| 47th week of 2009 patent applcation highlights part 14 |
| Patent application number | Title | Published |
|---|
| 20090283895 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame. | 2009-11-19 |
| 20090283896 | Package structure and method - A semiconductor die has a surface and an active region on the surface. A thick-film coating is applied to the surface of the semiconductor die to cover only a portion or entire of the active region before the semiconductor die is cut from a wafer. The thick-film coating reduces the stress to the semiconductor die. The thick-film coating does not cover the bonding pads of the semiconductor die to avoid influencing the bonding wires bonding to the boding pads. | 2009-11-19 |
| 20090283897 | SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE, AN ELECTRONIC DEVICE, METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE - A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion. | 2009-11-19 |
| 20090283898 | DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECTS AND ASSOCIATED SYSTEMS AND METHODS - Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect. | 2009-11-19 |
| 20090283899 | Semiconductor Device - According to one embodiment of the present invention, a semiconductor device is provided, that includes a semiconductor carrier; a cavity formed within the semiconductor carrier, the cavity extending from the top surface of the semiconductor carrier into the semiconductor carrier; and at least one semiconductor chip provided within the cavity. | 2009-11-19 |
| 20090283900 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A semiconductor device comprises: (a) a wiring board having front surface lands disposed on a front surface and rear surface lands disposed on a rear surface; (b) a semiconductor chip formed with an integrated circuit and electrode terminals electrically connected to the integrated circuit; and (c) a sealing resin that covers a front side of the wiring board when the semiconductor chip is mounted on the front side of the wiring board such that the front surface lands and the rear surface lands are electrically connected to the electrode terminals, wherein (d) holes having a shape and dimensions that allow projecting electrodes of the other semiconductor device to be inserted therein are formed in the sealing resin such that the front surface lands disposed further toward an inner side than a front surface of the semiconductor chip are exposed. | 2009-11-19 |
| 20090283901 | Semiconductor device and multilayer wiring board - A gas or an insulating material having a relative dielectric constant of not more than 2.5 on average is interposed between a first wiring layer and a second wiring layer included in a multilayer wiring structure. Between a wiring of the first wiring layer and a wiring of the second wiring layer, a conductive connector is arranged. Between a predetermined wiring of the first wiring layer and a predetermined wiring of the second wiring layer, an insulating heat conductor having a relative dielectric constant of not more than 5 is arranged. | 2009-11-19 |
| 20090283902 | Semiconductor Package Structures Having Liquid Coolers Integrated with First Level Chip Package Modules - Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate. | 2009-11-19 |
| 20090283903 | BUMP WITH MULTIPLE VIAS FOR SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF, AND SEMICONDUCTOR PACKAGE UTILIZING THE SAME - A bump for a semiconductor package forms a polymer layer having multiple vias on an electrode pad above a semiconductor chip to increase an electrical contact area between the electrode pad and a metal bump. Further, the bump forms a polymer layer having multiple vias on a redistribution electrode pad to increase a surface area of an electrode interconnection. The multiple vias increase electrical and mechanical contact areas, thereby preventing current crowding and improving joint reliability. The bump for a semiconductor package may further comprise a stress relaxation layer at the lower portion of the bump. | 2009-11-19 |
| 20090283904 | FLIPCHIP BUMP PATTERNS FOR EFFICIENT I-MESH POWER DISTRIBUTION SCHEMES - Disclosed is a flipchip scheme where power and ground bumps are arranged in a striped configuration. Specifically, there are a plurality of lines of power bumps, and a plurality of lines of ground bumps. Each line of power bumps is interconnected by a mesh core power bus, and each line of ground bumps is interconnected by a mesh core ground bus. The busses are shorted across the bumps without having to use metal tab extensions. This arrangement provides that: signal routing can be provided between the lines of bumps; and/or the mesh core power busses can be provided as being wider in order to provide improved power mesh performance and/or in order to reduce or eliminate the metal required on the second top-most metal layer. | 2009-11-19 |
| 20090283905 | CONDUCTIVE STRUCTURE OF A CHIP - A conductive structure of a chip is provided. The conductive structure comprises a ground layer, a dielectric layer, a redistribution layer, an under bump metal and a solder bump. The ground layer electrically connects to the ground pad of the chip, while the dielectric layer overlays the ground layer. Thus, the conductive layer can result in impedance matching, and the packaged chip is adapted to transmit a high frequency signal. | 2009-11-19 |
| 20090283906 | SEMICONDUCTOR DEVICE, METHOD FOR MOUNTING SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE - A semiconductor device of the present invention includes a semiconductor substrate on which an electrode and a Cu bump are stacked, and on the electrode and the Cu bump, a metal bump layer is provided, in which (i) a solder layer via which the semiconductor device is bonded and electrically connected to the mounting substrate by metal bonding and (ii) a Cu layer, an intermetallic compound being formed by interdiffusion of the Cu layer and the solder layer are included. Hence, the present semiconductor device can be mounted with a high bonding strength while avoiding a decrease in mounting reliability, by flip chip mounting by means of metal bonding. | 2009-11-19 |
| 20090283907 | LOW-RESISTANCE INTERCONNECTS AND METHODS OF MAKING SAME - Devices and methods for providing low-resistance interconnects in a semiconductor device are provided. Specifically, one or more embodiments of the present invention relate to disposing a conductive material in a trench without disposing a resistive barrier material between the conductive material and the sidewalls of the trench so that the conductive material takes up the full width of the trench. For example, the trench may be disposed over one or more contacts made of a barrier material such as titanium nitride that also acts as a seed, and the conductive material may be grown on top of the titanium nitride to fill the trench. | 2009-11-19 |
| 20090283908 | METAL LINE OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - A metal line of a semiconductor device includes an insulation layer formed on a semiconductor substrate and a metal line forming region is formed in the insulation layer. A diffusion barrier is formed on a surface of the metal line forming region of the insulation layer, and the diffusion layer has a multi-layered structure of an Ru layer, an Ru | 2009-11-19 |
| 20090283909 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - There is provided a semiconductor device having a metal silicide layer which can suppress the malfunction and the increase in power consumption of the device. The semiconductor device has a semiconductor substrate containing silicon and having a main surface, first and second impurity diffusion layers formed in the main surface of the semiconductor substrate, a metal silicide formed over the second impurity diffusion layer, and a silicon nitride film and a first interlayer insulation film sequentially stacked over the metal silicide. In the semiconductor device, a contact hole penetrating through the silicon nitride film and the first interlayer insulation film, and reaching the surface of the metal silicide is formed. The thickness of a portion of the metal silicide situated immediately under the contact hole is smaller than the thickness of a portion of the metal silicide situated around the contact hole. | 2009-11-19 |
| 20090283910 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF - A semiconductor device includes: a metal-containing compound layer on a semiconductor substrate; a dielectric film on the semiconductor substrate and the metal-containing compound layer; a contact hole penetrating through the dielectric film to reach the metal-containing compound layer; a contact plug in the contact hole. The semiconductor device further includes a manganese oxide layer extending between the contact plug and respective one of the dielectric film and the metal-containing compound layer. | 2009-11-19 |
| 20090283911 | Backend Interconnect Scheme with Middle Dielectric Layer Having Improved Strength - An integrated circuit structure includes a first, a second and a third metallization layer. The first metallization layer includes a first dielectric layer having a first k value; and first metal lines in the first dielectric layer. The second metallization layer is over the first metallization layer, and includes a second dielectric layer having a second k value greater than the first k value; and second metal lines in the second dielectric layer. The third metallization layer is over the second metallization layer, and includes a third dielectric layer having a third k value; and third metal lines in the third dielectric layer. The integrated circuit structure further includes a bottom passivation layer over the third metallization layer. | 2009-11-19 |
| 20090283912 | DAMASCENE WIRING FABRICATION METHODS INCORPORATING DIELECTRIC CAP ETCH PROCESS WITH HARD MASK RETENTION - Methods for fabricating metal wiring layers of a semiconductor device are provided where damascene interconnect structures are formed in a BEOL process that incorporates a dielectric cap-open-first process to achieve hard mask retention and to control the gouging of a buffer oxide layer to prevent exposure of underlying features protected by the buffer oxide layer. | 2009-11-19 |
| 20090283913 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A semiconductor device includes: a copper (Cu) wire having a first region and a second region in which densities of silicon (Si) and oxygen (O) atoms are higher than in the first region; a compound film that is selectively formed on the Cu wire and contains Cu and Si; and a dielectric film formed on a side surface side of the Cu wire. | 2009-11-19 |
| 20090283914 | SILICON INTERPOSER AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a silicon interposer, includes a step of forming a protection film on a surface, on which an element portion is formed, of a silicon wafer, a step of forming open holes according to planar arrangements of through holes which pass through the silicon wafer in a thickness direction, a step of forming the through holes by etching the silicon wafer using the protection film as a mask, a step of forming an oxide film on inner wall surfaces of the through holes by a thermal oxidation, a step of forming a contact hole, which is in communication with the element portion, in the protection film, and a step of forming wirings on both surfaces of the silicon wafer. In the step of forming the wirings, one of the wirings is formed to be connected electrically to the element portion via a contact portion formed in the contact hole. | 2009-11-19 |
| 20090283915 | Oversized Contacts and Vias in Layout Defined by Linearly Constrained Topology - A rectangular-shaped interlevel connection layout structure is defined to electrically connect a first layout structure in a first chip level with a second layout structure in a second chip level. The rectangular-shaped interlevel connection layout structure is defined by an as-drawn cross-section having at least one dimension larger than a corresponding dimension of either the first layout structure, the second layout structure, or both the first and second layout structures. A dimension of the rectangular-shaped interlevel connection layout structure can exceed a normal maximum size in one direction in exchange for a reduced size in another direction. The rectangular-shaped interlevel connection layout structure can be placed in accordance with a gridpoint of a virtual grid defined by two perpendicular sets of virtual lines. Also, the first and/or second layout structures can be spatially oriented and/or placed in accordance with one or both of the two perpendicular sets of virtual lines. | 2009-11-19 |
| 20090283916 | CHIP STRUCTURE AND METHOD OF REWORKING CHIP - A method of reworking a chip includes providing a first chip and a second chip. The first and second chips have at least one first module and at least one second module, respectively. The first and second modules electrically connect with each other. The first module of the first chip has a defect. The second module of the second chip has a defect. The first module having a defect of the first chip is opened with the second module of the first chip, and the second module having a defect of the second chip is opened with the first module of the second chip. The first and second chips are stacked, and the second module of the first chip is electrically connects with the first module of the second chip. | 2009-11-19 |
| 20090283917 | SYSTEMS AND METHODS FOR VERTICAL STACKED SEMICONDUCTOR DEVICES - Systems and methods fabricate a vertically stacked multi-chip semiconductor device assembly. An exemplary assembly is fabricated by forming a first semiconductor device in a first semiconductor device layer with a first connector located at a first surface of the first semiconductor device layer; forming a second semiconductor device in a second semiconductor device layer with a second connector located at an interior surface of the second semiconductor device layer; forming a via in the first semiconductor device layer extending from the first surface to an opposing second surface of the first semiconductor device layer corresponding to the location of the second connector; and joining the second surface of the first semiconductor device layer and the interior surface of the second semiconductor device layer, wherein the via at the second surface of the first semiconductor device layer is coupled to the second connector of the second semiconductor device. | 2009-11-19 |
| 20090283918 | SEMICONDUCTOR CHIP PACKAGE STRUCTURE - A semiconductor chip package structure is described. The semiconductor chip package structure comprises a first chip, which is operated through a first power connection, having a central region and a marginal region. The first chip comprises a plurality of first and second power bonding pads disposed in a marginal region on the top of the first chip. A first power ring and a second power ring are disposed on the first chip, wherein the first and second power rings are respectively electrically connected to the first and second power bonding pads. A second chip, which is operated through a second power connection, is mounted on the central region of the first chip, wherein the second chip comprises a plurality of power bonding pads thereon. A plurality of second bonding wires are electrically connected to the power bonding pads and the second power bonding pads, respectively. | 2009-11-19 |
| 20090283919 | SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN METAL LAYERS - Embodiments in accordance with the present invention relate to flip-chip packages for semiconductor devices, which feature a die sandwiched between metal layers. One metal layer comprises portions of the lead frame configured to be in electrical and thermal communication with various pads on a first surface of the die (e.g. IC pads or MOSFET gate or source pads) through a solder ball contact. The other metal layer is configured to be in at least thermal communication with the opposite side of the die. Embodiments of packages in accordance with the present invention exhibit superior heat dissipation qualities, while avoiding the expense of wire bonding. Embodiments of the present invention are particularly suited for packaging of power devices. | 2009-11-19 |
| 20090283920 | BALL-BUMP BONDED RIBBON-WIRE INTERCONNECT - A ball-bump bonded ribbon-wire interconnect has a ball-bump attached to an integrated circuit's bond pad. A ribbon-wire has one end attached to the ball-bump and its opposing end attached to a substrate's metallized surface. The ribbon-wire may be wider than the ball-bump, and the ball-bump may separate the ribbon-wire from the integrated circuit's surface. The ribbon-wire may interconnect multiple integrated circuits, each of which has a ball-bump or a suitably wide metallized surface, to a substrate's metallized surface. The present invention also includes a method of electrically connecting an electronic component to a substrate. | 2009-11-19 |
| 20090283921 | CONTACT LAYOUT STRUCTURE - A contact layout structure includes a substrate having at least a first region defined thereon, plural sets of first contact layouts positioned along a predetermined direction in the first region, and a plurality of second contact layouts positioned in the first region. Each set of the first contact layout has two square contact units and two adjacent rectangle contact units positioned between the two square contact units. | 2009-11-19 |
| 20090283922 | INTEGRATING HIGH STRESS CAP LAYER IN HIGH-K METAL GATE TRANSISTOR - In some embodiments an etchstop layer is deposited over a transistor that has been encapsulated by a high-K film, a silicon nitride is deposited over the deposited etchstop layer, the silicon nitride is removed, and the etchstop layer is removed. Other embodiments are described and claimed. | 2009-11-19 |
| 20090283923 | HUMIDIFIER SYSTEM - A humidifier system comprising a housing having a reservoir extending therethrough for passage of liquid through the humidifier system. Liquid from a liquid receptacle is transferred to the reservoir in the housing. The flow rate of the liquid can be controlled so as to adjust the water rate within the reservoir. The housing provides at least one opening defined therein separately positioned within the housing from the reservoir but accessible thereto, and an electric heating element is inserted therein, the heating element projecting into the reservoir whereby the heating element is in direct contact with the liquid to heat it. The heating element is supplied with electrical power from a power source for enabling the heating element to heat the liquid and create steam within the housing. A safety switch is also provided, in association with the interior of the housing, wherein the safety switch is adapted to turn the heating element off when a temperature of the element exceeds a pre-determined level. Means are also provided for controlling an exhaust flow rate and temperature of the steam exiting the housing. | 2009-11-19 |
| 20090283924 | Method for post-injection in mold lamination with an adhesively coated functionalized film - A method for laminating a functional film on to a plastic injection molded lens. An outer layer of the film is selected to perform an HMA-type function when subjected to the heat and pressure of the mold. After forming the lens, the mold is open and the film is loaded in to the empty insert. The residual heat and pressure bonds the film via the HMA to the lens, in a press lamination process. A functionally enhanced lens having a film intimately laminated on to one side. | 2009-11-19 |
| 20090283925 | Slip Casting Nano-Particle Powders for Making Transparent Ceramics - A method of making a transparent ceramic including the steps of providing nano-ceramic powders in a processed or unprocessed form, mixing the powders with de-ionized water, the step of mixing the powders with de-ionized water producing a slurry, sonifing the slurry to completely wet the powder and suspend the powder in the de-ionized water, separating very fine particles from the slurry, molding the slurry, and curing the slurry to produce the transparent ceramic. | 2009-11-19 |
| 20090283926 | METHOD FOR POST-INJECTION LAMINATION TO ADD A FUNCTIONAL FILM TO AN OPTICAL LENS - A method for laminating a functional film on to a thermoplastic injection molded lens. A thermally curable glue is deposited on the lens while it is still in the mold. A functional film is introduced and the mold is closed again. The heat from the mold and the clamping pressure thermoform the film and cure the glue, in a lamination process. A functionally enhanced lens having a film intimately laminated on to one side. | 2009-11-19 |
| 20090283927 | Method of fabricating small dimensioned lens elements and lens arrays using surface tension effects - A method is disclosed of implementing lens elements or lens arrays having dimensions ranging from a few centimeters down to the micro-scale or nano-scale using the surface tension of the lens material in a molten state to allow the curved shape of the lens to be precisely defined. The method has useful application in the fabrication of lens elements and lens arrays out of a large variety of material types, including elemental materials, as well as compound materials and alloys. The method also allows the implementation of lenses having far superior surface smoothness compared to other approaches, as well as very accurate lens shapes. The method allows the making of high quality lenses and lens arrays, wherein the diameter of the lenses are on the order of a few microns or less. Convex, concave, plano-convex, plano-concave, compound lenses, and many other types of lens shapes can be implemented using the method of the present invention. | 2009-11-19 |
| 20090283928 | METHOD OF MANUFACTURING PLUGGED HONEYCOMB STRUCTURE - A method of manufacturing a plugged honeycomb structure has a plugging process which includes the steps of: immersing one end (a first end) of a honeycomb base material in a plugging slurry while vibrating the plugging slurry; after bringing an internal part of a cell into a negative pressure and then returning it into an atmospheric pressure, vibrating the plugging slurry to make the plugging slurry enter a first open end of the cell; and drying the plugging slurry having entered the first open end of the cell to form a first plugging portion at the first end. | 2009-11-19 |
| 20090283929 | System and method of agglomerating, resultant product and method of backing a liner the agglomerator - A new system and method for making agglomerates from material like wet chopped glass fiber strand segments is disclosed and the agglomerates so produced. Agglomerates, made by feeding wet chopped fiber strand segments into a wave chamber having a vibrating curved surface supporting a curved, dimpled liner working surface have improved density and flow characteristics compared with dry chopped strands, but it was discovered that the dimpled liner flexes during operation during vibration causing undesirable variation in properties like agglomerate size. In the invention the dimpled liner is backed up with a substantially non-compressible material and this results in agglomerates that have even better uniformity of flow and agglomerate diameters. Typical backing materials include a particulate material, an elastomer, a rididized elastomer, slurry or liquid, or wire or slivers of metal. | 2009-11-19 |
| 20090283930 | METHOD FOR MANUFACTURING THERMOPLASTIC RESIN FILM - An aspect of the present invention is a method for manufacturing a thermoplastic resin film, comprising the steps of: extruding a molten thermoplastic resin from a die in the form of sheet; and sandwiching the sheet-form thermoplastic resin between one support and the other support, wherein at least one of the supports has such a surface property that the arithmetic average surface depth (Ra) is 100 nm or less, and the support is a hollow drum and the thickness Z (mm) of an outercylinder of the drum satisfies the following expression; 0.2 mm| 2009-11-19 | |
| 20090283931 | Molded Bodies Containing Polyacetals and Method for Producing Said Molded Bodies - The present invention relates to moldings encompassing polyacetals, where the molding has a microcellular structure. The moldings have excellent mechanical properties. Furthermore, the moldings have very little tendency toward stress cracking. Processes for production of inventive moldings are also disclosed. | 2009-11-19 |
| 20090283932 | Dual Cured Castable System for Use in Golf Balls - Compositions for golf balls that include polyurethane and/or polyurea linkages and that are crosslinked in the soft segments of the polymer backbone. In particular, the compositions of the invention, which are based on a polyurethane and/or polyurea, have improved crosslink density and hardness from the crosslinking between the soft, unsaturated segments of the polymer backbone. The curative blend includes at least one isocyanate-reactive component and a free radical initiator. | 2009-11-19 |
| 20090283933 | CERAMIC MEMBER AND METHOD FOR PRODUCING THE SAME - A ceramic member is provided, including a ceramic sintered body and a metallic member, which includes a metal element, formed to be in contact with the ceramic sintered body. An affected layer around the metallic member of the ceramic sintered body has a thickness of 300 μm or less. | 2009-11-19 |
| 20090283934 | Imprinting of Partial Fields at the Edge of the Wafer - Edge field patterning of a substrate having full fields and partial fields may include patterning using a template having multiple mesas with each mesa corresponding to a field on the substrate. Polymerizable material may be deposited solely between the template and the full fields of the substrate. A non-reactive material may be deposited between the template and partial fields of the substrate. | 2009-11-19 |
| 20090283935 | Impact Resistant Polyolefin Compositions - The present invention provides polyolefin composition comprising a 50-80 wt % of propylene omopolymer or copolymer and a first and a second ethylene/alpha-olefin copolymer, said composition having good stress whitening resistance and gloss, in combination with a good balance of mechanical properties. | 2009-11-19 |
| 20090283936 | STRUCTURE WITH RECONFIGURABLE POLYMER MATERIAL - A structure includes a polymer structural member, which may include a shape memory polymer material, that can change its size and/or shape. An electromagnetic source is used to impose an electric field or a magnetic field on the polymer structural material, in order to control the shape of the material. The force may be used to change the shape of the material and/or to maintain the shape of the material while it is under load. The polymer material may be a solid material, may be a foam, and/or may include a gel. A shape memory polymer material may have mixed in it particles that are acted upon by the electromagnetic field. The structure may be used in any of a variety of devices where shape change (morphing), especially under loading, is desired. | 2009-11-19 |
| 20090283937 | CURABLE COMPOSITION FOR NANOIMPRINT, AND PATTERNING METHOD - A curable composition for nanoimprints which comprises a polycyclic aromatic structure-having polymerizable monomer and a photopolymerization initiator is excellent in mold releasability, etching resistance and solvent resistance and capable of forming patterns. | 2009-11-19 |
| 20090283938 | IMPRINT APPARATUS, IMPRINT METHOD, AND MOLD FOR IMPRINT - An imprint apparatus for imprinting a mold pattern onto a substrate or a member on the substrate includes a light source for irradiating a surface of the mold disposed opposite to the substrate and a surface of the substrate with light; an optical system for guiding the light from the light source to the surface of the mold and the surface of the substrate and guiding reflected lights from these surfaces to a spectroscope; a spectroscope for dispersing the reflected lights guided by the optical system into a spectrum; and an analyzer for analyzing a distance between the surface of the mold and the surface of the substrate. The analyzer calculates the distance between the surface of the mold and the surface of the substrate by measuring a distance between the surface of the mold and a surface formed at a position away from the surface of the mold. | 2009-11-19 |
| 20090283939 | Polyolefin Compositions, Articles Made Therefrom and Methods for Preparing the Same - The invention provides compositions for blow molding applications and other applications, where such compositions comprise a high molecular weight ethylene interpolymer and a low molecular weight ethylene polymer, and where the high molecular weight ethylene interpolymer has a density from 0.920 g/cm | 2009-11-19 |
| 20090283940 | METHOD FOR PRODUCING MULTILAYER ARTICLE - A method for producing a multilayer article is provided. The method comprises: a step of applying a first dispersion liquid comprising a first liquid medium and a first polymer component, a first alkali metal ion and a first inorganic laminar compound each dispersed in the first liquid medium to a surface of a support having a layer composed of a first thermoplastic resin to form a first dispersion liquid film on the support, wherein the first polymer component contains hydroxyl groups and carboxyl groups at a molar ratio, hydroxyl groups:carboxyl groups, of from 30:70 to 95:5; a step of removing the first liquid medium from the first dispersion liquid film to form a first coating film, thereby producing a layered article comprising the support and the first coating film; a step of heating the layered article at or above a temperature at which a condensation reaction between a hydroxyl group and a carboxyl group in the first coating film can occur, thereby hardening the coating film; and a step of supplying a second thermoplastic resin having been plasticized onto the layer of the first thermoplastic layer of the substrate of the layered article and shaping it into a specified shape, thereby producing a multilayer article having the layered article and a layer of the second thermoplastic resin. | 2009-11-19 |
| 20090283941 | METHOD FOR BOLTLESS HEAT TREATMENT OF THIN FLANGES - A method for preventing distortion in a flange of a metal part during heat treatment is provided. A method of preventing distortion includes engaging a bottom surface of the flange with a first boltless ring, engaging a top surface of the flange with a second boltless ring, locking the first and second boltless rings into a fixed position relative to each other and relative to the flange, heat treating the part, unlocking the first and second boltless rings from each other, and removing the first and second boltless rings from engagement with the flange. | 2009-11-19 |
| 20090283942 | VIBRATION TRANSMISSION DAMPING APPARATUS - A vibration transmission damping apparatus ( | 2009-11-19 |
| 20090283943 | Combination oil/gas-operated spring with expansion vessel - Combination oil/gas spring comprising a first hollow casing, a piston capable of fluid-tightly sliding within said casing, a rod connected rigidly with an end portion thereof to a central portion of said piston, a first chamber containing an actuating rod provided inside said casing, a second sealed chamber provided within the same casing on the opposite side of the piston, a mass of hydraulic fluid filling said second sealed chamber, a second hollow casing and a respective second piston provided to slide therewithin, a first conduit connecting the interior of said second sealed chamber with the interior of said second hollow casing, a first valve connected to said first conduit and adapted to selectively open and close it, a second conduit being provided to connect an expansion vessel to the first conduit at a position upstream of the first valve, and a second valve being provided on the second conduit. There are provided pressure-exerting means adapted to act by exerting a controllable pressure upon the surface of the liquid in the expansion vessel. | 2009-11-19 |
| 20090283944 | SHOCK-MITIGATING APPARATUS FOR SEATS AND OTHER OBJECTS - A shock-mitigating damper apparatus for vertical shocks has a scissor linkage extending vertically between a base and an object. A damper is also connected between the base, the object, and is mounted to the base for substantially horizontal reciprocating damper motion. An articulated arm assembly connects one end of the damper to the object at a point substantially in vertical alignment with an intermediate pivot point for the scissors. | 2009-11-19 |
| 20090283945 | VIBRATION DAMPER - A vibration damper with improved durability achieved by preventing stress concentration in a partition wall portion to avoid an excessive increase in strain in that portion. An intermediate cylinder member ( | 2009-11-19 |
| 20090283946 | SINGLE-SIDED MAGNETIC FIXTURING SYSTEMS - A combination useful for providing a clamping force to a workpiece during a manufacturing operation so as to maintain a workpiece in a stationary position includes a workpiece having a first side and a second side, a magnet disposed about a portion of the first side of the workpiece, and a pressure pad disposed about a portion of the second side of the workpiece. The pressure pad may include one or more of permanently magnetic materials and ferromagnetic materials, and disposed in sufficient proximity with respect to the magnet to enable the pressure pad to be attracted by the magnet, thus providing a clamping force on the workpiece. | 2009-11-19 |
| 20090283947 | Door Installation - Tool having a body and at least one jamb-securing finger can be used to install a pre-hung door. The body can be removably attached to a building component about a door opening such as a 2×4, with the finger(s) for holding a jamb component of the pre-hung door. The tool may be intrinsically adjustable. A kit may include the tool, a fastener and/or a spacer. | 2009-11-19 |
| 20090283948 | CLAMP DEVICE - A clamp device including a detection mechanism provided to detect whether the clamp device is in a clamped state or an unclamped state. The detection mechanism includes a tilt plate tiltably placed inside a switch holder installed on a body and a sliding rod displaced together with a piston rod and displaced in the direction normal to the tilt plate. When the sliding rod presses and tilts the tilt plate while a piston is displaced, a second detection switch detects that the clamp device is in the unclamped state. | 2009-11-19 |
| 20090283949 | FINE POSITIONER MODULE - A fine positioner module is used to perform fine positioning of a device that is pressing against a work surface. In some embodiments, the fine positioner module includes a contact member for making contact with a work surface, a position adjustor for using the contact member to move the device along the work surface, and an actuator for relieving pressure of the device against the work surface while the contact member is used to move the device along the work surface. | 2009-11-19 |
| 20090283950 | MACHINING CENTER WITH A ROTATABLE AND PIVOTABLE WORKPIECE TABLE HAVING A CLAMPING DEVICE FOR THE ROTATION AXIS - A machining center that includes a swivel bridge supported by a bearing wall and pivotable about a horizontal axis, at least one drive sprocket attached to a disc-type connector of the swivel bridge, and at least one drive system attached adjacent the bearing wall and operatively connected to the drive sprocket of the swivel bridge. The machining center is characterized by clamping of the swivel bridge being performed by a friction-locked clamping system which is arranged rotationally fixed about a bearing pin of the swivel bridge in a circular ring shape and which is operatively connected to the disc-type connector. A clamping force of the friction-locked clamping system is generated by an energy storage. | 2009-11-19 |
| 20090283951 | CLAMP ASSEMBLY - A clamping jaw includes an unthreaded rod receiver and a swing nut assembly including a swing nut lever and threaded nut coupling integrated thereon. An adjustment knob includes an adjustment knob collar fixed onto a second end of the threaded rob opposite said shaft collar. An idle jaw includes an unthreaded shaft collar adapted to receive and fit over a second end of the threaded rod. The swing nut is operable to interface the threaded nut coupling with the threaded rod held within the unthreaded rod receiver of the clamping jaw and move along the threaded rod by rotation of the adjustment knob while the idle jaw mounted on said threaded rod between the clamping jaw and the adjustment knob remain stationary next to the adjustment knob. The clamping jaw is freely movable along the threaded rod by disengagement of the swing nut and then by rotation of the adjustment knob when the swing nut is engaged with the threaded rod. | 2009-11-19 |
| 20090283952 | CUTTING BOARD TO PREVENT CROSS CONTAMINATION - A food cutting board made up of four separate but hinged panels each movable to each other between 180° and in contact at zero degrees providing for four separate clean food cutting surfaces. The device may also include a plurality of magnets for keeping each of the panels in a fixed position relative to each other during certain modes of operation. | 2009-11-19 |
| 20090283953 | AUTOMATIC SHEET FEEDER WITH RETRACTABLE SHEET SUPPORTING STRUCTURE - An automatic sheet feeder includes a body, a sheet-feeding mechanism and a sheet supporting structure. The body has a sheet passageway which has an input end and an output end. The sheet-feeding mechanism disposed in the body feeds a sheet from the input end into the sheet passageway and then discharges the sheet out of the output end. The sheet supporting structure, disposed at one of the input end and the output end and pivotally connected to the body, supports the sheet to be fed into the input end or the sheet to be discharged from the output end. The sheet supporting structure is rotatable relatively to the body and can be thus spread out or retracted relatively to the body. | 2009-11-19 |
| 20090283954 | SHEET ALIGNING APPARATUS AND IMAGE FORMING SYSTEM - In a sheet aligning apparatus, a sheet is conveyed from a conveying-in path into a sheet storing section through an open end portion and the leading end of the sheet comes in with a stop member. Thereafter, when a shifting section shifts the stop member from an initial position to a first position, the sheet is shifted inversely together with the stop member and the back end of the sheet proceeds as the inversed leading end from the open end portion to a conveying-out path so that a succeeding sheet is allowed to be conveyed from the conveying-in path into the open end portion. When the sheet is shifted inversely, a shift regulating section regulates the shift of the sheet in such a way that the back end of the sheet is prevented from proceeding more than a predetermined distance due to the inertia of the shift. | 2009-11-19 |
| 20090283955 | IMAGE FORMING APPARATUS - An image forming apparatus includes: an image forming section that forms a toner image on a sheet; a fixing section that fixes the toner image on the sheet; a sheet conveyance path that branches into a first sheet conveyance path and a second sheet conveyance path downstream of the fixing section; a blowing section that guides the sheet to the first sheet conveyance path or to the second sheet conveyance path by blowing air to the sheet; and a controller that controls the blowing air of the blowing section. | 2009-11-19 |
| 20090283956 | FEEDING DEVICE AND RECORDING APPARATUS - There is provided a feeding device including a pickup roller for picking up a placed medium to be transported and transporting the medium at a downstream side in a transport direction, a guide pathway for guiding the medium transported by the pickup roller, a transport driving roller that is driven by a power of a driving source and that transports the transported medium at the further downstream side in the transport direction, a retard roller that is moved to be brought into contact with and separated from the transport driving roller and that is rotated with a predetermined load. | 2009-11-19 |
| 20090283957 | SHEET PROCESSING APPARATUS - A sheet processing apparatus includes an aligning member and a shift conveying unit. The aligning member is movable in a width direction perpendicular to a sheet conveying direction and presses a sheet stack loaded on a sheet processing tray so as to align the sheet stack in the width direction. The unit is provided on the upstream side of the tray and conveys a sheet, shifting the sheet in the width direction. Being shifted by the unit, sheets are loaded at first and second loading positions on the tray. When sheets are loaded at the first loading position, the aligning member is moved to a first standby position corresponding to the first loading position in advance. When sheets are loaded at the second loading position, the aligning member is moved in advance to a second standby position corresponding to the second loading position. | 2009-11-19 |
| 20090283958 | SHEET FEEDING DEVICE AND IMAGE-FORMING APPARATUS - An image-forming apparatus and sheet feeding device capable of feeding sheets without skewing or multi-feeding of sheets using a small number of side air blowing drive sources. The sheet feeding device has a plurality of side discharge nozzles comprising side discharge outlets for blowing air onto the respective side edge surfaces of a paper stack, and two sirocco fans which are communicatively connected in series as a side air blowing drive source, and are communicatively connected, via a side discharge drive source chamber and a side discharge relay tube (duct), to the plurality of side discharge nozzles. The respective side discharge nozzles capable of moving in linkage with side fences, and an immovable fixed side discharge nozzle are disposed at different distances from the leading edge of the loaded and set paper stack with respect to a sheet feeding direction. | 2009-11-19 |
| 20090283959 | AUTOMATIC IMAGE PROCESSING APPARATUS AND SHEET FEEDING DEVICE THEREOF - An automatic image processing apparatus includes a sheet feeding device and an image processing device. The sheet feeding device supports a plurality of sheets and feeds the sheets one by one. The image processing device receives the sheets coming from the sheet feeding device one by one, and feeds and processes the sheets one by one. The sheet feeding device is removably connected to the image processing device, and receives mechanical power from the image processing device and thus feeds the sheets one by one. The sheet feeding device for the automatic image processing apparatus is also disclosed. | 2009-11-19 |
| 20090283960 | SHEET FEEDER - A sheet feeder has a tray for receiving one or more media sheets. An arm is configured to pivot relative to the tray. A roller is rotatably coupled to the arm. A biasing device is coupled to the arm. The biasing device biases the arm to pivot toward the tray. | 2009-11-19 |
| 20090283961 | Sheet Stacking device, Drive control method, and computer program product - A sheet stacking unit that stacks sheets thereon is movable up and down. A lifting unit moves the sheet stacking unit up and down. A driving unit drives the lifting unit. A control unit controls a driving speed of the driving unit. A position detecting unit detects a position of the sheet stacking unit in an up-and-down direction. The control unit controls the driving speed according to the position of the sheet stacking unit detected by the position detecting unit. | 2009-11-19 |
| 20090283962 | BI DIRECTIONAL PAPER HANDLING TRANSPORT - A method and apparatus for bi-directionally transporting sheet stock in a marking engine by disposing idler rolls on opposite sides of a drive roll for forming forward and reverse nips and feeding sheets from opposite directions into the nips. | 2009-11-19 |
| 20090283963 | AUTOMATIC FEEDER CONTROL SYSTEM TO ACCOUNT FOR INPUT VARIATIONS - The present application relates generally to a method and system for the processing of mail items within a document processing system. More specifically, described herein is a method and system for automatically adjusting the feeding of mail items based on a stack pressure for minimizing jams and improving the overall system efficiency. Stack pressure is monitored as mail items are fed to a transport path and mail item feeding behavior is adjusted according to the stack pressure to minimize the mail item jams. | 2009-11-19 |
| 20090283964 | Systems And Methods For Orienting Media For Improved Scan Quality - Systems and methods systems and methods for orienting media for improved scan quality are disclosed. In an exemplary implementation, a method may include receiving a transparency media in a media holder, and guiding the transparency media into the media holder. The method may also include accepting the transparency media in the media holder only if the transparency media is oriented with an emulsion side facing toward an imaging surface. The method may also include self-ejecting the transparency media from the media holder if the transparency media is oriented with the emulsion side facing away from the imaging surface. | 2009-11-19 |
| 20090283965 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - An apparatus of the present invention includes a first guide supported by a cover body in such a manner that the first guide can swing around a hinge with respect to the main body of the apparatus and a second guide provided on the apparatus main body. The first guide is supported in such a manner that it can move with respect to the cover body. When the cover body swings so as to open a sheet conveyance path, a site of the first guide on the side of the hinge swings with respect to the cover body in such a direction so as to separate from the second guide. | 2009-11-19 |
| 20090283966 | IMAGE FORMING APPARATUS - An image forming apparatus includes: an image forming section which forms normal images on sheets sequentially based on normal image data and forms sample images on sheets based on sample image data; a discharge section which discharges normal image sheets in a stack which are sheets on which the normal images were formed and sample image sheets which are sheets on which the sample images were formed; and a control section which is configured to control at least one of the image forming section and the discharge section to discharge the normal image sheets in the stack and the sample image sheets to the discharge section so as to enable timings at which the sample image sheets were discharged to be appreicated in the stacked normal image sheets. | 2009-11-19 |
| 20090283967 | AMUSEMENT OR GAMING APPARATUS - Amusement or gaming apparatus comprises coin operated apparatus adapted for playing of a roulette game which is enhanced by a bonus game. The apparatus comprises an actual or a simulated roulette wheel ( | 2009-11-19 |
| 20090283968 | ROULETTE GAME APPARATUS AND MEHTOD - A method for arranging indicia on a game surface and on an associated roulette wheel. Indicia indicating numbers from 1 through 36 are arranged on the game surface in ascending order with half of the numbers associated with a first color and half associated with a second color. The numbers are arranged in three groups of twelve, each group having three even numbers and three odd numbers associated with each of the two colors. Indicia indicating each of the numbers are arranged on a roulette wheel such that no two adjacent numbers on the roulette wheel are associated with a same color, are disposed in a same group, are disposed in a same column, are disposed in a same row, or are disposed adjacent one another on the game surface and such that each pair of numbers disposed substantially diametrically across from one another on the roulette wheel is disposed in a same group and column on the game surface. | 2009-11-19 |
| 20090283969 | Automatic poker shuffling machine - An automatic poker shuffling machine includes a frame having a first container, a second container and a card chamber between the first container and the second container, an elevating device has a table in the card chamber, a card cutting device for sending the cards on the table to the first and second containers alternately, and a card shuffling device having first and second turning wheels on the bottoms of the first and the second containers to stack the cards alternately on the table again. The present invention further includes a plurality of sensors to sense the cards and control the corresponding elements action, and a collecting box to receive the shuffled cards. | 2009-11-19 |
| 20090283970 | BOARD GAME OF BASEBALL - The present invention provides a truly entertaining user friendly board game of baseball, which captures the essential fundamentals and rules of baseball, easy to follow, with a simple structural configuration, and few structural elements. Since the board game of baseball of the present invention, does not demand intense concentration, it can be played leaving room for the players to engage in other aspects of an entertaining and friendly interaction. | 2009-11-19 |
| 20090283971 | Method and System for Integrating a Lottery Game with a Deck of Cards - A system and methodology for combining a lottery game with playing cards provides a plurality of decks of playing cards to purchasers. Each deck includes a set of a defined number and type of cards to play any manner of card game separate from the lottery game. At least one of the cards within each deck includes a lottery game play area that provides the purchaser of the deck with a chance to win a prize in a first lottery game. | 2009-11-19 |
| 20090283972 | BONDED PISTON SEAL - A bonded piston ring, which comprises a metal ring, and a rubbery elastomer seal as vulcanization-bonded thereto except the sliding site along which a mating seal member slides, where the rubbery elastomer seal in partially bonded to the metal ring through an adhesive layer, wherein the adhesive layers comprise (a) an underlayer adhesive layer comprising a phenol resin and an epoxy resin, and (b) an overlayer adhesive layer comprising a phenol resin, a halogenated polymer, and a metal oxide. Not only the distinguished initial adhesiveness, but also the distinguished water-resistance can be obtained by providing (a) the underlayer adhesive layer of the afore-mentioned components and (b) the overlayer adhesive layer of the afore-mentioned components. | 2009-11-19 |
| 20090283973 | Composition for gasket and gasket - Disclosed herein is a composition for a gasket, including about 100 parts by weight of a hydrogenated styrene-based block copolymer,about 70 to 99 parts by weight of a petroleum-based softener, about 10 to 25 parts by weight of a polyolefin-based resin; about 10 to 25 parts by weight of an inorganic filler, and about 10 to 25 parts by weight of a heat-resistant polymer, based on 100 parts by weight of the hydrogenated styrene-based block copolymer. The thermoplastic elastomer composition has superior physical properties, such as tensile strength, heat resistance, high-temperature restoring force and chemical resistance, while being applicable to injection-molding and recyclable, like general thermoplastic resins. Disclosed herein is further a gasket produced from the composition. | 2009-11-19 |
| 20090283974 | Seal assembly - Seal assembly for sealing a clearance gap between a boundary of an aperture formed in a housing and a member extending through the aperture. The seal assembly comprises a seal member and a seal member mounting means disposed around the sealing member and is configured to engage with the aperture boundary. The seal member mounting means is configured to seal an alignment interspace provided in the clearance gap between the seal member and aperture boundary. The seal member mounting means is configurable to permit the seal member to be located at a position relative to the aperture boundary in dependence upon the relative positions of the member and aperture boundary to thereby accommodate misalignment between the member and aperture boundary. The seal member mounting means is configurable to lock the seal member relative to the aperture boundary in said position. | 2009-11-19 |
| 20090283975 | Junction Between Two Components of a Rotating Tool System - The invention relates to a junction ( | 2009-11-19 |
| 20090283976 | SUBSTRATE HOLDING APPARATUS - A substrate holding apparatus comprises a substrate holding mechanism configured to hold a substrate; a heating mechanism; and a heat-conductive member which is interposed between the substrate holding mechanism and the heating mechanism to be in contact therewith and conducts heat generated by the heating mechanism to the substrate holding mechanism, wherein the heat-conductive member has a recessed section that opens to the substrate. | 2009-11-19 |
| 20090283977 | Device for Adjusting the Height of the Body of a Motor Vehicle - The invention relates to a device for adjusting the height of the body of a motor vehicle having a bearing spring which is connected between the wheel guiding element of the wheel suspension and the body and which is supported on a spring disk which is vertically adjustable by way of an actuating device, and having an overload spring which limits a defined spring path in the deflection direction. According to the invention, the overload spring is assigned an actuating device with which the overload spring is vertically adjustable, preferably following the vertical adjustment of the spring disk. | 2009-11-19 |
| 20090283978 | DEVICE FOR TRANSPORTING A TODDLER ACROSS SNOW - A collapsible stroller like device is described. The device includes a base portion to permit a child to be pushed or pulled across the snow or other surface. | 2009-11-19 |
| 20090283979 | Auger Dolly (an attachment for all handheld power earth augers) - A rolling dolly like apparatus comprising a longitudinal column of predetermined length, having a rotary mechanism at each end, whereby power is transferred to a move a supportive structure in a parallel direction with said column. At the lower end of said column, a small frame having multiple wheels is attached to the said column by means of a swiveling mechanism. The said supportive structure in configured as to receive the attachment of any type of handheld portable power posthole digger, so that the Auger Dolly and the said attached handheld power posthole digger function in concert with each other, thereby increasing the portability and maneuverability of any handheld power posthole digger, and also thereby eliminating the reverse torque and recoil being exerted on the operator, as well as eliminating the physical stress and danger associated with normal use of any handheld power posthole digger. | 2009-11-19 |
| 20090283980 | AXLE LIFTING DEVICE FOR A VEHICLE - Axle lifting device for a vehicle, in particular for vehicle axles with pneumatic suspension, comprising a supporting element, a lifting element, and a lever element, the supporting element and the lever element being connectable to one another via the lifting element such that when the lifting element is actuated, the supporting element is supported on a frame element of the vehicle and the lever element exerts a preferably vertical force on an axle control arm of the vehicle in order to lift the axle control arm, and the lever element is mounted essentially in a stationary manner so as to be rotatable or pivotable with respect to a distal end of the axle control arm and/or the frame element, and the supporting element is rotatably or pivotably supported on the lever element. | 2009-11-19 |
| 20090283981 | OVERDRIVE SYSTEM FOR FOUR-WHEEL BICYCLE - Disclosed is an overdrive system for a bicycle, which increases the speed through use of a combination of a plurality of sprockets and ratchet wheels, and which drives with less power where a user steps on a pedal of a drive lever using the principle of a lever as overdrive generating means. | 2009-11-19 |
| 20090283982 | USER-PROPELLED WHEELED VEHICLES - A seated user-propelled vehicle ( | 2009-11-19 |
| 20090283983 | Wheelchair construction - A wheelchair construction has an undercarriage with lateral struts, a rear axle and a seat. A pair of connection adapters are connected with the lateral struts and the rear axle, and have a circular arc-shaped portion. A pair of seat supports are connected with the seat, and have a circular arc-shaped portion which mates with, is received in, and is supported by the circular arc-shaped portion of the connection adapters to facilitate selected angular shifting of the seat supports relative to the connection adapters for adjusting the tilt angle of the seat. | 2009-11-19 |
| 20090283984 | Two wheel streering bicycle with each wheel having its own steering control operated by rider's left and right hand respectively and rider positioned facing an angle greater than zero and less than ninty degrees with respect to the direction of motion - A two wheel steering bicycle with two steering controls and rider positioned facing an angle greater than zero and less than ninety degrees with respect to the direction of motion. A frame member connects the rear head tube to the front head tube. The rear wheel attaches to the rear fork extending upwards. The rear fork steerer column passes through the rear head tube and can rotate within the rear head tube by means of a bicycle bearing headset. A rear steering handle is connected to the rear fork steerer column. The rear steering handle is designed to contact the rider's first hand. The front wheel attaches to the front fork extending upwards. The front fork steerer column passes through the front head tube and can rotate within the front head tube by means of a bicycle bearing headset. A front steering handle is connected to the front fork steerer column. The front steering handle is designed to contact the rider's second hand. A seat tube member attaches to the frame member. A bicycle saddle is attached to the seat tube member in such a way as to position the rider facing an angle greater than zero and less than ninety degrees with respect to the longitudinal axis of the frame member. A bicycle bottom bracket, front sprocket, left and right crank and pedals are attached to the device. The rider's left hand is positioned at the rider's left side and contacts one of the steering handles. The rider's right hand is positioned at the rider's right side and contacts the other steering handle. The saddle and steering handles should be adjusted so that the rider's body is roughly balanced across the vertical plane of the rear and front wheels. The device moves forward and the rider keeps the device balanced by constantly correcting the front and rear steering handles. It may take some practice to make this correction reflex, but once mastered this device offers more control and artistic expression than a currently available bicycle. | 2009-11-19 |
| 20090283985 | Bicycle Front Fork Assembly - A bicycle front end assembly is provided which is configured to reduce aerodynamic drag. In particular, an axis shaft of a fork may be mounted to a head tube of a bicycle frame. A fork head may be disposed in front of the head tube for providing a front end assembly which is aerodynamically configured while providing an increased moment of inertia compared with traditional designs to reduce drag of the bicycle and increase steering stiffness. Also, the handlebar may be attached to the fork head such that when the bicycle is steered to the left, the fork head is rotated toward the left and when the bicycle is steered to the right, the fork head is rotated toward the right. In this manner, the fork head is alignable to the travel direction of the bicycle. | 2009-11-19 |
| 20090283986 | REAR FORK - A rear fork for a rear suspension bicycle having a ground link, the rear fork has a front frame, a rear frame, input links, a shock absorber, coupler links, follower links, a brake mount and a connecting shaft. The input links are mounted pivotally on the ground link and are connected to the shock absorber that is mounted on the ground link. The coupler links are connected to the input links and terminate in dropouts being mounted thereon. The followers are mounted rotatably on the dropouts and pivotally to at least one link mount being connected to the ground link. The brake mount is pivotally mounted adjacent to a non-drive side dropout and has a caliper mounted thereon. The connecting shaft is connected to the ground link and the brake mount to prevent a shock absorbing force of the rear fork from interfering with a braking force of the caliper. | 2009-11-19 |
| 20090283987 | SYSTEM AND DEVICE FOR TRANSPORTING A WHEELED GARBAGE CAN - A system for transporting a wheeled container via a connector device linking the wheeled container to a hitch-adapted vehicle, wherein the connector device is adapted on a first end to receive and support the handle of a wheeled container, is adapted on a second end to attach to a hitch ball, and is configured therebetween to efficiently transfer forces. | 2009-11-19 |
| 20090283988 | Toe binding of a safety ski binding - The invention relates to a toe binding ( | 2009-11-19 |
| 20090283989 | Shopping-Cart With Removable Compartments - A cart having a cart-frame that includes: an upper frame-portion enabling a user to hold the portion in order to push the cart; a base frame-portion comprising wheels connected to the base frame-portion enabling the cart to roll through the wheels; and connectors connecting the base frame-portion to the upper frame-portion and supporting the upper frame-portion's weight. The upper frame-portion may include compartment-installation structures enabling the user to add and remove compartments according to his desire and needs. The compartments may be selectively removed and installed. | 2009-11-19 |
| 20090283990 | EZ BN green shopping bag with wheels - The EZ BN GREEN SHOPPING BAG WITH WHEELS, is a lightweight, easy to carry, rolling, re-usable mechanical machine. It is particularly suited for those in search of a less taxing, less strenuous way to transport groceries on foot, while simultaneously gaining good cardio exercise. | 2009-11-19 |
| 20090283991 | AIRBAG APPARATUS - A side airbag apparatus includes an airbag | 2009-11-19 |
| 20090283992 | Curtain airbag device - A curtain airbag that can be inflated with gas from an inflator and deployed along a side surface of a vehicle cabin. The curtain airbag includes, in an occupant restraint area corresponding to an occupant's position, a multistage chamber section comprising an upper chamber that is arranged at an upper side; a lower chamber that is arranged below the upper chamber; and a discharge passage that is arranged at a middle portion in a vertical direction between the upper chamber and the lower chamber. The discharge passage communicates with at least one of said upper chamber and said lower chamber to discharge gas from said upper chamber and/or said lower chamber through the discharge passage and is adapted to reduce its cross section when pressed by the occupant's head. | 2009-11-19 |
| 20090283993 | Instrument panel having an airbag therein and method for forming thereof - Several embodiments take the form of an instrument panel having an airbag therein for a motor vehicle. The instrument panel includes a pre-constructed substrate that includes a mounting surface and a reference surface. The instrument panel also includes a cover including a cover skin layer and a woven layer. The cover skin layer has an outer surface that defines a stitched region for presentation to an occupant and an airbag region that is separate from the stitched region. The woven layer has an inner surface that is coupled to the mounting surface of the substrate and coupled to the mounting surface via an adhesive. The stitched region is configured to receive at least one stitch and the airbag region corresponds to at least part of an area where the airbag impacts the cover skin layer during a deployment of the airbag. Other embodiments relate forming an instrument panel. | 2009-11-19 |
| 20090283994 | SERVICEABLE ASSEMBLY FOR SEATBELT INTEGRATED DEPLOYABLE CUSHION - A serviceable seatbelt integrated airbag assembly that is removably attached to a vehicle seat which includes an integrated deployable cushion, an inflation device, and a lap belt portion. A bracket may be provided that is removably attached to the seat. The lap belt portion is generally removably attached to the seat structure through connection with a bracket or structural member of the seat assembly and secured by a removable fastener. The airbag cushion is attached to, or contained within, a portion of the lap belt portion seatbelt webbing. An end of the lap belt portion fits through an interfacing joint element attached to one end of the primary seatbelt webbing. The airbag inflation device is connected to the electrical system of the vehicle. Removal of the serviceable seatbelt integrated airbag assembly is accomplished by disconnecting the electrical connector from the electrical system of the vehicle and seatbelt integrated airbag lap belt portion. The removable fastener is removed to disengage the lap belt portion from connection with the seat assembly and the lap belt portion is then released from connection with the primary seatbelt assembly by feeding an end of the lap belt portion through the interfacing joint element Attachment of the serviceable assembly is accomplished by reversing the described steps. Removal of the remaining portion of the seatbelt system, including the retractor and upper seatbelt guide may be achieved after decoupling the seatbelt integrated airbag lap belt portion from the seat structure and primary seatbelt system. | 2009-11-19 |
