAY DEVICES INCLUDING POLARIZATION STRUCTURES - A polarization structure may include at least one adhesion layer, a phase retarder layer disposed over the adhesion layer, a polarization layer disposed over the phase retarder layer, and a light blocking member disposed over a peripheral portion of the polarization layer, under the peripheral portion of the polarization layer or under a peripheral portion of the phase retarder layer. When a display device includes the polarization structure having the light blocking member, the display device may display an image with improved visibility and uniformity in an entire display area although the display device has a minimized bezel or does not have any bezel. | 2013-12-26 |
20130343033 | Illumination Optical System and Projector Including Fluorophore - An illumination optical system includes: a light source emitting light of a first wavelength; a fluorophore unit; an optical element and a quarter-wave plate between the optical element and the fluorophore unit The fluorophore unit has a reflection region and a fluorophore region that gives off fluorescent light of a different wavelength than the first wavelength when irradiated by light of the first wavelength. The fluorophore unit is able to move such that the light from the light source sequentially irradiates the fluorophore region and the reflection region. The optical element separates the light of the first wavelength into a first linearly polarized light component and a second linearly polarized light component that is orthogonal to the first linearly polarized light component The optical element guides the first linearly polarized light component of the light emitted from the light source to the fluorophore unit, and emits the light of the first wavelength that was reflected by the reflection region and fluorescent light that was emitted by the fluorophore region in the same direction. | 2013-12-26 |
20130343034 | EFFICIENT LED-BASED ILLUMINATION MODULES WITH HIGH COLOR RENDERING INDEX - An illumination module includes a light mixing cavity with an interior surface area and window that are physically separated from an LED. A portion of the window is coated with a first wavelength converting material and a portion of the interior surface area is coated with a second wavelength converting material. The window may be coated with LuAG:Ce. The window may also be coated with a third wavelength converting material with a peak emission wavelength between 615-655 nm where the spectral response of light emitted from the window is within 20% of a blackbody radiator at the same CCT. The LED may emit a light that is converted by the light mixing cavity with a color conversion efficiency ratio greater than 130 lm/W where the light mixing cavity includes two photo-luminescent materials with a peak emission wavelengths between 508-528 nm and 615-655 nm. | 2013-12-26 |
20130343035 | ILLUMINATING APPARATUS AND METHOD OF PRODUCING LENS SHEET USED THEREIN - An illuminating apparatus includes: a light source, and a lens sheet arranged on an optical axis of the light source on which a plurality of prisms arranged in concentric circles centered on the optical axis of the light source are formed. A light diffusing part including a plurality of hemispherical light scattering elements is provided on the lens sheet, the light diffusing part includes light scattering elements whose shape is distorted due to influence of light scattering elements that are adjacent in at least one direction, and the plurality of light scattering elements is arranged in concentric circles centered on the optical axis of the light source. | 2013-12-26 |
20130343036 | PRODUCT LIGHTING REFRIGERATION DOOR - An illustrative refrigeration unit door includes a transparent window portion that receives light from a light source such that the light exhibits total internal reflection within the window portion. A series of uniformly-sized prisms with non-uniform spacing ejects light from one face of the transparent window portion at angles around 60 degrees and 30 degrees. Collimated light can be used to reduce the amount of light ejected from a second face of the transparent window that is opposite the first face. | 2013-12-26 |
20130343037 | LINEAR LED MODULE AND SOCKET FOR SAME - A lighting assembly can include a linear light module with one or more LED light elements, where a length of the light module is greater than a width of the light module. An elongate socket removably receives the linear light module therein. The socket includes a locking mechanism actuatable to releasably and resiliently lock the linear light module in the socket via actuation of one or more levers. | 2013-12-26 |
20130343038 | Display Device and Display System Combined Thereof - A display device includes a backlight module, a display panel, a prism film, a light-splitting layer, and a grating layer. The light-splitting layer splits light into a first backlight group and a second backlight group, wherein the two groups are inclined in different directions relative to a light-emitting surface of the backlight module. The grating layer allows the first backlight group to pass while blocking the second backlight group. The prism film has a plurality of prisms disposed facing the display panel. Each prism has a first surface and a second surface, wherein the angle between the first surface and the normal line to the light-emitting surface is greater than the angle between the second surface and the normal line to the light-emitting surface. | 2013-12-26 |
20130343039 | DRIVING CIRCUIT FOR LED BACKLIGHT, LCD DEVICE, AND METHOD FOR MANUFACTURING DRIVING CIRCUIT FOR LED BACKLIGHT - The driving circuit for a light emitting diode (LED) backlight includes at least two lightbars arranged in parallel connection. An output end of each of the LED lightbars is coupled with a converter module, and the converter module is configured with a digital potentiometer balancing a voltage difference between the LED lightbars and adjusting a resistance by an electric signal. In the present disclosure, the digital potentiometer adjusting the resistance by the electric signal is arranged in the converter module connected with the LED lightbar in series, and the resistance of the digital potentiometer is dynamically adjusted according to the resistance of different LED lightbars during use. Thus, the total voltage of each LED lightbar and the digital potentiometer connected with the LED lightbar in series is constant. | 2013-12-26 |
20130343040 | DIRECT TYPE BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - A direct type backlight unit includes an optical film, a diffusion plate for supporting the optical film, a bottom plate disposed under the diffusion plate, a plurality of light emitted diodes disposed between the diffusion plate and the bottom plate, and a plurality of support structures disposed between the diffusion plate and the bottom plate and fixed on the bottom plate, wherein each support structure is disposed between two adjacent light emitting diodes, a height of each support structure is smaller than a distance between the bottom plate and the diffusion plate. The direct type backlight unit can improve the problem that a dark area occurs on the diffusion plate. | 2013-12-26 |