38th week of 2008 patent applcation highlights part 46 |
Patent application number | Title | Published |
20080227271 | Method of manufacturing bonded wafer - The present invention provides a method of manufacturing a bonded wafer. The method includes ozone washing two silicon wafers to form an oxide film equal to or less than 2.2 nm in thickness on each surface of the two silicon wafers, and bonding the two silicon wafers through the oxide films formed to obtain a bonded wafer. | 2008-09-18 |
20080227272 | Wafer dividing method - A method of dividing a wafer having a plurality of streets which are formed in a lattice pattern on the front surface and having devices which are formed in a plurality of areas sectioned by the plurality of streets into individual devices along the streets, the method comprising the steps of applying a laser beam of a wavelength having permeability for the wafer along the streets to form a deteriorated layer along the streets in the inside of the wafer; forming a groove in areas corresponding to the streets from the rear side of the wafer; and exerting external force to the wafer where the deteriorated layer and the groove have been formed along the streets to divide the wafer into individual devices along the streets where the deteriorated layers and the grooves have been formed. | 2008-09-18 |
20080227273 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes: a) forming a first semiconductor layer on a semiconductor substrate; b) forming a second semiconductor layer on the first semiconductor layer; c) forming a first groove exposing a side of the first semiconductor layer by partially etching the first semiconductor layer and the second semiconductor layer; d) forming a cavity between the semiconductor substrate and the second semiconductor layer by etching the first semiconductor layer through the first groove under an etching condition in which the first semiconductor layer is more easily etched than the second semiconductor layer; e) respectively forming a third semiconductor layer on an upper surface of the semiconductor substrate and a lower surface of the second semiconductor layer that are facing an inside of the cavity while leaving a space in the cavity; and f) thermally oxidizing the third semiconductor layer so as to form a buried oxide film in the cavity. | 2008-09-18 |
20080227274 | MANUFACTURING METHOD OF DISPLAY DEVICE - In crystallization of a silicon film by annealing using a linear-shaped laser beam having a width of the short axis of the beam is ununiform, the profile (intensity distribution) of the laser beam is evaluated and the results are fed back to a condition of oscillating the laser beam or an optical condition for projecting the laser beam onto the silicon film, whereby a display device comprising a high-quality crystalline silicon film is manufactured. The energy distribution of the linear-shaped laser beam is determined by a detector type CCD camera which is moved stepwise in the directions in which its long axis and short axis extend, respectively, and a value obtained by dividing an accumulated intensity E in the long axis direction obtained by accumulating the detected signal in the direction parallel to the short axis by the square root of the width W of the short axis of the above linear-shaped laser beam in each position of the long axis: E/√{square root over ( )}(W), is determined in all the positions of a cross section of the linear-shaped laser beam to evaluate the above intensity distribution. | 2008-09-18 |
20080227275 | METHOD AND DEVICE WITH DURABLE CONTACT ON SILICON CARBIDE - A Schottky barrier silicon carbide device has a Re Schottky metal contact. The Re contact | 2008-09-18 |
20080227276 | Silicon Substrate With Reduced Surface Roughness - The present disclosure provides a method for fabricating a semiconductor device including providing a semiconductor substrate comprising a first surface and a second surface, wherein at least one imaging sensor is located adjacent the first surface, activating a dopant layer in the semiconductor substrate adjacent the second surface using a localized annealing process, and etching the dopant layer | 2008-09-18 |
20080227277 | Method of manufacturing semiconductor element - A method of manufacturing a semiconductor element includes implanting ions of a dopant having a large diffusion coefficient into a semiconductor to provide a doped layer; and irradiating the doped layer with a plurality of pulsed laser beams supplied by a plurality of laser irradiation devices to activate the doped layer and provide an activated doped layer. The activated doped layer may be one of a single doped layer or a plurality of successive doped layers which each have respective conduction types that are one of identical or different. Device breakage and failure of the manufactured semiconductor element due to heat induced during laser irradiation are substantially prevented by this method. | 2008-09-18 |
20080227278 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device including an NMOS transistor and a PMOS transistor is provided. The method includes: forming a silicon layer over a substrate through a gate insulating film; forming a first gate electrode and a second gate electrode by patterning the silicon layer, the first gate electrode being a gate electrode of the NMOS transistor, and the second gate electrode being a gate electrode of the PMOS transistor; selectively forming a silicon oxide film on the first gate electrode which is formed of silicon; after the selectively forming the silicon oxide film, forming a first metallic layer formed of a metal capable of forming a silicide over the first and second gate electrodes; and performing a first heat treatment such that a first silicide layer of a silicide of the first metallic layer is formed. | 2008-09-18 |
20080227279 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - According to the present invention, it is provided a method of manufacturing a semiconductor device comprising a PMOS transistor and a NMOS transistor, wherein the method facilitates obtaining a FUSI phase of a suitable composition for the NMOS transistor and the PMOS transistor respectively, with fewer mask layers and through a fewer number of manufacturing steps | 2008-09-18 |
20080227280 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - According to the present invention, it is provided a method of manufacturing a semiconductor device comprising a PMOS transistor and an NMOS transistor, wherein the method facilitates obtaining a full silicide phase of a suitable composition for the NMOS transistor and the PMOS transistor respectively, with fewer mask layers and through a fewer number of manufacturing steps. | 2008-09-18 |
20080227281 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH RECESS GATE - A method for fabricating a semiconductor device includes forming a sacrificial layer having a stack structure of a first insulation layer, a first conductive layer and a second insulation layer over a substrate, forming a recess by etching the sacrificial layer and the substrate, forming a gate insulation layer over a recess surface, filling a second conductive layer in the recess and between etched sacrificial layers, forming a gate electrode metal layer, a gate hard mask layer and a gate mask pattern over a resultant substrate, etching layers formed below the gate mask pattern by using the gate mask pattern until the first conductive layer is exposed, thereby forming an initial gate pattern, forming a capping layer on a sidewall and a top portion of the initial gate pattern, and etching an exposed portion by using the capping layer as a mask until the first insulation layer is exposed, thereby forming a final gate pattern. | 2008-09-18 |
20080227282 | METHOD OF MANUFACTURING NON-VOLATILE MEMORY - A non-volatile memory is provided. A substrate having a number of trenches and a number of select gates is provided. The trenches are arranged in parallel and extend in a first direction. Each of the select gates is disposed on the substrate between two adjacent trenches respectively. A number of select gate dielectric layers are disposed between the select gates and the substrate. A number of composite layers are disposed over the surface of the trenches and each composite layer has a charge trapping layer. A number of word lines are arranged in parallel in a second direction, wherein each of the word lines fills the trenches between adjacent select gates and is disposed over the composite layers. | 2008-09-18 |
20080227283 | SELF-ALIGNED METAL TO FORM CONTACTS TO Ge CONTAINING SUBSTRATES AND STRUCTURE FORMED THEREBY - A method for forming gennano-silicide contacts atop a Ge-containing layer that is more resistant to etching than are conventional silicide contacts that are formed from a pure metal is provided. The method of the present invention includes first providing a structure which comprises a plurality of gate regions located atop a Ge-containing substrate having source/drain regions therein. After this step of the present invention, a Si-containing metal layer is formed atop the said Ge-containing substrate. In areas that are exposed, the Ge-containing substrate is in contact with the Si-containing metal layer. Annealing is then performed to form a germano-silicide compound in the regions in which the Si-containing metal layer and the Ge-containing substrate are in contact; and thereafter, any unreacted Si-containing metal layer is removed from the structure using a selective etch process. In some embodiments, an additional annealing step can follow the removal step. The method of the present invention provides a structure having a germano-silicide contact layer atop a Ge-containing substrate, wherein the germano-silicide contact layer contains more Si than the underlying Ge-containing substrate. | 2008-09-18 |
20080227284 | Wire bonding method and related device for high-frequency applications - A wire bond circuit device has a circuit die in which substantially all of the input/output (I/O) pads are disposed along the outermost row of pads. A substrate onto which the die is disposed has wedges that are similarly arranged in rows, with the wedges used to carry I/O placed closest to the circuit die. As a result, lowest-tiered bond wire is used to connect the I/O-related pads to their respective wedges. | 2008-09-18 |
20080227285 | WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE - A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a stable contact between the bond wire and the copper pad in at least one of an oxidizing environment and an environment with temperatures up to at least about 350° C. | 2008-09-18 |
20080227286 | METHOD FOR MANUFACTURING AN INTERCONNECTION STRUCTURE WITH CAVITIES FOR AN INTEGRATED CIRCUIT - The invention relates to a method for manufacturing a structure of electrical interconnections of the damascene type for an integrated circuit, comprising at least one level of interconnections, consisting of electrical conductors arranged on a substrate and separated from one another by air gaps, a layer of electrically isolating material covering the level of interconnections, the method comprising steps consisting of:
| 2008-09-18 |
20080227287 | Method For Dual Damascene Process - The present disclosure provides a method of dual damascene processing. The method includes providing a substrate having vias formed therein; forming an under-layer in the vias and on the substrate; applying a solvent washing process to the under-layer; forming a silicon contained layer on the under-layer; patterning the silicon contained layer (SCL) to form SCL openings exposing the under-layer within the SCL openings; and etching the substrate and the under-layer within the SCL openings to form trenches. | 2008-09-18 |
20080227288 | Dual damascene process - A dual damascene process. A first photoresist layer with a first opening corresponding to a trench pattern is formed on a dielectric layer. A second photoresist layer with a second opening corresponding to a via pattern smaller then the trench pattern is formed on the first photoresist layer and extends to a portion of the dielectric layer. The second photoresist layer has a material character different from the first photoresist layer. A via etching process using the second photoresist as a mask is performed to form a via hole passing through the dielectric layer. A photoresist ashing process is performed to remove the second photoresist layer. A trench etching process using the first photoresist layer as a mask is performed to form a trench in the upper portion of the dielectric layer. The via etching process, the photoresist ashing process and the trench etching process are performed as a continuous process in one chamber. | 2008-09-18 |
20080227289 | Method of Fabricating Integrated Circuitry - The invention includes methods of fabricating integrated circuitry. In one implementation, at least two different elevation conductive metal lines are formed relative to a substrate. Then, interconnecting vias are formed in a common masking step between, a) respective of the at least two different elevation conductive metal lines, and b) respective conductive nodes. Interconnecting conductive metal is provided within the interconnecting vias. Other aspects and implementations are contemplated. | 2008-09-18 |
20080227290 | Semiconductor Device and Method for Fabricating the Same - A method of fabricating a semiconductor device includes forming a barrier film over a semiconductor substrate and over a gate disposed on the substrate; forming a metal layer over the barrier film; selectively etching the metal layer and the barrier film to form a contact pattern between the gates; forming a spacer over a sidewall of the contact pattern; forming an interlayer insulating film over the contact pattern and the gate; and polishing the interlayer insulating film to expose the contact pattern. | 2008-09-18 |
20080227291 | FORMATION OF COMPOSITE TUNGSTEN FILMS - Embodiments of the invention provide methods for depositing tungsten materials. In one embodiment, a method for forming a composite tungsten film is provided which includes positioning a substrate within a process chamber, forming a tungsten nucleation layer on the substrate by subsequently exposing the substrate to a tungsten precursor and a reducing gas containing hydrogen during a cyclic deposition process, and forming a tungsten bulk layer during a plasma-enhanced chemical vapor deposition (PE-CVD) process. The PE-CVD process includes exposing the substrate to a deposition gas containing the tungsten precursor while depositing the tungsten bulk layer over the tungsten nucleation layer. In some example, the tungsten nucleation layer has a thickness of less than about 100 Å, such as about 15 Å. In other examples, a carrier gas containing hydrogen is constantly flowed into the process chamber during the cyclic deposition process. | 2008-09-18 |
20080227292 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes preparing a semiconductor wafer, forming a semiconductor function element on the semiconductor wafer, drying the semiconductor wafer after forming the semiconductor function element by using an isopropyl alcohol vapor, heating the semiconductor wafer after drying the semiconductor wafer, and performing an RA cleaning on the semiconductor wafer after heating the semiconductor wafer by using a fuming nitric acid. | 2008-09-18 |
20080227293 | INTEGRATED CIRCUIT FABRICATION - A method for defining patterns in an integrated circuit comprises defining a plurality of features in a first photoresist layer using photolithography over a first region of a substrate. The method further comprises using pitch multiplication to produce at least two features in a lower masking layer for each feature in the photoresist layer. The features in the lower masking layer include looped ends. The method further comprises covering with a second photoresist layer a second region of the substrate including the looped ends in the lower masking layer. The method further comprises etching a pattern of trenches in the substrate through the features in the lower masking layer without etching in the second region. The trenches have a trench width. | 2008-09-18 |
20080227294 | Method of making an interconnect structure - A method of making an interconnect structure includes providing a die ( | 2008-09-18 |
20080227295 | Self-aligned contact frequency doubling technology for memory and logic device applications - Contact spatial-frequency doubling technology is invented to pattern a contact-hole array and a row/column (or multiple isolated rows/columns) of contact holes with their density increased to twice of the maximum density achievable during one exposure with a conventional lithographic technology. These contact frequency doubling processes can be used not only in contact-hole patterning for both memory and logic devices, but also applicable for doubling the density of epi-Si (or epi-SiGe, epi-Ge) columns. If introduced to fabricate vertical MOSFET devices wherein the epi-columns act as the transistor body/channel and drain/source is designed in the vertical way, the epi-column doubling technology can enable cost-effective fabrication processes for high-density 4F | 2008-09-18 |
20080227296 | SLURRY COMPOSITIONS, METHODS OF PREPARING SLURRY COMPOSITIONS, AND METHODS OF POLISHING AN OBJECT USING SLURRY COMPOSITIONS - A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include lysine, proline and arginine. Examples of the glycol compound include diethylene glycol, ethylene glycol and polyethylene glycol. | 2008-09-18 |
20080227297 | CHEMICAL MECHANICAL POLISHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A chemically mechanically polishing method is provided, which includes slide-contacting a polishing film with a polishing pad while feeding a first chemical liquid and a second chemical liquid to the polishing pad. The first chemical liquid contains an electrolyte and bubbles having a diameter ranging from 10 nm to 1000 μm, and the second chemical liquid contains abrasive particles. | 2008-09-18 |
20080227298 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The object of the present invention is to embed an insulating film in a hole having a high aspect ratio and a small width without the occurrence of a void. The thickness of a polishing stopper layer is reduced by making separate layers respectively serve as a mask during forming the hole in a semiconductor substrate, and a stopper during removing the insulating film filled in the hole. | 2008-09-18 |
20080227299 | TAPERED EDGE EXPOSURE FOR REMOVAL OF MATERIAL FROM A SEMICONDUCTOR WAFER - A semiconductor wafer edge exposure process as described herein employs a photoresist exposure step that exposes photoresist material to radiation having a gradient intensity profile near the outer edge of the wafer. The gradient intensity profile creates a tapered outer edge in the developed photoresist material, which in turn creates a tapered outer edge in the underlying target material after etching. Different gradient intensity profiles can also be used for subsequent layers of material. The resulting tapered edge profile of the wafer is resistant to edge peeling and flaking. | 2008-09-18 |
20080227300 | Method for manufacturing semiconductor device - A method of manufacturing a semiconductor device prevents a pattern bridge phenomenon generated by a proximity effect between patterns and a thickness lowering phenomenon of the pattern. As a result, a length of the major axis required in characteristics of the device is secured to improve an electric characteristic and an overlapping margin. A photoresist pattern is formed to have a line/space type, thereby securing a DOF margin in comparison with a photoresist pattern of an island type. | 2008-09-18 |
20080227301 | Control of bevel etch film profile using plasma exclusion zone rings larger than the wafer diameter - A method of cleaning a bevel edge of a semiconductor substrate is provided. A semiconductor substrate is placed on a substrate support in a reaction chamber of a plasma processing apparatus. The substrate has a dielectric layer overlying a top surface and a bevel edge of the substrate, the layer extending above and below an apex of the bevel edge. A process gas is introduced into the reaction chamber and energized into a plasma. The bevel edge is cleaned with the plasma so as to remove the layer below the apex without removing all of the layer above the apex. | 2008-09-18 |
20080227302 | FIBROUS LAMINATE INTERFACE FOR SECURITY COATINGS - an integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer. | 2008-09-18 |
20080227303 | SYSTEMS AND METHODS FOR FORMING TANTALUM OXIDE LAYERS AND TANTALUM PRECURSOR COMPOUNDS - A method of forming (and apparatus for forming) a tantalum oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and a tantalum precursor compound that includes alkoxide ligands, for example. | 2008-09-18 |
20080227304 | Cable connection structure in electric vehicle - The cable connection structure in an electric vehicle includes a main body of the electrical machinery having an inclined face with respect to the detaching direction; a terminal connector unit being formed contiguously to and separately from the main body and having an insertion opening through which the cable is inserted into the terminal connector unit and a contact face which intimately contacts with the inclined face; a busbar projecting into the terminal connector unit through connecting openings formed on the inclined face and the contact face and having one terminal being connected to the inside of the main body and the other terminal being electrically connected to the terminal of the cable inside the terminal connector unit; and one or more connection bolts, penetrating the inclined face and the contact face, for detachably coupling the main body and the terminal connector unit, improving maintenance efficiency and reducing the costs. | 2008-09-18 |
20080227305 | ELECTRICAL CONNECTOR - An electrical connector ( | 2008-09-18 |
20080227306 | Micro power supply device - A micro power supply device is inserted into slots of a circuit board, and the circuit board is fixed into an electronic system. The device includes an electric connector and a plurality of neatly and oppositely arranged pins on a side of the electric connector, and the pins are sheathed with conducting plates, and the conducting plates are electrically connected with the slots. Another end of the conducting plates is protruded from another side of the electric connector, and a power supply board is inserted between the protruded conducting plates. The power supply board is connected with the power of an external port and other electronic equipments. The thickness of the power supply board is reduced, such that the conducting plates are centralized from both lateral side to the middle to reduce the volume of the whole electric connector, so as to reduce the volume of the whole device. | 2008-09-18 |
20080227307 | Electrical interconnect system utilizing non-conductive elastomeric elements - An electrical interconnect system for providing electrical connection between two or more opposing arrays of contact areas, the electrical interconnect having a conductive substrate and conductors electrically isolated from the substrate. | 2008-09-18 |
20080227308 | TOUCH PANEL - A touch panel includes an upper substrate, a lower substrate, and a wiring board. The upper substrate includes an upper conductive layer, a pair of upper electrodes, and upper electrode terminals. The lower substrate includes a lower conductive layer, a pair of lower electrodes extending orthogonal to the upper electrodes, and lower electrode terminals. The wiring board includes a substrate portion, L-shaped upper and cover sheets. The substrate portion has upper and lower wiring patterns on its top and bottom surfaces, respectively. The upper wiring patterns are connected to each of the upper electrode terminals, and the lower wiring patterns are connected to each of the lower electrode terminals. At least part of the top surface of the upper wiring patterns is covered with the upper cover sheet, and at least part of the bottom surface of the lower wiring patterns is covered with the lower cover sheet. | 2008-09-18 |
20080227309 | Land grid array connector - A land grid array (LGA) connector, for electrically connecting an IC (Integrated Circuit) package to a printed circuit board, comprises a retaining frame, a plurality of sections mounted on the retaining frame and a plurality of contacts received in the sections. Each contact having a contacting portion extending beyond the top surface of the section to contact with the IC package, and the contacting portions of the contacts received in a same section have two opposed extending direction to evenly and elastically support the IC package when the IC package is pressed toward the contacts. | 2008-09-18 |
20080227310 | Integrated Circuit Socket - Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate. | 2008-09-18 |
20080227311 | Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards - An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board. | 2008-09-18 |
20080227312 | Multilayer wiring substrate - A first wiring pattern formed on a first layer of a multilayer wiring substrate, a second wiring pattern formed on a layer different from the first layer on which the first wiring pattern is formed, a penetration hole penetrating the front surface and the back surface of the substrate, and a penetration hole penetrating a front surface and a back surface of the substrate; and a fitting connector having a conductor part on a side surface inscribed in the penetration hole and fitting into the penetration hole are provided. The first wiring pattern and the second wiring pattern are exposed from the internal surface of the penetration hole, and the fitting connector connects a first end part of the conductor part and a second end part with an exposed part of the first wiring pattern and an exposed part of the second wiring pattern, respectively. | 2008-09-18 |
20080227313 | Printed circuit board connection - An electronic device, comprising an improved printed circuit board connection for connecting a first printed circuit board to a second printed circuit board in a manner that permits physical engagement at a different position than the electrical engagement, and a method for making the improved printed circuit board connection with precision in alignment. In one embodiment, the first printed circuit board includes an end portion configured to engage with a member of a connector on the second printed circuit board. The end portion and the member engage along concave portions of the end portion and convex portions of the member. When engaged, the end portion and the member align wires of the first printed circuit board with terminals of the connector. | 2008-09-18 |
20080227314 | FLEXIBLE CIRCUIT CONNECTOR ASSEMBLY - An electrical connector assembly for connecting a flexible circuit to a circuit board includes a flexible circuit attached to a clamp member and a plurality of alignment posts extending from the circuit board. The clamp member has notches that receive the posts to place the contact field of the flexible circuit above the contact field of the circuit board. A spring assembly attached to the clamp member has a manually-operated drive that moves a cam member deflecting the spring against the posts, generating a spring force pressing the clamp member against the circuit board. Barriers formed on the posts prevent contact of the flexible circuit with the circuit board until the contact fields are properly aligned. | 2008-09-18 |
20080227315 | Terminal and connecting structure between terminal and board - A terminal adapted to be inserted into a through-hole of a board from an insertion end and electrically connected to the board, includes a body portion in a cylindrical shape, a first retaining portion outwardly extending from the body portion so as to be elastically deformable in a perpendicular direction relative to an axial direction of the body portion and contacting a first surface of the board or a boundary portion between the first surface and the through-hole, and a second retaining portion positioned at a counter-insertion end side relative to the first retaining portion, outwardly protruding from the body portion and contacting a second surface, which is an opposite surface of the first surface, or a boundary portion between the second surface and the through-hole. | 2008-09-18 |
20080227316 | ELECTRICAL CONNECTOR - The electrical connector of the invention includes an insulative body and a plurality of conductive terminals. The insulative body has a plurality of terminal receiving passages accommodating the conductive terminals. The electrical connector further includes a shell, and the shell connects to the insulative body to form a mating port. The conductive terminals can be assembled on the electrical connector of the invention from a front direction and a back direction, even from an up direction and a down direction. Accordingly, the electrical connector of the invention can be with better performance, and the cost is lowered. | 2008-09-18 |
20080227317 | Electrical card connector with a dustproof device - An electrical card connector comprises an insulative housing, a shell covering the insulative housing, a plurality of terminals received in the insulative housing, an ejecting mechanism assembled on one side of the shell and a dustproof device. The dustproof device retains on the shell away from the terminals, witch comprises a door member, a base portion and a pair of vertical wall extending downwardly from opposite sides of the base portion separately. A horizontal wall extends horizontally from one side of the base portion for retaining the ejecting mechanism. A engagement portion extends outwardly from each vertical wall for holding the electrical card connector. The dustproof device has a simple structure and can be assembled easily and firmly. | 2008-09-18 |
20080227318 | Connector Device for Producing an Electrical Connection Between a Mains Cable and a Loom - A connector device for the production of an electrical connection between a mains cable and a cable harness in an electrical device, in particular, a domestic device, is disclosed, comprising a first plug-in connector, for the production of a detachable, mechanical and electrical connection to the cable harness of the electrical device and a second plug-in connector, for the production of a detachable, mechanical and electrical connection to the mains cable, whereby the second plug-in connector is provided for a number of differing mains cables and has an identical connector configuration for each of the differing mains cables. | 2008-09-18 |
20080227319 | Universal connector - This new connector was originally designed for coaxial cables. All connectors are identical. None of them has gender. Any connector will fit any other connector. There are a male sub-connector and a female sub-connector in a universal connector for connection of a wire. There is also a lock to keep two conjunct connectors together. The connection of connectors is shielded as well. | 2008-09-18 |
20080227320 | Lamp keying system and method - A system and a method for keying lamps which involve a lamp keying device, such as a keying device with a base protruding key having a configuration, e.g., being formed on, being affixed to, or being detachably coupled with, the base and a support slot being formed in the lamp support receptacle, the base protruding key detachably coupling with the support slot; a keying device with a support protruding key being formed on, being affixed to, or being detachably coupled with, the lamp support receptacle and a base slot being formed in the base, the base slot detachably coupling with the protruding support key; and a keying device with a base protruding key being formed on, being affixed to, or being detachably coupled with, the base and a base slot being formed in the base, the keying device further having a complementary support protruding key being formed on, being affixed to, or being detachably coupled with, the lamp support receptacle and a complementary support slot being formed in the lamp support receptacle, the base protruding key detachably coupling with the complementary support slot, and the slot detachably coupling with the complementary protruding support key. | 2008-09-18 |
20080227321 | CORDSET ASSEMBLY - An extension cordset assembly includes a receptacle and a sealing gasket. The receptacle includes a receptacle main body, a receptacle connecting interface and first and second spade mating holes extending into the receptacle main body from the receptacle connecting interface. The receptacle is configured to mate with a plug having a standard spade configuration. The sealing gasket is positioned on the receptacle connecting interface and includes first and second spade openings aligned with the first and second spade mating holes, respectively. The sealing gasket is configured to provide a water-resistant seal between the receptacle and the plug. | 2008-09-18 |
20080227322 | High Voltage Wet Mateable Electrical Connector - An electrical connector for use in subsea applications, the connector comprising a receptacle component comprising a fluted, insulated male contact pin, and a plug component comprising a contact assembly. On engagement of the receptacle component and plug component in use, a watertight electrical connection is formed between the male contact pin and the contact assembly. The receptacle component further comprises an isolation tube substantially surrounding the insulated male contact pin over at least part of its length and containing oil therein, in use. | 2008-09-18 |
20080227323 | High Power Electrical Connector for a Laminated Heater - An electrical connector has a non-conductive outer housing and a spring-loaded conductive assembly mounted within. The non-conductive outer housing has a longitudinal axis along which the spring-loaded conductive assembly is allowed to move over a limited range, in either direction. The conductive assembly includes a conductive contact pad and an conductive elongated shaft which are mated together within the non-conductive outer housing. A spring mounted along the contact shaft and in abutment therewith biases the contact shaft in a direction away from the contact base. When the electrical connector is employed in a chamber lid of a chamber lid assembly having an integrated laminated heater, such as for use in conjunction with a wafer processing chamber, the spring biases a lower surface of the contact shaft against the heater. | 2008-09-18 |
20080227324 | Conductive contact for CPU socket connector - A conductive contact ( | 2008-09-18 |
20080227325 | Electrical plug-and-socket connector - An electrical plug-and-socket connector includes a housing having chambers for receiving contacts. Latches of the chambers hold contacts inserted in the chambers. The housing has first and second openings with pairs of the first and second openings respectively leading into the chambers. A flap attached to the housing is pivotable to either open away from the housing or close against the housing. The flap includes first projections which extend through the first openings into the chambers when the flap is closed to lock contacts held in the chambers. The flap includes second projections which extend through the second openings into the chambers when the flap is closed and when the contacts held in the chambers are positioned correctly in the chambers to engage the contacts and thereby reinforce the locking of the contacts held in the chambers. | 2008-09-18 |
20080227326 | MOUNTING PIN AND PLUGHOLE ARRANGEMENT - A mounting pin and plughole arrangement is disclosed include a plughole formed on a circuit board, and a mounting pin downwardly extending from a frame body and having a shank with two hooked portions for fastening to the plughole to lock the frame body to the circuit board by: inserting the shank of the mounting pin through the center of the plughole and then rotating the mounting pin through an angle to force top locating blocks of the hooked portions into engagement with retaining holes that form a part of the plughole. | 2008-09-18 |
20080227327 | Led holder - An LED holder has a housing, a disc mounted in a lower end of the housing, a seat formed on the disc, a pair of sockets formed in the seat and a bracket mounted detachably on the seat to hole the LED. Hence, the LED is assembled and disassembled easily. | 2008-09-18 |
20080227328 | ELECTRICAL CONNECTOR - An electrical connector includes an insulating base and at least one row of conducting terminals. Each row of conducting terminals includes a body portion, a connecting arm located at two ends of the body portion, and a connecting portion. The insulating base includes a holding portion. The connecting arm is held on the holding portion. Because the connecting arm of the conducting terminal of the electrical connector is held on the holding portion of the insulating base, the coplanarity of the connecting portion of the conducting terminal can be assumed by keep the roughness of the holding portion of the insulating base. It prevents that the whole conducting arm of the conducting terminal is pasted on the insulating base to decrease the coplanarity of the connecting portion. | 2008-09-18 |
20080227329 | Insulation Displacement Plug-In Connector And Device For Telecommunications And Data Technology - The invention relates to an insulation displacement plug-in connector for telecommunications and data technology, comprising a housing ( | 2008-09-18 |
20080227330 | Plug with Slidable Pins and Blocking Device - Plug, comprising a housing with a first contact face, a first set of pins for a first type of power point, and a first blocking device, comprising interacting first and second blocking means, in which the first set of pins is slidably accommodated in the housing. The first set of pins in the active position projects from the first contact face of the housing in such a way that said set of pins can be inserted into the first type of power point. The first blocking means are connected to the first set of pins. The second blocking means are connected to the housing. The first and second blocking means are movable relative to each other, so that they can assume a blocking position and an unblocking position. | 2008-09-18 |
20080227331 | Electrical connector retaining mechanism having slide clip member - A slide clip member ( | 2008-09-18 |
20080227332 | Insertion-Connected Connector - The invention relates to a plug connector ( | 2008-09-18 |
20080227333 | OUTLET ADD-ON MODULE - A method and an apparatus for upgrading an existing service outlet (e.g. LAN, telephone, power or CATV outlet) in a house by adding functionality thereto. The functionality is added by an add-on module, connected electrically and secured mechanically to the existing outlet. Several attachment devices are exampled, including surface attachment, side clamping, snap locking, strap securing and fastening screws. The add-on module may include a service connector for retaining the basic existing outlet function. The module may be attached in a permanent way or by using a detachable solution. | 2008-09-18 |
20080227334 | MULTI-POLE COAXIAL CONNECTOR - To provide a multi-pole coaxial connector that can be made more compact. More specifically, to provide a multi-pole coaxial connector in which a pitch between members is reduced to reduce a connecting body in size. In a multi-pole coaxial connector in which when a housing block and a receptacle are coupled to each other, a signal post and a signal contact are brought into conduction, a ground contact and a ground case are brought into conduction, an internal conductor and a signal SMD terminal are brought into conduction, and an external conductor and a ground SMD terminal are brought into conduction, and a cross section of the ground contact is formed into substantially U-shape in which adjacent ground contact side is opened. | 2008-09-18 |
20080227335 | Electrical connector with shell - An electrical connector ( | 2008-09-18 |
20080227336 | Contacting appliance and contacting arrangement for mobile electrical devices - The contacting appliance for temporarily establishing an electrically conductive contact is described, in particular a charging device for electrical devices. The appliance includes an accommodating entity which can be moved between at least two end locations, so that an electrical contact which is associated with the accommodating entity executes movements relative to a placement position or an insertion position of the mobile electrical device as a result of movements of the accommodating entity between the end locations. When the device is inserted into the contacting appliance, movement of the contact of the device relative to the contact of the accommodating entity is avoided. | 2008-09-18 |
20080227337 | Memory card, memory card adaptor and combination thereof - The present invention provides a first memory card, a memory card adaptor and a memory device combining the first memory card and the memory card adaptor. The first memory card has dual interfaces for the host, wherein one interface is the USB interface and dual interface contact pads are respectively arranged on different surfaces and different ends of the first memory card. The first memory card adaptor has an appearance of a second memory card and has the corresponding connecting structure for fixing the first memory card. Once the memory device is in the USB mode, the user can directly extract the memory card or just partially extract the memory card to expose those USB contact pads. Further, the memory card adaptor can hold the first memory card without loosening while partially extracting from the insertion port of the memory card adaptor. | 2008-09-18 |
20080227338 | PORTABLE ADAPTER - A portable adapter includes a first body; a second body; a pivoting unit, mounted between the first body and the second body; a power input, mounted on the first body; a power output, mounted on the first body near to the pivoting unit; and at least one connector, mounted on the second body. The pivoting unit unfolds the first body and the second body in a manner such that the power output is partially hidden between the first body and the second body. The foldable structure of the portable adapter has a reduced volume and the power output is partially hidden during travel. When in use with a laptop, the first body and the second body unfold to an angle of 90 degrees relative to each other by means of the pivoting unit, so that the connector can be plugged with an electronic device. | 2008-09-18 |
20080227339 | PLUG CONNECTOR FOR MOBILE COMMUNICATION DEVICE - A plug connector for a mobile communication device is provided. The plug connector includes a plurality of contact pins, an insulator, and an outer shell. The contact pins are provided correspondingly to contact terminals of a socket connector for the mobile communication device, and are arranged with predetermined gaps therebetween. The insulator supports the contact pins. The outer shell encloses the insulator, and includes a substrate supporter extended outwardly from the insulator to support an outer surface of a PCB (printed circuit board). The substrate supporter comprises a side supporter enclosing lateral sides of the PCB, and a ground portion bonded to put to earth to a ground circuit of a PCB. The plug connector is capable of firmly bonding with a PCB, preventing from noise occurring. | 2008-09-18 |
20080227340 | Methods and systems for positioning connectors to minimize alien crosstalk - The present invention relates to methods and systems for minimizing alien crosstalk between connectors. Specifically, the methods and systems relate to isolation and compensation techniques for minimizing alien crosstalk between connectors for use with high-speed data cabling. A frame can be configured to receive a number of connectors. Shield structures may be positioned to isolate at least a subset of the connectors from one another. The connectors can be positioned to move at least a subset of the connectors away from alignment with a common plane. A signal compensator may be configured to adjust a data signal to compensate for alien crosstalk. The connectors are configured to efficiently and accurately propagate high-speed data signals by, among other functions, minimizing alien crosstalk | 2008-09-18 |
20080227341 | CONNECTOR ASSEMBLY FOR USE WITH AN ELECTRICAL SUBMERSIBLE COMPONENT IN A DEEPWATER ENVIRONMENT - A connector for a connection assembly for providing electrical power to a submersible electrical component in a deepwater environment, such as a subsea well, includes a ceramic body having a metallized inner passageway. A conductive contact extends through the passageway and has a contact end and a cable connecting end. A conductive sleeve is disposed about an outer surface of the ceramic body. The ceramic body is retained within a connector housing that has an interface chamber and a cable retaining chamber. The contact end of the connector contact is disposed within the interface chamber, and the cable connecting end of the contact is disposed within the cable retaining chamber. The sleeve is attached to the housing to provide a seal between the interface chamber and the cable retaining chamber. When the connector is engaged with a complementary connector, a Faraday cage is provided within the interface chamber to manage the electrical field about the connection interface between the connectors. | 2008-09-18 |
20080227342 | MULTIPLE BORE TERMINATION SYSTEM - A cable termination housing for terminating a cable to one or more devices includes a bore for receiving a device mating portion, a component portion integrally formed within the housing, the component portion having a fastener that is slidable between a retracted position wherein fastener does not extend into the lug aperture of the cable assembly and an extended position wherein the fastener extends into the lug aperture. Preferably, the fastener is rotatable while in its extended position so as to couple with the device mating portion. | 2008-09-18 |
20080227343 | AMPHIBIOUS DRIVE SYSTEM FOR A BOAT - An improved amphibious drive system for a watercraft. The amphibious drive system features a paddled drive wheel which is operatively mounted to a drive frame. The drive frame pivots about a horizontal pivot joint. The drive wheel can thereby be raised and lowered with respect to the watercraft. In the elevated position the drive wheel is only partially submerged in the water (such that the drive wheel may operate like a paddlewheel). In the lowered position the drive is submerged more deeply in the water. The amphibious drive system also features a mount plate for attaching the amphibious drive system to the transom of the watercraft. A swing-arm frame links the drive frame to the mount plate. The swing-arm frame pivots in the horizontal direction relative to the watercraft via a vertically-oriented kingpin. This action angularly offsets the thrust from the drive wheel, thereby allowing steering. | 2008-09-18 |
20080227344 | AMPHIBIOUS ALL-TERRAIN VEHICLE - An amphibious, all-terrain vehicle utilizing a pair of hydrostatic pumps to independently provide power to hydraulic drive mechanisms of the left and right side of the vehicle respectively. The hydraulic drive mechanisms on a side of the vehicle comprise a plurality of hydraulic wheel motors and a hydraulic propeller motor. Using a novel hydraulic manifold assembly, the vehicle can operate in three distinct modes: wheels only, wheels and propellers, and propellers only. The hydraulic manifold assembly also allow the vehicle to by put in neutral mode for starting. The wheel motors are mounted in a pair of undercarriage assemblies that are outside of the vehicle's body and fluidly connected to the hydraulic manifold assembly thorough a hose chase that extends well above the vehicle's waterline to eliminate the potential for water to enter the body of the vehicle when operated in the water. | 2008-09-18 |
20080227345 | Partially flooding spar buoy - A partially flooding buoy includes a buoy body having a substantially cylindrical shape defining a cavity therein and a mooring mechanism attached to the buoy body to allow the buoy to be moored. The partially flooding buoy can be partially flooded with water after the buoy is deployed. The cavity is adapted to accommodate ballast therein. The buoy also includes at least one handle to allow more convenient handling of the buoy, wherein the handle is an opening formed within the buoy body. | 2008-09-18 |
20080227346 | Canine swim safe vest and collar - The present invention is a dog “swim safe” floatation system, including flanking water wings sewn directly to a suspension-type harness for the dog. The harness can be adjusted by a system of Velcro and latches and thus the entire apparatus can be conveniently modified to promote stability. A canine floatation collar is also disclosed. | 2008-09-18 |
20080227347 | Underwater Submersion Installation - The invention concerns an underwater immersion installation ( | 2008-09-18 |
20080227348 | Nonwoven printing medium - A nonwoven printing medium is provided which is formed from a spunbond nonwoven web of continuous multiple component filaments and optionally a coating on at least one surface of the spunbond nonwoven layer. The spunbond filaments are preferably formed in a sheath-core configuration with a high strength component in the core and a sheath component resulting in an abrasion resistant surface. The printing medium has an improved combination of tensile properties, outdoor durability, and high temperature stability for printing in high temperature printers. | 2008-09-18 |
20080227349 | Temperature sensing fabric - A blanket or article of wearing apparel for a subject such as an infant. A fiber optic temperature sensing element is integrated into the fabric by a process such as weaving. The temperature sensing element is a optic fiber having inscribed therein one or more fiber Bragg grating sensors such that a light is introduced into the optic fiber and that light directed onto the subject at a grating interface. A return light signal is received, either by a reflectance mode or a transmission mode, where the return light signal has a wavelength shift indicative of the temperature of the subject by Bragg resonant effect. Higher temperature sensitivity is obtained with a metal material of a high thermal expansion coefficient that is coated around the fiber sensor cladding. | 2008-09-18 |
20080227350 | Method For the Production of a Web - Disclosed is a method for producing a web ( | 2008-09-18 |
20080227351 | Cleansing Polyester Fabrics, and a Process of Preparing the Same - The cleansing polyester fabric of the present invention (AAA). The cleansing fabric of the present invention is useful as a makeup cleansing fabric or as a wiping fabric for precision products and optical devices since it exhibits excellent cleansing performance, is soft to the touch and does not damage the surface of a products to be cleansed. | 2008-09-18 |
20080227352 | Flame-resistant high visibility textile fabric for use in safety apparel - A knitted textile fabric for use in safety apparel, comprising a first yarn containing modacrylic fibers and a second yarn containing cellulosic fibers. The first and second yarns are intimately interknitted with one another in plated relationship with the modacrylic yarn disposed predominantly at an outer face of the fabric for imparting flame resistant properties and an affinity for high visibility dyes and with the cellulosic yarn disposed predominantly at the opposite face of the fabric for imparting a hand suitable for comfortable body contact with a user's skin. | 2008-09-18 |
20080227353 | Process For the Production of an Underlay For Roofs - The invention relates to a method for the production of an active-breathing composite in the form of a web, consisting of a nonwoven made of synthetic material and a layer fully or mainly consisting of polyurethane for utilization as counter ceiling webs for roofs and as façade webs. The invention aims at enabling production of said composite with good properties and greater economic viability. This is achieved in that PU or a mixture of materials with a high fraction of PU is heated to melting temperature and extruded on a nonwoven made of PP in order to form a diffusion-open coating of the PP nonwoven and then pressing the PP nonwoven in order to form an active-breathing composite. | 2008-09-18 |
20080227354 | Hot-Press Cushioning Material its Manufacturing Method and Manufacturing Method of Laminated Board - A cushioning material for a heat press having a non-woven fiber composed of a fiber web ( | 2008-09-18 |
20080227355 | Signal Receiving Device For Receiving Signals of Multiple Signal Standards - A multicomponent fiber that contains a high-melting aliphatic polyester and a low-melting aliphatic polyester is provided. The multicomponent fibers are substantially biodegradable, yet readily processed into nonwoven structures that exhibit effective fibrous mechanical properties. | 2008-09-18 |
20080227356 | Substrates having improved ink adhesion and oil crockfastness - A printed nonwoven web having improved oil crockfastness when an ink composition is applied to an outer surface of the nonwoven is generally disclosed. For example, an ink composition that has improved resistance to rub off of the web, even if the ink composition contacts an oily substance (e.g., baby oil, lotion, etc.), can be printed on a surface of the web. The nonwoven web can be a layer in a laminate having at least a film layer and the nonwoven web layer. For example, the printed laminate can be used as the outercover of an absorbent article. | 2008-09-18 |
20080227357 | Organic light-emitting device with improved layer conductivity distribution - An OLED comprises an anode, a hole source, an emissive region, an electron source and a cathode, wherein the materials for the electron source and the hole source are chosen such that the electrical conductivity of these charge carrier sources is greater than the electrical conductivity of the emissive region. In particular, the electrical conductivity of the source layers is between 10 | 2008-09-18 |
20080227358 | METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE, IMAGE DISPLAY DEVICE, AND TV APPARATUS - A method for manufacturing an image display device includes the steps of preparing a plurality of spacers preliminarily, measuring heights of the plurality of spacers prepared by the preparing step individually, and deciding an order of arranging the spacers on the basis of the measured heights obtained in the measuring step. The spacers are arranged in the order decided in the deciding step. | 2008-09-18 |
20080227359 | Electrode-Less Incandescent Bulb - A method of making an electrodeless incandescent bulb comprises the steps of:
| 2008-09-18 |
20080227360 | Method for fabricating electron emitter - A method for fabricating a surface-conduction electron emitter includes the steps of: (a) providing a substrate; (b) disposing two lower layers on the surface of the substrate, the two lower layers are parallel and apart from each other; (c) disposing a plurality of carbon nanotube elements on the lower layers; (d) disposing two upper layers on the two lower layers, and thereby, sandwiching the carbon nanotube elements therebetween; and (e) forming a micro-fissure between the carbon nanotube elements. | 2008-09-18 |
20080227361 | Method and Device For Producing an Electroluminescent Luminous Element - Method and device for production of an electroluminescent light-emitting element The invention relates to a device and method for production of an electroluminescent light-emitting element ( | 2008-09-18 |
20080227362 | Method and apparatus for facilitating the construction of a snow man/woman - A building component for facilitating a construction of a snow man/woman. A spherically-shaped body is provided that has an outer surface and an interior, the interior substantially lighter than when the interior is filled with snow. An adhesion surface is provided on the outer surface of the spherically-shaped body that substantially increases the ability of the outer surface to adhere snow to the spherically-shaped body. The spherically-shaped body and adhesion surface form a building component for facilitating the construction of the snow man/woman. | 2008-09-18 |
20080227363 | SWIMMING ROBOT - A swimming robot according to the present invention is constructed to simulate a human body having an upper portion including a chest | 2008-09-18 |
20080227364 | Water Toy - To provide a water toy with which infants can play joyfully in a bathroom, which is easy to be fixed in place and which prevents the infants from losing their interests in playing therewith, there is provided a water toy including a pedestal portion having a pump, a circular cylindrical shaped column fixed to an upper portion of the pedestal portion, which includes a water flowing tube in an interior and a water outlet port at an upper end thereof, a spiral water flowing rail fixed to a circumferential edge of the column, a first water flowing rail detachably coupled to a lower end of the spiral water flowing rail, which includes a windmill portion having a rotor turned by using a flow of water, a second water flowing rail detachably coupled to a lower end of the first water flowing rail while being fixed onto an auxiliary fixing base, a third water flowing rail detachably coupled to a lower end of the second water flowing rail, a fourth water flowing rail detachably coupled to a lower end of the third water flowing rail, and a sliding element which slides on water flowing surfaces of the respective rails. | 2008-09-18 |
20080227365 | BALANCING SYSTEM AND TURNING MECHANISM FOR REMOTE CONTROLLED TOY - A radio controlled two wheeled vehicle incorporates a disposition of two motors, a gear system and electronics to provide a balancing and mobility during operation. There is a low center of gravity provided by relatively heavy wheels. The two-wheeled vehicle provides increased balancing at slower speeds between the drive system motors. In the motorbike, and a figurine having movable joints is attachable to the bike and provides for tilting of the bike and steering effects during the bike operation. | 2008-09-18 |
20080227366 | COMBINED APPARATUS FOR MACHINING OF ARTICLES, IN PARTICULAR IN FORM OF SLABS - An apparatus for machining an article (L) in the form of a slab or the like comprises—in addition to a rotary tool ( | 2008-09-18 |
20080227367 | Substrate polishing metrology using interference signals - A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal. | 2008-09-18 |
20080227368 | DOCUMENT ABRADING DEVICE - The present invention provides a shredding device that has an elongated body that houses a motor. A brush may be rotatably secured to the body, at least partly outside of the body, and driven by the motor and configured to remove by abrasion at least a layer of a substrate having markings thereon. The shredding device may include a vacuum system for collecting particulate matter formed by abrading the substrate. | 2008-09-18 |
20080227369 | Apparatus and Method for Confined Area Planarization - A proximity head and associated method of use is provided for performing confined area planarization of a semiconductor wafer. The proximity head includes a chamber defined to maintain an electrolyte solution. A cathode is disposed within the chamber in exposure to the electrolyte solution. A cation exchange membrane is disposed over a lower opening of the chamber. A top surface of the cation exchange membrane is in direct exposure to the electrolyte solution to be maintained within the chamber. A fluid supply channel is defined to expel fluid at a location adjacent to a lower surface of the cation exchange membrane. A vacuum channel is defined to provide suction at a location adjacent to the lower surface of the cation exchange membrane, such that the fluid to be expelled from the fluid supply channel is made to flow over the lower surface of the cation exchange membrane. | 2008-09-18 |
20080227370 | SUBSTRATE FOR MAGNETIC DISK - A method for manufacturing a substrate for a magnetic disk, including the steps of (a) polishing a substrate with a polishing composition A containing alumina abrasives having an average particle size of from 0.05 to 0.5 μm, and an oxidizing agent, and (b) polishing the substrate with a polishing composition B containing silica particles having an average particle size of from 0.005 to 0.1 μm; a substrate for a magnetic disk, obtainable by the method for manufacturing a substrate for a magnetic disk; and a substrate for a magnetic disk having the following surface properties of a long-wavelength waviness of 0.05 nm or more and 0.3 nm or less, and an AFM surface roughness of 0.03 nm or more and 0.2 nm or less. The substrate for a magnetic disk may be suitably used in the manufacture of a hard disk having a high recording density. Especially, a hard disk having a recording density of 50 G bits or more per square inch may be industrially manufactured. | 2008-09-18 |