43rd week of 2014 patent applcation highlights part 46 |
Patent application number | Title | Published |
20140315354 | PACKAGE PROCESS - A package structure and a package process are provided. The package structure comprises a carrier having a carrying portion and a plurality of supporting bar remnants disposed around and extending outward from the carrying portion, a chip mounted to the carrying portion, and an encapsulant disposed on the carrier and covering the chip, wherein the supporting bar remnants are encapsulated by the encapsulant, and each of the supporting bar remnants has a distal end shrank from an outer surface of the encapsulant. A package process for fabricating the package structure is also provided. | 2014-10-23 |
20140315355 | MANUFACTURING METHOD OF WAFER LEVEL PACKAGE - The present invention provides a method for manufacturing a semiconductor package structure, including (i) providing a carrier plate; (ii) disposing a die on the carrier plate; (iii) forming a plurality of bonding wires having a first end and a second end; (iv) forming an encapsulant covering the die and the bonding wires and exposing a portion of each of the bonding wires from a first surface thereof; (v) removing the carrier plate; (vi) forming a patterned conductive layer on a second surface of the encapsulant opposite to the first surface; (vii) electrically connecting the second ends of the bonding wires to the active surface of the die via the patterned conductive layer; and (viii) forming a plurality of first external connection terminals on the first surface of the encapsulant respectively covering the portions of the bonding wires exposed from the encapsulant. | 2014-10-23 |
20140315356 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a manufacturing method of a semiconductor device, a semiconductor chip is sealed with a resin, and then a laser is applied to remove the resin so that a part of the semiconductor chip is exposed. The semiconductor chip is made of a material that has a lower absorptivity of the laser than the resin and is not melted by the laser. The laser has a wavelength that passes through the semiconductor chip and has a lower absorptivity in the semiconductor chip than in the resin. The laser is applied to the resin from a side adjacent to one of plate surfaces of the semiconductor chip, so that the resin sealing the one of the plate surfaces is sublimated and removed and at least a part of the resin sealing the other of the plate surfaces is subsequently sublimated and removed by the laser having passed through the semiconductor chip. | 2014-10-23 |
20140315357 | METHOD OF MANUFACTURING AN LTPS ARRAY SUBSTRATE - The present disclosure discloses a method of manufacturing the LTPS array substrate, comprising: depositing a polysilicon layer and an amorphous silicon layer on the substrate successively and crystallizing the amorphous silicon layer to form the polysilicon layer by laser annealing; coating a photoresist layer covering the PMOS area, NMOS area and TFT area of the polysilicon layer; forming a polysilicon pattern and a channel by dry etching the polysilicon layer, then removing the regions of the photoresist layer which are thinner and covering the NMOS area and the TFT area by ashing, the region of the photoresist layer covering the PMOS area is remained. The present disclosure saves the cost of the equipment, improves the yield, reduces the design defect and the process difficulty of the conventional process using 8 photomasks. | 2014-10-23 |
20140315358 | MANUFACTURING METHOD OF JUNCTION FIELD EFFECT TRANSISTOR - The present invention discloses a manufacturing method of a junction field effect transistor (JFET). The manufacturing method includes: providing a substrate with a first conductive type, forming a channel region with a second conductive type, forming a field region with the first conductive type, forming a gate with the first conductive type, forming a source with the second conductive type, forming a drain with the second conductive type, and forming a lightly doped region with the second conductive type. The channel region is formed by an ion implantation process step, wherein the lightly doped region is formed by masking a predetermined region from accelerated ions of the ion implantation process step, and diffusing impurities with the second conductive type nearby the predetermined region into it with a thermal process step. | 2014-10-23 |
20140315359 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A semiconductor device includes a p-type semiconductor layer, n-type column regions formed of columnar thermal donors exhibiting an n-type property, a p-type column region interposed between the n-type column regions, the n-type column regions configured to form a super-junction structure in cooperation with the p-type column region, a channel region formed in the semiconductor layer, a source region formed in the channel region, a gate insulator film formed on the semiconductor layer, and a gate electrode formed on the gate insulator film and opposite to the channel region across the gate insulator film. | 2014-10-23 |
20140315360 | Method of Scavenging Impurities in Forming a Gate Stack Having an Interfacial Layer - A multi-layer scavenging metal gate stack, and methods of manufacturing the same, are disclosed. In an example, a gate stack disposed over a semiconductor substrate includes an interfacial dielectric layer disposed over the semiconductor substrate, a high-k dielectric layer disposed over the interfacial dielectric layer, a first conductive layer disposed over the high-k dielectric layer, and a second conductive layer disposed over the first conductive layer. The first conductive layer includes a first metal layer disposed over the high-k dielectric layer, a second metal layer disposed over the first metal layer, and a third metal layer disposed over the second metal layer. The first metal layer includes a material that scavenges oxygen impurities from the interfacial dielectric layer, and the second metal layer includes a material that adsorbs oxygen impurities from the third metal layer and prevents oxygen impurities from diffusing into the first metal layer. | 2014-10-23 |
20140315361 | Replacement Metal Gate Process for CMOS Integrated Circuits - A complementary metal-oxide-semiconductor (CMOS) integrated circuit structure, and method of fabricating the same according to a replacement metal gate process. P-channel and n-channel MOS transistors are formed with high-k gate dielectric material that differ from one another in composition or thickness, and with interface dielectric material that differ from one another in composition or thickness. The described replacement gate process enables construction so that neither of the p-channel or n-channel transistor gate structures includes the metal gate material from the other transistor, thus facilitating reliable filling of the gate structures with fill metal. | 2014-10-23 |
20140315362 | CMOS Transistor With Dual High-k Gate Dielectric - A CMOS device with transistors having different gate dielectric materials and a method of manufacture thereof. A CMOS device is formed on a workpiece having a first region and a second region. A first gate dielectric material is deposited over the second region. A first gate material is deposited over the first gate dielectric material. A second gate dielectric material comprising a different material than the first gate dielectric material is deposited over the first region of the workpiece. A second gate material is deposited over the second gate dielectric material. The first gate material, the first gate dielectric material, the second gate material, and the second gate dielectric material are then patterned to form a CMOS device having a symmetric V | 2014-10-23 |
20140315363 | 6T SRAM Architecture For Gate-All-Around Nanowire Devices - A memory device includes a first plurality of semiconductor nanowires tethered between landing pads and suspended over a substrate. A first gate electrode surrounds each of the first plurality of semiconductor nanowires, making them gate-all-around, (GAA) semiconductor nanowires. First, second, and third field effect transistors (FETs) are formed by the first plurality of semiconductor nanowires. The memory device also includes a second plurality of semiconductor nanowires tethered between landing pads and suspended over the substrate. A second gate electrode surrounds each of the second plurality of semiconductor nanowires, making them GAA semiconductor nanowires. Fourth, fifth, and sixth FETs are formed by the second plurality of semiconductor nanowires. The first gate electrode is aligned with and cross-coupled to a landing pad of the second plurality of semiconductor nanowires, and the second gate electrode is aligned with and cross-coupled to a landing pad of the first plurality of semiconductor nanowires. | 2014-10-23 |
20140315364 | Methods Of Forming A Vertical Transistor - Trenches are formed into semiconductive material. Masking material is formed laterally over at least elevationally inner sidewall portions of the trenches. Conductivity modifying impurity is implanted through bases of the trenches into semiconductive material there-below. Such impurity is diffused into the masking material received laterally over the elevationally inner sidewall portions of the trenches and into semiconductive material received between the trenches below a mid-channel portion. An elevationally inner source/drain is formed in the semiconductive material below the mid-channel portion. The inner source/drain portion includes said semiconductive material between the trenches which has the impurity therein. A conductive line is formed laterally over and electrically coupled to at least one of opposing sides of the inner source/drain. A gate is formed elevationally outward of and spaced from the conductive line and laterally adjacent the mid-channel portion. Other embodiments are disclosed. | 2014-10-23 |
20140315365 | METHOD OF FORMING SEMICONDUCTOR DEVICE - A method of forming a semiconductor device is provided. At least one gate structure including a dummy gate is formed on a substrate. A contact etch stop layer and a dielectric layer are formed to cover the gate structure. A portion of the contact etch stop layer and a portion of the dielectric layer are removed to expose the top of the gate structure. A dry etching process is performed to remove a portion of the dummy gate of the gate structure. A hydrogenation treatment is performed to the surface of the remaining dummy gate. A wet etching process is performed to remove the remaining dummy gate and thereby form a gate trench. | 2014-10-23 |
20140315366 | Semiconductor Device and Method of Making - The present disclosure is related to semiconductor technologies and discloses a semiconductor device and its method of making. In the present disclosure, a transistor's source and drain are led out by concurrently formed metal-semiconductor compound contact regions at the source and drain and metal-semiconductor compounds in vias formed at positions corresponding to the source and drain. Because the metal-semiconductor compound has relatively low resistivity, the resistance of the metal-semiconductor compounds in the vias can be minimized. Also, because the material used to fill the vias and the material forming the source/drain contact regions are both metal-semiconductor compound, contact resistance between the material filling the vias and the metal-semiconductor compound source/drain contact regions can be minimized. Furthermore, because the material filling the vias is metal-semiconductor compound, the conducting material in the vias and dielectric material in the insulator layer can form good interface and have good adhesion properties, and the conducting material would not cause structural damage in the dielectric material. Thus, there is no need to form a barrier layer between the insulator layer and the material filling the vias. | 2014-10-23 |
20140315367 | RINSE LIQUID FOR INSULATING FILM AND METHOD OF RINSING INSULATING FILM - A rinse liquid for an insulation layer, the rinse liquid including a solvent represented by the following Chemical Formula 1: | 2014-10-23 |
20140315368 | PROCESS FOR FORMING A CAPACITOR STRUCTURE WITH RUTILE TITANIUM OXIDE DIELECTRIC FILM - A process of forming a capacitor structure includes providing a substrate. Next, a first electrode is deposited onto the substrate. Later, a water-based ALD process is performed to deposit a transitional amorphous TiO | 2014-10-23 |
20140315369 | Resistive Random Access Memory Cells Having METAL ALLOY Current Limiting layers - Provided are semiconductor devices, such as resistive random access memory (ReRAM) cells, that include current limiting layers formed from alloys of transition metals. Some examples of such alloys include chromium containing alloys that may also include nickel, aluminum, and/or silicon. Other examples include tantalum and/or titanium containing alloys that may also include a combination of silicon and carbon or a combination of aluminum and nitrogen. These current limiting layers may have resistivities of at least about 1 Ohm-cm. This resistivity level is maintained even when the layers are subjected to strong electrical fields and/or high temperature processing. In some embodiments, the breakdown voltage of a current limiting layer is at least about 8V. The high resistivity of the layers allows scaling down the size of the semiconductor devices including these layers while maintaining their performance. | 2014-10-23 |
20140315370 | Full Wafer Processing By Multiple Passes Through A Combinatorial Reactor - Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing. | 2014-10-23 |
20140315371 | METHODS OF FORMING ISOLATION REGIONS FOR BULK FINFET SEMICONDUCTOR DEVICES - One method disclosed herein includes forming a plurality of fin-formation trenches in a semiconductor substrate that define a plurality of spaced-apart fins, forming a patterned liner layer that covers a portion of the substrate positioned between the fins while exposing portions of the substrate positioned laterally outside of the patterned liner layer, and performing at least one etching process on the exposed portions of the substrate through the patterned liner layer to define an isolation trench in the substrate, wherein the isolation trench has a depth that is greater than a depth of the fin-formation trenches. | 2014-10-23 |
20140315372 | WAFER PROCESSING METHOD - A wafer processing method including a wafer supporting step of attaching a front side of a dicing tape formed of synthetic resin to a back side of a wafer and supporting a peripheral portion of the dicing tape to an annular frame, a dicing tape heating step of heating a back side of the dicing tape attached to the wafer to soften the dicing tape, thereby flattening the back side of the dicing tape, and a modified layer forming step of applying a laser beam having a transmission wavelength to the wafer through the dicing tape from the back side thereof along the division lines in the condition where the focal point of the laser beam is set inside the wafer, thereby forming a modified layer inside the wafer along each division line. | 2014-10-23 |
20140315373 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A method for manufacturing a silicon carbide substrate 10 has the following steps. A silicon carbide single crystal substrate | 2014-10-23 |
20140315374 | Selective Epitaxial Growth of Semiconductor Materials with Reduced Defects - A semiconductor device includes a substrate formed of a first semiconductor material; two insulators on the substrate; and a semiconductor region having a portion between the two insulators and over the substrate. The semiconductor region has a bottom surface contacting the substrate and having sloped sidewalls. The semiconductor region is formed of a second semiconductor material different from the first semiconductor material. | 2014-10-23 |
20140315375 | SUBSTRATE PROCESSING APPARATUS INCLUDING EXHAUST PORTS AND SUBSTRATE PROCESSING METHOD - Provided is a substrate processing apparatus. The substrate processing apparatus in which processes with respect to substrates are performed includes a lower chamber having an opened upper side, the lower chamber including a passage allowing the substrates to pass therethrough in a side thereof, an external reaction tube closing the opened upper side of the lower chamber to provide a process space in which the processes are performed, a substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position in which the substrates are stacked within the substrate holder and a process position in which the processes with respect to the substrates are performed, at least one supply nozzle disposed along an inner wall of the external reaction tube, the at least one supply nozzle having a supply hole for discharging a reaction gas, at least one exhaust nozzle disposed along the inner wall of the external reaction tube, the at least one exhaust nozzle having an exhaust hole for suctioning an non-reaction gas and byproducts within the process space, and a rear exhaust line connected to the exhaust nozzle to discharge the non-reaction gas and the byproducts which are suctioned through the exhaust hole. The lower chamber includes an exhaust port connecting the exhaust nozzle to the rear exhaust line and an auxiliary exhaust port connecting a stacking space defined within the lower chamber to the rear exhaust line. | 2014-10-23 |
20140315376 | SYSTEM AND METHODS OF EMBEDDING MATERIAL IN A GLASS SUBSTRATE - A method for embedding a dopant into a glass substrate is provided. The method may include the steps of applying the dopant to a surface of the glass substrate, positioning the glass substrate adjacent to a catalyst such that the dopant is intermediate the catalyst and the glass substrate, heating the glass substrate to a first temperature, operating a directed thermal energy source so as to generate thermal energy incident upon the dopant, reducing the temperature of the glass substrate to a second temperature below the first temperature, and holding the glass substrate at the second temperature for at least a period of time. | 2014-10-23 |
20140315377 | WORK FUNCTION ADJUSTMENT WITH THE IMPLANT OF LANTHANIDES - Semiconductor devices and fabrication methods are provided, in which fully silicided gates are provided. A lanthanide series metal is implanted into the gate electrode layer prior to silicidation and diffuses into the gate dielectric during an activation anneal. This process and resultant structure provides adjustment of the gate electrode work function, thereby tuning the threshold voltage of the resulting transistor. | 2014-10-23 |
20140315378 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING - A nonvolatile semiconductor memory device includes a first insulating layer on a semiconductor layer, a charge storage layer on the first insulating layer, a second insulating layer on the charge storage layer, and a control gate electrode on the second insulating layer. The charge storage layer includes a floating gate layer on the first insulating layer, an interface insulating layer on the floating gate layer, and a charge trap layer on the interface insulating layer, and a lower end of a conduction band of the interface insulating layer is higher than a trap level of the charge trap layer and is lower than a lower end of a conduction band of the charge trap layer. | 2014-10-23 |
20140315379 | CONTACT STRUCTURE EMPLOYING A SELF-ALIGNED GATE CAP - After formation of a replacement gate structure, a template dielectric layer employed to pattern the replacement gate structure is removed. After deposition of a dielectric liner, a first dielectric material layer is deposited by an anisotropic deposition and an isotropic etchback. A second dielectric material layer is deposited and planarized employing the first dielectric material portion as a stopping structure. The first dielectric material portion is removed selective to the second dielectric material layer, and is replaced with gate cap dielectric material portion including at least one dielectric material different from the materials of the dielectric material layers. A contact via hole extending to a source/drain region is formed employing the gate cap dielectric material portion as an etch stop structure. A contact via structure is spaced from the replacement gate structure at least by remaining portions of the gate cap dielectric material portion. | 2014-10-23 |
20140315380 | TRENCH PATTERNING WITH BLOCK FIRST SIDEWALL IMAGE TRANSFER - A method including forming a tetra-layer hardmask above a substrate, the tetra-layer hardmask including a second hardmask layer above a first hardmask layer; removing a portion of the second hardmask layer of the tetra-layer hardmask within a pattern region of a structure comprising the substrate and the tetra-layer hardmask; forming a set of sidewall spacers above the tetra-layer hardmask to define a device pattern; and transferring a portion of the device pattern into the substrate and within the pattern region of the structure. | 2014-10-23 |
20140315381 | INTERCONNECT FABRICATION AT AN INTEGRATED SEMICONDUCTOR PROCESSING STATION - A stand-alone processing station of a semiconductor manufacturing system may be configured to fabricate interconnects on a semiconductor wafer. The stand-alone processing station may include a chemical mechanical polishing (CMP) module and an electro-chemical deposition (ECD) module. The CMP module may be configured to receive a semiconductor wafer from another processing station and selectively remove a first top layer from the received semiconductor wafer. The ECD module may be configured to receive a semiconductor wafer from the CMP module and fill interconnect features with metal. The CMP module may also be configured to receive a semiconductor wafer from the ECD module and selectively remove excess metal and a second top layer from the semiconductor wafer. Methods of forming an interconnect on a semiconductor wafer are also provided, as are other aspects. | 2014-10-23 |
20140315382 | Interconnection Wires of Semiconductor Devices - A method of forming a semiconductor device includes forming a plurality of substantially equal-spaced first spacers having a first pitch over a substrate and forming first metal interconnecting wires utilizing the first spacers. The method also includes forming a plurality of substantially equal-spaced second spacers in such a way to abut, respectively, the plurality of first metal interconnecting wires and define a plurality of substantially equal-spaced trenches. A plurality of second metal interconnecting wires are disposed, respectively, within the trenches and the second spacers are removed, thereby defining a plurality of substantially equal-spaced channels. | 2014-10-23 |
20140315383 | METHODS OF MAKING INTEGRATED CIRCUITS - A method of making an integrated circuit including forming a seal ring structure around a circuit where the seal ring structure has a first portion and a tilted portion. The first portion of the seal ring structure is substantially parallel with an edge of the circuit. The tilted portion of the seal ring structure forms an obtuse angle with the first portion. The method further includes forming a first pad which is electrically coupled with the seal ring structure. The method further includes disposing a leakage current test structure in an area enclosed by the seal ring where at least one portion of the leakage current test structure is substantially parallel with the tilted portion of the seal ring structure. The method further includes forming a second pad which is electrically coupled with the leakage current test structure. | 2014-10-23 |
20140315384 | METHOD OF PROCESSING A DEVICE SUBSTRATE - Methods of processing a device substrate are disclosed herein. In one embodiment, a method of processing a device substrate can include bonding a first surface of a device substrate to a carrier with a polymeric material. The device substrate may have a plurality of first openings extending from the first surface towards a second surface of the device substrate opposite from the first surface. Then, material can be removed at the second surface of the device substrate, wherein at least some of the first openings communicate with the second surface at least one of before or after performing the removal of the material. Then, at least a portion of the polymeric material disposed between the first surface and the carrier substrate can be exposed to a substance through at least some first openings to debond the device substrate from the carrier substrate. | 2014-10-23 |
20140315385 | METHOD OF FORMING A DIELECTRIC FILM - A method for flowable oxide deposition is provided. An oxygen source gas is increased as a function of time or film depth to change the flowable oxide properties such that the deposited film is optimized for gap fill near a substrate surface where high aspect ratio shapes are present. The oxygen gas flow rate increases as the film depth increases, such that the deposited film is optimized for planarization quality at the upper regions of the deposited film. | 2014-10-23 |
20140315386 | Metal Compound Coated Colloidal Particles Process for Making and Use Therefor - Solid metal compound coated colloidal particles are made through a process by coating metal compounds onto colloidal particle surfaces. More specifically, metal compound precursors react with the base solution to form solid metal compounds. The solid metal compounds are deposited onto the colloidal particle surfaces through bonding. Excess ions are removed by ultrafiltration to obtain the stable metal compound coated colloidal particle solutions. Chemical mechanical polishing (CMP) polishing compositions using the metal compound coated colloidal particles prepared by the process as the solid state catalyst, or as both catalyst and abrasive, provide uniform removal profiles across the whole wafer. | 2014-10-23 |
20140315388 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes forming a second insulating layer over a first insulating layer, forming a mask over the second insulating layer, after the forming the mask, a first etching of the second insulating layer which is not covered by the mask, and after the first etching, a second etching of the second insulating layer and the first insulating layer which are not covered by the mask. At the first etching, the second insulating layer left over the first insulating layer and the first insulating layer is not exposed. At the second etching, the left over second insulating layer and the first insulating layer are etched. The first insulating layer has a lower dielectric constant than the second insulating layer. A second etching condition of the second etching includes a larger flow rate of oxygen than a first etching condition of the first etching. | 2014-10-23 |
20140315389 | CRACK CONTROL FOR SUBSTRATE SEPARATION - A method for separating a layer for transfer includes forming a crack guiding layer on a substrate and forming a device layer on the crack-guiding layer. The crack guiding layer is weakened by exposing the crack-guiding layer to a gas which reduces adherence at interfaces adjacent to the crack guiding layer. A stress inducing layer is formed on the device layer to assist in initiating a crack through the crack guiding layer and/or the interfaces. The device layer is removed from the substrate by propagating the crack. | 2014-10-23 |
20140315390 | GRAPHO-EPITAXY DSA PROCESS WITH DIMENSION CONTROL OF TEMPLATE PATTERN - A method for defining a template for directed self-assembly (DSA) materials includes patterning a resist on a stack including an ARC and a mask formed over a hydrophilic layer. A pattern is formed by etching the ARC and the mask to form template lines which are trimmed to less than a minimum feature size (L). Hydrophobic spacers are formed on the template lines and include a fractional width of L. A neutral brush layer is grafted to the hydrophilic layer. A DSA material is deposited between the spacers and annealed to form material domains in a form of alternating lines of a first and a second material wherein the first material in contact with the spacers includes a width less than a width of the lines. A metal is added to the domains forming an etch resistant second material. The first material and the spacers are removed to form a DSA template pattern. | 2014-10-23 |
20140315391 | Method of Manufacturing a Semiconductor Device Including a Stress Relief Layer - A method of manufacturing a semiconductor device includes providing a layered structure having a hard dielectric layer containing a first dielectric material having a Young's modulus greater than 10 GPa in a central portion of a main surface of a main body comprising a single crystalline semiconductor body, and providing a dielectric stress relief layer containing a second dielectric material having a lower Young's modulus than the first dielectric material, the stress relief layer covering the layered structure and extending beyond an outer edge of the layered structure. | 2014-10-23 |
20140315392 | COLD SPRAY BARRIER COATED COMPONENT OF A PLASMA PROCESSING CHAMBER AND METHOD OF MANUFACTURE THEREOF - A cold spray barrier coated component of a semiconductor plasma processing chamber comprises a substrate having at least one metal surface wherein a portion of the metal surface is configured to form an electrical contact. A cold spray barrier coating is formed from a thermally and electrically conductive material on at least the metal surface configured to form the electrical contact of the substrate. Further, the cold spray barrier coating may also be located on a plasma exposed and/or process gas exposed surface of the component. | 2014-10-23 |
20140315393 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM - A method of manufacturing a semiconductor device includes: pre-treating a surface of a substrate by supplying an oxygen-containing gas and a hydrogen-containing gas to the substrate heated in a process chamber under a pressure less than atmospheric pressure; and forming a film on the pre-treated substrate by performing a cycle a predetermined number of times. The cycle includes: supplying a precursor gas to the substrate in the process chamber; and supplying a reaction gas to the substrate in the process chamber. | 2014-10-23 |
20140315394 | PROCESS FOR SMOOTHING A SURFACE VIA HEAT TREATMENT - The process for smoothing a rough surface of a first substrate made of a semiconductor alloy based on at least two elements chosen from Ga, As, Al, In, P and N is implemented by placing a second substrate facing the first substrate so that the rough surface is placed facing a surface of the second substrate. The first and second substrates are separated by a distance d of at least 10 μm, the facing portions of the two substrates defining a confinement space. The first substrate is then heated so as to partially desorb one of the elements of said alloy and to reach the saturated vapor pressure of this element in the confinement space and to obtain a surface atom mobility that is sufficient to reduce the roughness of the rough surface. | 2014-10-23 |
20140315395 | CONNECTOR ASSEMBLY AND ELECTRONIC DEVICE THEREWITH - The present invention discloses a connector assembly includes a connector and a plug. The connector is disposed on the circuit board and includes an insulating socket with a slot. The slot includes an inner first end and an outer second end, and an inner diameter of the second end of the slot is greater than an inner diameter of the first end of the slot. The plug is connected to an end of a power cable for plugging into the connector. The plug includes an insulating portion and a plug portion exposed outside the insulating portion. The plug portion includes a first end which is close to the insulating portion and a second end which is far way from the insulating portion, and an outer diameter of the first end of the plug portion is greater than an outer diameter of the second end of the plug portion. | 2014-10-23 |
20140315396 | CONNECTOR WITH AIR EXTRACTION - An electrical connector a semiconductor processing tool is provided. The electrical connector comprises a male connector part having pins and a first holder in which the pins are mounted and a female connector part having sockets and a second holder in which the sockets are mounted. The male connector part is configured to mate with the female connector part, and at least one of the male connector part and the female connector part has an air extraction conduit of which one end communicates with a vacuum pump and the other end communicates with a space formed between the male connector part and the female connector part. | 2014-10-23 |
20140315397 | Electrical connector for connecting a daughterboard to a motherboard - The present invention relates to an electrical connector ( | 2014-10-23 |
20140315398 | PCB connector - The invention relates to a PCB connector for fastening a first printed circuit board on a second printed circuit board. The PCB connector may have a longitudinal base body with a clamping and fastening device for tool-free fastening of the PCB connector on a printed circuit board. The clamping and fastening device has a put-through body and a spring body which is formed extendable upon putting-through the put-through body through the land. The base body is thus pressed against the printed circuit board by the spring body. | 2014-10-23 |
20140315399 | ASSEMBLY COMPRISING AN ADAPTER AND A SMART CARD - In an assembly including an adapter and a smart card, the outer dimensions of the adapter are compliant with the 3FF microcircuit card format, the format further defining the positioning and minimum dimensions of contact areas; the smart card includes a plurality of contact surfaces, the dimensions of which are greater than those defined by the 3FF format for the contact areas, the outer dimensions of the card being smaller than those of the 3FF format; and the adapter includes a recess, the outline of which is defined by a plurality of arms that surround the recess, the recess being shaped so as to receive the smart card so the contact areas of the adapter fit inside the contact surfaces of the smart card, each of the contact areas being off-center relative to each of the contact surfaces, so each arm has a width of 700 micrometers, ensuring mechanical stability. | 2014-10-23 |
20140315400 | ELECTRICAL CONNECTOR AND ELECTRICAL CONNECTOR ASSEMBLY USED THEREOF - An electrical connector assembly includes an electrical connector ( | 2014-10-23 |
20140315401 | Bus Bar Arrangement And A Shroud For The Same - A bus bar arrangement for electrical equipment has at least one bus bar and a shroud. The shroud provides a fault free interface for personnel working with the electrical equipment. First and second shrouds mounted on opposing ends of the at least one bus bar surround a substantial portion of the at least one bus bar. The shroud provides a connection surface for the connection of a wide variety of circuit breakers thereon. The shroud provides protection against intruding objects and ease of connection between circuit breaker contacts and bus bar assemblies of electrical equipment. | 2014-10-23 |
20140315402 | Insert for Filling Grounding Contact in Standard 3-Prong Electrical Receptacle - A plastic formed insert or peg is provided to block the ground connection aperture of a standard 3-prong electrical receptacle to render the receptacle usable only as a 2-prong receptacle to cure faulty or missing ground connections for the receptacle. | 2014-10-23 |
20140315403 | ELECTRICAL CARD CONNECTOR WITH IMPROVED METAL SHELL - An electrical card connector comprises an insulative housing, a plurality of contacts mounted to the insulative housing and a cover covering the insulative housing. The insulative housing defines a receiving space and a mounting wall in a rear of the receiving space. The contact has a contacting portion extending into the receiving space and a retaining portion retained to the mounting wall. The cover has a top wall covering a top of the receiving space. The contacts include a grounding contact, the top wall has an elastic finger extending therefrom and touching the grounding contact to achieve grounding. By this arrangement, the electrical card connector has an additional grounding path, and improves the performance of the electrical card connector. | 2014-10-23 |
20140315404 | LOW PROFILE CONNECTOR - An electrical connector comprises an insulative unit, a shielding shell, a plurality of terminals and a card ejecting mechanism. The card ejecting mechanism comprises a shaft member, a lever member and a push rod. The shaft member has a base portion fixed to the insulative unit and a shaft portion extending from the base portion and protruding from the insulative unit. The lever member has an operating portion, a pushing portion and a shaft hole positioned between the operating portion and the pushing portion. The shaft hole receives the shaft portion therein and the lever member can rotate about the shaft portion between two positions. The push rod is provided correspondingly to the operating portion and slides under pushing from an external force to push the operating portion, so as to allow the lever member to rotate from the receiving position to the pushing position. | 2014-10-23 |
20140315405 | ELECTRICAL CONNECTOR WITH DTECT PINS - An electrical connector comprises an insulative housing, a metallic shell surround the insulative housing, a plurality of contacts and two detect modules retained to the metallic shell. The insulative housing is formed with a base and a tongue extending forwardly from the base. The shell and the insulative housing define a receiving cavity therebetween. The detect module have a detect pin, respectively, the detect pins extend into the receiving cavity through the shell and electrically connecting with each other via a shell of a mating plug. | 2014-10-23 |
20140315406 | Combination RJ Connector and Flash Card Connector - A combination connector includes a number of walls defining a housing and a female RJ connector and a female flash card connector inside the housing. Contact pins extend from contacts of the female RJ connector and contacts of the female flash card connector through at least one wall of the housing for connection to a PCB. The walls include electromagnetic interference (EMI) shielding. | 2014-10-23 |
20140315407 | ADAPTER CONVERTING CFL BASE TO MEDIUM BASE OR OTHER SOCKETS MADE IN THE LIGHTING/ELECTRICAL INDUSTRIES - The present invention is an adapter with a first section having a base with standard compact fluorescent lamp (CFL) bi/quad pins formed thereon. A second section of the adapter has a socket for receiving an incandescent bulb, an LED bulb or other types of base sockets. The socket has a vertical telescoping section to allow the bulb to move relative to the base. A second embodiment of the invention has the socket positioned at a 90 degree angle relative to the base, and further having a knuckle and a horizontal telescoping section allowing the bulb to be repositioned when the adapter is used in recess housing. Additional embodiments utilize an electric pigtail in communication with the base to mount to a variety of lighting fixtures. | 2014-10-23 |
20140315408 | STANDARD ANTENNA INTERFACE - An RF interconnection module includes a housing having a perimeter, a capacitive coupling, and a float gasket disposed about the perimeter of the housing. When the housing is mounted in an opening, the float gasket is positioned between the housing and the opening. The float gasket may be made of an elastomer material and may include a plurality of outwardly extending ribs for movable securing the gasket in the opening. In addition, a mount assembly includes a bracket assembly attachable to a tower-mounted equipment and at least one jumper cable having at least one ohmic connector for connecting to the tower-mounted equipment and at least one capacitive connector. The capacitive connector may comprise an RF interconnection module mounted on the bracket assembly. The bracket assembly may be adjustable to accommodate tower mounted equipment of various sizes. | 2014-10-23 |
20140315409 | LEVER-TYPE CONNECTOR - A lever-type connector has a housing ( | 2014-10-23 |
20140315410 | JOINT CONNECTOR AND ASSEMBLING METHOD THEREOF - A joint connector and an assembling method are provided for simultaneously achieving waterproofing and double locking. A ground joint connector ( | 2014-10-23 |
20140315411 | INSULATING SHEATH FOR RETAINING CONTACTS IN AN ELECTRICAL CONNECTOR AND RELATED ASSEMBLY METHOD - An electrically insulating sheath for retaining electrical contacts in an electrical connector, the insulating sheath including an electrically non-conductive housing with a chamber defined therein. The chamber includes a pair of contact-receiving channels extending in an axial direction, each of the contact-receiving channels including a collar pocket for retaining the electrical contacts when inserted in the sheath. A dividing wall separates the contact-receiving channels from one another to reduce interference and crosstalk among the wires of the electrical contacts. The sheath includes a cover connected to the housing, the cover extending over at least a portion of the chamber. | 2014-10-23 |
20140315412 | Electric Cable Plug Connecting Device and Method - A plug adaptor device and method for using the same, the device including anchor and clip components for attachment with electric cable plugs and/or wall (or floor) sockets or socket faceplates. Corresponding anchor and clip components are separately attachable to electric cable plugs or sockets and used to secure plug to plug or plug to socket connections. The components are engaged by sliding the toe portion of the clip over the anchor so that a claw protrusion fits snugly behind the inside edge of the anchor thus preventing the connected plugs (or plug and socket) from being accidentally disconnected. When engaged, the plug adaptor device provides enough resistance to an opposing pulling force to prevent accidental disconnections allowing disconnection with application of a reasonable amount of pulling force in emergency situations. | 2014-10-23 |
20140315413 | WATERPROOF ELECTRICAL CONNECTOR AND METHOD FOR MAKING THE SAME - A waterproof electrical connector ( | 2014-10-23 |
20140315414 | PLUG TOOL FOR PLUGGING OR UNPLUGGING CONNECTOR - A plug tool for plugging or unplugging a connector includes a first operation member and a second operation member. The connector includes a plug, a resilient latching piece, and a cable. The first operation member includes a fastening shell receiving the plug and a sleeve extending out from the fastening shell receiving the cable of the connector. The second operation member is rotatably connected to the sleeve. The second operation member includes a pressing portion for pressing the latching piece of the connector toward the plug. | 2014-10-23 |
20140315415 | ELECTRICAL CONNECTOR MODULE - An electrical connector module, includes a first connecting part and a second connecting part. The first connecting part includes a main body and a pair of protrusion portions. The second connecting part includes a base seat, a receiving portion on the base body; and a pair of latching assemblies. The latching assembly includes a pair of first blocking members, a pair of second blocking members and a latching member. The latching member is located between the pair of first blocking members and the pair of second blocking members. The latching member includes a base body, a latching portion protruding from the base body, and a pair of cam portions on the base body, each cam portion is rotatably retained between one first blocking member and one second blocking member. | 2014-10-23 |
20140315416 | ELECTRICAL CONNECTOR - An electrical connector includes a lock claw and a latch claw. The latch claw is provided at a nearer side than the lock claw in a fitting direction where a connector fitting portion is fitted to a power receiving connector and is provided with the lock claw along the fitting direction. | 2014-10-23 |
20140315417 | TERMINAL STRUCTURE - A terminal structure to be locked to a terminal locking lance which is provided in a cavity of a connector housing, includes: a box part formed in a shape of a rectangular tube, including an outer bottom plate, outer side walls, an upper plate, an inner bottom plate formed inside the outer bottom plate, and an inner side wall formed inside one of the outer side walls, the box part including a contact to be in contact with a male terminal tab adapted to be inserted into the box part; and a locking protrusion including: a locking plate extended from an end of the outer side wall so as to be in parallel with the upper plate above the upper plate and adapted to be in contact with the terminal locking lance; and a stamped-out part in contact with the upper plate. | 2014-10-23 |
20140315418 | ADAPTER AND ELECTRICAL CONNECTION SYSTEM - An electrical connection system includes an electrical connector electrically connected to a chip module, and an adapter disposed on one side of the electrical connector. The chip module laterally extends to form a conducting portion. Two rows of terminals are disposed in the adapter, and form a slot therebetween for the conducting portion to be inserted therein. When the conducting portion is not inserted in the slot, the width of the slot is greater than the thickness of the conducting portion, so that a zero insertion force is required for insertion of the chip module. After the chip module is inserted in the slot, under the effect of an external force, the width of the slot is reduced to an extent that the terminals urge against the conducting portion, which ensures close electrical connection between the terminals and the chip module. | 2014-10-23 |
20140315419 | SUBSTRATE CONNECTION STRUCTURE USING SUBSTRATE CONNECTOR - Provided is a substrate connection structure using a substrate connector capable of: ensuring a sufficient distance for adjusting positional misalignment even when the size and height of the substrate connector are reduced; preventing connector breakdown during the connecting operation thereof; and visually checking the connection thereof. A guide protrusion is provided at a mate-side end face of a guided portion so as to protrude farther beyond a mate-side substrate mounting surface when the plug is fitted into the socket. A first-side guide face is formed in an edge portion of an opening in a guide groove and the guide protrusion is provided with a second-side guide face slidable with the first-side guide face so as to lead the guided portion into the guide groove. Also, interference between the guide protrusion and the mate-side substrate is prevented from occurring. | 2014-10-23 |
20140315420 | Plug for a data and/or telecommunication cable comprising several conductors - A plug-in terminal for a data or telecommunication cable comprising terminal elements for connecting at least one electrical or optical conductor, further comprising connecting elements for connecting the electrical or optical conductor(s) with an electronic device, wherein the plug-in terminal comprises a storage for data and a means for reading out and/or archiving data in the storage by means of the electronic device, and a method of use thereof. | 2014-10-23 |
20140315421 | WATERPROOF ELECTRICAL CONNECTOR AND METHOD FOR MAKING THE SAME - A waterproof electrical connector ( | 2014-10-23 |
20140315422 | FRAME GROUND CONNECTION - An electronic device including a frame having a front frame wall and a front panel assembly. The front frame wall is grounded and is parallel to the front panel assembly (FPA). The front panel assembly has a printed circuit board (PCB) on an interior side of it and PCB includes a ground contact. A detachable ground clip is attached to the front frame wall and has a protruding flexible arm that is configured to engage the ground contact of the PCB when the FPA is positioned for assembly. The central contact portion contacts or engages the ground contact on the PCB, and includes a visual indicator means integrated into the distal end and the front frame wall such that an observer looking at the interior side of the front frame wall can visually confirmed the central contact engagement with the ground contact of the printed circuit board. | 2014-10-23 |
20140315423 | MOUNTED POWER CORD - A ceiling mounted extension cord that can be disposed in and HVAC diffuser and can be displaced from a ceiling mounted position to a deployed position for use. The extension cord can also be retracted upwardly adjacent the ceiling. The displacement of the cord may be by remote control. | 2014-10-23 |
20140315424 | WATERPROOF SIMPLEX RECEPTACLE WITH ADDITIONAL WATERSHEDDING - A liquid spill resistant electrical receptacle includes a main body and a front portion. The front portion includes a front surface and rear surface. Terminals are recessed rearwardly from openings formed in the front surface, and are connected to wires extending rearwardly from the main body. The front surface includes a first surface portion, in the vicinity of the openings, which is positioned forwardly from a second surface portion that is located generally outboard of the first surface portion. Optionally, the first surface portion may be in the form of outwardly-extending ridges around the terminal openings, and configured to direct water or other liquids away from the terminal openings associated with the terminals. | 2014-10-23 |
20140315425 | Subsea High Voltage Terminal Assembly - A system and method are provided for a terminal assembly of a subsea motor-compressor. The terminal assembly may include a plurality of terminal ports extending through a hollow spherical body to a cavity defined therein. The terminal assembly may also include a penetrator detachably coupled with the spherical body about each of the plurality of terminal ports. The terminal assembly may further include a mounting port extending through the spherical body to the cavity defined therein. The mounting port may be configured to couple the terminal assembly with a housing of the motor-compressor. | 2014-10-23 |
20140315426 | VEHICLE-SIDE CONNECTOR - A vehicle-side connector ( | 2014-10-23 |
20140315427 | COAXIAL CONNECTOR WITH SWITCH - Provided is a switch attached coaxial connector that improves an isolation characteristic between a common terminal and a closed terminal. In a normal state where a coaxial plug is not connected to the switch attached coaxial connector, a movable contact portion biased by a leaf spring piece portion elastically contacts a fixed contact piece portion so that a closed terminal and a common terminal are electrically connected to each other. When the coaxial plug is connected to the switch attached coaxial connector, the movable contact portion moves rearward from the fixed contact piece portion by the plug pin abutting against a plug contact portion so that the contact with respect to the fixed contact piece portion is disconnected and the electrical connection of the common terminal is switched from the closed terminal to the plug pin. | 2014-10-23 |
20140315428 | RFI INGRESS REDUCTION COAXIAL CABLE CONNECTOR - A coaxial connector including a selectively engageable radio frequency interference shield. | 2014-10-23 |
20140315429 | CONNECTOR PRODUCING A BIASING FORCE - A connector includes, in one embodiment, a first component, a coupling element configured to engage the first component, and a second component configured to engage the first component. The second component, in one embodiment, is configured to produce a spring, pushing or biasing force. | 2014-10-23 |
20140315430 | COAXIAL CONNECTOR HAVING A SPRING WITH TINES FOR ENGAGING A MATING CONNECTOR - A male coaxial cable connector includes a spring with tines and a fastener wherein the spring is housed by the fastener and the spring tines are arranged to provide a spring mouth for receiving a mating connector. | 2014-10-23 |
20140315431 | Combination USB Connector and MicroSD Flash Card Connector - A combination female USB connector and female MicroSD flash card connector include walls defining a housing in which a female USB connector and a female MicroSD flash card connector are disposed. Contact pins extend from contacts of the female USB connector and contacts of the female MicroSD flash card connector through at least one wall of the housing for connection to a printed circuit board. The walls include electromagnetic interference (EMI) shielding. | 2014-10-23 |
20140315432 | LOW PROFILE CONNECTOR - An electrical connector comprises a housing having a front side and a rear side, a cage and a detection switch. The cage is engaged with the housing, the cage and the housing together define a slot, and an entrance of the slot is adjacent to the front side so as to allow an electronic card to enter into the slot along a card insertion direction. The detection switch is provided to the housing and comprises a first resilient terminal and a second resilient terminal. The second end portion is further adjacent to the front side relative and when the electronic card is received in the slot, the first resilient arm portion is separated from the second end portion. | 2014-10-23 |
20140315433 | LOW PROFILE CONNECTOR - An electrical connector comprises a housing, a cage and a switch unit. The housing has a base and a side wall connected to a side edge of the base. The side wall extends along a card insertion direction and has an end face. The cage is engaged with the housing, the cage and the housing together define a slot, and an entrance of the slot is adjacent to the end face. The switch unit is provided to the side wall. The side wall further has a mounting space receiving the switch unit and a through-hole extending from the end face of the side wall and extending into the mounting space along the card insertion direction, a pin-like element can be inserted into the through-hole to enable the switch unit. | 2014-10-23 |
20140315434 | ELECTRICAL CONNECTORS HAVING OPEN-ENDED CONDUCTORS - Electrical connector including a plurality of mating conductors. Each of the mating conductors extends between an engagement portion and an interior portion. The engagement portions of the mating conductors are configured to engage contacts of the mating connector. The engagement portions are located proximate to one another at a first nodal region. The interior portions are located proximate to one another at a second nodal region. The electrical connector also includes a first open-ended conductor electrically connected to the engagement portion of a first mating conductor of the plurality of mating conductors and extending from the first nodal region. The electrical connector also includes a second open-ended conductor electrically connected to the interior portion of a second mating conductor of the plurality of mating conductors and extending from the second nodal region. The first open-ended conductor is capacitively coupled to the second open-ended conductor. | 2014-10-23 |
20140315435 | MULTI-CHIP SOCKET - A multi-chip socket includes a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip. A second cavity has a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip. The first support surface is in a first plane, and the second support surface is in a second plane, where the first plane is angled with respect to the second plane. | 2014-10-23 |
20140315436 | COMMUNICATION CONNECTORS HAVING SWITCHABLE ELECTRICAL PERFORMANCE CHARACTERISTICS - A connector configured to operate in two different electrical performance modes. The connector may include a plurality of connector contacts, a plurality of contact pads, and an insulator having an insulating portion adjacent the plurality of contact pads. The insulator is movable between an insulating position and a non-insulating position. When the insulator is in the insulating position, the insulating portion insulates the plurality of contact pads from the plurality of connector contacts and the connector operates in a first one of the electrical performance modes. When the insulator is in the non-insulating position, the plurality of connector contacts contact the plurality of contact pads and the connector operates in a different second one of the electrical performance modes. The connector may be implemented as a plug or an outlet. | 2014-10-23 |
20140315437 | LOW PROFILE CONNECTOR - An electrical connector is used to mount to a circuit board. The electrical connector comprises a housing having a spacer, a cage and a terminal block. The cage is engaged with the housing, the cage and the housing together are provided on the circuit board and the spacer is spaced apart from the circuit board, so as to together define a first slot positioned above the spacer and a receiving space positioned under the spacer and is adjacent to the circuit board. The terminal block comprises an insulative plate positioned in the receiving space and the insulative plate is parallel to and spaced apart from the spacer so as to in turn form a second slot in the receiving space. | 2014-10-23 |
20140315438 | INTERFACE CONNECTOR - An interface connector includes a housing, a plurality of contacts, and a square tube shaped shell. The housing integrally forms a header portion and a frame portion. The plurality of contacts is arranged in parallel on one face of the header portion, the shell is attached so as to cover an outer face of the housing. The shell includes a highly solderable layer formed on an inner face and an outer face including a plate-thickness face thereof, a pair of locking strips soldered to the printed circuit board, and an opening portion that is exposed outward and through which a counterpart housing is inserted and extracted, the opening portion including an end part (a plate-thickness face) of the opening portion which is turned black by laser irradiation. | 2014-10-23 |
20140315439 | ELECTRICAL CONNECTOR WITH HIGH RELIABILITY - An electrical connector ( | 2014-10-23 |
20140315440 | ELECTRICAL CONNECTOR HAVING IMPROVED CHARACTERISTIC IMPEDANCE - An electrical connector ( | 2014-10-23 |
20140315441 | BATTERY WIRING MODULE - A battery wiring module may include a connecting member and a resin protector. The connecting member may be connected to an electrode terminal, and the connecting member may include a beveled corner. The resin protector may be made of insulating resin and include a holding portion and a coming-off preventing projection. The holding portion may hold the connecting member and may be provided with a surrounding wall that surrounds a peripheral edge of the connecting member. The coming-off preventing projection may include an elastic piece disposed cover the beveled corner of the connecting member and thereby limit movement of the connecting member. | 2014-10-23 |
20140315442 | LOWER PROFILE CARD EDGE CONNECTOR - A card edge connector is used for connecting an electronic card to a printed circuit board and includes an insulative housing and a plurality of conductive terminals retained in the insulative housing. The insulative housing defines a front face, a mounting surface and a receiving slot running through the front face and extending along a longitudinal direction with a key disposed therein. Each conductive terminals defines a contacting arm extending into the receiving slot along a mating direction perpendicular to the longitudinal direction and a soldering portion extending outside of the insulative housing. Each contacting arm defines a free end portion located in the receiving slot and with a contacting portion disposed thereon, the thickness of the free end portion in a vertical direction perpendicular to both the longitudinal direction and the mating direction is smaller than the thickness of other parts of the contacting arm. | 2014-10-23 |
20140315443 | SOCKET - A socket includes a casing, a circuit board, a first connector, and a second connector. The casing has a first jack and a second jack. The circuit board is disposed in the casing. The first and second connectors are disposed on the circuit board. The first connector has a first slot corresponding in position to the first jack. The external plug is moved along a first extension line and inserted into the first slot. The second connector has a second slot corresponding in position to the second jack. The external plug is moved along a second extension line and inserted into the second slot. The first and second extension lines are not parallel. With the jacks corresponding in position to the slots, respectively, space required for accommodating external plugs and transmission lines thereof is reduced or properly arranged; hence, the socket is fit for use in layout in crowded places. | 2014-10-23 |
20140315444 | CONNECTOR WITH FPCB PIN MODULE - A connector includes a front seat, an FPCB pin module, an FPCB, a plurality of terminals and a flexible support. The front seat has a socket and a room for receiving the socket. The flexible printed circuit board (FPCB) pin module is received in the room. The FPCB has a fixing portion, a connecting portion bendingly extending from an edge of the fixing portion and a terminal insertion portion extending from another edge of the fixing portion and corresponding to the socket. The terminals pass through and are fixed on the terminal insertion portion. The flexible support is attached on the fixing portion and the connecting portion for supporting the connecting portion. | 2014-10-23 |
20140315445 | SOCKET FOR LED LIGHT STRING - A socket is provided for an LED light string and is formed by jointing two unsymmetrical casing members through thermal fusion by application of ultrasonic wave to thereby securely combine with electrical wires and a luminous element. The first and second casing members are provided with raised-and-recessed inter-engageable structures including holes and protrusions and multiple tiny bosses that is thermally fusible through application of ultrasonic wave for adhesion purposes. The first casing member includes a receiving channel for receiving electrical wires therein and the second casing member includes hold-down blocks and holding blocks for holding the electrical wires in position. | 2014-10-23 |
20140315446 | Electrical Connector - An electrical connector includes an insulating body, a plurality of terminals integrated in the insulating body, a strengthening structure and a shell mounted around the insulating body. The insulating body has a base portion and a tongue portion extending forward from a front face of the base portion. A top face of the tongue portion is concaved downward to form a receiving groove passing through a front end of the tongue portion. The strengthening structure has a base plate and two holding arms which oppositely extend from two opposite side edges of a rear of the base plate. A front edge of the base plate is bent downward to form a protecting eave. The base plate is molded in the receiving groove of the tongue portion and the holding arms are embedded in the base portion. The front end of the tongue portion is wrapped by the protecting eave. | 2014-10-23 |
20140315447 | Sleeve For Shielding Electrical Joint - A splice for use in high voltage electrical environment employing a combination of cold-shrink and interference fit in a single splice component allowing for the use of a shortened core at a first cold splice end and the absence of a cable adapter at the interference fit second end. | 2014-10-23 |
20140315448 | POST ASSEMBLY FOR COAXIAL CABLE CONNECTORS - A post assembly for a coaxial cable connector comprises, in one embodiment, a post configured to be coupled to a conductor of the coaxial cable. The post assembly has a post extender disposed between the post and an interface port, and a spring configured to urge the post extender toward the interface port. | 2014-10-23 |
20140315449 | TERMINAL - A terminal includes an insertion groove for pressing a conductor thereinto disposed between a pair of conductive arm parts, and a slit disposed proximate to the insertion groove. | 2014-10-23 |
20140315450 | BUOYANT APPARATUS SYSTEM - A buoyant apparatus system for use on a user's foot having an outer frame including a foot insert and a plurality of folding flaps. The outer frame is substantially rectangular having a tapered bow end. The outer frame has a bottom surface having a plurality of folding flaps extending downwardly therefrom to increase drag and folding parallel to the bottom surface to decrease drag. A foot insert is integrally coupled to the outer frame at the center for accepting the user's foot therein. A pair of paddle is used to increase propulsion and maintain stability. | 2014-10-23 |
20140315451 | FIXATION RELEASING DEVICE - A fixation releasing device by which a buoyant body and a weight may be securely fixed and the fixed state between the buoyant body and the weight may be readily released, using a simple structure. The fixation releasing device is made from a buoyant body, a weight, and a connection designed to connect the buoyant body and weight. The connection device has a connection structure made from a closed loop member, rotation arms, and connection members. A connection member is engaged with each rotation arm, and rotation of each rotation arm is restrained b the closed loop member, thereby fixing the buoyant body. To release the buoyant body, a trigger mechanism provided at the closed loop member is operated to fusion cut the closed loop member. Then, each rotation arm is rotated, and then the connection member comes out of each rotation arm, thereby releasing the buoyant body. | 2014-10-23 |
20140315452 | MULTI-DIRECTIONAL SIGNAL ASSEMBLY - A multi-directional signal assembly includes a signal display assembly having one or more display surface, and at least one signal indicia affixed to each display surface. The multi-directional display assembly comprises a buoyant construction such that the signal indicia affixed to the display surface(s) are readily visible above the surface of a body of water in which the assembly is deployed. A counterweight assembly is mounted to the signal display assembly to maintain the signal display assembly in a substantially upright, operative orientation when deployed. An illumination assembly comprising one or more illumination member is mounted to the signal display assembly, and is actuated to increase visibility of the signal display assembly while it is deployed n the surface of a body of water. | 2014-10-23 |
20140315453 | Stand-Up Paddle Board and Method of Manufacture - A stand-up paddle board is formed by a core surrounded by a skin. The core is manufactured by creating an upper core member mold and a lower core member mold, corresponding to the top and bottom of the core. The upper core member and lower core member includes a concave surface filled by a lattice-shaped matrix. The core members and the matrices are molded to be complimentary in shape, such that the surface of each matrix and the surrounding upper and lower core members adjoin each other and are connected by an adhesive to create an air-tight core having air-tight matrix chambers. The completed core is then surrounded by a conventional paddle board skin. | 2014-10-23 |
20140315454 | SURFBOARD HAVING INTERCHANGEABLE TAIL EXTENSIONS - A riding board such as a surfboard extending from a tip or front end longitudinally to a tail or rear end. The rear end terminates at a board interface plate that is incorporated into and as part of the riding board. The board interface plate is adapted to be either the tail section of the riding board or alternatively, a coupling means for connecting a tail block to the rear end of the board. The board interface plate includes a plurality of spaced apart coupling cavities that extend inwardly into the riding board body from the rear end. The surfboard may also be used with an interchangeable tail block having a tail faceplate that interfaces and couples with the interface plate on the surfboard. The tail block may be configured to most any desired tail configuration, size and shape. | 2014-10-23 |