47th week of 2013 patent applcation highlights part 18 |
Patent application number | Title | Published |
20130307124 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS - A method for manufacturing an electronic component includes mounting a vibrating element on each singulation region of a base substrate, joining the surface of a lid substrate where grooves are arranged to the base substrate via low-melting glass so as to cover a functional element in each singulation region, thereby obtaining a laminate, and performing singulation in each singulation region by breaking the laminate along grooves. | 2013-11-21 |
20130307125 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a semiconductor substrate having an upper surface and a lower surface; a device region or sensing region defined in the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; at least two recesses extending from the upper surface towards the lower surface of the semiconductor substrate, wherein sidewalls and bottoms of the recesses together form a sidewall of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to the sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate. | 2013-11-21 |
20130307126 | SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF - A semiconductor structure includes a stacked metal oxide layer on a substrate, wherein the stacked metal oxide layer includes a first metal oxide layer, a second metal oxide layer, and a third metal oxide layer from top to bottom, and the energy bandgap of the second metal oxide layer is lower than the energy bandgap of the first metal oxide layer and that of the third metal oxide layer. The semiconductor structure includes a metal oxide layer on a substrate, wherein the energy bandgap of the metal oxide layer changes along a direction perpendicular to the surface of the substrate. The present invention also provides a semiconductor process forming said semiconductor structure. | 2013-11-21 |
20130307127 | Semiconductor Device Including A Silicate Glass Structure and Method of Manufacturing A Semiconductor Device - A semiconductor device includes a semiconductor body including a first surface. The semiconductor device further includes a continuous silicate glass structure over the first surface. A first part of the continuous glass structure over an active area of the semiconductor body includes a first composition of dopants that differs from a second composition of dopants in a second part of the continuous glass structure over an area of the semiconductor body outside of the active area. | 2013-11-21 |
20130307128 | SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION STRUCTURES AND EMI SHIELDING - Semiconductor packages and related methods. The semiconductor package includes a substrate, a semiconductor chip, a package body, a recess and a conductive layer. The substrate includes a grounding element. The semiconductor chip is disposed on the substrate and has a lateral surface and an upper surface. The package body encapsulates the lateral surface of the semiconductor chip. The recess is formed in the package body and exposes the upper surface of the semiconductor chip. The conductive layer covers an outer surface of the package body, the grounding element and the upper surface of the semiconductor chip exposed by the recess to provide both thermal dissipation and EMI shielding for the semiconductor chip. | 2013-11-21 |
20130307129 | WIRING MEMBER AND SEMICONDUCTOR MODULE HAVING THE SAME - A wiring member includes a first leg portion, a second leg portion, a third leg portion, a first connecting wall and a second connecting wall. The first leg portion is electrically connected to a first conductive portion. The second leg portion is electrically connected to a second conductive portion. The third leg portion is electrically connected to a third conductive portion. The first connecting wall connects the first leg portion and the second leg portion. The second connecting wall connects the second leg portion and the third leg portion. The first leg portion, the second leg portion, and the third leg portion are non-linearly arranged. | 2013-11-21 |
20130307130 | SEMICONDUCTOR DEVICE - A semiconductor device is provided, in which a first lead ( | 2013-11-21 |
20130307131 | SEMICONDUCTOR DEVICE - A semiconductor device includes at least one semiconductor chip, a first lead, and a second lead. The first lead includes a first portion connected to the semiconductor chip via a first wiring. The second lead includes a first portion connected to the semiconductor chip via a second wiring. The first portion of the first lead and the first portion of the second lead extend along a first direction. The first portion of the first lead is disposed so as to oppose the first portion of the second lead. The semiconductor chip is disposed between the first portion of the first lead and the first portion of the second lead. | 2013-11-21 |
20130307132 | SEMICONDUCTOR DEVICE - A semiconductor device includes at least one semiconductor chip and a lead. The lead has a first portion connected to the semiconductor chip via a wiring. The first portion of the lead extends along a first direction and is placed so as to face the semiconductor chip. | 2013-11-21 |
20130307133 | SEMICONDUCTOR DEVICE ASSEMBLY AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing, at a reduced cost, a semiconductor device assembly and a semiconductor device, having a conductive support which is not eroded by an etchant for a lift-off layer even when the lift-off layer is made of a material for which no suitable selective etching solution has been found is provided. In the method of manufacturing the semiconductor device assembly, a plating step of forming a conductive support is carried out such that a first metal which is dissolved with an etchant is encapsulated in second metal which are not dissolved with the etchant, and through-holes for supplying etchant are formed in the second metal. | 2013-11-21 |
20130307134 | CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS OF MAKING THE SAME - In one implementation, a method of forming a conductive device can include depositing a non-conductive epoxy on a first portion of a lower surface of a semiconductor die, and can include depositing a conductive epoxy on a second portion of the lower surface of the semiconductor die. | 2013-11-21 |
20130307135 | SEMICONDUCTOR ELEMENT HOUSING PACKAGE AND SEMICONDUCTOR DEVICE EQUIPPED WITH THE SAME - A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend. | 2013-11-21 |
20130307136 | SHEET STRUCTURE, METHOD OF MANUFACTURING SHEET STRUCTURE, AND ELECTRONIC DEVICE - A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction. | 2013-11-21 |
20130307137 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - Embodiments of the present invention provide a chip package including: a semiconductor substrate having a first surface and a second surface; a device region formed in the semiconductor substrate; a dielectric layer disposed on the first surface; and a conducting pad structure disposed in the dielectric layer and electrically connected to the device region; a cover substrate disposed between the chip and the cover substrate, wherein the spacer layer, a cavity is created an surrounded by the chip and the cover substrate on the device region, and the spacer layer is in direct contact with the chip without any adhesion glue disposed between the chip and the spacer layer. | 2013-11-21 |
20130307138 | DESKEWED MULTI-DIE PACKAGES - A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connection can extend from a respective terminal of the package to a corresponding contact on the first microelectronic element, and a second electrical connection can extend from the respective terminal to a corresponding contact on the second microelectronic element, the first and second connections being configured such that a respective signal carried by the first and second connections in each group is subject to propagation delay of the same duration between the respective terminal and each of the corresponding contacts coupled thereto. | 2013-11-21 |
20130307139 | BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH METAL RAISED ABOVE DIELECTRIC AND STRUCTURES SO FORMED - Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality. | 2013-11-21 |
20130307140 | PACKAGING WITH INTERPOSER FRAME - The mechanisms of using an interposer frame to package a semiconductor die enables fan-out structures and reduces form factor for the packaged semiconductor die. The mechanisms involve using a molding compound to attach the semiconductor die to the interposer frame and forming a redistribution layer on one or both sides of the semiconductor die. The redistribution layer(s) in the package enables fan-out connections and formation of external connection structures. Conductive columns in the interposer frame assist in thermal management. | 2013-11-21 |
20130307141 | Wire-Based Methodology of Widening the Pitch of Semiconductor Chip Terminals - A packaged semiconductor device ( | 2013-11-21 |
20130307142 | SELECTIVE SOLDER BUMP FORMATION ON WAFER - A method for selective bump formation on a wafer includes performing a wafer test on the wafer. Known good dies (KGDs) on the wafer are identified based on the wafer test performed. Solder bumps are formed on the KGDs. | 2013-11-21 |
20130307143 | WAFER-LEVEL PACKAGING MECHANISMS - The embodiments of mechanisms of wafer-level packaging (WLP) described above utilize a planarization stop layer to determine an end-point of the removal of excess molding compound prior to formation of redistribution lines (RDLs). Such mechanisms of WLP are used to implement fan-out and multi-chip packaging. The mechanisms are also usable to manufacture a package including chips (or dies) with different types of external connections. For example, a die with pre-formed bumps can be packaged with a die without pre-formed bumps. | 2013-11-21 |
20130307144 | THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME - A three dimensional (3D) chip stack includes a first chip bonded to a second chip. The first chip includes a first bump structure overlying the first substrate, and the second chip includes a second bump structure overlying the second substrate. The first bump structure is attached to the second bump structure, and a joining region is formed between the first bump structure and the second bump structure. The joining region is a solderless region which includes a noble metal. | 2013-11-21 |
20130307145 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package including a package substrate; a semiconductor chip on the package substrate; a first via contact on the package substrate; a second via contact on the semiconductor chip; a metal wiring, which is arranged on the first via contact and the second via contact and interconnects the first via contact and the second via contact; a first encapsulating material which is arranged between the metal wiring and the package substrate and encapsulates the semiconductor chip, the first via contact, and the second via contact; and a second encapsulating material which encapsulates the first encapsulating material and the metal wiring. | 2013-11-21 |
20130307146 | MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE MOUNTING STRUCTURE OF THE ELECTRONIC COMPONENT - A mounting structure of an electronic component includes a plurality of joining portions that join a plurality of first electrode terminals on the electronic component to a plurality of second electrode terminals on a circuit board. The joining portions each include a first projecting electrode formed on the first electrode terminal, a second projecting electrode formed on the second electrode terminal, and a solder portion that joins the first projecting electrode to the second projecting electrode. The end face of the first projecting electrode is larger in area than the end face of the second projecting electrode, and at least a part of the second electrode terminals exposed from the circuit board has a larger area than the bottom of the second projecting electrode. | 2013-11-21 |
20130307147 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - Embodiments of the present invention provide a chip package including: a substrate having a first surface and a second surface; a device region located in the substrate; a conducting pad structure disposed on the substrate and electrically connected to the device region; a spacer layer disposed on the first surface of the substrate; a second substrate disposed on the spacer layer, wherein a cavity is created and surrounded by the second substrate, the spacer layer, and the substrate on the device region; and a through-hole extending from a surface of the second substrate towards the substrate, wherein the through-hole connects to the cavity. | 2013-11-21 |
20130307148 | LOW LOOP WIRE BONDING - A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads positioned thereon. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires includes a first portion extending upward from one of the second plurality of bond pads substantially along a z-axis and curving outward substantially along x and y axes in a direction towards the first semiconductor die. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die. | 2013-11-21 |
20130307149 | Three-Dimensional Integrated Circuit (3DIC) - An embodiment 3DIC device includes a semiconductor chip, a die, and a polymer. The semiconductor chip includes a semiconductor substrate, wherein the semiconductor substrate comprises a first edge, and a low-k dielectric layer over the semiconductor substrate. The die is disposed over and bonded to the semiconductor chip. The polymer is molded onto the semiconductor chip and the die. The polymer includes a portion level with the low-k dielectric layer, wherein the portion of the polymer comprises a second edge vertically aligned to the first edge of the semiconductor substrate and a third edge contacting the low-k dielectric layer, wherein the second and the third edges are opposite edges of the portion of the polymer. | 2013-11-21 |
20130307150 | COPPER INTERCONNECT STRUCTURE AND ITS FORMATION - A structure with improved electromigration resistance and methods for making the same. A structure having improved electromigration resistance includes a bulk interconnect having a dual layer cap and a dielectric capping layer. The dual layer cap includes a bottom metallic portion and a top metal oxide portion. Preferably the metal oxide portion is MnO or MnSiO and the metallic portion is Mn or CuMn. The structure is created by doping the interconnect with an impurity (Mn in the preferred embodiment), and then creating lattice defects at a top portion of the interconnect. The defects drive increased impurity migration to the top surface of the interconnect. When the dielectric capping layer is formed, a portion reacts with the segregated impurities, thus forming the dual layer cap on the interconnect. Lattice defects at the Cu surface can be created by plasma treatment, ion implantation, a compressive film, or other means. | 2013-11-21 |
20130307151 | METHOD TO RESOLVE HOLLOW METAL DEFECTS IN INTERCONNECTS - A method of repairing hollow metal void defects in interconnects and resulting structures. After polishing interconnects, hollow metal void defects become visible. The locations of the defects are largely predictable. A repair method patterns a mask material to have openings over the interconnects (and, sometimes, the adjacent dielectric layer) where defects are likely to appear. A local metal cap is formed in the mask openings to repair the defect. A dielectric cap covers the local metal cap and any recesses formed in the adjacent dielectric layer. | 2013-11-21 |
20130307152 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield. | 2013-11-21 |
20130307153 | INTERCONNECT WITH TITANIUM-OXIDE DIFFUSION BARRIER - An interconnect structure located on a semiconductor substrate within a dielectric material positioned atop the semiconductor substrate is provided having an opening within the dielectric material, the opening includes an electrically conductive material extending from the bottom to the top, and contacting the sidewall; a first layer located on the sidewall of the opening, the first layer is made from a material including titanium oxide or titanium silicon oxide; a second layer located between the first layer and the electrically conductive material, the second layer is made from a material selected from the group TiXO | 2013-11-21 |
20130307154 | INTEGRATED CIRCUIT WIRING FABRICATION AND RELATED METHODS AND APPARATUS - Integrated circuits having electrically conductive traces are described. The electrically conductive traces may be formed of multiple electrically conductive layers. One or more of the multiple electrically conductive layers may have a cut formed therein to form a gap in that electrically conductive layer. One or more electrical conductive layers of the electrical conductive traces may bridge the gap. | 2013-11-21 |
20130307155 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT - A semiconductor device according to the present invention includes a semiconductor substrate, a surface electrode provided on a front surface of the semiconductor substrate through an insulating film, a via, passing through the semiconductor substrate from a rear surface thereof up to the front surface to reach the surface electrode, having a wall including a flange portion inwardly projecting on a front surface portion of the semiconductor substrate, a via insulating film formed on the wall of the via, and a through-electrode embedded inside the via insulating film and electrically connected to the surface electrode, while the via insulating film has portions having different thickness compensating for a step between the flange portion and the remaining portion of the wall, to planarize a contact surface with the through-electrode. | 2013-11-21 |
20130307156 | Reliable Area Joints for Power Semiconductors - A power semiconductor module includes an electrically insulating substrate, copper metallization disposed on a first side of the substrate and patterned into a die attach region and a plurality of contact regions, and a semiconductor die attached to the die attach region. The die includes an active device region and one or more copper die metallization layers disposed above the active device region. The active device region is disposed closer to the copper metallization than the one or more copper die metallization layers. The copper die metallization layer spaced furthest from the active device region has a contact area extending over a majority of a side of the die facing away from the substrate. The module further includes a copper interconnect metallization connected to the contact area of the die via an aluminum-free area joint and to a first one of the contact regions of the copper metallization. | 2013-11-21 |
20130307157 | SEMICONDUCTOR DEVICE PACKAGES WITH SOLDER JOINT ENHANCEMENT ELEMENT AND RELATED METHODS - Electronic devices including a semiconductor device package, a substrate, and first and second solder joints. The semiconductor device package includes a die pad, leads and enhancement elements surrounding the die pad, a chip electrically connected to the leads, and a package body encapsulating the chip, portions of the leads, and portions of the enhancement elements, but leaving exposed at least a side surface of each enhancement element. Side surfaces of the enhancement elements and the package body are coplanar. The substrate includes first pads corresponding to the leads and second pads corresponding to the enhancement elements. The first solder joints are disposed between the first pads and the leads. The second solder joints are disposed between the second pads and the enhancement elements. The second solder joints contact side surfaces of the enhancement elements. The surface area of the second pads is greater than the surface area of the corresponding enhancement elements. | 2013-11-21 |
20130307158 | CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY IN AN INTEGRATED CIRCUIT - A method for reducing areas of high field density in an integrated circuit is disclosed. In one embodiment, the method includes forming a first curvilinear wiring structure in a first interconnect layer of an integrated circuit. A second curvilinear wiring structure may be formed in a second interconnect layer of the integrated circuit, such that the first and second curvilinear wiring structures are substantially vertically aligned. The first curvilinear wiring structure may then be electrically connected to the second curvilinear wiring structure. A corresponding apparatus and design structure are also described. | 2013-11-21 |
20130307159 | PHYSICAL DESIGN SYMMETRY AND INTEGRATED CIRCUITS ENABLING THREEDIMENTIONAL (3D) YIELD OPTIMIZATION FOR WAFER TO WAFER STACKING - One of the wafers in a semiconductor wafer to wafer stack can be rotated a predefined number of positions, relative to a previous wafer in the stack, and bonded in the position in which the maximum number of good die are aligned. An adjustment circuit on each die reroutes signals received from a pad that has been relocated due to rotation. A communication channel formed from a pair of pads that are interconnected by a Through Substrate Vias can be placed in each die and can convey selected information from one die to the next. A code representative of the position orientation of each die can be recorded in a Programmable Read Only Memory located on each die, or may be down loaded from a remote source. Any additional wafer may be stacked serially, and each one may be rotated relative to the wafer that precedes it in the stack. | 2013-11-21 |
20130307160 | Via Structure For Three-Dimensional Circuit Integration - Circuits incorporating three-dimensional integration and methods of their fabrication are disclosed. One circuit includes a bottom layer and a plurality of upper layers. The bottom layer includes a bottom landing pad connected to functional components in the bottom layer. In addition, the upper layers are stacked above the bottom layer. Each of the upper layers includes a respective upper landing pad that is connected to respective functional components in the respective upper layer. The landing pads are coupled by a single conductive via and are aligned in a stack of the bottom layer and the upper layers such that each of the landing pads is offset from any of the landing pads in an adjacent layer in the stack by at least one pre-determined amount. | 2013-11-21 |
20130307161 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a first substrate; a second substrate disposed thereon, wherein the second substrate includes a lower semiconductor layer, an upper semiconductor layer, and an insulating layer therebetween, and a portion of the lower semiconductor layer electrically contacts with at least one pad on the first substrate; a conducting layer disposed on the upper semiconductor layer of the second substrate and electrically connected to the portion of the lower semiconductor layer electrically contacting with the at least one pad; an opening extending from the upper semiconductor layer towards the lower semiconductor layer and extending into the lower semiconductor layer; and a protection layer disposed on the upper semiconductor layer and the conducting layer, wherein the protection layer extends onto a portion of a sidewall of the opening, and does not cover the lower semiconductor layer in the opening. | 2013-11-21 |
20130307162 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, a first conducive layer having first conductive patterns formed on the first insulation layer, a wiring structure positioned on the first insulation layer and including a second insulation layer and a second conductive layer having second conductive patterns formed on the second insulation layer, multiple conductive patterns formed on the wiring structures such that the conductive patterns are connected to the second conductive patterns, respectively, multiple first electrodes formed on the first conductive patterns, respectively, and multiple second electrodes formed on the conductive patterns connected to the second conductive patterns of the wiring structure, respectively. The first electrodes and the second electrodes have top surfaces which form the same plane. | 2013-11-21 |
20130307163 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a wiring substrate, a semiconductor chip whose connection terminal is connected to the wiring substrate, an underfill resin formed from a clearance between the wiring substrate and the semiconductor chip to a periphery area of the semiconductor chip, wherein the underfill resin in the periphery area is formed at a same height as an upper surface of the semiconductor chip, an auxiliary member fixed on the semiconductor chip by an adhesive layer, and including a protruding portion which protrudes to an outside from the semiconductor chip, and the protruding portion arranged at least on the underfill resin via the adhesive layer, and a sealing resin sealing the underfill resin and at least side faces of the auxiliary member, wherein respective coefficients of thermal expansion of the auxiliary member and the adhesive layer are larger than a coefficient of thermal expansion of the semiconductor chip. | 2013-11-21 |
20130307164 | INTEGRATED CIRCUIT APPARATUS, SYSTEMS, AND METHODS - High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed. | 2013-11-21 |
20130307165 | METHOD FOR LOW TEMPERATURE WAFER BONDING AND BONDED STRUCTURE - A low temperature wafer bonding method and a bonded structure are provided. The method includes: providing a first substrate having a plurality of metal pads and a first dielectric layer close to the metal pads, where the metal pads and the first dielectric layer are on a top surface of the first substrate; providing a second substrate having a plurality of semiconductor pads and a second dielectric layer close to the semiconductor pads, where the semiconductor pads and the second dielectric layer are on a top surface of the second substrate; disposing at least one of the metal pads in direct contact with at least one of the semiconductor pads, and disposing the first dielectric layer in direct contact with the second dielectric layer; and bonding the metal pads with the semiconductor pads, and bonding the first dielectric layer with the second dielectric layer. | 2013-11-21 |
20130307166 | METHOD FOR FORMING PATTERNS OF DENSE CONDUCTOR LINES AND THEIR CONTACT PADS, AND MEMORY ARRAY HAVING DENSE CONDUCTOR LINES AND CONTACT PADS - A method for forming patterns of dense conductor lines and their contact pads is described. Parallel base line patterns are formed over a substrate. Each of the base line patterns is trimmed. Derivative line patterns and derivative transverse patterns are formed as spaces on the sidewalls of the trimmed base line patterns, wherein the derivative transverse patterns are formed between the ends of the derivative line patterns and adjacent to the ends of the trimmed base line patterns. The trimmed base line patterns are removed. At least end portions of the derivative line patterns are removed, such that the derivative line patterns are separated from each other and all or portions of the derivative transverse patterns become patterns of contact pads each connected with a derivative line pattern. | 2013-11-21 |
20130307167 | PHENOLIC OLIGOMER AND METHOD FOR PRODUCING THE SAME - The present invention relates to techniques including a phenolic oligomer of general formula (1): | 2013-11-21 |
20130307168 | LIQUID-GAS MIXER AND TURBULATOR THEREFOR - Disclosed is a liquid-gas mixer including a central passageway provided about an injector axis, and first and second gas passageways. The first gas passageway is radially outward of the central passageway and radially inward of the second gas passageway. A turbulator is provided between the first and second gas passageways, and includes a plurality of first disturbance generators and a plurality of second disturbance generators. The first and second disturbance generators are provided about the turbulator in an alternating arrangement. | 2013-11-21 |
20130307169 | METHOD FOR MANUFACTURING MICRO-OPTICAL ELEMENT - A method for manufacturing micro-optical element includes the following steps: (a) providing a mold core defining a plurality of replicated structures in a side surface of the mold core; (b) providing a transparent base board facing the side surface of the mold core defining the plurality of replicated structures; (c) distributing liquid replication material on the transparent base board corresponding to the plurality of the replicated structures via a droplet distribution tool; (d) molding the liquid replication material distributed on the transparent base board by the mold core; (e) solidifying the liquid replication material; (f) removing the mold core; and (g) cutting the transparent base board to form a plurality of micro-optical elements. | 2013-11-21 |
20130307170 | BLOOD SUBSTITUTES AND USES THEREOF - The invention relates to blood substitute compositions, and methods of use thereof. Described herein are compositions in which hemoglobin is maintained substantially in the reduced form of hemoglobin as opposed to the oxidized methemoglobin form through inclusion of an oxido-reductase enzyme and reducing agent within a vesicle with the hemoglobin. The vesicles additionally can comprise a dismutase, a catalase, and an electron acceptor, each of which contribute to either the maintenance of hemoglobin in the active oxygen carrying state or provide a benefit not achieved with free hemoglobin. | 2013-11-21 |
20130307171 | WASHING DEVICE FOR POROUS HOLLOW FIBER MEMBRANES, AND POROUS HOLLOW FIBER MEMBRANE PRODUCTION METHOD - This invention relates to a washing device for a porous hollow fiber membrane, including: n (n is an integer of 2 or greater) washing tanks that contain a washing liquid, through which the porous hollow fiber membrane sequentially passes; and at least one pressure applying unit that pressurizes or de-pressurizes the washing liquid on the outer side of the porous hollow fiber membrane immersed in the washing liquid to force the washing liquid to pass through a membrane part of the porous hollow fiber membrane, in which the pressure applying unit is accommodated in at least one of the first to (n−1)-th washing tanks. According to the invention, it is possible to provide a porous hollow fiber membrane production method that is capable of reducing the concentration of residual substances in membrane retained water and preventing reattachment of a hydrophilic polymer. | 2013-11-21 |
20130307172 | Method Of Converting Tear-Off Asphaltic Shingles To A Formed Product - A method of converting asphaltic shingles to a formed product, comprising the steps of providing a charge of recovered asphaltic shingles, comminuting the charge into small particles, adding to the charge a quantity of hydrated aluminosilicate, heating the charge while simultaneously mixing the comminuted charge to a homogeneous state, placing the mixed charge into molds to form the product, applying pressure to the charge in the mold for a determinable dwell time, ejecting the product from the mold, and cooling the product. | 2013-11-21 |
20130307173 | STAMPING AND/OR DRILLING DEVICE COMPRISING A SUBSTRATE SUPPORT HEAD WITH CONTINUOUSLY CONTROLLED ORIENTATION - A device for stamping and/or drilling a substrate, including two dies supported by two support assemblies configured to be moved relative to each other in translation. The assembly includes: a base; an orientable head fixed to the die; a connection mechanism between the base and the head to adjust orientation of the head relative to the base; pressure sensors configured to continuously output information about pressure applied at different points of the die; and a mechanism controlling a connection, to continuously control the orientation of the head relative to the base, in response to information output by the sensors. | 2013-11-21 |
20130307174 | METHOD OF REMOVING AN OUT-OF-TOLERANCE AREA IN A COMPOSITE STRUCTURE - A method of removing an out-of-tolerance area in a composite structure may comprise determining a location of the out-of-tolerance area within the composite structure, and selecting a volume of the composite structure to be removed based on the location of the out-of-tolerance area. The method may further include programming a machine tool to remove the volume and to pause after removal of each one of a quantity of layers of the volume. The method may additionally include removing one of the layers using the machine tool. | 2013-11-21 |
20130307175 | METHOD FOR PRODUCING A THREE DIMENSIONAL GREEN ARTICLE - A method for producing a three dimensional green article includes: (a) providing a slurry composition that contains an inorganic powder, a binder, and a solvent; (b) forming a slurry layer made of the slurry composition; (c) removing the solvent of the slurry layer from an upper surface of the slurry layer so as to form the slurry layer into a green layer with a plurality of pores; (d) scanning the green layer with an energy beam having a power sufficient to vaporize or burn the binder such that the vaporized binder or the burnt binder escapes from the green layer through the pores, while leaving the inorganic powder which is not bound by the binder; and (e) repeating steps (b) to (d). | 2013-11-21 |
20130307176 | Single-Fire Two-Step Soak Method - A method for making a cordierite filter article, including:
| 2013-11-21 |
20130307177 | METHOD FOR MANUFACTURING POROUS CERAMIC BODIES WITH GRADIENT OF POROSITY - Provided is a method of manufacturing porous ceramic bodies with gradient of porosity, in which a gradient that is continuous to a pore size and porosity is precisely controlled in a simple way. The method includes the steps of: obtaining molded bodies by pressurizing and molding a mixture of powder obtained by mixing ceramic powder and polymer powder at a weight ratio of | 2013-11-21 |
20130307178 | DRILLING TOOL AND METHOD FOR PRODUCING DRILL HOLES - A drilling tool for producing drill holes includes a tip and a shaft arranged opposite the tip in a direction of a longitudinal axis of the drilling tool. The drilling tool has at least one geometrically defined cutting edge in the tip area, and has an expanded diameter trailing the tip in a longitudinal direction from the tip. The drilling tool has a first area with a first diameter that precedes the expanded diameter, and a second area with a second diameter, larger than the first diameter, that trails the expanded diameter. The drilling tool is distinguished in that the expanded diameter and/or the second area is/are embodied such that chips are produced in the area of the expanded diameter and/or in the second area when a workpiece is machined, chips consistent with those produced when a workpiece is machined with a geometrically undefined cutting edge. | 2013-11-21 |
20130307179 | COOLING DEVICE AND COOLING METHOD FOR AN EXTRUDATE - A device for sizing and cooling an extruded flat product made of plastic material includes at least two main rolls and a polishing stack including a plurality of rolls arranged in tandem and disposed downstream of the main rolls. An adjustable sizing nip is disposed between all of the adjacent respective rolls. The sizing nip is adjustable so as to pinch the flat product during an extrusion process to a greater or a lesser extent. | 2013-11-21 |
20130307180 | SNOWMAN MAKING DEVICE - A snowman making device includes hollow spheres each having a hollow outer sphere and a hollow inner sphere. The outer sphere is penetrated by a plurality of first openings. The inner sphere is located within the outer sphere and spaced from the outer sphere by a first distance. The spheres collect snow between the outer sphere and the inner sphere and upon an outer surface of the outer sphere as the hollow spheres are rolled in snow, thereby forming light weight snow spheres useful as body parts of a snowman. The inner sphere is penetrated by a plurality of second openings that permit the entry of snow into an interior of the inner sphere, thereby preventing movement of snow located between the outer sphere and the inner sphere. The inner and outer spheres are each formed as first and second joinable hemispheres. Accessory decorations can be attached to the spheres. | 2013-11-21 |
20130307181 | WATER-BALLASTED PROTECTION BARRIERS AND METHODS - A water-ballasted molded plastic barrier system incorporates barrier segments wherein each segment employs a sawtooth reflective design, designed to prevent the tire of a vehicle, impacting the barrier, from climbing up the side of the barrier segment. Adjacent barrier segments are attached together using an interlocking knuckle design, having a lug pin connection system. Wire rope cable assemblies are internally molded into each barrier segment to create an impenetrable cable fence. The wire rope cable assemblies include steel bushings which are molded into the interlocking knuckles to further strengthen the barrier system. | 2013-11-21 |
20130307182 | METHOD FOR MANUFACTURING A GOLF BALL - An object of the present invention is to provide a method for manufacturing a golf ball excellent in kneading workability when preparing a core rubber composition containing (d) a carboxylic acid and/or a salt thereof. The present invention provides a method for manufacturing a golf ball comprising the steps of blending (a) a base rubber and at least (b) a carboxylic acid and/or a salt thereof to prepare a first masterbatch; blending (a) a base rubber and at least (c) a crosslinking initiator to prepare a second masterbatch; blending the first masterbatch and second masterbatch to form a core rubber composition; molding the core rubber composition into a spherical core; and forming one or more cover layers covering the spherical core. | 2013-11-21 |
20130307183 | INJECTION MOLDING METHOD AND INJECTION MOLDING DEVICE - An injection molding device, includes a first mold which has an injection material channel and a second mold defining a first cavity in which a first product part can be injection-molded. The first mold can be moved in a direction different from the mold opening direction. In this manner, especially two-component products can be produced, the first mold together with the first product part being moved to a third mold section with which a second cavity for injection of another injection material is defined. | 2013-11-21 |
20130307184 | Implantable Medical Electrical Device Connector Module Assemblies and Methods - Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator. | 2013-11-21 |
20130307185 | METHOD AND PROCESS FOR MANUFACTURING A TERMINAL BLOCK - A method of manufacturing a terminal block for a telecommunication cable is disclosed, which includes: positioning at least one electrical connector in a mold, the at least one electrical connector comprising a first end adapted to receive a first electrical wire and a second end adapted to receive a second electrical wire; connecting at least one insulated electrical wire to the first end of each of the at least one electrical connectors; and injecting a dielectric material by a force of greater than 1 g into the mold containing the at least one electrical connector and the at least one electrical wire, wherein the dielectric material surrounds at least the first end of the electrical connector and the at least one electrical wire. | 2013-11-21 |
20130307186 | Molding Tool for Back-Molding a Plastic Film with a Plastic Melt - The invention relates to a mould ( | 2013-11-21 |
20130307187 | Oral Care Implement Having Multiple Soft Tissue Cleaner Components - An oral care implement with a soft tissue cleaner. The inventive oral care implement comprises different kinds of soft tissue cleaners that offer expanded in-mouth cleaning. In one aspect, the invention can be an oral care implement comprising: a handle; a head having a structural body having a front surface and a rear surface opposite the front surface; a basin formed into the rear surface of the structural body, the structural body comprising a protuberance extending upward from a recessed floor of the basin, the basin surrounding the protuberance; a first cleaner formed of a resilient material for cleansing soft oral tissue located within the basin, the protuberance of the structural body extending through a central hole of the first cleaner; and a second cleaner formed of a resilient material for cleansing soft oral tissue, the second cleaner located on the protuberance of the structural body. | 2013-11-21 |
20130307188 | COMPOSITE MATERIAL FOR THE MAKING OF DECORATIVE ITEMS AND PROCEDURE FOR THE MAKING OF A DECORATIVE ITEM - Composite material for the making of decorative items which contains at least a polymeric component and at least a metallic powder dispersed in the polymeric component in an amount in weight between 2% and 95%. The metallic powder includes plate-like particles with a nanometric thickness of between 5 and 300 nm and a preferential growth in a two-dimensional surface with at least a dimension of between 0.6 and 100 μm. A procedure for the making of an ornamental article includes at least a phase for preparing at least a base component of a silicone resin; at least a phase for preparing the metallic powder; at least an initial phase for mixing the metallic powder with the silicone resin base component to obtain an even mixture; and at least an initial phase for reticulating the base component in the even mixture with the metallic powder distributed in a homogeneous way. | 2013-11-21 |
20130307189 | Injection Molding Apparatus and Method - A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path. | 2013-11-21 |
20130307190 | MOLD CLAMPING DEVICE AND MOLDED PRODUCT EJECTING METHOD - Provided is a mold clamping device that saves a space, has a light machine weight and requires low manufacturing cost in an injection molding machine, a diecast machine, and the like. The mold clamping device includes: a stationary platen having a stationary mold; a movable platen having a movable mold; a plurality of tie bars supported by the stationary platen; end blocks provided in the same number as the tie bars, which is penetrated by the tie bars and coupled with the movable platen with toggle link mechanisms; split nuts supported by the end blocks and capable of being engaged with and disengaged from the tie bars; a mold opening-closing drive unit for opening and closing the movable platen, the end blocks, and the toggle link mechanisms; and a cross head for operating the toggle link mechanisms to generate a mold clamping force. | 2013-11-21 |
20130307191 | Expanded Compression Molding of Composite Plastics - Composite polymeric articles significantly larger than the size of a compression molding press are produced by providing a plurality of expandable pillows interposed between an upper plate and the upper exterior surface of an outside the press upper mold. The upper plate has a plurality of downwardly extending paired vertical arms attached to opposite sides of the upper plate. Each vertical arm has a lower portion having a eyelet (or aperture), and each pair of vertical arms together forms an aligned pair of eyelets. When the upper and lower mold portions are pressed together, the eyelets reside below the exterior lower surface of the outside the press lower mold portion. Each eyelet is dimensioned to reversibly receive a horizontal or lateral arm that is deployed below the exterior lower surface of the outside the press lower mold portion. A plastic material is introduced onto the interior surface of the lower mold portion, which is compressed between the upper and lower mold portions via a press having a press area that does not extend out over the outside the press portions of the upper and lower mold portions. The lateral arms are extended through the paired and aligned eyelets. The plurality of expandable pillows are expanded, and the lateral arms are brought into compressive abutment with the exterior lower surface of the outside the press lower mold portion. The plastic material residing between the outside the press upper mold portion and the outside the press lower mold portion is then correspondingly compressed. | 2013-11-21 |
20130307192 | DEFORMABLE WELDMENT OF COSMETIC OVERMOLDING - A structure configured to be overmolded with a material includes a deformable portion that may be biased by a slider of a mold. When biased by the slider, the deformable portion may deform in the direction that the deformable portion is being biased by the slider. The deformable portion may be deformed in order to reduce flash during an injection molding process. | 2013-11-21 |
20130307193 | Support Structures and Deposition Techniques for 3D Printing - There is provided a support structure for use with 3D printing of objects from computer-aided designs. The support structures include fine points that contact the down-facing surfaces of the 3D object being printed in order to adequately support the 3D object while also being adapted for easy removal after the 3D print process is complete. The fine points are possible by controlling the operation of the dispenser to provide a precise amount of material in a precise location. The dispenser jumps from a first fine point to a second fine point by retracting the print material after the first fine point is printed and then moving the dispenser vertically relative to the first fine point before the dispenser is moved horizontally to the second fine point. | 2013-11-21 |
20130307194 | DEVICE FOR MAKING AN OBJECT - An apparatus for making an object is disclosed herein. | 2013-11-21 |
20130307195 | CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION - The present invention has an object to provide a curable composition for transfer materials. The curable composition is applicable to a UV nanoimprint process capable of forming micropatterns with high throughput, is applicable to a thermal nanoimprint process in some cases, and is capable of forming a micropattern having high selectivity on etching rates regarding a fluorine-based gas and an oxygen gas. The curable composition for transfer materials comprises a silsesquioxane skeleton-containing compound having, in its molecule, a specific silsesquioxane skeleton and a curable functional group. | 2013-11-21 |
20130307196 | PRODUCTION OF AN ARTICLE BY SELECTIVE FUSION OF POLYMER POWDER LAYERS - A process is described for manufacturing articles by selective fusion of polymer powder layers, especially the rapid prototyping by solid-phase laser sintering of a powder based on a copolyamide of type 6 having a low enthalpy of cold crystallization. Further described, are the articles obtained by such a process. | 2013-11-21 |
20130307197 | METHOD AND DEVICE FOR PRODUCING CONTAINERS WHICH ARE FILLED WITH A LIQUID FILLING SUBSTANCE - Method and device for producing containers which are filled with a liquid filling substance from parisons made from a thermoplastic material, wherein the respective parison is at least conditioned thermally and is subsequently shaped into the container during a shaping and filling phase in a mould by way of at least one liquid filling substance as pressure medium, and wherein, while it is being shaped into the container, the prison is preferably guided at least temporarily through a stretching rod and is stretched in the axial direction. | 2013-11-21 |
20130307198 | Pearlescent Container - A pearlescent container comprising about 86% to about 99.99% of a thermoplastic material having a Total Luminous Transmittance value of at least about 80%, about 0.01% to about 5% of a siloxane fluid having a viscosity of no greater than about 1,000,000 cst, wherein said thermoplastic material and said siloxane fluid are immiscible, forms a lamellar structure, and have a Refractive Index difference of at least about 0.1. | 2013-11-21 |
20130307199 | CONTAINER HAVING OXYGEN SCAVENGING SYSTEM - A polyethylene terephthalate container having a hydrogen generator and catalyst disposed or otherwise incorporated in components of the container, including the closure, closure insert, label, label glue, and/or any other portions of the final container assembly. In addition, the catalyst and the hydrogen generator can both be located in the same component. Methods for dispersing the hydrogen generator and catalyst in the container wall without affecting clarity are provided. | 2013-11-21 |
20130307200 | Sintered Polycrystalline Silicon-based Thermoelectrics - Methods and processes to fabricate thermoelectric materials and more particularly to methods and processes to fabricate doped silicon-based semiconductive materials to use as thermoelectrics in the production of electricity from recovered waste heat. Silicon metal particulates, extracting liquid, and dopant are combined into a mixture and milled. Substantially oxidant-free and doped silicon metal particulates are recovered and sintered to form a porous polycrystalline silicon-based thermoelectric material. | 2013-11-21 |
20130307201 | CERAMIC ARTICLE AND ADDITIVE PROCESSING METHOD THEREFOR - An additive manufacturing process includes providing a powder mixture having a ceramic constituent and a reactive metal constituent, and reacting and fusing the powder mixture with a directed energy source to form a geometry. | 2013-11-21 |
20130307202 | Method and Apparatus for Heating Metals - The present invention relates to a method of heating a non-ferrous and/or ferrous metal-containing stock in a furnace with a heating chamber, a charging door, an exhaust stream port and an exhaust stream duct, which comprises
| 2013-11-21 |
20130307203 | GAS STRUT ASSEMBLY WITH AN INTERNAL DETENT MODULE - A gas strut assembly includes a housing defining an interior space. A rod is coupled to the housing, and is slideably moveable between an extended position and a retracted position. A flexible member is secured in position relative to the housing. A rigid member is coupled to and moveable with the rod. The flexible member includes at least one displaceable member that moves radially away from the central axis in response to a second radial force component of a closing force when engaged by the rigid member moving from the extended position into the retracted position. The flexible member includes a multi-layered structure that changes shape in response to a change in temperature to affect the magnitude of the second radial force component required to move the displaceable member. | 2013-11-21 |
20130307204 | LOAD MOUNT JOUNCE RATE CUP - A vehicle suspension system including a shock upper mount assembly mounted to vehicle structure, a jounce bumper being made of an elastomeric material and including a vertically extending rod bore around a rod of a shock absorber, and a jounce rate cup. The jounce rate cup is made of an elastomeric material and includes a horizontally extending support flange having a lower surface mounted on the jounce bumper, a horizontally extending dust boot attachment flange spaced from the support flange and having an upper surface located below and adjacent to the shock upper mount assembly, and a vertical flange extending between the support flange and the dust boot attachment flange to define a gap between the support flange and the dust boot attachment flange, with the jounce rate cup including a vertically extending rod bore mounted around the rod. | 2013-11-21 |
20130307205 | CLAMPING/RELEASING FLANGE - The invention relates to a clamping/releasing flange that can be used to hold a plate panel on a machining stage, comprising a supporting body ( | 2013-11-21 |
20130307206 | POST-PROCESSING APPARATUS, IMAGE FORMING APPARATUS, AND FOLDING APPARATUS - A post-processing apparatus includes a transport path, a loading part, a first folding member, a second folding member, a drive mechanism, a position detecting unit, a time information output part, a time monitoring part, and a rotational driving control part. The time monitoring part measures a moving time of the blade member from a first position between an initial position and a protrusion position to a second position, and determines whether the moving time has elapsed by a predetermined time. When the time monitoring part determines that the moving time has elapsed by the predetermined time, the rotational driving control part controls a rotary drive part so as to switch a rotational driving direction into a backward rotational direction. | 2013-11-21 |
20130307207 | INSERTER AND SINGLE-COPY GRIPPER WITH DEEP REACH - An inserter including a pocket for holding an unevenly folded printed product having a fold edge, a first section on a first side of the fold edge and a second section on a second side of the fold edge that is at least 20 percent shorter than the first section is provided. The pocket includes a lower support surface for supporting the fold edge, a first wall for supporting the first section and a second wall for supporting the second section. The first and second walls each have at least one cutout defined therein. The at least one cutout of the second wall includes a lower cutout edge that is less than a length of the second section away from the lower support surface. The inserter also includes a gripper for securely gripping unevenly folded printed product and removing the unevenly folded printed product from the pocket by passing through the at least one cutouts in the first and second walls. A method of inserting an insert into an unevenly folded printed product is also provided. | 2013-11-21 |
20130307208 | PERIPHERAL DEVICE AND SHEET FEEDING METHOD - A peripheral device includes a body, a carriage, a first feeding assembly, and a second feeding assembly. The carriage and the first and second feeding assemblies are assembled to the body. The first and second feeding assemblies are located at the same side of the body. The carriage moves back and forth along an axial direction. A portion of the first feeding assembly is located on a moving path of the carriage. The first feeding assembly is removably coupled to the second feeding assembly. The first feeding assembly drives the second feeding assembly to move a printing medium into or out of the body. When the carriage is moved to one side of the body, the carriage moves the first feeding assembly away from the second feeding assembly, such that the printing medium is fed into or moved out of the body only by the first feeding assembly. | 2013-11-21 |
20130307209 | PAPER SHEETS HANDLING APPARATUS - A paper money handling apparatus comprises a service mechanism unit for delivery of a paper sheet or sheets, a counting processing unit for counting of a paper sheet or sheets, a stacker for storing of a paper sheet or sheets, and conveyance paths for conveyance of a paper sheet or sheets to the service mechanism unit, the counting processing unit, and the stacker. The apparatus further comprises connection guides provided between the conveyance paths and the stackers to perform delivery of a paper sheet or sheets, a motor, a cam, and a solenoid, which switch the connection guides to a connected state to connect the same to the conveyance paths and the stackers to enable delivery of a paper sheet or sheets and to an evacuated state to release the connection. | 2013-11-21 |
20130307210 | SHEET TRANSPORT APPARATUS FACILITATING ESTABLISHING A CONTINUOUS SHEET TRANSPORT PATH - In a sheet transport apparatus, first transport guides are provided in pair in parallel to, and spaced from, each other to form a first transport path to convey sheets. The transport guides have one ends engageable with the ends of second transport guides, which are provided in pair to be parallel to, and spaced from, each other to form a second transport path. A supporting member rotatably supports the second transport guides in response to the position of the first transport guides. When the ends of the first and second transport guides are brought into engagement with each other with the one ends of the second transport guides inclined against the first transport guides to displace the ends from each other, both transport paths can be connected to each other without changing the transverse cross-sectional depth thereof, thereby preventing a step or hollow from being formed in the connecting section. | 2013-11-21 |
20130307211 | SHEET EJECTION TRAY - A sheet ejection tray on which a sheet ejected from a sheet ejection port lands, includes: an inclined surface that becomes higher as farther from the sheet ejection port in a sheet ejecting direction; a projecting member that is provided in a region closer to the sheet ejection port than the position on which a leading end of the sheet having a dimension not smaller than a predetermined value lands and which has a guiding surface more inclined than the inclined surface; and an abutting cover that contacts a rear end of the sheet moving toward the sheet ejection port due to the inclination of the guiding surface. The leading end of the sheet passes above the projecting member before landing on the guiding surface. A portion of the sheet closer to the sheet ejection port than the leading end lands on the guiding surface. | 2013-11-21 |
20130307212 | SHEET REVERSING DEVICE - A sheet reversing device including a first conveyance unit, second conveyance unit, third conveyance unit, and sheet pressing member. The first conveyance unit includes a first holder, and a support surface that supports the sheet, and conveys the sheet with an edge held by the first holder, and its entire surface supported by the support surface. The second conveyance unit includes second holders, which convey the sheet. The third conveyance unit is supported to be swingable between a reception position at which the third conveyance unit receives the sheet, and a transfer position at which the third conveyance unit transfers the sheet to the second conveyance unit. The third conveyance unit includes a third holder, and conveys the sheet held by the third holder. The sheet pressing member presses the sheet, transferred from the third conveyance unit to the first conveyance unit, against the first conveyance unit support surface. | 2013-11-21 |
20130307213 | SHEET CONVEYING APPARATUS - A sheet conveying apparatus irradiates a conveyed sheet with light from a light source to receive reflected light by a line sensor and detects a side edge position of the sheet based on an output of a reading pixel of the line sensor. The reading pixel within a predetermined range facing the sheet in the line sensor is determined to be used for light quantity adjustment of the light source based on a size in a width direction orthogonal to a sheet conveying direction, and the light quantity of the light source is adjusted based on the output of the determined reading pixel. A threshold value for detecting the side edge position of the sheet is determined based on outputs of reading pixels within the region facing the sheet and outputs of the reading pixels within the region not facing the sheet in the line sensor. | 2013-11-21 |
20130307214 | MODULAR GAME CASE - A new game piece chamber has a front surface, a rear surface, and an interior. Spaced apart railings extend in parallel from the front surface to the rear surface and have smooth surfaces facing the interior. A securing mechanism is attached to the railings opposite the smooth surfaces. One or more dividers are configured to be removably secured to the securing mechanism and to organize game pieces stored in the interior. A new game board chamber has a first side and a second, opposing side and a securing mechanism on at least one of the two sides. One or more game piece holders are configured for removable attachment to, and repositioning on, the securing mechanism. A game board organizer is attached to the first side or the second side. A new modular gaming case is configured to house game piece chambers and game board chambers. | 2013-11-21 |
20130307215 | CARD DISPOSAL SYSTEM FOR TABLE GAME - A card disposal system for a table game is provided that is capable of assuring the disposal of all of cards corresponding to a predetermined number of decks that are used at a game table without any deficiency and without any fraudulent diversion being made over such cards. | 2013-11-21 |
20130307216 | ROTARY CARD SHUFFLING MACHINE - A rotary card shuffling and selection machine for use in playing a game of chance includes a wheel supported in a generally vertical plane for rotation about a horizontal rotary axis. The wheel is provided with a plurality of card positions arranged concentrically about the rotary axis. Each card position receives a card bearing indicia suitable to decide the game of chance. The cards are secured in card positions disposed around the wheel such they are oriented face up so that indica on the face of the card, which is relevant to the outcome of the game of chance, can be seen while the wheel is rotating. | 2013-11-21 |
20130307218 | PROJECTILE CONTAINMENT SYSTEM - Steel plates loosely mounted in frame, with neoprene pads between the frame and plates to better absorb the noise and impact from projectiles. The plates are inclined having laterally projecting tabs in openings defined by parallel steel side-walls. A containment chamber communicates with downstream ends of inclined plates by a transition area downstream of the inclined plates. Chamber has projectile impact boundary defined by laterally extending vanes or strips of hardened steel. End portions of vanes fit loosely in openings defined by the chamber side-walls. The vanes have beveled edges that abut one another so movement of adjacent vanes occurs in response to one of these vanes being struck by a projectile. Vanes are biased inwardly toward normal, or rest positions, but can move outwardly when impacted by a projectile. The number of vanes selected to establish angles of incidence for adjacent vanes less than 12 degrees in chamber. | 2013-11-21 |
20130307219 | SEAL HOLDER ANDMETHOD FOR SEALING A BORE - A seal holder for retaining a sealing arrangement ( | 2013-11-21 |
20130307220 | OIL SCRAPER RING - The oil control ring ( | 2013-11-21 |
20130307221 | PISTON RING - A piston ring, in particular a compression piston ring, includes a main body, which has a radially outer running surface, a radially inner circumferential surface, an upper and a lower flank surface, and a joint, wherein the ruining surface is provided with at least one circumferential recess which receives a wear-resistant coating, in particular a PVD coating, and wherein, starting from respective end faces of the joint, as seen in the circumferential direction of the main body, a land Shoulder is integrally formed on the main body outside the coating and extends at a predetermined radial height over a predetermined circumferential length on both. sides of the joint. | 2013-11-21 |
20130307222 | Seal for Sealing Shafts - In a seal ( | 2013-11-21 |
20130307223 | Sealing Element - A sealing element ( | 2013-11-21 |
20130307224 | GASKET WITH A COMPRESSION LIMITER - A cylinder head gasket has a functional layer with a plurality of openings with a compression bead surrounding at least one of the openings. The functional layer additionally includes a plurality of stoppers, or compression limiters, spaced from the compression bead for preventing full flattening of the compression bead between the engine block and the cylinder head and for limiting the expansion and contraction of the compression bead during and between firings in the cylinders of the engine block. At least one of the stoppers has a generally frustoconical shape with a top and a reverse-frustoconical opening in the top. | 2013-11-21 |