43rd week of 2008 patent applcation highlights part 17 |
Patent application number | Title | Published |
20080258278 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging - A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation. | 2008-10-23 |
20080258279 | LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD USING THE SAME - A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins. | 2008-10-23 |
20080258280 | Lead frame, semiconductor device using the lead frame, and methods of manufacturing the same - Provided are a lead frame, semiconductor device, and methods of manufacturing the same. The lead frame may include a die pad having at least three pair of sides parallel with each other, and a plurality of inner leads spaced apart from a circumference of the die pad, arranged in a radial shape with respect to a center of the die pad, and having the ends form inner lead connection surfaces parallel with at least one pair of sides of the die pad. In addition, there may be provided a semiconductor device having the lead frame. Accordingly, a semiconductor chip may be positioned on a die pad. The plurality of inner leads may be electrically connected to the semiconductor chip through wires. The semiconductor device may further include a molding resin for surrounding top and bottom surfaces of the lead frame and filling in an interior thereof. | 2008-10-23 |
20080258281 | Process for Producing and Apparatus for Improving the Bonding Between a Plastic and a Metal - A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands. | 2008-10-23 |
20080258282 | LEAD FRAME FREE PACKAGE AND METHOD OF MAKING - A lead frame free packaged semiconductor device with an exposed heat sink is formed by die bonding the semiconductor device directly to the heat sink and bonding package leads directly to the semiconductor die, and optionally to the heat sink. In an alternative embodiment, a lead frame free packaged semiconductor device with an exposed heat sink is formed by die bonding the semiconductor device directly to the heat sink and wire bonding package leads to the semiconductor die, and optionally to the heat sink. | 2008-10-23 |
20080258283 | WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME - A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as D | 2008-10-23 |
20080258284 | ULTRA-THIN CHIP PACKAGING - A packaging method involves attaching a first chip to a stable base, forming contact pads at locations on the stable base, applying a medium onto the stable base such that it electrically insulates sides of the first chip, forming electrical paths on the medium, attaching a second chip to the first chip to form an assembly, and removing the stable base. A package has at least two chips electrically connected to each other, at least one contact pad, an electrically conductive path extending from the contact pad to a contact point on at least one of the chips, a planarizing medium, and a coating material on top of the planarizing medium. | 2008-10-23 |
20080258285 | Simplified Substrates for Semiconductor Devices in Package-on-Package Products - An insulating sheet-like substrate ( | 2008-10-23 |
20080258286 | High Input/Output, Low Profile Package-On-Package Semiconductor System - A package-on-package system ( | 2008-10-23 |
20080258287 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes: solder balls provided on an upper package; and pads provided on a lower package and directly connected to the solder balls, wherein at least one of the pads serves as a fiducial mark. Further, a shape of at least one of the pads is different from that of other pads and an area of at least one of the pads is substantially equal to that of the other pads. | 2008-10-23 |
20080258288 | Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the same - In a semiconductor device stack package and a method of forming the same, the package comprises: a substrate; a plurality of lower chips stacked on the substrate and having an active surface oriented in a direction toward the substrate; and at least one upper chip disposed on the lower chips and connected to the substrate via a bump disposed between the lower chips. As no wire loops are formed, there is no increase in the height of the stack package, and the electrical path is shortened, thereby improving the electric performance of the stack package. Also, the semiconductor device stack package has a flip chip structure, and thus a plurality of semiconductor chips can be stacked in various manners. | 2008-10-23 |
20080258289 | INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING - An integrated circuit package system comprising: forming an area array substrate; mounting surface conductors on the area array substrate; forming a molded package body on the area array substrate and the surface conductors; providing a step in the molded package body; and exposing a surface conductor by the step. | 2008-10-23 |
20080258290 | Semiconductor device and method for manufacturing the same - A COF which can effectively dissipate the heat by using a simple structure and its manufacturing method. A semiconductor device of COF, which is formed over the main surface of a flexible substrate having no device hole and where a semiconductor chip is mounted over the inner lead interconnection, is characterized by forming a first resin layer over the second main surface of the flexible substrate opposite the side where the semiconductor chip is mounted and at the position corresponding to the semiconductor chip. | 2008-10-23 |
20080258291 | Semiconductor Packaging With Internal Wiring Bus - A packaged semiconductor includes inner bond fingers, at least first and second semiconductor dies, and an interposer. The packaged semiconductor further includes wiring between the first and second semiconductor dies and the inner bond fingers, wiring between the interposer and the inner bond fingers, and wiring between the interposer and the first and second semiconductor dies. The wiring between the interposer and the first and second semiconductor dies thereby reduces the count of inner bond fingers needed for the wiring between the first and second semiconductor dies and the inner bond fingers. The interposer further provides indirect access to the inner bond fingers when the inner bond fingers are inaccessible by the first and second semiconductor dies. | 2008-10-23 |
20080258292 | Macro-cell block and semiconductor device - There have been cases where the wirings are not led out when a semiconductor chip comprising a conventional macro is mounted on a package substrate. | 2008-10-23 |
20080258293 | SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND GROUND SHIELD - The present invention provides a package structure and a method for forming the same. The structure comprises a substrate with contact pads and through holes filled with conducting metals for performing heat dissipation and ground shielding A chip with bonding pads is attached on the contact pad by an adhesive with high thermal conductivity to achieve heat dissipation. A RDL is formed on the substrate and the chip to couple the bonding pad and the contact pad formed on the substrate. The structure of present invention can improve the thickness thereof, and the heat dissipation and ground shielding of the structure are enhanced. Furthermore, the structure can achieve package on package (PoP) structure. | 2008-10-23 |
20080258294 | Heat-dissipating semiconductor package structure and method for manufacturing the same - A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking. | 2008-10-23 |
20080258295 | Self-Contained Cooling Mechanism for Integrated Circuit Using a Reversible Endothermic Chemical Reaction - A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound that reacts endothermically to absorb heat produced by the devices and releases the heat in a reverse reaction to the enclosure. | 2008-10-23 |
20080258296 | Cut-Out Heat Slug for Integrated Circuit Device Packaging - In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate ( | 2008-10-23 |
20080258297 | METHOD OF MAKING SOLDER PAD - A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching operation is performed on the metal layer to form voids in the metal layer. A second etching operation is performed on the metal layer to form the solder pad. A solder mask is formed on the substrate and a portion of the solder pad. | 2008-10-23 |
20080258298 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - Embodiments include a semiconductor device comprising: a pad formed on an insulating layer and having an electric connection region with external components; and a protective insulating layer which has an aperture for exposing the electric connection region. The protective insulating layer may include a first insulating layer and a second insulating layer, and side surfaces of these insulating layers are exposed to the aperture. At least part of the side surfaces surrounding the electric connection region have a tapered configuration at an acute angle to a top surface of the pad. This semiconductor device not only enables reduction of the fabrication steps, but also provides a reliable passivation structure for a pad with sufficient thickness and stress relaxation characteristics. | 2008-10-23 |
20080258299 | Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device - A method of manufacturing a semiconductor device includes forming a diffusion barrier layer on a substrate, and forming at least two features on the substrate such that the diffusion barrier layer is respectively disposed between each feature and the substrate and contacts the at least two features. A first impurity region of the substrate contains impurities of a first type, a second impurity region of the substrate contains impurities of a second type, different from the first type, a first feature of the at least two features is in the first impurity region, and a second feature of the at least two features is in the second impurity region, such that the second feature is electrically isolated from first feature by the different impurity regions. | 2008-10-23 |
20080258300 | WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD - A semiconductor device | 2008-10-23 |
20080258301 | Semiconductor device and manufacturing method of the same - A conventional semiconductor device has a problem that reduction of a connection resistance value between wiring layers is difficult because of an oxide film formed between the wiring layers. In a semiconductor device of this invention, a first metal layer is embeded in opening regions which connect a first wiring layer and a second wiring layer and an opening is formed in a spin coated resin film formed on the first metal layer. In the opening, a Cr layer forming a plating metal layer and a Cu plated layer are connected to each other. With this structure, the spaces among crystal grains in portions in the Cr layer on the first metal layer are wide, which causes the portions to be coarse. In the coarse portions in the Cr layer, an alloy layer formed of the second metal layer and the Cu plated layer is formed, and thus, the connection resistance value is reduced. | 2008-10-23 |
20080258302 | Methods of forming a denuded zone in a semiconductor wafer using rapid laser annealing - Methods for forming a denuded zone in an oxygen-containing semiconductor wafer using rapid laser annealing (RLA) are disclosed. The method includes scanning an intense beam of laser radiation over the surface of the wafer to raise the temperature of each point on the wafer surface to be at or near the wafer's melting temperature for a time period on the order of a millisecond or so. This rapid heating and cooling causes oxygen in the wafer near the wafer surface to diffuse out from the wafer surface. Oxygen in the body of the wafer remains unheated and thus does not diffuse toward the wafer surface. The result is an oxygen-depleted zone—called a “denuded zone”—formed immediately adjacent the wafer surface. The methods further include forming a semiconductor device feature in the denuded zone such as by implanting the wafer with dopants. | 2008-10-23 |
20080258303 | Novel structure for reducing low-k dielectric damage and improving copper EM performance - A semiconductor structure and methods for forming the same are provided. The semiconductor structure includes a dielectric layer; a chemical mechanical polish (CMP) stop layer on the dielectric layer; a conductive wiring in the dielectric layer; and a metal cap over the conductive wiring. | 2008-10-23 |
20080258304 | Semiconductor device having multiple wiring layers - A semiconductor device includes: a substrate; and wiring layers on the substrate. Each wiring layer includes: an interlayer insulation film having a wiring groove with a via hole; a copper wiring in the groove and the hole; an barrier metal layer between an inner wall of the groove with the hole and the copper wiring; and an upper barrier metal layer on the interlayer insulation film and covering an upper surface of the copper wiring. The barrier metal layer prevents a copper component in the copper wiring from diffusing into the interlayer insulation film. The copper wiring of an upper layer is electrically coupled with the copper wiring of a lower layer. The upper barrier metal layer of the lower layer prevents a copper component in the copper wiring of the lower layer from diffusing into the interlayer insulation film of the upper layer. | 2008-10-23 |
20080258305 | Low fabrication cost, fine pitch and high reliability solder bump - A barrier layer is deposited over a layer of passivation including in an opening to a contact pad created in the layer of passivation. A column of three layers of metal is formed overlying the barrier layer and aligned with the contact pad and having a diameter that is about equal to the surface of the contact pad. The three metal layers of the column comprise, in succession when proceeding from the layer that is in contact with the barrier layer, a layer of pillar metal, a layer of under bump metal and a layer of solder metal. The layer of pillar metal is reduced in diameter, the barrier layer is selectively removed from the surface of the layer of passivation after which reflowing of the solder metal completes the solder bump of the invention. | 2008-10-23 |
20080258306 | Semiconductor Device and Method for Fabricating the Same - The present invention provides a semiconductor device and a method for fabricating the same. The semiconductor device includes a chip having an active surface and an opposing non-active surface, wherein a plurality of bond pads are formed on the active surface, and first metal layers are formed on the bond pads and to edges of the non-active surface; conductive traces disposed on the non-active surface of the chip; a dielectric layer covering sides of the chip and formed with a plurality of openings therein to expose a portion of the conductive traces; and a plurality of second metal layers formed in the openings of the dielectric layer and on the first metal layers, such that the bond pads are electrically connected to the conductive traces via the first and second metal layers. | 2008-10-23 |
20080258307 | Integration type semiconductor device and method for manufacturing the same - A semiconductor device includes: a plurality of power MOS cells on a semiconductor substrate; a plurality of lead wires connecting to a source and a drain of each power MOS cell through a contact hole; a plurality of collecting electrodes connecting in parallel with the lead wires through a via hole; an interlayer protection film on the collecting electrode; a thick film electrode connecting to the collecting electrode through the opening; and a terminal protection film having an opening for bonding connection. The openings are formed in the interlayer protection film such that a portion between the openings becomes a beam shape | 2008-10-23 |
20080258308 | Method of controlled low-k via etch for Cu interconnections - An interconnect stack and a method of manufacturing the same wherein the interconnect has vertical sidewall vias. The interconnect stack includes a substrate, a metal interconnect formed in the substrate, an etch stop formed on the substrate and the metal interconnect, and an interlayer dielectric (ILD) layer having at least one via formed therein extending through a transition layer formed on the etch stop layer. The via is formed by etching the ILD to a first depth and ashing the interconnect stack to modify a portion of the ILD between the portion of the via formed by etching and the transition layer. Ashing converts this portion of the ILD to an oxide material. The method includes wet etching the interconnect to remove the oxide material and a portion of the transition layer to form a via extending through the ILD to the etch stop layer. | 2008-10-23 |
20080258309 | Three-dimensional semiconductor device - A three-dimensional semiconductor device using redundant bonding-conductor structures to make inter-level electrical connections between multiple semiconductor chips. A first chip, or other semiconductor substrate, forms a first active area on its upper surface, and a second chip or other semiconductor substrate forms a second active area on its upper surface. According to the present invention, when the second chip has been mounted above the first chip, either face-up or face-down, the first active area is coupled to the second active area by at least one redundant bonding-conductor structure. In one embodiment, each redundant bonding-conductor structure includes at least one via portion that extends completely through the second chip to perform this function. In another, the redundant bonding-conductor structure extends downward to the top level interconnect. The present invention also includes a method for making such a device. | 2008-10-23 |
20080258310 | Semiconductor device having a tapered plug - A semiconductor device includes: first and second interlayer dielectric films consecutively deposited to overlie a silicon substrate; contact plugs penetrating the first interlayer dielectric film and having a top surface located within the second interlayer dielectric film; and via-plugs having a first portion, the diameter of which reduces from the top of the second interlevel dielectric film toward the bottom thereof and a second portion extending between the first portion and the first plug, the second portion having a diameter increasing from the first portion to the first plug. | 2008-10-23 |
20080258311 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a first wiring layer, a second wiring layer and a third wiring layer. The first wiring layer is formed on a semiconductor substrate. The second and the third wiring layer wiring layers are arranged in a direction intersecting with the first wiring layer on respective sides of the wiring layer. An air bridge wiring intersects the second and third wiring layers sandwiching an air layer above the first wiring layer therewith. The overall shape of the air bridge wiring has an upward convex curvature in an arch shape and the transverse sectional shape of the air bridge wiring is in the form of a downward concave curvature. | 2008-10-23 |
20080258312 | SEMICONDUCTOR DEVICE - The present invention enhances the reliability of a semiconductor device. The semiconductor device includes a package substrate having a dry resist film which covers some conductive portions out of a plurality of conductive portions formed on a main surface and a back surface and is formed of a film, a semiconductor chip which is mounted over the package substrate, conductive wires which electrically connect the semiconductor chip with the package substrate, a die-bonding film which is arranged between the main surface of the package substrate and the semiconductor chip, a plurality of solder bumps which are formed on the back surface of the package substrate, and a sealing body which is made of resin. By forming the dry resist film made of a film on the main surface and the back surface of the package substrate, it is possible to suppress the warping of the package substrate and hence, the occurrence of package cracks at the time of reflow mounting can be prevented thus enhancing the reliability of the semiconductor device. | 2008-10-23 |
20080258313 | CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS - A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die. | 2008-10-23 |
20080258314 | FABRIC TYPE SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF INSTALLING AND MANUFACTURING SAME - A fabric type semiconductor device package is provided. The fabric type semiconductor device package comprises a fabric type printed circuit board comprising a fabric and a lead unit formed by patterning a conductive material on the fabric, a semiconductor device comprising an electrode unit bonded to the lead unit of the fabric type printed circuit board, and a molding unit for sealing the fabric type printed circuit board and the semiconductor device. In the fabric type semiconductor device package according to the present invention, a fabric type printed circuit board formed of fabric is used so that a feeling of an alien substance can be minimized. The fabric type semiconductor device package can be easily installed. The productivity of the fabric type semiconductor device package can be improved. | 2008-10-23 |
20080258315 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD OF THE SAME SEMICONDUCTOR DEVICE - The present invention aims to provide a semiconductor device which can enhance area efficiency, and the semiconductor device includes a plurality of electroconductive member regions formed in a predetermined layer, an insulating film region which is formed in the insulating layer which is an upper layer of the predetermined layer and which covers a region other than at least the plurality of electroconductive member regions, and wiring for making a connection which is formed along the insulating film region and which connects the plurality of electroconductive member regions mutually. | 2008-10-23 |
20080258316 | Power Semiconductor Module - A power semiconductor module having a surface of the power semiconductor chip and an external circuit pattern connected by an aluminum wire, and sealed with an epoxy resin, wherein wire diameter of the aluminum wire is 0.4±0.05 mmφ, and coefficient of linear expansion of the epoxy resin in a rated temperature range of a module is from 15 to 20 ppm/K. | 2008-10-23 |
20080258317 | SEMICONDUCTOR DEVICE - A resin layer covering a semiconductor chip on a wiring board is composed of a first resin layer and a second resin layer, wherein the first resin layer and the second resin layer differ in their plan view pattern, satisfying a relation of a | 2008-10-23 |
20080258318 | Semiconductor device - Disclosed herewith is a semiconductor device capable of suppressing the peeling-off that might occur between an island and a resin layer due to a difference of the shrinkage between those items, thereby the reliability of the semiconductor device is improved. The semiconductor device of the present invention includes an island, a semiconductor chip mounted on the island, and a resin layer that seals the island and the semiconductor chip respectively. And at the interface between the island and the resin layer is provided a buffer film having an elastic modulus lower than that of the resin layer. | 2008-10-23 |
20080258319 | Method for Preparing Diorganomagnesium-Containing Synthesis Means - A diorganomagnesium-containing synthesis means, a method for its preparation and its use. | 2008-10-23 |
20080258320 | CHARGE FORMING DEVICE WITH IDLE AND OPEN THROTTLE CHOKE CONTROL - A charge forming device may include a body having a fuel and air mixing passage, a throttle valve and choke valve moveable between first and second positions to control at least in part the fluid flow in the fuel and air mixing passage, and throttle and choke control members associated with the throttle and choke valves, respectively. The choke control member may also be associated with an engine starting system so that the choke valve is moved to its second position upon actuation of the starting system. The choke control member is selectively associated with the throttle control member to hold the choke control member in a position spaced from its first position. In this manner, the throttle valve and choke valve may be automatically positioned in a desired position for starting of the engine upon actuation of the engine starting system. | 2008-10-23 |
20080258321 | APPARATUS FOR INJECTING GAS INTO A VESSEL - An apparatus for injecting gas into a metallurgical vessel is disclosed. The apparatus comprises a gas flow duct, an elongate central tubular structure extending within the gas flow duct, a plurality of flow directing swirl vanes disposed about the central tubular structure, and cooling water passages within the central tubular structure. The forward end of the central structure has a nose portion comprised of a domed outer shell, an inner component disposed within the outer shell and formed with an internal nozzle to receive water from the cooling water passages and to direct that water in a jet against the inner surface of the outer shell to produce an outwardly and backwardly fanning flow of water around the inner surface of the outer shell. | 2008-10-23 |
20080258322 | USE OF SURFACTANTS IN EXTRACTION PROCEDURES FOR SILICONE HYDROGEL OPHTHALMIC LENSES - Methods of producing silicone hydrogel ophthalmic lenses include contacting one or more delensed silicone hydrogel ophthalmic lens with a liquid composition that contains alcohol, water, and a surfactant. The methods can be steps of an extraction/hydration procedure used in the production of silicone hydrogel contact lenses. In some examples, contacting silicone hydrogel ophthalmic lens products with a liquid composition that contains alcohol, water, and a surfactant can significantly reduce or prevent surface distortion of the ophthalmic lens resulting from the extraction procedure. Some methods include subsequently contacting the silicone hydrogel ophthalmic lens with a liquid composition consisting essentially of water and a surfactant. | 2008-10-23 |
20080258323 | Method for making a bamboo tool handle - A method for making a bamboo-made tool handle, has the following steps. A bamboo material is cut into multiple bamboo strips. Green skins of the bamboo strips are removed to obtain original bamboo strips. The original bamboo strips are steamed with hydrogen peroxide and dried to obtain dried bamboo strips. The dried bamboo strips is turned to obtain turned bamboo woods. The turned bamboo wood is carbonized to obtain carbonized bamboo woods. The carbonized bamboo wood is combined to obtain a bamboo wood bundle, wherein each carbonized bamboo woods are combined at a longitudinal direction. The method for making a bamboo-made tool handle is convenient and could obtain an elastic and tough bamboo tool handle. | 2008-10-23 |
20080258324 | Foam molding method and apparatus - It is an object of the present invention to provide a foam molding method for foaming and molding a foamable material, which is free from problems, such as deformation of or continuation between closed cells. To achieve this object, there is provided a foam molding method for foaming a foamable material, comprising the steps of providing a mold having a cavity, placing the cavity of the mold under a pressurized condition, foaming the foamable material in the cavity of the mold under the pressurized condition, thus appropriately controlling foaming of the foamable material, and releasing the pressurized condition of the cavity of the mold. | 2008-10-23 |
20080258325 | Method of and device for cooling blown film during the production of blown film - A method of cooling blown film consisting of thermoplastic plastics during the production of blown film by means of a blown film extruder with a film blowing head which comprises an annular nozzle from which the blown film emerges and is guided away in an extraction direction, wherein at least two cooling gas flows are made to approach the blown film from the outside in at least two blowing-out planes located at a distance from the annular nozzle, wherein at least one cooling gas flow K | 2008-10-23 |
20080258326 | Injection molding machine and control method thereof - When controlling each operational process in a molding cycle by variably controlling the number of revolutions of a drive motor | 2008-10-23 |
20080258327 | Method for Forming Porous PTFE Layer, and Porous PTFE Layer and Molded Product that are Obtained by the Forming Method - A method forming a porous PTFE layer includes steps of: combining one or at least two unburned porous PTFE films and a support body that can withstand a heating condition in the following process (a rod or plate shaped support body made of mesh or the like is preferable) by using a predetermined means in such a manner that a slip can be prevented in a heating treatment in the following process; and heating the matter resulted from the above process at a temperature of at least 150° C. and less than the melting point of the PTFE film for the range of 5-120 minutes (preferably at a temperature in the range of the melting point of a thermoplastic resin fiber to 320° C. for the range of 10-60 minutes in the case in which the thermoplastic resin fiber or the like is used in the process. | 2008-10-23 |
20080258328 | Process for Producing Cylindrical Mouldings Based on Cellular Polyurethane Elastomers - A process for the production of cylindrical moldings based on cellular polyurethane elastomers having a density, according to DIN EN ISO 1798, of from 350 to 800 kg/m | 2008-10-23 |
20080258329 | METHOD OF PREPARING A MOLDED ARTICLE - A method of forming a shaped thermoplastic sheet is described. The method includes providing a mold apparatus ( | 2008-10-23 |
20080258330 | PAEK powder, in particular for the use in a method for a layer-wise manufacturing of a three-dimensional object, as well as method for producing it - By a temper treatment a polyaryletherketone powder is processed such that it is particularly suited for the use in a method for a layer-wise manufacturing of a three-dimensional object. To this effect the powder is tempered at a temperature that is at least 20° C. above the glass transition temperature for at least 30 minutes before it is used as building material. | 2008-10-23 |
20080258331 | Method for Making an Injection-Moulded Abrasive Article - A method for making an abrasive article is disclosed. An exemplary embodiment comprises positioning particles of abrasive agglomerate ( | 2008-10-23 |
20080258332 | Apparatus for Manufacturing Moving Hand-Rail of Passenger Conveyer and Method for Manufacturing Moving Hand-Rail - A manufacturing apparatus and a manufacturing method that can form in successive processes tooth-marks longitudinally at a regular pitch on the back side of a passenger-conveyor moving handrail. The manufacturing apparatus includes: a material feed port through which a thermoplastic resin is fed; a heater that heats the fed thermoplastic resin; a molding machine that extrusion-molds the thermoplastic resin having been fluidized; and a tooth-mark forming tool, which is a tooth-mark forming device, that forms tooth-marks longitudinally at a regular pitch on the back side of a preformed moving-handrail material having been extrusion-molded, while it is in a state in a plastically deformable temperature range. | 2008-10-23 |
20080258333 | Method and Apparatus for Producing Oriented Slit Film Tapes - The invention relates to a method for producing oriented slit film tapes, comprising the following steps: extruding melt polymer through a die ( | 2008-10-23 |
20080258334 | Method and Device for the Production of At Least One Container Filled With a Medium - The invention relates to a method and to a device for the production of at least one container filled with a medium, said container being made of a plastic material. The plastic material is extruded in a tubular manner and is applied to the inner walls of a moulding tool in order to mould the respective container by means of differential pressure. The respective container is filled with a medium via the inlet opening with the aid of a filling device and the inlet opening of the container is closed by a lock. A coextrusion method is used for the extrusion of different plastic materials, whereby the respective container is made at least partially of several layers of plastic materials. At least one of the layers is used at a barrier layer. | 2008-10-23 |
20080258335 | CASTING UNIT, DOPE APPLYING METHOD, AND SOLUTION CASTING METHOD - A casting die for casting a joint dope constructed of a main dope and a substantial dope has a side plate, an inner deckle plate, an inlet and an outlet. The inner deckle plate has a contact face forming an inner wall of the slot. The first dope is fed through a manifold into a slot connecting the inlet and the outlet. The second dope is fed through a pipe into a passage formed in the inner deckle plate. The passage may be connected to the slit. The inner deckle plate has a partitioning portion for partitioning the second path from the slit. The partitioning portion has an end having acute angle. | 2008-10-23 |
20080258336 | Mold for Fabricating Bats for Mounting on a Pottery Wheel - A mold for fabricating a plaster bat includes a well portion, adapted to be placed on a relatively smooth hard surface. The well forms a well adapted to contain plaster. A bridge portion is attached to the well portion and includes a collar holder adapted to hold a collar within the well portion at a nominal location. The collar holder is adapted to hold a collar at a predetermined height above the surface. | 2008-10-23 |
20080258337 | Polyether Ether Ketone/Polyphenylene Sulfide Blend - The present description discloses a polymeric composition which is a melt-processed alloy comprised of (a) a polyarylene sulfide resin, (b) a polyaryl-ether-ketone resin, and a reactive compound which results in (c) a graft copolymer of the polyarylene sulfide resin and/or the polyaryl-ether-ketone resin in addition to the starting resins. Exemplary melt-processed polymeric compositions can be made by reacting an alkoxy silane with the polyarylene sulfide resin and/or the polyaryl-ether-ketone resin to produce a graft copolymer of a portion of one or both of the resins, sufficient to render the composition uniform and homogeneous. It is normally preferred for the exemplary organosilane compound, to be an amino silane. The subject invention further reveals an insulated wire comprising (1) an electrical conductor and (2) a layer of the melt-processed alloy composition; and fiber reinforced composites comprising fibers substantially fully impregnated with the alloy polymeric composition. | 2008-10-23 |
20080258338 | POLYCARBONATE MOLDING COMPOSITIONS - The invention relates to talcum-reinforced polycarbonate compositions comprising: A) a polycarbonate, polyester carbonate or a mixture thereof, B) optionally, at least one polymer selected from one of the group consisting of graft polymer produced in an emulsion polymerisation process, graft polymer produced in a bulk polymerisation process, rubber-free vinyl homopolymer and rubber-free vinyl copolymer, C) talcum, D) a Brönstedt acid, and optionally E) at least one polymer additive, and wherein the composition is free of aromatic or partially aromatic polyesters. Compared to the known prior art the inventive compositions have an improved ductility, thermal resistance towards deformation and thermal stability during compounding and processing (molding). The invention also provides for the use of the composition for the production of molded articles and two-component structural parts. | 2008-10-23 |
20080258339 | Method for the Production of a Substrate Having a Holographic Appearance - A means of digitizing the topography of an art work is disclosed. A means of reproducing said art work and the related apparatus are also disclosed. The art reproduction process disclosed employs a thin sheet of thermoformable plastic onto which a permanent image of an art work has been created and which is heated prior to either a dot matrix print head, a daisy wheel print head, or both being employed to apply mechanical force to said thin sheet of thermoformable plastic sheet so as to create an accurate three-dimensional relief reproduction of an original artwork. An alternative embodiment is also disclosed wherein the art reproduction process employs a thin sheet of paper or cardboard onto which a permanent image of an art work has been created and which is heated and humidified with steam prior to either a dot matrix print head, a daisy wheel print head, or both being employed to apply mechanical force to said thin paper or cardboard sheet so as to create an accurate three-dimensional relief reproduction of an original artwork. | 2008-10-23 |
20080258340 | System and method for manufacturing concrete blocks - A system and method for manufacturing an uncured concrete block using the dry-cast manufacturing process includes a mold box having a pair of side walls, a pair of side plates, an open top side and an open bottom side defining a mold cavity. One or more end liners are disposed within the mold cavity and are selectively shiftable within the mold cavity with hydraulic cylinders between a first position and a second position. The end liners can be provided with a three-dimensional textured face to impart a decorative face to a side surface of the concrete block formed in the mold or can also provide blocks with a tapered face when disposed in the second position while the mold is filled with concrete. Before the block is stripped from the mold, the end liners are returned to the first position, so that the side surfaces are not damaged as the block is released. | 2008-10-23 |
20080258341 | LIGHTWEIGHT SINGLE-USE CONCRETE CURING SYSTEM - A lightweight concrete curing blanket includes a layer of nonwoven fabric that is hydrophilic and that has a thickness of less than about 0.020 inches. A layer of film (e.g., polyethylene film) is bonded to the layer of nonwoven fabric, and has a thickness less than or equal to about 0.001 inch. The layer of film has a moisture vapor transport rate of less than about 0.0016 grams per square foot per twenty-four hours. A combined weight of the layer of nonwoven fabric and the layer of film is less than about 100 grams per square meter. | 2008-10-23 |
20080258342 | Dual Piston Valve Stem Actuator and Associated Method of Use - An injection molding apparatus includes a valve support structure having an internal channel for directing a flow of melted resin to a mold cavity. A first valve actuator is supported by the valve support structure and is operatively connected to a valve stem. The valve stem extends at least partially through the internal channel through a valve aperture. A bushing is fitted in the valve aperture. A second valve actuator is located adjacent the first valve actuator. The second valve actuator is operatively connected to a sleeve member with a hollow interior dimensioned to slidingly engage the valve stem and an exterior surface dimensioned for sliding movement in the bushing. The second valve actuator selectively moves the sleeve member between a retracted position where the sleeve member moves toward the bushing and an extended position where the sleeve moves away from of the bushing. | 2008-10-23 |
20080258343 | Rotary Powder Compression Molding Machine - A rotary powder compression molding equipment arranged to compression molding powder filled in the mortar hole of a mortar fixed to a rotary disc between the lower end face of an upper pestle and the upper end face of a lower pestle, wherein a means for injecting powder lubricant comprises an injection nozzle having a concave surface and injecting powder lubricant L being guided to the concave surface substantially in one direction while facing the end faces of the upper and lower pestles at respective supply positions of powder lubricant, an air flow supply mechanism for injecting air flow to the vicinity of the lower end face of the upper pestle in order to prevent upward scattering of the powder lubricant injected from the injection nozzle, and a charger for charging the powder lubricant when it is injected from the injection nozzle. | 2008-10-23 |
20080258344 | ABLATABLE ELEMENTS FOR MAKING FLEXOGRAPHIC PRINTING PLATES - Flexographic printing plates and other relief images can be formed from a laser-ablatable element having a laser-ablatable layer that is at least 20 μm in thickness. The laser-ablatable layer includes a film-forming material that is a laser-laser-ablatable material or the film-forming material has dispersed therein a laser-ablatable material. The laser-ablatable material is a polymeric material that when heated to 300° C. at a rate of 10° C./minute, loses at least 60% of its mass to form at least one predominant low molecular weight product. The element can be imaged by ablation at an energy of at least 1 J/cm2 to provide a relief image. | 2008-10-23 |
20080258345 | Liquid Radiation-Curing Compositions - The present invention relates to liquid radiation-curing compositions having flexible and elastic material properties in the cured state, consisting of the following components: a) from 5.0 to 99.0% by weight of a di- or polyfunctional polyether (meth)-acrylate compound having a molecular weight of more than 1000 g/mol; b) from 1.00 to 90.0% by weight of a mono-, di- or polyfunctional radiation-curing (meth)acrylate compound having a molecular weight of less than 1000 g/mol as a reactive component or reactive thinner or cross-linking agent for the formation of polymer networks; c) from 0.05 to 10.0% by weight of a free-radical forming photoinitiator; d) from 0.001 to 5.0% by weight of further components; with the proviso that the sum of components a) to d) amounts to 100% by weight. Further, the present invention relates to products obtainable from the compositions according to the invention, and processes for the preparation, treatment and use of three-dimensional shaped objects made from the compositions according to the invention. | 2008-10-23 |
20080258346 | COMPOSITE POWDER, USE IN A SHAPING PROCESS, AND MOULDINGS PRODUCED FROM THIS POWDER - The present invention relates to a composite powder of polymer powder and porous glass beads, and to the use of this composite powder for shaping processes, and also to mouldings produced from this composite powder. | 2008-10-23 |
20080258347 | Method of enhancing moisture management and providing negative ion properties to fabric materials - The present invention relates to a method of enhancing the negative ion properties of a material and enhance its moisture management properties if necessary. The method of the present invention teaches the determination of the moisture properties of a material, development of a negative ion agent, and the application of that agent to the material, such steps leading to a material possessing negative ion properties and good moisture management. | 2008-10-23 |
20080258348 | Method and applicator for selective electromagnetic drying of ceramic-forming mixture - Electromagnetic (EM) drying of a plugged ware is provided that includes subjecting the ware to an axially non-uniform EM radiation field that causes more EM radiation to be dissipated in either of the plugged regions than in the unplugged region. The EM radiation field is provided by a configurable applicator system that includes a feed waveguide and a conveyor path. The feed waveguide includes configurable slots. The configurable applicator system can be set to selectively vary the amount of EM radiation dissipated by each ware along the longitudinal axis of each ware as a function of ware position along the conveying path, thereby enhancing the EM drying process. | 2008-10-23 |
20080258349 | Method and apparatus for producing containers - An apparatus and method for producing plastic objects. The apparatus comprises an extruder disposed to extrude at least one parison, a parison coating system and a mold disposed to receive the extruded parison. The parison coating system comprises: a powdered material source; a fluid source interconnected with the powdered material source; and a nozzle connected to the interconnected fluid and powdered material sources. The nozzle is disposed such that the nozzle disperses the powdered material in a spray pattern which interacts with the extruded parison. The method comprises steps of extruding a plastic parison, applying a powdered material coating to the parison, enclosing the coated parison in a mold cavity and expanding the coated parison to the limits of the cavity. | 2008-10-23 |
20080258350 | Method of Producing a Flexible Pipe and a Flexible Pipe - The invention relates to a method of producing a flexible pipe comprising a metal carcass and an internal sealing sheath extruded onto the carcass, said method comprising providing a metal carcass; heating an application section of said carcass, preferably using induction heating, to an application section temperature of at least 150° C.; extruding a non-cross-linked polyethylene material comprising a peroxide having an activation temperature above 150° C. onto said application section of said carcass; cross-linking the extruded polyethylene in a cross-linking zone by raising its temperature to at least the activation temperature of said peroxide by exposing the extruded polymer material to electromagnetic waves, with a wavelength of between 0.5 μm to 0.5 m, preferably infrared radiation; and cooling said cross-linked polyethylene material to obtain the internal sealing sheath. In a preferred embodiment the method comprises heating the application section to an application section temperature of between 30 and 5° C. below the activation temperature of the peroxide. Preferred peroxides include butylcumyl peroxide, dicumyl peroxide, 2,5-Dimethyl-2,5-di(tert-butylperoxy)hexyne-3,3,3,5,7,7-Pentamethyl-1,2,4-trioxepane, hydroperoxide, 2,5-dimethyl hexane 2,5-di-t-butyl peroxide, bis(t-butylperoxy isopropyl)benzene, t-butyl cumyl peroxide, di-t-butyl peroxide, 2,5-dimethyl hexine-3 2,5-di-t-butyl peroxide and butylhydroperoxide. A foil may be applied onto the metal carcass prior to the step of heating the metal carcass, the polyethylene material being extruded onto said foil. | 2008-10-23 |
20080258351 | EQUIPMENT AND METHOD FOR ELECTROSPINNING - An electrospinning equipment is provided. The electrospinning equipment includes a power supply, a collector and a material supply electrically connected to the power supply facing the collector and having a spinneret and a guide unit coupled to the spinneret and bent toward the collector, and the spinneret is configured at a central portion of the guide unit. | 2008-10-23 |
20080258352 | Article Comprising Polystyrene and Thermoplastic Polyurethane - Articles comprising polystyrene and thermoplastic polyurethane joined adheringly without chemical adhesion promoter. | 2008-10-23 |
20080258353 | METHODS AND SYSTEMS FOR FORMING MULTILAYER ARTICLES - Disclosed is a mold system which comprises a cube configured to rotate about an axis, a first cavity platen comprising at least one first cavity section, a second cavity platen comprising at least one second cavity section, a fluid channel being disposed within at least one of the mandrels and a hydraulic connection member configured to connect at least one of the fluid channels to an inlet and or outlet positioned outside the cube. The cube comprises at least two sides, each side comprising at least one mandrel. The hydraulic connection member is configured to deliver a volume cooling fluid from or to the fluid channels while the cube is rotating. | 2008-10-23 |
20080258354 | METHOD OF PREPARING A MOLDED ARTICLE - A method of forming a shaped thermoplastic sheet is described. The method includes providing a mold apparatus ( | 2008-10-23 |
20080258355 | Articles Having Improved Gas Barrier Properties - The present invention relates to a sulfo-modified copolyester blend composition and polyglycolic acid. The blend of sulfo-modified copolyester and polyglycolic acid can be used to prepare containers with good transparency and high gas barrier properties. The preferred sulfo-modified copolyester composition comprises terephthalic acid, isophthalic acid and 5-sulfoisophthalic acid. A method of preparing a blend of sulfo-modified copolyester and polyglycolic acid is disclosed, as well as master batch processes. The present invention also relates to a method of making a container wherein the sulfo-modified copolyester is blended with the polyglycolic acid at an injection molding machine used to make preforms, which are then blown into bottles. | 2008-10-23 |
20080258356 | Integrally blow-moulded bag-in-container comprising an inner layer and an outer layer comprising energy absorbing additives, and preform for making it - The present invention relates to an integrally blow-moulded bag-in-container and preform for blow-moulding the bag-in-container. An inner layer and an outer layer are used, wherein the preform forms a two-layer container upon blow-moulding, and wherein the obtained inner layer of said container releases from the thus obtained outer layer upon introduction of a gas at a point of interface between the two layers. At least one of the inner and outer layers includes at least one additive allowing both inner and outer layers to reach their respective blow-moulding temperatures substantially simultaneously. | 2008-10-23 |
20080258357 | Method for Producing Semicrystalline Polylactic Acid Articles - Amorphous sheets of PLA resins are thermoformed by heating the sheets until they become semicrystalline, and then forming the sheets on a relatively cold mold. Semicrystalline formed articles having improved heat resistance are made by the process. | 2008-10-23 |
20080258358 | Slip Containing Zirconium Dioxide and Aluminum Oxide and Shaped Body Obtainable Therefrom - Slip containing at least one aluminium oxide powder and at least one unstabilized zirconium dioxide powder, wherein
| 2008-10-23 |
20080258359 | Low-temperature method of producing nano-scaled graphene platelets and their nanocomposites - A method of exfoliating a layered material to produce separated nano-scaled platelets having a thickness smaller than 100 nm. The method comprises: (a) providing a graphite intercalation compound comprising a layered graphite containing expandable species residing in an interlayer space of the layered graphite; (b) exposing the graphite intercalation compound to an exfoliation temperature lower than 650° C. for a duration of time sufficient to at least partially exfoliate the layered graphite without incurring a significant level of oxidation; and (c) subjecting the at least partially exfoliated graphite to a mechanical shearing treatment to produce separated platelets. The method can further include a step of dispersing the platelets in a polymer or monomer solution or suspension as a precursor step to nanocomposite fabrication. | 2008-10-23 |
20080258360 | CONTINUOUS CARBURIZING FURNACE - The continuous carburizing furnace of this invention provides a furnace, a lift mechanism and a plurality of pushers. A furnace has a carburizing zone and a plurality of regions including a first region and a second region at the upstream side of said carburizing zone. The second region and the first region being disposed successively along a direction of conveyance of workpieces loaded upon a tray in this order. The lift mechanism lowers a tray in some region, among the plurality of regions, other than the region most to the upstream side in the direction of conveyance. A plurality of pushers includes a first pusher and a second pusher. The first pusher pushes a tray in said first region to said carburizing zone. The second pusher pushes a tray in said second region to said first region. A plurality of pushers are arranged the lower, the further towards the downstream side in said direction of conveyance is the position at which they push said trays. | 2008-10-23 |
20080258361 | SUSPENSION SPRING MOUNT - A spring is to be supported on an axle with a housing. The housing surrounds a portion of the spring and has a housing inner portion positioned between first and second housing end portions. A lining secures the spring to the housing. A portion of the lining at the first and second housing end portions is thicker than a portion of the lining at the housing inner portion. | 2008-10-23 |
20080258362 | TRAILER MOUNTED CRASH ATTENUATION SYSTEM - A trailer crash attenuation assembly includes a longitudinal hollow member adapted to act as a hydraulic cylinder at one end, hydraulic fluid disposed in the hydraulic cylinder and a tank connected to the hydraulic cylinder to receive and store said hydraulic fluid expressed from the hydraulic cylinder. A first longitudinal telescopic member is adapted to slide into and out of the longitudinal hollow member and is adapted to act a piston. Two other longitudinal hollow members are positioned substantially parallel to and on either side of the first longitudinal hollow member and are connected to the first longitudinal hollow member. Two telescopic members are adapted to slide into and out of the two other longitudinal hollow members respectively. A casing is connected at its proximal end to all three longitudinal hollow members, is adapted at its distal end to receive a crash cushion; and has a pair of wheels. | 2008-10-23 |
20080258363 | Mechanical Control Shock-Absorbent Anti-Recoil Universal Mechanism - Mechanical control shock-absorbent anti-recoil universal mechanism intended for various fields such as industrial and civil constructions, machine building industry, robotics et cetera, its purpose being to protect against the impact forces, recoil forces or vibrations. The mechanical control shock-absorbent anti-recoil universal mechanism comprises a mobile holder X, a joint lever and spring mechanism Y and an end holder Z. The mechanical control shock-absorbent anti-recoil universal mechanism has the role of absorbing and a cancellation of the impact forces and recoil forces, while a mechanical control mechanism K adjust concomitently and continuously the tension of the absorbent springs and the annulling springs in order to decrease or to annul the impact force. | 2008-10-23 |
20080258364 | CYLINDRICAL VIBRATION ISOLATING DEVICE - A cylindrical vibration isolating device having an inner cylinder, an outer cylinder surrounding the inner cylinder, an elastic leg having a pair of right and left leg portions to connect the inner cylinder and the outer cylinder and, when viewed in the axial direction of the inner cylinder, being formed in a substantially inverted V-shape while placing the inner cylinder in an intermediate position, and a mass projection being provided in the elastic leg such that the mass projection resonates in a frequency range that the elastic leg causes bending resonance. The mass projection is provided outside of an inner restraint line that is a perpendicular line passing an outermost point of an inner restrained portion that is a connected portion between the inner cylinder and the elastic leg. | 2008-10-23 |
20080258365 | Vibration Damper for Isolator - A system for use in for example the production of semiconductors comprises a chamber ( | 2008-10-23 |
20080258366 | SPRING APPARATUS AND A METHOD OF PROVIDING SUCH - A spring apparatus comprises a substantially linear first segment and a substantially linear center segment, rotatably connected to the first segment by a first bend. A substantially linear second segment is rotatably connected to the center segment by a second bend and has a terminal end spaced apart from the second bend. The terminal end contacts the first segment in a slidable manner as at least one of the second segment and the center segment rotates relative to the first segment to release stored energy. | 2008-10-23 |
20080258367 | PEENING METHOD FOR VEHICLE SUSPENSION SPRING - A method of manufacturing a vehicle suspension component, such as a helical coil spring, includes the step of rotating a first impeller to project ceramic peening media in a first direction toward the vehicle suspension component to peen a surface section of the vehicle suspension component. In one example, the vehicle suspension component is peened with metal peening media before peening with the ceramic peening media. | 2008-10-23 |
20080258368 | Miter Joint Clamp - A miter joint clamp comprises a base and a sled mounted on the base for linear movement with respect to the base. The base has a planar top side, and such movement is relative to a miter joint plane perpendicular to the planar top side of the base. The sled comprises a first sled fence that has a planar first sled surface extending perpendicular to the top side of the base aligned at a 135° angle relative to a first side of the joint plane, with the first sled surface being resiliently compressible relative to the sled in a direction perpendicular to the first sled surface. The sled further comprises a second sled fence that has a planar second sled surface extending perpendicular to the top side of the base and aligned at a 135° angle relative to a second side of the joint plane, with the second sled surface being resiliently compressible relative to the sled in a direction perpendicular to the second sled surface. The base comprises a first base fence that has a planar first base surface extending perpendicular to the top side of the base and aligned generally parallel to the first sled surface, and a second base fence that has a planar second base surface extending perpendicular to the top side of the base and aligned generally parallel to the second sled surface. | 2008-10-23 |
20080258369 | VARIABLE GEOMETRY WORKTABLE - A worktable having a leg supports ( | 2008-10-23 |
20080258370 | Book production apparatus and method of producing books - A book product apparatus includes a gathering line and a plurality of feeding devices adapted to dispense at least one signature onto the gathering line. The apparatus further includes a controller operatively connected to the plurality of feeding devices for controlling the operation of the feeding devices, wherein a comparison of two customer data sources generates instructions for the feeding devices. | 2008-10-23 |
20080258371 | AFTERTREATMENT APPARATUS, AND CONTROLLING METHOD, PROGRAM AND STORAGE MEDIUM THEREFOR - Sheet thickness data obtained from the output of a sheet thickness detecting sensor are calculated to thereby calculate a sheet bundle thickness. When the sheet bundle thickness reaches a predetermined value, other aftertreatment differing from a set aftertreatment is executed. | 2008-10-23 |
20080258372 | SHEET PROCESSING APPARATUS AND IMAGE FORMING SYSTEM - A sheet processing apparatus includes a winding unit configured to wind a continuous sheet, a binding unit configured to bind the continuous sheet that is wound and stacked by the winding unit, and a first cutting unit configured to cut the continuous sheet that is bound by the binding unit in a state that the continuous sheet is wound by the winding unit. | 2008-10-23 |
20080258373 | Post-processing apparatus and image forming system - A post-processing apparatus including a conveyance unit containing a stacker for storing a plurality of sheets placed one on top of the other and a conveyance path having a curvature for ejecting a plurality of sheets placed one on top of the other in the stacker and a control section for controlling conveyance of sheets, wherein the control section controls aligning the plurality of sheets in the conveyance unit, feeding a plurality of sheets placed one on top of the other to a roller through the conveyance path having a curvature, driving the conveyance roller so as to feed the plurality of sheets, hitting the sheet ends against a stopper so as to align the sheet ends, further conveying the sheets with the ends aligned until a loop is formed on sheets, and punching the sheets using by a punching section subsequent to formation of the loop. | 2008-10-23 |
20080258374 | PRINTING SYSTEM, CONTROL METHOD THEREOF, PROGRAM, AND STORAGE MEDIUM - An object of this invention is to process as many print jobs as possible even if requests to print various types of print jobs requiring various types of print media are simultaneously intensively accepted. Another object of this invention is to build a convenient, flexible printing environment where the productivity of one job is increased by shortening the time taken to end printing one print job after the start of printing. To accomplish them, a control unit ( | 2008-10-23 |
20080258375 | Printer Incorporating Opposed Printhead Assemblies - A printer comprising: a support structure; a feed arrangement positioned on the support structure and configured to feed an endmost sheet of print media from the stack and including a movable pick-up assembly, the pick-up assembly having an array of spaced apart nozzles configured to direct air on to respective locations along said topmost sheet so that said topmost sheet can be picked-up from the stack by moving said pick-up assembly; a pair of rollers configured to engage with said endmost sheet fed from said feed arrangement; a printing station configured to print ink upon said endmost sheet engaged by said rollers; and an air displacement mechanism connected to the nozzles to displace air out of some expulsion nozzles and into some other suction nozzles, wherein said printing station has a pair of opposed printhead assemblies between which said endmost sheet can be fed so that concurrent duplex printing can be performed on the endmost sheet. | 2008-10-23 |
20080258376 | ACCUMULATOR HAVING ROTARY DRIVE - A sheet stacking device includes a support frame, a conveyor and an accumulator at a discharge end of the conveyor, the accumulator having a plurality of elongate fingers, at least one of which includes a rack having teeth along a first side, a rotatable drive shaft extending in a width direction of the conveyor, a gear having teeth mounted on the drive shaft and operatively engaging the rack teeth, and a rotary actuator operably connected to the drive shaft, the rotary actuator rotating said drive shaft in a first and second directions to move an end of the elongate fingers toward and away from the conveyor discharge end of the conveyor. Also a method of operating the device. | 2008-10-23 |
20080258377 | Method and Apparatus for Feeding Flat Printed Products - The invention refers to a method and an apparatus for gathering flat printed products by selecting a single printed product from each of a multitude of collections of identical printed products and conveying the selected printed products towards a collecting conveyor ( | 2008-10-23 |