40th week of 2009 patent applcation highlights part 58 |
Patent application number | Title | Published |
20090246942 | APPARATUS FOR DEPOSITING SILICON-BASED THIN FILM AND METHOD FOR DEPOSITING SILICON-BASED THIN FILM - A silicon-based thin film depositing apparatus, including a plurality of transparent electrodes disposed to face corresponding counter electrodes with a space therebetween. Subsequently, while injecting a raw material gas from raw material gas injection orifices toward the supporting electrodes and also injecting a barrier gas from barrier gas injection orifices in the same direction as the direction in which the raw material gas is injected, the gases are discharged from a gas outlet, and thereby, the pressure in a chamber is controlled to a pressure of more than 1 kPa. Then, a DC pulse voltage is applied to each counter electrode to deposit a silicon-based thin film. A DC pulse voltage is applied to perform discharge. Therefore, even in a state where the distance between the electrodes is increased, plasma can be generated efficiently, and the in-plane distribution of film thickness can be improved. | 2009-10-01 |
20090246943 | APPARATUS FOR MASS-PRODUCING SILICON-BASED THIN FILM AND METHOD FOR MASS-PRODUCING SILICON-BASED THIN FILM - A silicon-based thin film mass-producing apparatus, including transparent electrodes placed to face in parallel to corresponding counter electrodes with a space therebetween, and silicon-based thin films are deposited on the transparent electrodes by feeding a raw material gas for depositing the silicon-based thin films into the chamber and by applying a DC pulse voltage to the counter electrodes to generate plasma. Unlike methods in which a radio frequency voltage is intermittently applied to perform discharge, a high plasma density distribution does not occur, and in-plane film thickness distribution does not occur. Furthermore, since the DC pulse voltage rises sharply, the ON period can be shortened. As a result, generation of a sheath ceases in the transient state before reaching the steady state, and the thickness of the sheath is small, which allows the space between the counter and transparent electrodes to decrease. | 2009-10-01 |
20090246944 | METHOD FOR HETEROEPITAXIAL GROWTH OF HIGH-QUALITY N-FACE GaN, InN, AND AlN AND THEIR ALLOYS BY METAL ORGANIC CHEMICAL VAPOR DEPOSITION - Methods for the heteroepitaxial growth of smooth, high quality films of N-face GaN film grown by MOCVD are disclosed. Use of a misoriented substrate and possibly nitridizing the substrate allow for the growth of smooth N-face GaN and other Group III nitride films as disclosed herein. The present invention also avoids the typical large (μm sized) hexagonal features which make N-face GaN material unacceptable for device applications. The present invention allows for the growth of smooth, high quality films which makes the development of N-face devices possible. | 2009-10-01 |
20090246945 | METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE - A method for manufacturing a nitride semiconductor substrate includes the steps of growing a first nitride semiconductor on a substrate, patterning the first nitride semiconductor to obtain a pattern surrounded by a plane equivalent to the (11-20) plane and having at least two concave portions that are similar in their planar shape, and growing a second nitride semiconductor layer, using a plane equivalent to the (11-20) plane in the first nitride semiconductor pattern as a growth nucleus. | 2009-10-01 |
20090246946 | METHOD OF FABRICATING A MICROELECTRONIC STRUCTURE OF A SEMICONDUCTOR ON INSULATOR TYPE WITH DIFFERENT PATTERNS - A microstructure of the semiconductor on insulator type with different patterns is produced by forming a stacked uniform structure including a plate forming a substrate, a continuous insulative layer and a semiconductor layer. The continuous insulative layer is a stack of at least three elementary layers, including a bottom elementary layer, at least one intermediate elementary layer, and a top elementary layer overlying the semiconductor layer, where at least one of the bottom elementary layer and the top elementary layer being of an insulative material. In the stacked uniform structure, at least two patterns are differentiated by modifying at least one of the elementary layers in one of the patterns so that the elementary layer has a significantly different physical or chemical property between the two patterns, where at least one of the bottom and top elementary layer is an insulative material that remains unchanged. | 2009-10-01 |
20090246947 | Method for Manufacturing Semiconductor Device - Disclosed herein is a method of manufacturing a semiconductor device that includes forming a metal catalytic pattern on a semiconductor substrate; etching the semiconductor substrate using the metal catalytic pattern as an etching mask to form a recess; forming an insulating layer over a structure including the recess, the metal catalytic pattern, and the semiconductor substrate; patterning the insulating layer to cross over the metal catalytic pattern and to expose a predetermined portion of the metal catalytic pattern; and growing a nano wire using the exposed predetermined portion of the metal catalytic pattern. | 2009-10-01 |
20090246948 | Method of Preparing P-Type Doped ZnO or ZnMgO - Method of preparing p-type doped ZnO or p-type doped ZnMgO, in which the following successive steps are carried out:
| 2009-10-01 |
20090246949 | Methods of manufacturing semiconductor devices - In a semiconductor device and a method of manufacturing a semiconductor device, a lower electrode is formed on a semiconductor substrate. A first zirconium oxide layer is formed on the lower electrode by performing a first deposition process using a first zirconium source and a first oxidizing gas. A zirconium carbo-oxynitride layer is formed on the first zirconium oxide layer by performing a second deposition process using a second zirconium source, a second oxidizing gas and a nitriding gas, and an upper electrode is formed on the zirconium carbo-oxynitride layer. A zirconium oxide-based composite layer having a high dielectric constant and a thin equivalent oxide thickness can be obtained. | 2009-10-01 |
20090246950 | LASER ANNEALING METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A laser annealing method for manufacturing a semiconductor device is presented. The method includes at least two forming steps and one annealing step. The first forming steps includes forming gates on a semiconductor substrate. The second forming step includes forming an insulation layer on the semiconductor substrate and on the gates. The annealing step includes annealing the insulation layer using electromagnetic radiation emitted from a laser. | 2009-10-01 |
20090246951 | METHOD FOR PATTERNING A METALLIZATION LAYER BY REDUCING RESIST STRIP INDUCED DAMAGE OF THE DIELECTRIC MATERIAL - By forming a hardmask layer in combination with one or more cap layers, undue exposure of a sensitive dielectric material to resist stripping etch ambients may be reduced and integrity of the hardmask may also be maintained so that the trench etch process may be performed with a high degree of etch selectivity during the patterning of openings in a metallization layer of a semiconductor device. | 2009-10-01 |
20090246952 | METHOD OF FORMING A COBALT METAL NITRIDE BARRIER FILM - A method is provided for forming a cobalt metal nitride barrier film on a substrate for semiconductor devices. According to one embodiment of the invention, the method includes depositing a plurality of metal nitride layers on the substrate, and depositing a cobalt layer between each of the plurality of metal nitride layers. According to another embodiment of the invention, the method includes simultaneously exposing the substrate to a metal nitride precursor or a metal precursor, a cobalt precursor, and a reducing gas, nitriding gas, or a combination thereof. Embodiments for integrating a cobalt metal nitride barrier film into semiconductor devices are described. | 2009-10-01 |
20090246953 | Method for Manufacturing Semiconductor Device - It is an object of the present invention to provide a semiconductor device including a wiring having a preferable shape. A manufacturing method includes the steps of forming a first conductive layer connected to an element and a second conductive layer thereover; forming a resist mask over the second conductive layer; processing the second conductive layer by dry etching with the use of the mask; and processing the first conductive layer by wet etching with the mask left, wherein the etching rate of the second conductive layer is higher than that of the first conductive layer in the dry etching, and wherein the etching rate of the second conductive layer is the same as or more than that of the first conductive layer in the wet etching. | 2009-10-01 |
20090246954 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device, includes forming a plurality of core portions arranged in a predetermined direction, on a to-be-processed film, forming a stacked sidewall portion in which a first sidewall portion and a second sidewall portion are stacked in that order, on each of side surfaces, of each of the core portions, removing the core portions to form a structure having a first space between the adjacent first sidewall portions and a second space between the adjacent second sidewall portions, and retreating at least one of the first sidewall portion and the second sidewall portion by a desired retreat amount to slim the stacked sidewall portion, after removing the core portions. | 2009-10-01 |
20090246955 | WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS - A wafer processing method is provided comprising the steps of: holding a wafer ( | 2009-10-01 |
20090246956 | METAL POLISHING COMPOSITION AND CHEMICAL MECHANICAL POLISHING METHOD - The invention provides a metal polishing composition that is used in chemical mechanical polishing in production of a semiconductor device, and includes an oxidizing agent, an abrasive grain, and at least one compound selected from compounds represented by the following formula (I) and the following formula (II). The invention also provides a chemical mechanical polishing method that uses the metal polishing composition. In formula (I), R | 2009-10-01 |
20090246957 | POLISHING LIQUID AND POLISHING METHOD - A polishing liquid is provided with which a polishing rate relative to a conductive metal wiring typically represented by a copper wiring on a substrate having a barrier layer containing manganese and/or a manganese alloy and an insulating layer on the surface (particularly, copper oxide formed at the boundary) is decreased and with which less step height between the conductive metal wiring and the insulating layer is formed, and a polishing method using the polishing liquid is also provided. The polishing liquid includes: colloidal silica particles exhibiting a positive ζ potential at the surface thereof, a corrosion inhibiting agent; and an oxidizing agent, in which the polishing liquid is used in a chemical mechanical polishing process for a semiconductor device having, on a surface thereof, a barrier layer containing manganese and/or a manganese alloy, a conductive metal wiring, and an insulating layer. | 2009-10-01 |
20090246958 | METHOD FOR REMOVING RESIDUES FROM A PATTERNED SUBSTRATE - The present invention relates to a method for removing residues from open areas of a patterned substrate involving the steps of providing a layer of a developable anti-reflective coating (DBARC) over a substrate; providing a layer of a photoresist over said DBARC layer; pattern-wise exposing said photoresist layer and said DBARC layer to a radiation; developing said photoresist layer and said DBARC layer with a first developer to form patterned structures in said photoresist and DBARC layers; depositing a layer of a developer soluble material over said patterned structures; and removing said developer soluble material with a second developer. | 2009-10-01 |
20090246959 | TWO STEP OPTICAL PLANARIZING LAYER ETCH - Methods are provided for etching during fabrication of a semiconductor device. The method includes initially etching to partially remove a portion of one or more lithographic-aiding layers overlying an oxide layer while etching a first portion of the oxide layer in accordance with a mask formed by the one or more lithographic-aiding layers, and thereafter additionally etching to remove remaining portions of the one or more lithographic-aiding layers while etching a remaining portion of the oxide layer. | 2009-10-01 |
20090246960 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - In a method of fabricating a semiconductor device, an additive gas is mixed with an etching gas to reduce a fluorine ratio of the etching gas. The etching gas having a reduced fluorine rate is utilized in the process for etching a nitride layer formed on an oxide layer to prevent the oxide layer formed below the nitride layer from being etched along with the nitride layer. The method comprises primarily etching an exposed charge storage layer using an etching gas; and secondarily etching the charge storage layer using the etching gas under a condition that a ratio of fluorine contained in the etching gas utilized in the secondary etching step is less than a ratio of fluorine contained in the etching gas utilized in the primary etching step. Thus, the tunnel insulating layer formed below the charge storage layer is not damaged when the charge storage layer is patterned. | 2009-10-01 |
20090246961 | METHOD FOR FORMING PATTERN OF A SEMICONDUCTOR DEVICE - A method for forming a pattern of a semiconductor device includes: forming a first mask film and a second mask film over an underlying layer; partially etching the first and second mask films using a photoresist mask pattern as an etching mask to form a intermediate mask pattern having a protrusion shape and including first and second mask film layers, over a remaining portion of the first mask film; forming a first spacer at sidewalls of the intermediate mask pattern etching the remaining portion of the first mask film and the first mask film layer of the intermediate mask pattern using the first spacer and the second mask film layer of the intermediate mask pattern as an etching mask to expose the underlying layer and form a mask pattern having first and second mask film layers; forming a second spacer at sidewalls of the mask pattern; and removing the mask pattern to form a symmetrical spacer pattern. | 2009-10-01 |
20090246962 | SUBSTRATE PROCESSING METHOD - A substrate processing method for use in a substrate processing apparatus having a stocker therein which stores a multiplicity of dummy substrates; a reaction chamber for producing semiconductor products; and a transferring unit for transferring into the reaction chamber a process substrate and the dummy substrate stored in the stocker in order to form a film on the process substrate, the method includes transferring one dummy substrate selected among the dummy substrates stored in the stocker to the reaction chamber without being out of the apparatus; and introducing a cleaning gas into the reaction chamber to clean said one dummy substrate within the reaction chamber. | 2009-10-01 |
20090246963 | Exposure Apparatus Applying Polarization Illuminator and Exposure Method Using the Same - An exposure apparatus for transferring patterns on a phase shift mask into a wafer according to the present invention comprises a light source, a polarized light illuminator that selectively passes through a TM mode polarized light of light from the light source to cause it to be incident onto the phase shift mask, a polarization mode translator that translates the TM mode polarized light passing through the phase shift mask into TE mode polarized light, and a lens system irradiating the TE mode polarized light from the polarization mode translator on the wafer. | 2009-10-01 |
20090246964 | Etching process for phase-change films - The invention is directed to a method for etching a phase change material layer comprising steps of providing a phase change material layer and performing a first etching process on the phase change material layer. The etching process is performed with an etchant comprising a fluoride-based gas with a concentration of the fluoride-based gas up to 85% of a total volume of the etchant. | 2009-10-01 |
20090246965 | ETCHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - Provided is an etching method capable of increasing a selectivity of a polysilicon film with respect to a silicon oxide film and suppressing the formation of recesses in a silicon base material. A wafer includes a gate oxide film, a polysilicon film and a hard mask film having an opening sequentially formed on a silicon base material, and has a native oxide film in a trench of the polysilicon film corresponding to the opening formed thereon. The native oxide film is etched, so that the polysilicon film is exposed at a bottom portion of the trench. An ambient pressure is set to be 13.3 Pa, and O | 2009-10-01 |
20090246966 | Method of fine patterning semiconductor device - For integrated circuit fabrication, at least one spacer support structure is formed in a first area over a semiconductor substrate, and a mask material is deposited on exposed surfaces of the spacer support structure and on a second area over the semiconductor substrate. A masking structure is formed on a portion of the mask material in the second area, and the mask material is patterned to form spacers on sidewalls of the spacer support structure and to form a mask pattern under the masking structure. The spacer support structure and the masking structure are comprised of respective high carbon content materials that have been spin-coated and have substantially a same etch selectivity. | 2009-10-01 |
20090246967 | SEMICONDUCTOR SURFACE TREATMENT AGENT - A semiconductor surface treatment agent containing a fluorine compound, a water-soluble organic solvent and an inorganic acid, with the balance being water and a method for manufacturing a semiconductor device by etching a high dielectric constant insulating material using the subject semiconductor surface treatment agent are provided. According to the present invention, it is possible to selectively and efficiently etch a high dielectric constant insulating material to be used in a transistor formation process of the semiconductor device manufacture; and it is also possible to achieve etching with ease within a short period of time even for a high dielectric constant insulating material to which etching is hardly applied. | 2009-10-01 |
20090246968 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD - A substrate treating apparatus for performing treatment of substrates with a treating liquid. The apparatus includes a treating tank for storing the treating liquid and performing a predetermined treatment of the substrates; a treating liquid supply unit for supplying the treating liquid to the treating tank; a treating liquid discharge unit for discharging the treating liquid from the treating tank; a first storage unit for storing in advance an initial life count specifying an allowable number of treatments of the substrates to be carried out with the treating liquid after an entire liquid replacement which replenishes the treating tank with a new supply the treating liquid from the treating liquid supply unit; a second storage device for storing in advance a normal life count specifying an allowable number of treatments to be carried out with the treating liquid after reaching the initial life count and after a partial liquid replacement which discharges part of the treating liquid in a predetermined amount from the treating tank through the treating liquid discharge device and replenishes, from the treating liquid supply device, a new supply of the treating liquid in an amount corresponding to the predetermined amount; and a control device for performing treatment of the substrates until the initial life count is reached after the entire liquid replacement, and after the initial life count is reached and the partial liquid replacement is made, performing treatment of the substrates while making the partial liquid replacement each time the normal life count is reached. | 2009-10-01 |
20090246969 | METHOD FOR TEXTURING SILICON WAFERS FOR PRODUCING SOLAR CELLS - In a method for texturing silicon wafers for producing solar cells, the step of introducing a silicon wafer involves the use of a texturing solution which is at a temperature of at least 80 degrees Celsius and which comprises water admixed with 1 percent by weight to 6 percent by weight KOH or 2 percent by weight to 8 percent by weight NaOH and with a surfactant or a surfactant mixture constituting less than 0.01 percent by weight. Very economic texturing can be performed in this way. | 2009-10-01 |
20090246970 | FABRICATION OF SEMICONDUCTOR DEVICE OXIDE AT LOWER TEMPERATURE USING PRE-DISSOCIATED CHLOROHYDROCARBON - The invention provides a method of fabricating a semiconductor device. In one aspect, the method comprises heating a gas mixture comprising chlorohydrocarbon having a general formula of C | 2009-10-01 |
20090246971 | IN-SITU HYBRID DEPOSITION OF HIGH DIELECTRIC CONSTANT FILMS USING ATOMIC LAYER DEPOSITION AND CHEMICAL VAPOR DEPOSITION - An in-situ hybrid film deposition method for forming a high-k dielectric film on a plurality of substrates in a batch processing system. The method includes loading the plurality of substrates into a process chamber of the batch processing system, depositing by atomic layer deposition (ALD) a first portion of a high-k dielectric film on the plurality of substrates, after depositing the first portion, and without removing the plurality of substrates from the process chamber, depositing by chemical vapor deposition (CVD) a second portion of the high-k dielectric film on the first portion, and removing the plurality of substrates from the process chamber. The method can further include alternatingly repeating the deposition of the first and second portions until the high-k dielectric film has a desired thickness. The method can still further include pre-treating the substrates and post-treating the high-k dielectric film in-situ prior to the removing. | 2009-10-01 |
20090246972 | METHODS FOR MANUFACTURING HIGH DIELECTRIC CONSTANT FILM - Processes for making a high K (dielectric constant) film using an ultra-high purity hafnium containing organometallic compound are disclosed. Also described are devices incorporating high K films made with high purity hafnium containing organometallic compounds. | 2009-10-01 |
20090246973 | METHOD OF FORMING A STRESSED PASSIVATION FILM USING A NON-IONIZING ELECTROMAGNETIC RADIATION-ASSISTED OXIDATION PROCESS - A method for forming a stressed passivation film. In one embodiment, the method includes depositing a silicon nitride film over an integrated circuit structure on a substrate and embedding oxygen into a surface of the silicon nitride film by exposing the silicon nitride film to a process gas containing oxygen radicals formed by non-ionizing electromagnetic radiation induced dissociation of an oxygen-containing gas or an oxygen- and nitrogen-containing gas. The method further includes heat-treating the oxygen-embedded silicon nitride film to form a stressed silicon oxynitride film. | 2009-10-01 |
20090246974 | METHOD OF FORMING A STRESSED PASSIVATION FILM USING A MICROWAVE-ASSISTED OXIDATION PROCESS - A method for forming a stressed passivation film. In one embodiment, the method includes depositing a silicon nitride film over an integrated circuit structure on a substrate and embedding oxygen into a surface of the silicon nitride film by exposing the silicon nitride film to a process gas containing an oxygen-containing or an oxygen- and nitrogen-containing gas excited by plasma induced dissociation based on microwave irradiation via a plane antenna member having a plurality of slots, wherein the plane antenna member faces the substrate surface containing the silicon nitride film. The method further includes heat-treating the oxygen-embedded silicon nitride film to form a stressed silicon oxynitride film. | 2009-10-01 |
20090246975 | MULTIPLE TECHNOLOGY NODE MASK - A multiple technology node mask (MTM) is provided. An MTM includes a pattern associated with a first technology node and a pattern associated with a second technology node. The first technology node and the second technology node may be different. For example, the first technology node may be a main node and the second technology node a sub-node. A mask set including an MTM may also include single technology node masks (STMs) for mask layers in which the first technology node and second technology node and/or the patterns associated with each are not compatible. A single mask set including MTM and STMs, may be used to produce a plurality of devices, each on a different wafer. | 2009-10-01 |
20090246976 | Rotary Connector - Rotary electrical connector comprising a ring-shaped outside terminal having a circular inner circumference portion, a ring-shaped inside terminal having a circular outer circumference portion, which is concentric with the inner circumference portion of the ring-shaped outside terminal; and a rotatable ring-shaped connection terminal electrically connecting the outside terminal with the inside terminal; wherein the connection terminal elastically deforms along a radial direction thereof, an outer circumference portion of the connection terminal abuting the inner circumference portion of the outside terminal and the outer circumference portion of the inside terminal. | 2009-10-01 |
20090246977 | Electrical Hose Swivel Connector - An electrical hose swivel connector may be used to connect a vacuum hose to a hair clipping device. The hair clipping device may need power, which may be delivered from a power source and through a power cord. The power cord may be in electrical communication with this electrical hose swivel connector to deliver power to the hair clipping device. This electrical hose swivel connector can allow for easier use of the hair clipping device, which may be used with the vacuum hose without causing tangling, twisting, or knotting in the power cord. | 2009-10-01 |
20090246978 | Headrest system for a vehicle seat - The invention relates to a headrest system for a vehicle seat, said headrest system comprising a headrest ( | 2009-10-01 |
20090246979 | Magnetic connection and indexing device - The disclosure relates to the use of magnets, which may be permanent magnets or electromagnets, to align and physically connect two adjacent audio components, or similar electronic components. Alternatively, a groove or similar mechanical aligning configuration may be used in combination with the magnetic configuration. | 2009-10-01 |
20090246980 | BOARD-TO-BOARD ELECTRICAL CONNECTOR - An electrical connector includes a housing defining a connector mating interface. The housing holds a plurality of contact modules that cooperate to define a connector mounting interface. Each contact module contains signal leads and ground leads arranged in an alternating pattern of individual ground leads and pairs of signal leads positioned side-by-side with respect to a thickness of the contact module. The signal and ground leads have respective mating contacts proximate the mating interface and respective mounting contacts proximate the mounting interface. The mating and mounting contacts within each contact module are arranged in one of first and second contact patterns different from the pattern of the signal and ground leads. The mating and mounting contacts in adjacent contact modules are arranged in respective different ones of the first and second contact patterns. | 2009-10-01 |
20090246981 | CABLE ASSEMBLY - An electrical connector includes a flex circuit, and a spring-and-pressurized-gas mechanism for selectively pushing electrical contacts of the flex circuit against contacts of an interposer used to make electrical contact with a part to be electrically tested, a device under test (DUT). The mechanism includes a pair of pawls that are rotated to hook onto posts of the board to pull the electrical connector toward and into contact with the contacts of the interposer. The mechanism has a chamber for receiving pressurized gas, to push against a piston, to compress a spring that is mechanically coupled to and rotates the pawls. The mechanism is biased such that the electrical connector engages the interposer when gas pressure is removed, allowing the connector to remain engaged with interposer using only the forces from the spring. | 2009-10-01 |
20090246982 | Ic socket having detachable aligning element - An IC socket includes a socket body defining a first receiving cavity with a bottom wall, a cover attached pivotally on one end of the socket body and a locking member for locking the cover to the socket body. The IC socket further includes four detachable aligning elements mounted on four corners of the bottom wall. The four aligning elements have a plurality of positioning surfaces adapted for corporately defining a second receiving cavity for snugly accommodating an IC package therein. Different aligning elements with different dimensions can be replaced to mount on the socket body for different IC packages, thus a cost of manufacturing is reduced. | 2009-10-01 |
20090246983 | Integrated Circuit Socket Set - An integrated circuit socket set includes a package receiving unit and a package fixing unit. The package receiving unit includes an insulating housing provided with a plurality of contacts. The insulating housing includes a frame with a recess. The contacts at least partially extend into the recess. The package fixing unit includes a base plate and a load applying plate. The load applying plate is rotatable with respect to the base plate by movement of a lever. The lever has an arm arranged on one side of the base plate. The base plate is provided with an opening that receives the frame of the insulating housing. The opening in the base plate being formed such that the frame of the insulating housing is received in the base plate in an initial position and in a position wherein the base plate is rotated at least 90 degrees from the initial position. | 2009-10-01 |
20090246984 | Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments - A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards. | 2009-10-01 |
20090246985 | PASS-THROUGH ADAPTER WITH CRYPTO IGNITION KEY (CIK) FUNCTIONALITY - A pass-through adapter includes an adapter body having at least two connector pin interfaces, with one configured for coupling to an external device such as a communications device. Each connector pin interface includes a plurality of connector pins, including a plurality of pass-through connector pins operative with each other for in-line, pass-through signaling when the pass-through adapter is coupled to the external device. A crypto ignition key (CIK) circuit is contained within the adapter body and connected to at least one of the connector pins to provide a secure mode of operation for the external device. | 2009-10-01 |
20090246986 | Connector - The invention discloses a connector including a body and a circuit board. The body includes an accommodating space and a casing. The circuit board is disposed in the accommodating space. There is a grounding circuit area disposed on part of the circuit board. Part of the circuit board extrudes out of the casing. The casing is electrically connected to the grounding circuit area. | 2009-10-01 |
20090246987 | Electrical connector assembly with a FFC module - An electrical connector assembly comprises an insulative housing defining a receiving cavity extending inwardly from a mating face thereof and a plurality of terminal receiving passages disposed in the insulative housing and in communication with the receiving cavity. A plurality of terminals are received into the corresponding terminal receiving passages. A FFC module defines a pair of FFCs with a pair of first mating portions at one end thereof and an insulative insert having a lower half section disposed between the pair of first mating portions. The FFC module has an inserting portion received into the receiving cavity of the insulative housing. | 2009-10-01 |
20090246988 | CONTACT STRUCTURE AND FORMING METHOD THEREOF AND CONNECTING STRUCTURE THEREOF - A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad. | 2009-10-01 |
20090246989 | Electrical connector assembly with pick up cap - An electrical connector assembly includes a socket body defining a receiving cavity, a pick up cap attached detachably onto the socket body and a movable fixing mechanism surrounding the socket body. The fixing mechanism includes a rotatable cover defining an open position and a close position and having two pressing portions extending towards the receiving cavity of the socket body. The pick up cap covers all terminals in the socket body and includes a planar body having concaved portions for receiving the corresponding pressing portions to prevent the pressing portions from interfering with top surface of the planar body of the pick up cap. | 2009-10-01 |
20090246990 | Floating electrical connector assembly - An electrical connector assembly comprises a first connector and a second connector, the first connector comprises a first insulative housing defining a guide groove extending from the top face to the bottom face, and a plurality of first terminals received in the first passageways; The second connector comprises a second insulative housing defining a guide post adapted to mate with the guide groove for fastening the first connector and the second connector, and a plurality of second terminals received in the second passageways, wherein the guide post penetrates through the guide groove and the transition portion of each first terminal respectively engages with the engagement section of corresponding second terminal when assembled together. | 2009-10-01 |
20090246991 | ELECTRICAL CONNECTOR HAVING AUTOMATIC LEVER LOCK RELEASE - An electrical connector assembly includes a plug assembly for mating with a header. The plug assembly includes a plug housing and a lever, where the lever includes gear teeth which cooperate with a tooth on the header in a rack and pinion fashion. The lever is locked to the plug housing when the lever is poised for the plug housing to be inserted into the header. A release member on the header releases the lever from the locked position allowing the lever to be rotated to the position where the lever gear teeth mesh with the header tooth, to draw the plug assembly into the header. | 2009-10-01 |
20090246992 | ELECTRICAL CONNECTOR HAVING DISCONNECTION ASSIST - An electrical connector assembly includes a plug assembly for mating with a header. The plug assembly includes a plug housing and a lever, where the lever includes gear teeth which cooperate with a tooth on the header in a rack and pinion fashion. The lever is locked to the plug housing when the lever is poised for the plug housing to be inserted into the header. A release member on the header releases the lever from the locked position allowing the lever to be rotated to the position where the lever gear teeth mesh with the header tooth, to draw the plug assembly into the header. A cam on the lever also contacts a contact surface in the header, which pre-lifts the plug assembly during disconnection. | 2009-10-01 |
20090246993 | Push-push card connector - A card connector ( | 2009-10-01 |
20090246994 | 5PINPROAUDIO SSW1 - Generally, camera have two channels—one and two. A channel is used by hardwiring the output to a particular channel. The Switch allows the cameraman to switch between channel one and two without hardwiring the equipment. | 2009-10-01 |
20090246995 | CABLE CONNECTOR HAVING FLUID RESERVOIR - Embodiments of a cable connector are provided that include an inner connector assembly and an outer connector housing. In use, the cable connector securely fastens or splices together at least two cables or cable sections and in electrical communication while also providing fluid communication therebetween. The cable connector further protects, and preferably seals off, the connection interface between the cables or cable sections and from the environment. | 2009-10-01 |
20090246996 | RIGHT-ANGLE CONNECTOR - A connector forms a connection by inserting a socket connector and a plug connector into a housing. The housing is configured by integrally forming a plug insertion recessed part and a socket insertion recessed part in an L shape. A socket terminal of the socket connector, which is inserted in a socket insertion recessed part, is connected to and pinched by a plug terminal of the plug connector, which is inserted in and attached to the plug insertion recessed part. | 2009-10-01 |
20090246997 | Modified Electrical Cable Connector Assembly - An electrical connector comprises a plug and socket electrical connector which includes two contact inserts each of which is separately adapted to be snap-fitted and held within a backing shell. The contact inserts can be joined together to form an electrical connection, and are held together by a first locking mechanism such as a bayonet and socket arrangement. A second locking mechanism is provided comprising a mated pair of coupling rings which are adapted to surround the contact insert connection. | 2009-10-01 |
20090246998 | SHIELDED ELECTRICAL CONNECTOR WITH LATCH MEANS - An electrical connector ( | 2009-10-01 |
20090246999 | ELECTRICAL CONNECTOR LATCH WITH SPRING - An electrical connector has a latch mechanism that includes a pair of hooks that move resiliently outward from the center line of the connector, and a pair of axial springs mechanically coupled to latch mechanism. The axial springs provide force in a direction substantially parallel to the center line of the connector. The axial springs are compressed during initial parts of the process of mating of the connector with a receptacle or other connector. The energy from the compressed springs is then used to pull the connector and the receptacle more tightly together after the initial insertion. The spring forces maintain a tight grip between the connector and the receptacle, avoiding the play that is generally found in hook-based electrical connector latching mechanism. The latching mechanism provides a secure mechanical coupling between the connector and the receptacle, such as been previously obtained in screw-based couplings. | 2009-10-01 |
20090247000 | CONNECTOR ASSEMBLY WITH A LOW PROFILE TERMINAL POSITION ASSURANCE MEMBER - An electrical connector assembly is described which has an electrical connector housing and a TPA. The electrical connector housing has terminal receiving cavities with openings which access the cavities. Latching projections are located within the openings. A TPA is insertable into the electrical connector housing and has latching which cooperates with the latching projections. | 2009-10-01 |
20090247001 | FEMALE TERMINAL AND CHAIN TERMINAL THEREOF - A female terminal, includes: a tubular portion which is formed by bending a metal sheet into a tubular shape; a peripheral wall which has a trapezoidal cross section having a pair of opposed shorter and longer sides to form a space extending in an axial direction of the female terminal inside the tubular portion; and a spring portion for pressing a male terminal inserted in the space, in a direction toward the shorter side of the peripheral wall. A maximum width of the male terminal is longer than the shorter side and is shorter than the longer side. | 2009-10-01 |
20090247002 | Electrical socket with emergency lighting - An electrical socket with emergency lighting is provided, including a casing, a circuit board, at least one light-emitting diode, at least two conductive terminals, and a power storage unit. The circuit board, the power storage unit, the at least one light-emitting diode, and the at least two conductive terminals are arranged inside the casing and are electrically connected to one another. The at least two conductive terminals are arranged in locations corresponding to at least two openings and at least two plug holes defined in the casing. As such, an electric socket with emergency lighting is provided. | 2009-10-01 |
20090247003 | Electric Wire Connection Structure - An electric flat cable wire connection structure for connecting to a mating connector has a plurality of individual electric wires, a plate-shaped intermediate member, a contact part, and a coupler. The plurality of individual electric wires are arranged in a row. The plate-shaped intermediate member has an electric wire connecting part to which the respective ends of the plurality of individual electric wires are connected. The contact part is received by the mating connector. The coupler grasps the intermediate member to which the plurality of individual electric wires are connected for guiding the intermediate member to a predetermined position of the mating connector. | 2009-10-01 |
20090247004 | BATTERY CONNECTOR - A battery connector includes an insulating body and a conductive terminal. The conductive terminal is disposed within a receiving space of the insulating body, and includes a fixing portion, a U-shape contacting portion, an elastic portion, and a leaning portion. The fixing portion is fixed within the receiving space. The U-shape contacting portion has a slot defining two U-shape elastic arms. The U-shape elastic arms protrude from an opening of a sidewall of the insulating body. The elastic portion connects between one end of the U-shape contacting portion and the fixing portion. The leaning portion connects with the other end of the U-shape contacting portion. A width of the leaning portion is larger than that of the opening, and the leaning portion leans against the sidewall near the opening. | 2009-10-01 |
20090247005 | Wire Distributed 5th Jaw System For Multi-Position Metering - The present invention relates generally to multi-position metering apparatus. More particularly, the invention encompasses a wire distributed 5th jaw system for multi-position metering. The present invention is also directed to a novel multi-position metering device with multiple optional 5th terminals. The invention further provides a way to use a single wire as potential to connect all 5th terminals in a multi-position metering device. A single wire with insulation, one end of which is connected to line neutral, is laid out to pass by all meter sockets through designated channel on each meter socket base. The single wire is then stripped on a specified area when it passes on each meter socket for electrical connection to a 5th terminal through a potential. Additionally, an inventive meter socket base has been designed to constraint the 5 | 2009-10-01 |
20090247006 | NETWORK ACCESS POINT HAVING INTERCHANGEABLE CARTRIDGES - Disclosed is multimedia system having at least one network access point comprising two discrete, but interrelated, components, a communications module and a device interface cartridge whereby in combination implement a network access point to accommodate via a medium. The interface cartridge is interchangeable to permit the access point to be customized to a desired application. | 2009-10-01 |
20090247007 | PATCH PANEL FRAME WITH BEZEL AND REAR MOUNTED MODULE - There is provided a patch panel for mounting thereto a plurality of keystone style modular jacks each comprising a forward portion having a plug receiving opening moulded therein. The patch panel comprises a flat frame comprising a first plurality of like rectangular openings, each one of the first plurality of openings adapted to receive one of the plurality of jacks, and a bezel arranged behind the frame substantially co-planar therewith and comprising a second plurality of like rectangular openings, each one of the second plurality of openings aligned with and of dimensions greater than one of the first plurality of openings. The bezel has a width for accommodating the forward portion of the plurality of jacks when the plurality of jacks are received in aligned pairs of the first and the second plurality of openings. When one of the plurality of jacks is positioned within one of the second plurality of openings, the plug receiving opening is accessible via one of the first plurality of openings. | 2009-10-01 |
20090247008 | RECEPTACLE RF CONNECTOR HAVING INTERFERENTIAL ENGAGEMENT BETWEEN CONTACT TERMINAL AND HOUSING - A receptacle RF connector ( | 2009-10-01 |
20090247009 | Coaxial connector and a structure for attaching the coaxial connector to a connector housing - A coaxial connector having excellent shielding performance. The coaxial connector | 2009-10-01 |
20090247010 | Method and Apparatus to Provide Electromagnetic Interference Shielding of Optical-Electrical Module - A pluggable optical/electrical module is disclosed. One or more features operate to decrease electromagnetic interference are implemented, which features include deforming the portions that mate together to form the housing, placing elbow deformities on extending fingers to more properly seal the housing convex shape to housing to seal gaps between multiple sections, and placing an EMI insulating material within an opening that is formed for the latch that locks the module in place in a chassis. | 2009-10-01 |
20090247011 | CONNECTOR ASSEMBLY HAVING PRIMARY AND SECONDARY LOCKING FEATURES - A connector assembly includes a housing having a cavity defined by at least one wall. The cavity extends between a mating end and a loading end. The housing has a terminal latch associated with the cavity, and the at least one wall has a projection extending into the cavity. A terminal is loaded into the cavity through the loading end and is held within the cavity by the terminal latch. The terminal includes body having an opening, wherein the projection extends at least partially into the opening to secure the terminal within the cavity. | 2009-10-01 |
20090247012 | High speed electrical connector having improved housing - An electrical connector ( | 2009-10-01 |
20090247013 | SHIELD CONNECTOR FOR PRINTED CIRCUIT BOARD - The present invention provides a shield connector for a printed circuit board, in which the disengagement of an outer shield shell from a connector housing is prevented, and also an anti-noise performance is enhanced. The shield connector includes a resin connector housing having a rectangular solid shape including a top-surface, a right-side-surface, a left-side-surface, a back-surface, and an opening; a terminal provided in the connector housing so as to be connected a connector through the opening; and a shield shell including a top-plate covering the top-surface, a right-side-plate covering the right-side-surface, a left-side-plate covering the left-side-surface, and a rear-plate covering the back-surface. The each of the right-side-surface and the left-side-surface includes an engagement portion positioned at the front lower end portion thereof, and each of the right-side-plate and the left-side-plate includes a hook positioned at the front lower end portion thereof and engaged with the engagement portion. | 2009-10-01 |
20090247014 | Electrical connector having a shell with a portion retained in an insulative housing - An electrical connector ( | 2009-10-01 |
20090247015 | Electrical component holder - An electrical component holder contains an electrical component to be connected to an internal circuit of a vehicle-installed electrical junction box. The holder has a casing main body and a lid to be mounted on an upper surface of the casing main body. The casing main body has a box-like configuration that is open at a lower end so that the casing main body can be placed on an electrical component mounting section of the electrical junction box. The casing main body has an upper wall that defines a through-hole that receives and holds a support portion of a terminal member of the electrical component. The support portion of the terminal member is inserted into and secured to the through-hole so that the terminal member projects into a hollow interior of the casing main body. The terminal member is inserted into and secured to a terminal aperture in the electrical component mounting section, under the condition that the casing main body is attached to the electrical component mounting section. | 2009-10-01 |
20090247016 | TEMPORARY CONNECT - A temporary connect enables a structure to receive electrical power via a simple extension cord before a utility meter is installed. The temporary connect incorporates the form factor of a standard power meter and mounts to the meter cabinet. It includes a standard male connector or breaker, fuse or lug recessed within a base. A female end of an extension cord may be plugged into the male connector, and the opposite end may be plugged into a temporary meter pole or other power source. The temporary connect connects the prongs of the connector to the load leads of the meter cabinet, but isolates the connector and load prongs from the line leads. The structure thereby can easily receive power for testing the circuits, lights, and other devices. When construction is complete, the temporary connect can be easily removed and replaced with a permanent power meter. | 2009-10-01 |
20090247017 | ELECTRICAL CONNECTOR WITH DUAL-INTERFACE - An electrical connector assembly ( | 2009-10-01 |
20090247018 | MEDICAL ELECTRICAL LEAD CONNECTION SYSTEMS AND METHODS - An electrical connection assembly of a medical device includes a plurality of electrical contact blocks and a sealing member, which are held within a cavity of a base of the assembly. The sealing member includes a plurality of openings, at least one interior surface surrounding a bore and at least one void. Each electrical contact block extends into a corresponding opening of the sealing member, and a conductive sidewall of each block defines a portion of a perimeter of an area for receiving a lead connector, while the bore of the sealing member forms another portion of the perimeter of the area. The at least one void provides a compressible space in a bulk volume of the sealing member. When the lead is inserted within the area, and a cap is engaged with the base, the at least one interior surface of the sealing member is compressed about the lead. | 2009-10-01 |
20090247019 | Expansion connection module for connecting to at least two coil connectors of an electromagnetic switching device, in particular a contactor - An expansion connection module is disclosed for connecting to at least two coil connectors of an electromagnetic switching device, in particular a contactor. In at least one embodiment, the expansion connection module includes a housing; at least one fastening device for fixing the expansion connection module to the electromagnetic switching device or to a switchgear unit positioned adjacent to the electromagnetic switching device; at least two connection openings and at least two terminal blocks associated with the at least two connection openings for the purpose of connecting voltage supply lines; and at least two flexible leads for electrically connecting the terminal blocks of the expansion connection module to the at least two coil connectors of the electromagnetic switching device. | 2009-10-01 |
20090247020 | BATTERY CLAMP FOR USE WITH TOP POST AND SIDE POST BATTERIES AND METHODS FOR USING THE SAME - A battery clamp for use with (a) batteries with top post terminal connections and (b) batteries with side post terminal connections includes a first jaw handle and a second jaw handle. The jaw handles each have a handle portion and a clamping portion. The jaw handles are pivotally coupled to each other and are biased with the clamping portions in a closed position. The battery clamp further includes a first jaw member and a second jaw member. The jaw members have a jaw clamp portion, a jaw pivot portion, and a jaw wire portion. The jaw pivot portion of the first jaw member and the jaw pivot portion of the second jaw member are both pivotally coupled to the jaw handles. The battery clamp further includes a load pad and a volt rod. The load pad has an aperture and is coupled to the first jaw member. The volt rod is coupled to the second jaw member and protrudes through the aperture of the load pad. | 2009-10-01 |
20090247021 | CONDUCTIVE ELASTIC SHEET STRUCTURE AND ELECTRONIC DEVICE USING THE SAME - The invention discloses a conductive elastic sheet structure mounted on a metallic cover of an electronic device eliminates static electricity. The conductive elastic sheet structure includes a main panel, a first extending portion, and a second extending portion. The main panel includes a first side wall, and a second side wall opposite to the first side wall. The first extending portion and the second extending portion extend from the side edges of the first side wall and the second side wall respectively, and each forms a sharp angle with the main panel. The first extending portion and the second extending portion extend from two opposite sides of the main panel respectively. The invention also provides an electronic device using the conductive elastic sheet structure. | 2009-10-01 |
20090247022 | Contact block at the end of an electrode support for forming a component of an electric oven - The aim of the invention is the reduction of the impairment in current transfer from the contact plate ( | 2009-10-01 |
20090247023 | ELECTRICAL CONTACT - An electrical contact ( | 2009-10-01 |
20090247024 | CONNECTOR STRUCTURE WITH A U-SHAPED CROSS SECTION HAVING A MALE TERMINAL AND A FEMALE TERMINAL - A male terminal | 2009-10-01 |
20090247025 | BOAT PROPULSION UNIT - A boat propulsion unit includes a power source, a propeller, a shift position switching mechanism, a control device, and a retention switch. The propeller is driven by the power source to generate propulsive force. The shift position switching mechanism has an input shaft connected to a side of the power source, an output shaft connected to a side of the propeller, and clutches that change a connection state between the input shaft and the output shaft. A shift position of the shift position switching mechanism is switched among forward, neutral, and reverse by engaging and disengaging the clutches. The control device adjusts an engagement force of the clutches. The retention switch is connected to the control device. When the retention switch is turned on by an operator, the control device controls the engagement force of the clutches to retain a hull in a predefined position. The boat propulsion unit provides a boat propulsion unit that can accurately retain a boat at a fixed point. | 2009-10-01 |
20090247026 | BOAT PROPULSION UNIT - A boat propulsion unit includes a power source, a propeller, a shift position changing mechanism, a control device, and a speed reducing switch. The shift position changing mechanism has an input shaft, an output shaft, and first and second clutches. The first and second clutches change the connection state between the input shaft and the output shaft. In the shift position changing mechanism, the first and second clutches are engaged or disengaged, thereby changing the shift position among forward, neutral, and reverse. The control device controls connecting forces of the first and second clutches so that the propeller generates propulsive forces in the direction opposite to the present propulsive direction of a hull when the speed reducing switch is turned on by the operator of the boat. The boat propulsion unit easily retains the propulsive speed of a hull substantially at zero. | 2009-10-01 |
20090247027 | Motorized Push Pole Device - A motorized push pole device having a standard mounted to a raised poling platform on a boat. A housing is mounted to the standard wherein the housing is adapted to removably clamp around a push pole. A drive wheel is mounted under the housing, wherein a periphery of the drive wheel is in contact with the push pole and adapted to rotate in a first direction causing push pole to move in an extendable motion and the drive wheel adapted to rotate in an opposing second direction causing push pole to move in a retractable motion. An electrical switch is connected to a motor for controlling operation of the motor for rotating the drive wheel. The motor includes a rotating motor shaft terminating in a worm gear. The drive wheel further comprising a cog wheel for engaging the worm gear of the motor. | 2009-10-01 |
20090247028 | Marine Drive - A stern drive for a boat has inboard and outboard portions, the outboard portion having a propeller rotatably disposed thereon, and the inboard portion being adapted to receive rotational power about a motor output drive axis to rotationally drive the propeller. A mounting structure is operative to secure the inboard portion to the stern of a boat in a manner permitting the inboard and outboard portions to be rotated about the motor output drive axis for steering purposes. The outboard portion of the stern drive is rotatable relative to the inboard portion, about a second axis transverse to the motor output drive axis, in raising/lowering/trimming directions. | 2009-10-01 |
20090247029 | Engine control system for jet-propulsion boat, jet-propulsion boat incorporating same, and method of using same - An engine control system, for controlling an engine of a jet-propulsion boat, includes a cavitation-control-mode determination unit, which starts a cavitation-control mode when an engine speed not faster than 3200 rpm is maintained for a predetermined time period. During a normal sailing operation, ignition timing is set by a first ignition-timing setting unit. Upon detection of a cavitation-control-mode by the cavitation-control-mode determination unit, an engine speed is raised up to a speed not slower than 3200 rpm, which makes an ignition-timing switching unit to select a second ignition-timing setting unit. The second ignition-timing setting unit retards the ignition timing for the normal sailing operation when the engine speed becomes 6500 rpm or faster. In addition to retardation of the ignition timing, a boost pressure control command upper-limit value is switched to a value at a startup operation, which is less than a value at the normal sailing operation. | 2009-10-01 |
20090247030 | Fabric For Airbags - To provide at a low cost a fabric for airbags, one of safety devices for automobiles, in which both edgecomb resistance and tear strength (factors affecting inflating properties of an airbag) are improved. Preferably, to provide a fabric for airbags which is capable of being recycled as easily as an uncoated fabric and a fabric for airbags which has self-extinguishing property. | 2009-10-01 |
20090247031 | Multiaxial Fabric for Ballistic Applications - The invention concerns multiaxial fabrics comprising a first layer comprising a plurality of first yarns being substantially parallel in a first direction; a second layer comprising a plurality of second yarns being substantially parallel in a second direction and skew of off-set with respect to the first yarns; a third yarn layer comprising a plurality of third yarns being substantially parallel in a third direction and skew of off-set with respect to the first yarns and second yarns; a fourth yarn layer comprising a plurality of fourth yarns being substantially parallel in a fourth direction and skew of off-set with respect to the first, second and third yarns; at least one fiber network layer; and a transverse yarn interlaced transversely within the multiaxial fabric where each layer may be arranged in any sequential order and optionally coated with a high viscosity polymer that has a glass transition temperature Tg in the range of about −40 to about 0° C., and a zero shear melt viscosity of about 2×10 | 2009-10-01 |
20090247032 | Resin composition, prepreg and metal-foil-clad laminate - A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl type cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e), which resin composition is for use in a printed wiring board for high multilayer and high frequency and is improved in moldability and copper foil peel strength, which are conventional problems, without any decrease in electric characteristics and heat resistance after moisture absorption while keeping flame retardancy, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film. | 2009-10-01 |
20090247033 | FIBERS MADE FROM COPOLYMERS OF ETHYLENE/a-OLEFINS - A fiber is obtainable from or comprises a blend of a propylene based polymer and an ethylene/α-olefin interpolymer characterized by an elastic recovery, Re, in percent at 300 percent strain and 1 cycle and a density, d, in grams/cubic centimeter, wherein the elastic recovery and the density satisfy the following relationship: Re>1481−1629(d). Such interpolymer can also be characterized by other properties. The fibers made therefrom have a relatively high elastic recovery and a relatively low coefficient of friction. The fibers can be cross-linked, if desired. Woven, knitted or non-woven fabrics can be made from such fibers. | 2009-10-01 |
20090247034 | Fiber Architecture for Pi-Preforms - A woven preform for a reinforces composite material, which may be woven flat and folded into a shape. The preform has a three-dimensional weave architecture with fill fibers woven to provide layer-to-layer interlocking of layers of warp fiber as well as interlocking of fibers within each layer. At least two legs extend from a base, the base and legs each having at least two layers of warp fibers. The legs can be connected at a symmetrical or asymmetrical, distributed-column intersection, with an even or odd number of columns of warp fibers being located between the legs. The outer ends of the base and/or legs preferably have tapers formed from terminating layers of warp fibers in a stepped pattern. | 2009-10-01 |
20090247035 | PIPD Comfort Fabrics and Articles Made Therefrom - The invention concerns a fabric useful in apparel and garments comprising an intimate blend of staple fibers, the blend of fibers comprising 55 to 95 parts by weight of a polypyridobisimidazole fiber having an inherent viscosity of greater than 20 dl/g and a tensile modulus of greater than 120 GPa (820 gpd); and 5 to 45 parts by weight of a flexible fiber having a tensile modulus of less than 10 GPa (70 gpd). | 2009-10-01 |
20090247036 | Thermoplastic Starch for Use in Melt-Extruded Substrates - A melt-extruded substrate (e.g., film, nonwoven web, etc.) that contains a thermoplastic starch formed from a starch and plasticizer is provided. The starch and plasticizer are melt blended together in the presence of a weak organic acid (e.g., lactic acid, formic acid, acetic acid, etc.). By selectively controlling certain parameters of the melt blending process (e.g., extrusion temperature, content of the components, etc.), the present inventors have discovered that the starch may be hydrolyzed in a highly efficient manner to form compositions having a comparably lower weight average molecular weight, polydispersity index, and viscosity, which are particularly suitable for use in the formation of melt-extruded substrates. | 2009-10-01 |
20090247037 | URETHANE FOAM REINFORCING MATERIAL - The present invention provides a reinforcing material for urethane foam which effectively protects a molded urethane foam body and suppresses fricatives with a metal spring, having high productivity and excellent handleability and being applicable to a molded urethane foam body with highly uneven shape at low cost. | 2009-10-01 |
20090247038 | DECORATIVE PLATE AND METHOD FOR MANUFACTURE THEREOF - Provided is a thermosetting resin decorative plate comprising a decorative sheet comprising a base material and a picture layer formed thereon, wherein the base material is a nonwoven fabric comprising chemical fibers or a mixed paper of chemical fibers and pulps, and the above decorative plate makes it possible to work a three-dimensional form. | 2009-10-01 |
20090247039 | INTRINSICALLY CONDUCTIVE THERMOPLASTIC COMPOSITION AND COMPOUNDING PROCESSING FOR MAKING CONDUCTIVE FIBER - A conductive thermoplastic composition capable of forming conductive fibers including monofilaments, methods of making these compositions, and fibers including these compositions. The conductive thermoplastic compositions may be formed using any method capable of forming the compositions into fibers. The fibers are substantially smooth and/or are capable of being woven into fabrics or other articles to provide conductive properties to the fabric or article. These fibers provide effective static charge dissipation that may be imparted into applications such conveying belts or protective clothing for clean room operation. | 2009-10-01 |
20090247040 | FLAT PANEL DISPLAY AND METHOD OF FABRICATING THE SAME - A flat panel display and method of fabricating the same are disclosed. The flat panel display includes a first substrate having a pixel region; a light-emitting element located on the pixel region; a second substrate located opposite the first substrate; and a sealant located between the first and second substrates to cover the light-emitting element. At least one of the first and second substrates includes a groove formed around at least a portion of the circumference surrounding the pixel region. When the first and second substrates are pressed together with the sealant between them, the sealant spreads, covering the light-emitting element, and at least partially filling the groove. | 2009-10-01 |
20090247041 | Throwing Disc - A throwing disc includes an elliptical, continuous, flexible frame which changes shape during flight. The flexible frame defines a central opening through the thickness thereof. The flexible frame has an arched shape with a height that changes during flight and which defines a three dimensional cavity situated at the bottom side of the frame to provide lift to the throwing disc during flight. | 2009-10-01 |