46th week of 2009 patent applcation highlights part 14 |
Patent application number | Title | Published |
20090278231 | Semiconductor device and method for fabricating the same - The semiconductor device comprises a first insulation film | 2009-11-12 |
20090278232 | RUTHENIUM SILICIDE DIFFUSION BARRIER LAYERS AND METHODS OF FORMING SAME - A method for use in the fabrication of integrated circuits includes providing a substrate assembly having a surface. A diffusion barrier layer is formed over at least a portion of the surface. The diffusion barrier layer is formed of RuSi | 2009-11-12 |
20090278233 | BONDED INTERMEDIATE SUBSTRATE AND METHOD OF MAKING SAME - A method includes growing a first epitaxial layer of III-nitride material, forming a damaged region by implanting ions into an exposed surface of the first epitaxial layer, and growing a second epitaxial layer of III-nitride material on the exposed surface of the first epitaxial layer. A level of defects present in the second epitaxial layer is less than a level of defects present in the first epitaxial layer. | 2009-11-12 |
20090278234 | (Al, Ga, In)N-BASED COMPOUND SEMICONDUCTOR AND METHOD OF FABRICATING THE SAME - Disclosed are a (Al, Ga, In)N-based compound semiconductor device and a method of fabricating the same. The (Al, Ga, In)N-based compound semiconductor device of the present invention comprises a substrate; a (Al, Ga, In)N-based compound semiconductor layer grown on the substrate; and an electrode formed of at least one material or an alloy thereof selected from the group consisting of Pt, Pd and Au on the (Al, Ga, In)N-based compound semiconductor layer. Further, the method of fabricating the (Al, Ga, In)N-based compound semiconductor device comprises the steps of growing a P layer including P type impurities in a growth chamber; discharging hydrogen and a hydrogen source gas in the growth chamber; lowering the temperature of the (Al, Ga, In)N-based compound semiconductor with the P layer formed thereon to such an extent that it can be withdrawn to the outside from the growth chamber; withdrawing the (Al, Ga, In)N-based compound semiconductor from the growth chamber; and forming an electrode of at least one material or an alloy thereof selected from the group consisting of Pt, Pd and Au on the p layer. According to the present invention, it is possible to sufficiently secure P type conductivity and obtain good ohmic contact characteristics without performing an annealing process. And, no further annealing is necessary when Pt, Pd, Au electrode are used. | 2009-11-12 |
20090278235 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - Provided is a manufacturing method of a semiconductor device, which is capable of realizing fine-pitch patterns and thus improving stabilization of patterning precision. The manufacturing method of the semiconductor device comprises forming a first photoresist pattern in a predetermined region on a substrate, depositing a thin film on the surface of the first photoresist pattern, and forming a second photoresist pattern in a region where the first photoresist pattern is not formed. | 2009-11-12 |
20090278236 | SEMICONDUCTOR DEVICE, WAFER STRUCTURE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A photo-resist used in photolithography in a microfabrication process may be formed uniformly even if trenches for separating semiconductor devices are formed before the microfabrication process. The two parallel trenches are formed between neighboring element forming regions in a p-type semiconductor layer containing a plurality of arrayed element forming regions and a convex portion formed between the two trenches is cut in separating the semiconductor devices. It becomes unnecessary to form a trench across a whole scribing region by this structure, so that a width of the trench may be reduced to be smaller than a thickness of a dicing blade or a diameter of a laser spot for example. As a result, it becomes possible to uniformly form the photo-resist used in the photolithography in the microfabrication process even if the trenches for separation are formed before the microfabrication process. | 2009-11-12 |
20090278237 | THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE - A microelectronic structure, such as a semiconductor structure, and a method for fabricating the microelectronic structure, include an aperture within a substrate. Into the aperture is located and formed a via. The via may include a through substrate via. The aperture includes, progressing sequentially contiguously at least partially through the substrate: (1) a first comparatively wide region at a surface of the substrate; (2) a constricted region contiguous with the first comparatively wide region; (3) a second comparatively wide region contiguous with the constricted region; and (4) a tapered region contiguous with the second comparatively wide region. The structure of the aperture provides for ease in filling the aperture, as well as void isolation within the via that is filled into the aperture. | 2009-11-12 |
20090278238 | TSVS HAVING CHEMICALLY EXPOSED TSV TIPS FOR INTEGRATED CIRCUIT DEVICES - A method for fabricating ICs including via-first through substrate vias (TSVs) and ICs and electronic assemblies therefrom. A substrate having a substrate thickness including a top semiconductor surface and a bottom surface is provided including at least one embedded TSV including a dielectric liner and an electrically conductive filler material formed on the dielectric liner. A portion of the bottom surface of the substrate is mechanically removed to approach but not reach the embedded TSV tip. A protective substrate layer having a protective layer thickness remains over the tip of the embedded TSV after the mechanical removing. Chemical etching exclusive of mechanical etching for removing the protective substrate layer is used form an integral TSV tip that has an exposed tip portion that generally protrudes from the bottom surface of the substrate. The chemical etching is generally a three step chemical etch. | 2009-11-12 |
20090278239 | Silicon Wafer and Production Method Thereof - In a silicon wafer having an oxygen precipitate layer, a depth of DZ layer ranging from a wafer surface to an oxygen precipitate layer is 2 to 10 μm and an oxygen precipitate concentration of the oxygen precipitate layer is not less than 5×10 | 2009-11-12 |
20090278240 | Semiconductor apparatus - Disclosed is a semiconductor apparatus that prevents diffusion of materials of a magnetic film during the process for manufacturing the semiconductor apparatus. The semiconductor apparatus includes: a substrate; a semiconductor device formed on a principal surface of the substrate and including an interconnect layer; a magnetic shielding film of a magnetic material covering the semiconductor device; and a buffer film disposed between the semiconductor device and the magnetic shielding film. The buffer film prevents diffusion of the magnetic material of the magnetic shielding film. | 2009-11-12 |
20090278241 | SEMICONDUCTOR DIE PACKAGE INCLUDING DIE STACKED ON PREMOLDED SUBSTRATE INCLUDING DIE - A semiconductor die package. The semiconductor includes a premolded substrate. The premolded substrate includes (i) a leadframe structure, (ii) a first semiconductor die comprising a first die surface and a second die surface, attached to the leadframe structure, and (iii) a molding material covering at least a portion of the leadframe structure and the first semiconductor die. The premolded substrate includes a first premolded substrate surface and a second premolded substrate surface. A second semiconductor die is stacked on the second premolded substrate surface of the premolded substrate. A housing material is on at least a portion of the second semiconductor die and the second premolded substrate surface of the premolded substrate. One of the first semiconductor die and the second semiconductor die includes a transistor while the other includes an integrated circuit. | 2009-11-12 |
20090278242 | STACKED TYPE CHIP PACKAGE STRUCTURE - A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip. | 2009-11-12 |
20090278243 | STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A stacked type chip package structure including a chip carrier, a first chip, a second chip, a third chip, and an insulating material is provided. The chip carrier includes two die pads and a plurality of leads surrounding the die pads. The first chip and the second chip are disposed on the die pads respectively, and are electrically connected to the leads by wire bonding. The third chip traverses the first chip and the second chip, and is electrically connected to the first chip and the second chip respectively. The insulating material is disposed on the chip carrier for encapsulating the first chip, the second chip and the third chip, and fills among the die pads and the leads. | 2009-11-12 |
20090278244 | IC DEVICE HAVING LOW RESISTANCE TSV COMPRISING GROUND CONNECTION - A semiconductor device includes an integrated circuit (IC) die including a substrate, and at least one through substrate via (TSV) that extends through the substrate to a protruding integral tip that includes sidewalls and a distal end. The protruding integral tip has a tip height between 1 and 50 μm. A metal layer is on the bottom surface of the IC die, and the sidewalls and the distal end of the protruding integral tips. A semiconductor device can include an IC die that includes TSVs and a package substrate such as a lead-frame, where the IC die includes a metal layer and an electrically conductive die attach adhesive layer, such as a solder filled polymer wherein the solder is arranged in an electrically interconnected network, between the metal layer and the die pad of the lead-frame. | 2009-11-12 |
20090278245 | PACKAGED ELECTRONIC DEVICES WITH FACE-UP DIE HAVING TSV CONNECTION TO LEADS AND DIE PAD - A packaged electronic device includes a leadframe including a die pad, a first, second, and third lead pin surrounding the die pad. An IC die is assembled in a face-up configuration on the lead frame. The IC die includes a substrate having an active top surface and a bottom surface, wherein the top surface includes integrated circuitry including an input pad, an output pad, a power supply pad, and a ground pad, and a plurality of through-substrate vias (TSVs) including an electrically conductive filler material and a dielectric liner. The TSVs couple the input pad to the first lead pin, the output pad to the second lead pin, the power supply pad to a third lead pin or a portion of the die pad. A fourth TSV couples pads coupled to the ground node to the die pad or a portion of the die pad for a split die pad. | 2009-11-12 |
20090278246 | SEMICONDUCTOR DEVICE - A plurality of LSI chips ( | 2009-11-12 |
20090278247 | BONDING PAD SHARING METHOD APPLIED TO MULTI-CHIP MODULE AND APPARATUS THEREOF - A multi-chip module (MCM) includes a first die and a second die. The first die supports a plurality of predetermined functions. The second die is coupled to the first die and comprises at least an option pad configured for a bonding option. The first die performs a predetermined function according to a bonding status of the option pad of the second die. | 2009-11-12 |
20090278248 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION - A semiconductor device includes a first die pad, a first semiconductor chip provided on the first die pad, a second die pad, a second semiconductor chip provided on the second die pad, and a sealing resin made of a first resin material, sealing the first die pad, the first semiconductor chip, the second die pad and the second semiconductor chip. A lower surface of the first semiconductor chip is connected to the first die pad. A first portion of a lower surface of the second semiconductor chip is connected to the second die pad, and a second portion not connected to the second die pad of the lower surface of the second semiconductor chip is connected to an upper surface of the first semiconductor chip via a second resin material different from the first resin material. | 2009-11-12 |
20090278249 | Printed circuit board and method thereof and a solder ball land and method thereof - A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance. | 2009-11-12 |
20090278250 | Method of Semiconductor Packaging and/or a Semiconductor Package - The method includes forming a leadframe. The leadframe is directly bonded to the semiconductor chip. The leadframe is flexed and/or compressed in a mold cavity. The compressed leadframe and the chip are molded into a package. | 2009-11-12 |
20090278251 | Pad Structure for 3D Integrated Circuit - This invention discloses an I/O pad structure in an integrated circuit (IC) which comprises a first vertical region in the IC including a top metal layer and one or more semiconductor devices formed thereunder, the top metal layer in the first vertical region serving as a first pad, the semiconductor devices being electrically connected to the first pad, and a second vertical region in the IC next to the first vertical region including the top metal layer and one or more through-silicon-vias (TSVs) formed thereunder, the top metal layer in the second vertical region serving as a second pad, and no semiconductor devices being formed beneath the second pad, the TSVs being electrically connected to the second pad, wherein the first and the second pad are electrically connected through at least one metal layer. | 2009-11-12 |
20090278252 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - To reduce defects of a semiconductor device, such as defects in shape and characteristic due to external stress and electrostatic discharge. To provide a highly reliable semiconductor device. In addition, to increase manufacturing yield of a semiconductor device by reducing the above defects in the manufacturing process. The semiconductor device includes a semiconductor integrated circuit sandwiched by impact resistance layers against external stress and an impact diffusion layer diffusing the impact and a conductive layer covering the semiconductor integrated circuit. With the use of the conductive layer covering the semiconductor integrated circuit, electrostatic breakdown (malfunctions of the circuit or damages of a semiconductor element) due to electrostatic discharge of the semiconductor integrated circuit can be prevented. | 2009-11-12 |
20090278253 | Semi-finished package and method for making a package - The present invention relates to a semi-finished package and a method for making a package. The semi-finished package includes a carrier and at least one molding compound. The molding compound is disposed on a surface of the carrier, and has a body and a plurality of outer protrusions. The outer protrusions are disposed at the periphery of the body, and the height of the outer protrusions is greater than that of the body. Thus, by utilizing the outer protrusions, the rigidity of the semi-finished package is increased, so as to overcome the warpage of the semi-finished package caused by different coefficients of thermal expansion of the molding compound and the carrier. Therefore, the yield rate of the package unit is increased. | 2009-11-12 |
20090278254 | Dielectric materials and methods for integrated circuit applications - An integrated circuit device is provided having a substrate and areas of electrically insulating and electrically conductive material, where the electrically insulating material is a hybrid organic-inorganic material that requires no or minimal CMP and which can withstand subsequent processing steps at temperatures of 450° C. or more. | 2009-11-12 |
20090278255 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate having external connection terminals, and a semiconductor chip mounted over a semiconductor-chip mounting portion of the substrate. The external connection terminals are formed by sequentially forming an electroless nickel plating layer, an electroless gold plating layer, and an electrolytic gold plating layer on a terminal portion formed on a surface of the substrate. | 2009-11-12 |
20090278256 | SEMICONDUCTOR PACKAGE ENHANCING VARIATION OF MOVABILITY AT BALL TERMINALS - A semiconductor package with enhanced mobility of ball terminals is revealed. A chip is attached to the substrate by a die-attaching material where the substrate has at least a stepwise depression on the covered surface to make the substrate thickness be stepwise decreased from a central line of the die-attaching area toward two opposing sides of the substrate. The die-attaching material is filled in the stepwise depression. Therefore, the thickness of the die-attaching material under cross-sectional corner(s) of the chip becomes thicker so that a row of the ball terminals away from the central line of the die-attaching area can have greater mobility without changing the appearance, dimensions, thicknesses of the semiconductor package, nor the placing plane of the ball terminals. Accordingly, the row of ball terminals located adjacent the edges or corners of the semiconductor package can withstand larger stresses without ball cracks nor ball drop. The stepwise depression can accommodate the die-attaching material to control bleeding contaminations. | 2009-11-12 |
20090278257 | METHOD TO ASSEMBLE STRUCTURES FROM NANO-MATERIALS - Numerous embodiments of a method to assemble nano-materials on a platform are described. In one embodiment, a nano-material is functionalized with a first bondable group. The functionalized nano-material is disposed on an assembly platform having an electrode to form a first layer. Additional layers of the nano-material may be formed above the first layer to form a semiconductor device. In one embodiment, the nano-material may be a carbon nanotube. | 2009-11-12 |
20090278258 | INTERCONNECT STRUCTURE WITH A MUSHROOM-SHAPED OXIDE CAPPING LAYER AND METHOD FOR FABRICATING SAME - An interconnect structure is provided that includes a dielectric material | 2009-11-12 |
20090278259 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes an insulation film formed above a semiconductor substrate, a conductor containing Cu formed in the insulation film, and a layer film formed between the insulation film and the conductor and formed of a first metal film containing Ti and a second metal film different from the first metal film, a layer containing Ti and Si is formed on the surface of the conductor. | 2009-11-12 |
20090278260 | REDUNDANCY DESIGN WITH ELECTRO-MIGRATION IMMUNITY AND METHOD OF MANUFACTURE - An IC interconnect for high direct current (DC) that is substantially immune to electro-migration (EM) damage, a design structure of the IC interconnect and a method of manufacture of the IC interconnect is provided. The structure has electro-migration immunity and redundancy of design, which includes a plurality of wires laid out in parallel and each of which are coated with a liner material. Two adjacent of the wires are physically contacted to each other. | 2009-11-12 |
20090278261 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - An interlayer insulating film is formed on the upper surface of a semiconductor substrate, and lower-level interconnects are formed in the interlayer insulating film. A liner insulating film is formed on the upper surfaces of the interlayer insulating film and lower-level interconnects. An interlayer insulating film is formed on the upper surface of the liner insulating film. Upper-level interconnects are formed in the interlayer insulating film. The lower-level interconnects and the upper-level interconnects are connected with each other through vias. Parts of the liner insulating film formed in via-adjacent regions have a greater thickness than a part thereof formed outside the via-adjacent regions. | 2009-11-12 |
20090278262 | Multi-chip package including component supporting die overhang and system including same - A microelectronic package and a system including the package. The package includes: a substrate; a stack of dice electrically and mechanically bonded to the substrate, the stack including a second level die and a first level die between the substrate and the second level die, the second level die defining an overhang; and a component disposed between the substrate and the overhang of the second level die and adapted to support the overhang on the substrate. | 2009-11-12 |
20090278263 | RELIABILITY WCSP LAYOUTS - An integrated circuit device includes a functional circuit die with a patterned rewiring layer defining a first rewiring pad and one or more second rewiring pads on opposite sides of a neutral point of the die. The device also includes at least one dielectric layer having bump opening features over the rewiring pads. The device further includes electrically conductive bump pad features formed on the dielectric layer over the bump opening features. The bump pad features make contact with the rewiring pads via the bump opening features. In the device, a center of the bump opening features are laterally offset from a center of the bump pad feature towards a neutral point of the die. | 2009-11-12 |
20090278264 | Semiconductor Chip Bump Connection Apparatus and Method - Various semiconductor chip packages and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a solder bump to a side of a semiconductor chip and bringing the solder bump into contact with a conductor pad coupled to a substrate and positioned in an opening of a solder mask on the substrate. The conductor pad has a first lateral dimension and the opening has a second lateral dimension that is larger than the first lateral dimension. A metallurgical bond is established between the solder bump and the conductor pad. | 2009-11-12 |
20090278265 | ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMPONENT - An electronic component, in which the outer perimeter portion of a component ( | 2009-11-12 |
20090278266 | DESUPERHEATER SPRAY NOZZLE - An improved valve element for a spray nozzle assembly of a steam desuperheating device that is configured to spray cooling water into a flow of superheated steam in a generally uniformly distributed spray pattern. The valve element comprises a valve body and an elongate valve stem that is integrally attached to the valve body and extends axially therefrom. The valve body itself comprises a nozzle cone which is integrally connected to the valve stem, and defines an outer surface. Integrally formed on a bottom surface of the nozzle cone is a hub having multiple ribs protruding therefrom. Integrally connected to each of the ribs is a generally circular fracture ring. The fracture ring is disposed in spaced relation to the lower edge of the nozzle cone which circumvents the bottom surface thereof. In this regard, a series of windows are formed in the valve body, with each window being framed by a segment of the lower edge of the nozzle cone, an adjacent pair of the ribs, and a segment of the top edge of the fracture ring. | 2009-11-12 |
20090278267 | METHOD FOR MANUFACTURING LIGHT GUIDE PLATES - A method for manufacturing a light guide plate, includes: providing a first mold having a first contact surface, a second mold, and a reflector having a reflecting surface, the first mold defining a cavity from the first contact surface toward an inner portion thereof and having a gate communicated with the cavity; sandwiching the reflector between the first and second molds with the reflecting surface tightly contacting with the contact surface to enclose the cavity; injecting molten transparent resin into the cavity through the gate to fill the cavity up with the molten transparent resin, thereby forming a light guide plate body on the reflecting surface of the reflector; cooling the light guide plate body to solidify the light guide plate body in the cavity; and separating the first and second molds. | 2009-11-12 |
20090278268 | Polarized Lens and Method of Making Polarized Lens - Method of making eyeglass lens are disclosed where the lens are made of layers which include an outer, convex hard coating, a layer of hard epoxy, a laminated PVA film where one of the layer of the PVA film is dipped in high contrast dye, a layer of soft epoxy, a base material, and an inner, concave hard coating. Other methods configuration of lens also include a camouflaged patterned lens, a layer of hard epoxy, a polyurethane mixture, a laminated PVA film where one of the layer of the PVA film is dipped with high contrast dye, a layer of soft epoxy, a base material, and an inner, concave hard coating. | 2009-11-12 |
20090278269 | METHOD FOR MANUFACTURING MOLD - One present embodiment provides a method for manufacturing a mold. In the method, firstly, a master die is provided. The master die includes a molding surface, the molding surface having a plurality of predefined structures thereon. Secondly, a melted PDMS material is applied on the molding surface using a spin coating process. Thirdly, the melted PDMS material is cured to form a mold. Finally, the master die is removed. | 2009-11-12 |
20090278270 | METHOD FOR MANUFACTURING MOLD FOR MOLDING OPTICAL ELEMENT - A method for manufacturing a mold for molding an optical element, wherein the mold comprising a base material having a molding base face and a covering layer provided on the molding base face of the base material, and an upper surface portion of the covering layer located above the molding base face forms a molding face, the method including: a covering step for forming a covering layer on the molding base face of the base material; a pressurizing step for pressurizing a surface of the covering layer; and a high-precision processing step for forming a molding face by applying high-precision processing onto the surface of the covering layer subsequent to the pressurizing step. | 2009-11-12 |
20090278271 | Thermal Revitalization of Polymer-Containing Materials - A method for thermally revitalizing a damaged polymer-containing material, consisting essentially of applying heat from an external heat source to the surface of the object to temporarily raise the surface temperature of the object above the softening point of the polymer is disclosed. A device for performing thermal revitalization on a polymer-containing material is also disclosed. | 2009-11-12 |
20090278272 | Method of making laminar materials suitable for use in the manufacture of shoes - A method of making a laminar material suitable for use in the manufacture of shoes. The material includes an extruded core having laminated thereto on both sides a fibre fabric layer, the thermoplastic sheet core is made from a mixture of granulated scrap shoe stiffener material with virgin extrudable thermoplastics material the core including at least 40% by weight of virgin extrudable thermoplastics material. Hot melt adhesive coatings are applied on both sides. The scrap material in the core includes fibrous particles. | 2009-11-12 |
20090278273 | Sprue removal in an injection molding machine - A method of removing solidified sprue plastic from an injection molding machine uses a picker assembly that includes an end-effector with a gripper. The injection molding machine has a stationary platen with a first mold, and has a moveable platen with a second mold. The method includes moving the gripper in a direction that is generally perpendicular to a direction that the second mold moves while the first mold and the second mold are opening. The method also includes grabbing the solidified sprue plastic before the first mold and the second mold reach a fully open position. | 2009-11-12 |
20090278274 | Method for Monitoring and/or Controlling the Melt Filling of at Least One Cavity - The invention relates to a method for monitoring and/or controlling the melt filling of at least one cavity of an injection molding machine, in particular, by means of a cold channel tool. The invention also monitors the time which is required for the melt to reach the sensor in the cavity and modifies the viscosity of the. melt in the event of variations and/or differentiations in said time. | 2009-11-12 |
20090278275 | Apparatus and Method for Forming Ceramic Products - A porous mold is provided for forming ceramic products from a ceramic fluid mixture formed of a suspension of ceramic material in a liquid. A suction device is arranged for extracting or withdrawing at least part of the liquid through the porous mold. An actuator reciprocally displaces the first and second half-molds of the porous mold to form a chamber and to vary the volume of the chamber. A method for forming ceramic products includes the steps of pouring in a porous mold a ceramic fluid mixture formed of a suspension of ceramic material in a liquid, extracting at least part of the liquid through the porous mold and pressing the ceramic fluid mixture by reciprocally moving first and second half-molds of the porous mold. | 2009-11-12 |
20090278276 | METHOD FOR MAKING CONTOURED DECORATIVE GRASS - Method for producing decorative grass, such as Easter grass, from a material, wherein the strips of decorative grass have a decorative pattern thereon. The decorative pattern may be printed material and/or embossed patterns thereon, or the decorative pattern may be a non-linear side edge that provides the decorative grass with a contoured configuration. | 2009-11-12 |
20090278277 | MULTILAYER FILMS FOR PACKAGE APPLICATIONS AND METHOD FOR MAKING SAME - A multilayer film formed by a solution process. The multilayer film includes a plurality of basic film structures positioned in contiguous overlying relationship to form a common multilayer film. Each of the plurality of basic film structures includes one of: a first two-layer structure with a first layer including either a polymer material or an organic material and a second layer including a functionalized inorganic material; a second two-layer structure with a first layer including either a polymer material or an organic material and a second layer including either a polymer binder and/or an organic binder; and a three layer structure with a first layer including either a polymer material or an organic material, a second layer including a functionalized inorganic material, and a third layer including one of a polymer binder and/or an organic binder. | 2009-11-12 |
20090278278 | METHOD OF PRODUCING POLYOLEFIN RESIN FILM - A method of producing a polyolefin resin film comprising melt-extruding a polyolefin resin from a circular die toward the antigravity direction to form a tubular film and cooling the tubular film while receiving the film toward the antigravity direction, wherein a water-absorbing material containing water and having a width in the gravity direction of 5 mm or more is brought into contact with the peripheral surface of the tubular film to cool the film, at any position distant by 0 to 200 mm toward the gravity direction from the frost line obtained by air cooling. | 2009-11-12 |
20090278279 | POLY(HYDROXYALKANOIC ACID) AND THERMOFORMED ARTICLES - Disclosed is a process comprising extruding a poly(hydroxyalkanoic acid) (PHA) to produce a first article; thermoforming the first article in a heated mold having a temperature≧about 90° C. to produce a second article; and heat treating the second article by holding the second article in the heated mold for less than about 40 seconds to produce a thermoformed article wherein the PHA composition comprises or consist essentially of PHA and 0 to about 4%, based on the weight of the composition, of a nucleator; and the first article is a film or sheet and is partially crystallized. | 2009-11-12 |
20090278280 | Method for manufacturing biodegradable cinerary urns - A method that contemplates the use of materials selected from amongst aggregates, aromatic plants, vegetal organic matter and combinations thereof, that are then mixed with vegetal agglutinant agents and the resulting mixture poured inside molds that are subjected to a pressure treatment and then, once they have had time to dry, to a heat application which purpose is to consolidate the urn ( | 2009-11-12 |
20090278281 | METHOD FOR FORMING A PUNCTURE AND ABRASION RESISTANT LAMINATED FABRIC AND THREE DIMENSIONAL BALLISTIC RESISTANT PRODUCTS THEREFROM - A puncture and abrasion resistant laminated fabric and ballistic resistant product is provided. The laminated fabric includes a woven fabric base sheet having warp and weft yarns, with at least 50 percent of the fibers in the warp yarns being formed of ultra high molecular weight polyethylene. A first thermoplastic film formed of EVA is bonded by heat and pressure applied by a hydraulic press to at least one of the sides of the fabric base sheet to form a film/fabric layer. Multiple layers are stacked with release paper between the layers to form multiple film/fabric layers simultaneously. Multiple layers of the film/fabric without release paper between the layers are also introduced to a molding operation to form three dimensional ballistic resistant articles such as body armor or helmets. | 2009-11-12 |
20090278282 | INSERT-MOLDED COVER AND METHOD FOR MANUFACTURING SAME - The present invention relates to an insert-molded cover ( | 2009-11-12 |
20090278283 | PRODUCING NANOPARTICLES USING NANOSCALE POLYMER TEMPLATES - In various aspects provided are methods for producing a nanoparticle within a cross-linked, collapsed polymeric material. In various embodiments, the methods comprise (a) providing a shape-static polymer template with a size in the range between about 1 nm to about 100 nm; (b)) incorporating one or more nanoparticle precursor moieties with the shape-static polymer template; and either (c) oxidizing the precursor moieties to form a composite nanoparticle comprising one or more of an inorganic oxide and hydroxide nanoparticle; or (c) adding an ion with an opposite charge polarity to the at least one nanoparticle precursor moieties to effect formation of a composite nanoparticle. | 2009-11-12 |
20090278284 | PROCESS FOR MAKING A DIP-FORMING COMPOSITION AND A DIP-FORMED ARTICLE - A dip-forming composition is provided, which can give a dip-formed article that exhibits good softness of touch and comfortable fittingness, an excellent tensile strength and a high flexural fatigue resistance, and which is less likely to color even when worn and subjected to working for a long time period. The above problem is solved by the dip-forming composition which is obtained by converting an organic peroxide, which is solid at 30° C. under normal pressure, to an aqueous dispersion in the presence of a surfactant and a polymeric protective colloid, adding the dispersion to a conjugated diene rubber latex, and aging the mixture. The organic peroxide is preferably dibenzoyl peroxide or dilauroyl peroxide. | 2009-11-12 |
20090278285 | Light curing system and method - A method for light-curing polymerizable materials to form a dental device is provided. A light-curing apparatus having at least one integrated lighting and heating source, a curing volume, and a temperature controller, preferably a fan, is used in the method. The light source and temperature controller are used to heat a first polymerizable material to temperatures within a first temperature range. A second polymerizable material is applied on or adjacent to the first polymerizable material. The light source and temperature controller are used to heat the second polymerizable material to temperatures within a second temperature range. The first temperature range has a first midpoint and the second temperature range has a second midpoint. The first midpoint temperature is at least 10° C. apart from the second midpoint temperature. The system is particularly suitable for making dental devices such as full dentures, removable partial dentures, relines of full and partial dentures, nightguards, and occlusal splints. | 2009-11-12 |
20090278286 | IN-LINE INSPECTION SYSTEM FOR VERTICALLY PROFILING PLASTIC CONTAINERS USING MULTIPLE WAVELENGTH DISCRETE SPECTRAL LIGHT SOURCES - Systems and methods for in-line inspection of plastic blow molded containers. The inspection system may comprise a plurality of emitter assemblies arranged in a vertical array. Each emitter assembly may cyclically emit light energy in at least two different narrow wavelength bands at a container as the container passes through an inspection area. The system may also comprise a plurality of broadband photodetectors arranged in a vertical array, each photodetector facing at least one of the emitter assemblies with the inspection area therebetween such that the photodetectors are capable of sensing light energy that passes through the container when it is in the inspection area. The system may also comprise a processor in communication with the photodetectors for determining a characteristic of the container based on signals from the photodetectors. | 2009-11-12 |
20090278287 | Substrate processing with reduced warpage and/or controlled strain - Provided are systems and methods for processing the surface of substrates that scan a laser beam at one or more selected orientation angles. The orientation angle or angles may be selected to reduce substrate warpage. When the substrates are semiconductor wafers having microelectronic devices, the orientation angles may be selected to produce controlled strain and to improve electronic performance of the devices. | 2009-11-12 |
20090278288 | Method and Device for Blow-Molding Containers - The invention relates to a method and a device for blow-moulding containers. Following a thermal conditioning process, a parison is stretched by a horizontal bar inside a blow station provided with a blow mould, and is moulded into a container by the effect of the blowing pressure. In order to carry out the blow-moulding, pressurised gas is introduced into the container. The horizontal rod is hollow at least in parts. Once a maximum blowing pressure has been reached in the blow station and at the earliest at the beginning of a pressure drop, a cooling gas is guided out of the horizontal bar towards the bottom of the blown container. | 2009-11-12 |
20090278289 | Cover Assembly for a Vehicle Air Spring - A cover assembly for an air spring for vehicles includes a cover ( | 2009-11-12 |
20090278290 | EASY-TO-INSTALL AIR SPRING - An air spring generally comprises a first end closure, a flexible member coupled to the first end closure and defining a pressurizable chamber, and a first mounting member projecting from the first end closure in a first direction. The first mounting member has an outer surface with a plurality of barbs projecting outward from the outer surface. The barbs have a spaced arrangement along the first direction. | 2009-11-12 |
20090278291 | FIXING STRUCTURE OF SPINDLE BALANCER FOR MACHINE TOOL TECHNICAL FIELD - A fixing structure of a spindle balancer for a machine tool in which a spindle balancer can be attached easily to a machine tool at an appropriate position in an appropriate posture while being supported stably and surely by the machine tool, safety is enhanced when the spindle balancer is attached to the machine tool by lessening the attaching load, set-up including replenishment of the cylinder body with compression gas and regulation of gas pressure is facilitated, and the attachment time and set-up time of the spindle balancer can be shortened. The fixing structure | 2009-11-12 |
20090278292 | Multi-axis spring damping system for a payload in a spacecraft - A multi-axis spring damping element includes two spring damping cushion members received between caps on a bolt shaft, and an axial adjustment mechanism at a free end of the bolt shaft. The other end of the bolt shaft is connected to a support structure, and a load to be supported in a vibration-damped manner is carried by intermediate caps between the two spring damping cushion members. A plurality of such spring damping elements forms a spring damping system, for example for supporting a payload-carrying pallet on a load platform of a spacecraft. | 2009-11-12 |
20090278293 | DAMPING MATERIAL AND METHOD FOR PRODUCTION THEREOF - Provided is a vibration damping material comprising: a polyester resin containing dicarboxylic acid constitutional units and diol constitutional units; and mica being dispersed in the polyester resin, wherein: (1) a ratio [(A | 2009-11-12 |
20090278294 | CLAMPING SYSTEM - A clamping system for clamping aerofoils. The clamping system has pivotally mounted engagement members that engage the aerofoil mounted on a pivotally mounted arm either side of the pivotal mounting. The arm can pivot as required relative to the item, to accommodate differences in shape in the item, whilst providing a substantially equal clamping force by both engagement members. | 2009-11-12 |
20090278295 | MAINTAINING DEVICE FOR A RIM OF A VEHICLE WHEEL - A holding device for a rim of a vehicle wheel having a base plate which has a central recess for being pushed onto the shaft of a balancing machine, having a plurality of rotatably mounted holding elements and having at least one coupling element which is arranged coaxially with respect to the central recess and is mounted rotatably on the base plate, the holding elements and the coupling element having an interacting coupling for the positive coupling of the rotational movement of the holding elements. There is provision, in addition to the coupling which bring about the positive connection, for the holding elements and the coupling element to have a further coupling mechanism for the frictional coupling of the rotational movement of the holding elements, and for at least one fixing device to be provided for fixing the holding elements, if required. | 2009-11-12 |
20090278296 | Vise for archery bow - A bow vise for clamping an archery bow at three spaced contact points between first and second relatively pivotable bow clamping assemblies movable about a common pivot axis includes a bracket on each assembly spaced from the pivot axis and a pin rotatable in each bracket. One pin has a smooth bore aperture and the other a threaded aperture. A coiled spring biases the assemblies away from each other. A threaded rod passes through both apertures, threads into the threaded aperture and includes a knob at one end for rotatably moving the rod clockwise and counterclockwise. As the rod threads through the threaded aperture, the knob applies a force to one of the brackets to pivot the assemblies toward each other. The bow is configured for rotating the bow about three mutually perpendicular axes and for microadjusting the position of the bow about two such axes. | 2009-11-12 |
20090278297 | CLAMPING DEVICE - A clamping device includes a securing seat, a driving member movably mounted on the securing seat, a first fixture, a second fixture, a first securing pole, a second securing pole, a first joining member and a second joining member. The first fixture includes a first clamping member and a first connecting member. The first connecting member comprises a first moving portion. The second fixture includes a second clamping member and a second connecting member. The second connecting member includes a second moving portion. The first and second securing poles are fixed on the securing seat. The first and second joining members are respectively matched with the first and second securing poles. Two ends of the first joining member are respectively connected to the driving member and the first moving portion. Two ends of the second joining member are respectively connected to the driving member and the second moving portion. | 2009-11-12 |
20090278298 | Device for holding a piston in a system for coating pistons - The invention relates to a device ( | 2009-11-12 |
20090278299 | DOCUMENT COLLATING APPARATUS - An apparatus for collating sheets, the apparatus comprising: a collating station having a collating position limited at its downstream end by a stop member against which the sheets abut whilst they are being collated; means for conveying sheets to the collating position so as to form a collated sheet set comprising a predetermined number of stacked sheets; a collating station eject device for moving the collated sheet set away from the collating position to an exit position; and means for conveying the collated sheet set from the exit position out of the apparatus to a downstream sheet handling device; wherein the collating station eject device comprises at least one movable pawl arranged to push each collated sheet set away from the collating position to the exit position and wherein the apparatus is adapted to collate a second sheet set at least partially overlying the first sheet set. | 2009-11-12 |
20090278300 | Sheet Feed Mechanism - A sheet feed mechanism includes a chassis for supporting a stack of sheets; a top sheet engaging member for engaging a top most sheet of the stack; a stack engaging structure for engaging the stack and biasing the top most sheet against the top sheet engaging member, the stack engaging structure hingedly connected to the chassis at a hinge axis; a friction surface extending from the stack engaging structure, the friction surface extending in a curvature parallel to a locus of the stack engaging structure about the hinge axis; a lock mechanism having a lock arm hingedly connected to the chassis at the hinge axis, the lock mechanism further having a biased contact foot for engaging the friction surface to retard a movement of the stack engaging structure about the hinge axis; and an actuator for engaging and disengaging the contact foot from the friction surface. The friction surface is arranged to extend beneath the biased contact foot, and the actuator is adapted to pivotally actuate the biased contact foot upwards and downwards to respectively disengage and engage the biased contact foot with the friction surface. | 2009-11-12 |
20090278301 | RECORDING APPARATUS - A recording apparatus is capable of reliably correcting skew feeding of a recording sheet in an arrangement for conveying the recording sheet absorbed by a belt surface. The recording apparatus includes: a driving roller for driving the conveying belt wound around the driving roller and electrically charging the conveying belt by application of a voltage; and a pinching roller abutting against the driving roller via the conveying belt. A pinching section, which is formed by the driving roller and the pinching roller, corrects skew feeding of the recording sheet fed from the paper feed section and thereafter the voltage is applied to the driving roller to electrically charge the conveying belt. | 2009-11-12 |
20090278302 | Actuation Of Output Tray - One embodiment is an apparatus that has an input tray and an output tray. Commencement of a print job causes the output tray to move from a closed position to an open position. | 2009-11-12 |
20090278303 | MEANDER CONTROL SYSTEM, AND MEANDER CONTROL METHOD - A meander control is performed by using: a guide roller that alters the conveying direction of a aluminum sheet conveyed along a conveying path; a first edge sensor that detects the amount of meandering at a first detection position that is upstream of the guide roller; a second edge sensor that detects the amount of meandering at a second detection position between the first edge sensor and the guide roller; and a control device that calculates an error contained in a first gain of a first feedforward model on the basis of a detected value from the first edge sensor and a detected value from the second edge sensor, and corrects a second gain of a second feedforward model by the calculated error, and then calculates a guide position-estimated amount of meandering on the basis of the second feedforward model and the detected value from the second edge sensor. | 2009-11-12 |
20090278304 | Printing apparatus capable of handling paper size error - In a printing apparatus, even when the measured paper size differs from the scheduled size, it is possible to reduce the frequency of requiring a recovery procedure, and prevent the productivity from decreasing by continuing the operation of the printing apparatus as much as possible. The printing apparatus includes a paper feeding unit for feeding a print sheet from a paper feed tray | 2009-11-12 |
20090278305 | IMAGE FORMING APPARATUS - An image forming apparatus has a sheet feeding portion feeding a sheet; a conveyance passage for conveying the sheet inside the apparatus; an image forming portion forming an image on the sheet; a skewing detector disposed in the conveyance passage between the sheet feeding portion and the image forming portion, detecting arrival and departure of the sheet, and detecting skewing amount of the sheet in the conveyance passage; a display portion displaying an apparatus state; a storage portion storing data; and a control portion controlling sheet feeding and conveying, and grasping the sheet skewing amount based on the output of the skewing detector to stop printing when the skewing amount is at or above a first predetermined amount stored in the storage portion. | 2009-11-12 |
20090278306 | DEVICE FOR PROCESSING PLANAR PARTS - A device for processing planar parts, in particular plastic substrates, preferably plastic cards, such as credit cards, having a transport apparatus, which defines a conveyance route, and at least two processing stations, which are situated in the conveyance route, the parts being transportable through the processing stations over a processing route, the processing stations comprising conveyance means and processing means, and the conveyance means contacting a first side (bottom side) of the parts for transport and the processing means processing a second side (top side) of the parts, is characterized in that at least one of the processing stations is pivotable or rotatable in such a way that the conveyance means contact the top side of the parts and the processing means process the bottom side of the parts. | 2009-11-12 |
20090278307 | Document handling apparatus - A document handling apparatus is disclosed which is particularly well adapted for counting documents of value, such as banknotes. The document handling apparatus comprises an input module for receiving a stack of documents and feeding them one by one into the apparatus, a detector box which houses a series of detectors for detecting characteristics of the documents, a transport system for conveying documents within the apparatus, a doubles detector for sensing the passage of each document therethrough and a stacker module for stacking the output documents and presenting them to the user. The apparatus is based on a metal framework in a plastics housing. | 2009-11-12 |
20090278308 | PRINTING SYSTEM, CONTROL METHOD, AND COMPUTER-READABLE STORAGE MEDIUM - A method for controlling a printing system includes stacking a sheet printed by executing a job on a stacking unit provided inside a stacker, the stacker including a door that can be opened and closed, opening the door in a case where a predetermined instruction is input by a user, and in a case where the predetermined instruction is input while a job for stacking the sheet on the stacking unit, control to output the sheet discharged by executing the currently executed job on an output destination different from the stacking unit. | 2009-11-12 |
20090278309 | THREE-DIMENSIONAL GAME AND METHOD OF PLAYING THE SAME - The present invention relates generally to a three-dimensional game and/or educational apparatus and a method of playing the game. The apparatus generally comprises a plurality of cells arranged in predetermined rows and columns which allow the movement of gaming pieces in three distinct directions. | 2009-11-12 |
20090278310 | SUDOKU BOARD GAME - A Sudoku board game has a receiver board, a decoder board, and pieces. The receiver board has a plurality of receiver holes. The decoder board has a plurality of key holes, and the key holes are arranged to present a Sudoku game to a player. The pieces are insertable first through the receiver holes and then into the key holes. Each of the pieces comprises a top, a key, and a shaft coupled to the top and the key. The keys are arranged to cooperate with the key holes such that only a key matching a key hole can be fully inserted into the key hole and corresponding receiver hole and such that a key not matching a key hole cannot be fully inserted into the key hole and corresponding receiver hole. | 2009-11-12 |
20090278311 | SUDOKU BOARD GAME - A decoder board for a Sudoku game has a plurality of keys arranged to present a Sudoku game to a player. | 2009-11-12 |
20090278312 | GAME SYSTEM WITH COOPERATIVE AND COMPETITIVE BOARDS - A game includes first and second boards. The first board is a competitive board permitting players to compete as the players play the game. The second board is distinct from the first board, and the second board is a cooperative board requiring the players to cooperate as the players play the game. | 2009-11-12 |
20090278313 | Bunko-Style Game - A game is provided based on the results of a random value generator, and a playing surface useful for some versions of the game is also provided. Some versions of the game involve a dice game reminiscent of bunko, in which rewards are given based on the results of die rolls. Like bunko, these versions of the game require infrequent decision-making during play, allowing the players to relax and socialize instead of constantly concentrating on the details of play. A gambling version of the game is provided, in which payouts depend in part on the number of target values rolled. | 2009-11-12 |
20090278314 | Playing card game with viewable grid array base - The playing cards are laid out in a grid configuration such as three rows of four cards each. Unlike traditional plating card games where there is an element of secrecy between players, in this game, the player does not hold any cards away from the other players field of vision. Both players play the game upon the grid of these array of the rows and columns of the playing cards, in an environment and orientation similar to how two players place chess four checkers on a respective chessboard or a checkerboard. | 2009-11-12 |
20090278316 | ILLUMINATED GAME - On aspect of the present invention comprises an illuminated game having a base having a receiving member; a first member removably received within a receiving member; a third member removably received within a different receiving member. The third member oriented substantially perpendicular to the first member. A second member secured to the first member and the third member. A fourth member secured to the first member and the third member. The fourth member disposed downwardly from the third member. A fifth member secured to the first member and the third member. The fifth member disposed downwardly from the fourth member, each member being transparent. An illumination device disposed within at least one the members. | 2009-11-12 |
20090278317 | Golf toss game - An advanced golf toss game that is interesting and more challenging for the entire family includes at least two stands with each stand having a base for disposition on the ground and a vertically extending frame that includes two spaced-apart upright members with at least two curved step-like target bars extending between and attached to the upright members with one target bar being the lower target and one target being the upper target. Each step-like target bar includes two horizontal tubular sections or bars joined by a vertically extending bar to form the curvilinear shape and each bar has a point value associated with it so that two players—or teams of players—can toss in alternating turns stringed pairs of golf balls at the opposite upper and lower targets within the frame in an attempt to hook and wrap their teams stringed golf ball pairs onto the bars for accumulating points to win the game. | 2009-11-12 |
20090278318 | PRIZE ACQUISITION GAME DEVICE - To perform angle adjustment of a claw member in an end portion of a gripping arm assuredly in a simple manner. A claw member | 2009-11-12 |
20090278319 | VACUUM TRANSFER SEAL - An intermediate sealing element and method for unsealing a vacuum membrane from one tool surface and transferring it to another tool surface without damaging the vacuum membrane. The intermediate sealing element forms a continuous path around the periphery of a vacuum membrane and is sealed directly to one or more vacuum membranes and a tool surface using any means known in the art to create an airtight seal between two surfaces. The intermediate sealing element is able to withstand high temperatures and high pressure without altering its structural characteristics. Because of its durability, the intermediate sealing element can be removed from the tool surface without tearing or elongating, subsequently allowing the vacuum membranes to be detached from the tool surface without tearing or elongating. | 2009-11-12 |
20090278320 | Piston ring with chromium nitride coating for internal combustion engines - The invention relates to a piston ring for internal combustion engines, the piston ring comprises a steel or cast iron base material with a coating of chromium nitride deposited by a physical vapor deposition process on a sliding surface of the piston ring, wherein the coating is composed of a columnar crystal structure of CrN with the following features:
| 2009-11-12 |
20090278321 | INTERNAL PIPE SEAL - A pipe sealing assembly, and a method of installing the pipe sealing assembly, for sealing a connection between a pair of underground pipes, including a generally cylindrical seal or gasket having at least three axially spaced sealing portions. Each sealing portion has a plurality of compressible sealing ridges, as well as an annular expansion band seat capable of receiving the expansion band of an expansion band assembly that is used to sealingly compress each sealing portion against a respective inner surface of a pipe. The sealing portions may include a middle sealing portion that may directly sealingly engage about, and bridge, a joint between two pipes, or may directly sealingly engage about, and bridge, a crack in a pipe. Additionally, each sealing portion may include a hollow section which houses the expansion band assembly, and may be provided with a small slit for installing the expansion band assembly. The expansion band assembly includes one or more expansion bands and one or more expansion mechanisms. The expansion bands may be initially installed as part of the pipe sealing assembly, while the expansion mechanisms may be installed after the pipe sealing assembly is brought underground through a structure, such as a manhole, and positioned at an installation site. | 2009-11-12 |
20090278322 | TEMPERATURE AND PRESSURE RESPONSIVE SEAL - A seal for a vessel is disclosed which militates against a leakage of fluid during expansion and contraction of the vessel due to changes pressure and temperature. Inner sealing surfaces of the seal form substantially fluid-tight seals in response to at least one of temperatures below a predetermined temperature and pressures below a predetermined pressure and outer sealing surfaces of the seal form substantially fluid-tight seals in response to at least one of temperatures above the predetermined temperature and pressures above the predetermined pressure. | 2009-11-12 |
20090278323 | DEVICE USABLE AS GRIPPER HEAD OR CHUCK - A device for clamping a stem has a body forming a piston chamber and having an axially outwardly open hole adapted to receive the stem and a plurality of collet jaws in the hole shiftable axially by a piston between an outer releasing position with its axial outer ends radially spread and an inner holding position with the ends more closely radially juxtaposed. The stem is engageable axially in the hole between the jaws and lockable in the body in the inner holding position. A main spring urges the piston and jaws axially inward into the inner position. A cover element has an outer head and is axially shiftable relative to the piston between an extended position with the head engaged radially between the outer ends of the jaws and a retracted position with the head spaced axially inward from the outer ends of the jaws. | 2009-11-12 |
20090278324 | TOOL CHUCKING APPARATUS - A tool chucking apparatus to hold a machining cutter or tool includes a holding member and a fastening member that are coupled together to form a grip space inside to hold a collet. The collet has a plurality of pawl structures with a plurality of elastic slots formed thereon. When the holding member and the fastening member are coupled, the collet has one end tightly held in the holding member and the other end tightly held in the fastening member. Hence the two ends of the collet contract the elastic slots to tightly grip the cutter or tool. As a result, machining precision improves, safety enhances and the life span of the cutter or tool increases. | 2009-11-12 |
20090278325 | Walking Aid Adapted For Mounting A Height Obstacle - The present invention relates to a walking aid adapted for mounting a height obstacle. The walking aid comprises a frame with a front and a back, and at least two rear wheels and at least one front wheel. The front wheel is supported by a front wheel carrier which is moveably connected to the frame for supporting the at least one front wheel such that it is moveable with respect to the frame between a lower forward position for supporting the frame on the surface and a higher backward position. The walking aid further comprises at least one temporarily forward support member provided at the front of the frame for supporting the frame on the surface when the at least one front wheel is in the higher backward position, which temporarily support member is connected to the frame such that the underside of the temporarily support member is at a distance from the support surface when the frame is supported by the at least one front wheel in the forward position. | 2009-11-12 |
20090278326 | Kits, Components and Stackable Trailers for Transporting Containers - Stackable trailers, kits, and components for stackable trailers are disclosed. The kits and components provide added functionality to existing or newly manufactured trailers for carrying shipping containers of various sizes. Stackability, modularity, and cost savings can be achieved using the various disclosed components with trailers. Components include outriggers for receiving shipping containers, cradles for receiving trailer wheels, and assemblies for receiving trailer landing gears. | 2009-11-12 |
20090278327 | Foldable Scooter - A foldable scooter includes a footboard, a steering column and a connecting member in between. The connecting member includes a stopper for engaging the connecting member with the notches disposed at a front portion of the footboard in the open condition. The connecting member also includes a rotatable locking member having a first biasing device for biasing the locking member against the connecting member in the open and folded conditions, an actuating end, a first locking end and a second locking end rotatable to a first and second locked position correspondingly for locking the connecting member to the footboard in the open and folded conditions. The locking member can be easily and conveniently released from the first and second locked positions by pressing the actuating end. | 2009-11-12 |
20090278328 | SUSPENSION ASSEMBLY WITH COAXIAL TORSION BAR - A vehicle suspension system includes a pair of suspension assemblies mounted on a pair of spaced vehicle frame members for supporting a vehicle body on the vehicle wheels. A torsion axle extends between the pair of suspension assemblies and terminates in a pair of stub shafts. The axle is mounted on a pair of spaced frame bars attached to the vehicle frame. An air spring extends between the vehicle frame and an outer end of a support arm mounted on the torsion axle. The stub shafts are supported within an outer tube of the torsion axle by a plurality of elastomeric members. One end of each stub shaft is connected to a spindle arm which has a spindle extending from an opposite end of the arm. The outer tube of the torsion axle pivotally supports the air spring support arm and the axis of the torsion axle is coaxial with the pivot axis of the air spring support arm to provide a more compact and sturdy suspension assembly. | 2009-11-12 |
20090278329 | SUSPENSION ASSEMBLY - A vehicle suspension system includes a pair of suspension assemblies mounted on a pair of spaced vehicle frame members for supporting a vehicle body on the vehicle wheels. A torsion axle extends between the pair of suspension assemblies and terminates in a pair of stub shafts. The axle is mounted on a pair of spaced frame brackets attached to the vehicle frame. An air spring extends between the vehicle frame and an outer end of a support arm pivotally mounted on each end of the torsion axle. The stub shafts are supported within an outer tube of the torsion axle by a plurality of elastomeric members. One end of each stub shaft is connected to a spindle arm which has a spindle extending from an opposite end of the arm. The length of the air spring support arm and the distances between the pivot axis of the support arm and the axii of the spindle and torsion axle are chosen so that the surface of the air spring is always out of contact with the mounting bracket and has a portion inboard between the axis of the spindle and axis of the torsion axle. | 2009-11-12 |
20090278330 | Multiple speed chainless drive for a utility tricycle with either torque amplifying pedal beams or a conventional bicycle seat and pedals - The improved chainless drive of the present invention features a four speed planetary transmission housed within the hub of the driving wheel of a utility tricycle, and a vehicle frame which provides two options for delivering power to the transmission. In the first option the drive shaft, which extends out through bearings on the center line of the driving wheel, has a crank arm fixed on each end. A spindle is fixed in the end of each crank arm and a pedal beam is rotatably mounted near its center on each spindle. A cam roller mounted on each pedal beam near its aft end engages a short length of steel track fastened on the sides of a trunk bolted on the aft end of the tricycle frame. The cam roller provides a downward force to counter balance the weight of the rider on the cantilevered forward end of the pedal beam increasing the force on the spindle and thus amplifying the torque delivered to the drive shaft. In the second option the pedal beams are replaced with conventional bicycle pedals and bicycle seat and the trunk is bolted on the forward end of the tricycle frame. Storage space in the fiberglass trunk permits use of the utility tricycle for shopping. | 2009-11-12 |
20090278331 | Bicycle Rear Wheel Suspension System with Controlled Variable Shock Rate - The present invention is a bicycle including a bicycle frame and a rear wheel suspension system that is attached to the frame. The rear wheel suspension system includes a rear wheel swingarm and a shock absorber that is engaged to the swingarm to control the motion of a rear wheel of the bicycle. A change in the vertical wheel travel (ΔVWT) of the rear wheel is related to a change in the length of the shock absorber (ΔSL), providing a shock rate (SR) according to the relationship: | 2009-11-12 |